KR102483377B1 - Electronic device and method of manufacturing the same - Google Patents

Abstract

According to the present invention, a method of manufacturing an electronic device includes the steps of detecting a location of at least one heat source disposed on a printed circuit unit or a display of the electronic device or a path of heat diffused from the heat source; selecting a heat dissipation structure to correspond to the detected location of the heat source or the diffusion path; selecting a heat-insulating material or a heat-dissipating material disposed according to the selected heat-dissipating structure to insulate or radiate heat transferred from the heat source; Forming the selected heat dissipation structure or arranging the selected heat insulation or heat dissipation material around the heat source or on the diffusion path.
According to various embodiments of the present disclosure, there is an effect of maximizing heat generation by improving the structure of a heat generating path of an electronic device and selecting and disposing a heat generating material at an appropriate location.

Description

Electronic device and electronic device manufacturing method {ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a structure and manufacturing method for uniformly diffusing heat generated in a specific area of a portable electronic device to the surrounding area.

Recently, portable terminals having new functions are being developed at a rapid pace, and as their distribution expands, the proportion of portable terminals in people's lives is gradually increasing.

In addition, portable terminals such as smart phones, which have become common due to the development of mobile communication technology, are essential to be miniaturized and lightweight in order to maximize user portability and convenience, and components integrated in a smaller space are being mounted for high performance. .

Accordingly, parts used in portable terminals have higher heating temperatures due to higher performance, and the increased heating temperatures affect adjacent parts, causing a problem of deteriorating the performance of portable terminals. In addition, the temperature of the outer surface of the mobile phone terminal rises due to the increased heat generation temperature, causing inconvenience when the user makes a call or operates the mobile phone.

A mobile device used for a portable terminal is manufactured in a structure that uses heat diffusion by directly attaching a heat dissipation sheet to parts generating heat inside the device. However, this heat dissipation structure has a problem in that it directly contacts the components and deteriorates the performance of the components and does not effectively spread heat.

An electronic device according to the present invention is intended to provide a heat-improving structural module and manufacturing method that improve the unstable heat-generating performance with a simple structure and effectively contribute to the diffusion of heat according to each heat-generating part.

According to various embodiments of the present disclosure, a method of manufacturing an electronic device includes detecting a location of at least one heat source disposed on a printed circuit unit or a display of the electronic device or a path of heat diffused from the heat source; selecting a heat dissipation structure to correspond to the detected location of the heat source or the diffusion path; selecting a heat-insulating material or a heat-dissipating material disposed according to the selected heat-dissipating structure to block or radiate heat transferred from the heat source; and forming the selected heat dissipation structure or arranging the selected heat dissipation material or heat dissipation material around the heat source or in the diffusion path.

The method may further include checking a change in heat diffused from the heat source and distributed in the electronic device according to the heat dissipation material disposed in the heat dissipation structure.

The forming of the heat dissipation structure and the disposing of the heat insulating material may include forming at least one open slit in a side region of the first plate or the second plate disposed above or below the printed circuit unit; and disposing the heat insulating material, which is a non-conductive material, on the side region including the formed slit.

In the forming of the heat dissipation structure and the disposing of the heat dissipation material, when it is sensed that the heat source disposed on the printed circuit unit transfers heat to the display disposed in the first direction, the dissipation in the first direction is performed. and arranging the heat dissipating material on top of the printed circuit unit facing the printed circuit unit so that the heat generated is diffused to the peripheral unit.

The method may further include forming at least one gap layer on or under the heat dissipating material to sequentially diffuse the heat dissipated in the first direction.

In the forming of the heat dissipation structure and disposing of the heat dissipation material, when the heat source is sensed by the display disposed on the upper surface of the device, the heat dissipation material is disposed on the lower surface of the display to dissipate heat dissipating downward. steps may be included.

In the forming of the heat dissipation structure and the disposing of the heat dissipation material, when it is sensed that the heat source disposed on the printed circuit unit transfers heat to the rear cover disposed in the second direction, the second direction The method may include arranging the heat-dissipating material under the printed circuit unit facing the printed circuit unit so that dissipated heat is diffused to the periphery. Furthermore, the method may further include forming at least one gap layer on or under the heat dissipation material to sequentially diffuse the heat dissipated in the second direction.

In addition, the forming of the heat dissipation structure and the disposing of the heat dissipation material may include shielding electromagnetic waves generated from the device by forming a shield to at least partially surround the heat source and spreading the generated heat by forming a gap above the heat source. It may include arranging the member.

and attaching the heat dissipation material to an upper portion of the shield member, wherein at least one hole is formed in the shield member, and the hole is used to transfer heat emitted from the heat source in a first direction to a second direction. It may include disposing a heat transfer material to face the.

In the method of manufacturing the electronic device, in the step of selecting the heat dissipation structure, the location of the heat dissipation structure is an area where heat transferred from the heat source is concentrated, and may be at least one of a side surface, a front surface, a rear surface area, or an inner area of the electronic device. there is.

Also, in the step of selecting the heat dissipation material, the heat dissipation material may be at least one of a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint that may be disposed in the heat dissipation structure.

An electronic device according to the present invention includes a first plate facing in a first direction; a second plate directed in a second direction opposite to the first direction; a display disposed to be exposed through a partial area of the first plate and including at least one heat source; a printed circuit unit disposed in a space between the first plate and the second plate and including at least one heat source; and a heat insulating or heat dissipating material disposed facing the heat source of the printed circuit unit or display or disposed adjacent to a path of heat diffused from the heat source to insulate or dissipate the heat.

In addition, at least one open slit is included in a side region of the first plate or the second plate, and the heat insulating material is disposed inside or outside the open slit to diffuse heat generated in the side region to the surrounding area. can make it

According to various embodiments of the present disclosure, there is an effect of maximizing heat generation by improving the structure of a heat generating path of an electronic device and selecting and disposing a heat generating material at an appropriate location.

According to an embodiment of the present invention, the performance of the product can be effectively realized by dispersing the concentration of heat generated from a specific region on the outer surface of the electronic device to other regions.

According to an embodiment of the present invention, in a model using a metal material, by implementing a structure for improving a heating area that directly contacts a user's skin, there is an effect of satisfying consumer needs.

According to an embodiment of the present invention, by enabling common use according to modularization, there is an effect of reducing material costs.

1 is a perspective view showing the front of an electronic device according to an embodiment of the present invention.
2 is a perspective view showing a rear surface of an electronic device according to an embodiment of the present invention.
3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
4 is a diagram sequentially illustrating a process of improving a heat dissipation structure of a printed circuit unit according to various embodiments of the present disclosure.
5 and 6 are schematic diagrams schematically illustrating a side portion of a second plate to improve heat generation according to various embodiments of the present disclosure.
FIG. 7 is a thermal distribution photograph showing an effect of improving heat generation by improving the structure of FIG. 5 or 6 .
8 to 11 are simplified views illustrating a heat dissipation structure for improving heat generation on the front surface of an electronic device according to various embodiments of the present disclosure.
12 and 13 are simplified diagrams illustrating a structure for improving heat dissipation generated from a rear surface of an electronic device according to various embodiments of the present disclosure.
14 is a front view of a printed circuit unit according to various embodiments of the present disclosure.
15 is a side view illustrating a heat dissipation material disposed in a heat source of a printed circuit unit according to various embodiments of the present disclosure.
16 is a side view illustrating a heat transfer material disposed in a heat source of a printed circuit unit according to another embodiment of the present invention.
17 is a side view illustrating a heat transfer material and a heat dissipation material disposed in a heat source of a printed circuit unit according to another embodiment of the present invention.
18 is a flowchart illustrating a method of manufacturing a heat dissipation structure of an electronic device according to an embodiment of the present invention.
19 is a block diagram illustrating a network environment of an electronic device according to an embodiment of the present invention.
20 is a block diagram illustrating a detailed structure of an electronic device according to an embodiment of the present invention.
21 is a block diagram illustrating a detailed structure of an electronic device according to an embodiment of the present invention.

Hereinafter, various embodiments of this document will be described with reference to the accompanying drawings. However, this is not intended to limit the technology described in this document to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of this document. . In connection with the description of the drawings, like reference numerals may be used for like elements.

In this document, expressions such as "has," "may have," "includes," or "may include" indicate the existence of a corresponding feature (eg, numerical value, function, operation, or component such as a part). , which does not preclude the existence of additional features.

In this document, expressions such as “A or B,” “at least one of A and/and B,” or “one or more of A or/and B” may include all possible combinations of the items listed together. . For example, “A or B,” “at least one of A and B,” or “at least one of A or B” (1) includes at least one A, (2) includes at least one B, Or (3) may refer to all cases including at least one A and at least one B.

Expressions such as "first," "second," "first," or "second," as used in this document may modify various elements, regardless of order and/or importance, and refer to one element as It is used only to distinguish it from other components and does not limit the corresponding components. For example, a first user device and a second user device may represent different user devices regardless of order or importance. For example, without departing from the scope of rights described in this document, a first element may be called a second element, and similarly, the second element may also be renamed to the first element.

A component (e.g., a first component) is "(operatively or communicatively) coupled with/to" another component (e.g., a second component); When referred to as "connected to", it should be understood that the certain component may be directly connected to the other component or connected through another component (eg, a third component). On the other hand, when an element (eg, a first element) is referred to as being “directly connected” or “directly connected” to another element (eg, a second element), the element and the above It may be understood that other components (eg, a third component) do not exist between the other components.

As used in this document, the expression "configured to" means "suitable for," "having the capacity to," depending on the circumstances. ," "designed to," "adapted to," "made to," or "capable of." The term "configured (or set) to" may not necessarily mean only "specifically designed to" hardware. Instead, in some contexts, the phrase "device configured to" may mean that the device is "capable of" in conjunction with other devices or components. For example, the phrase "a processor configured (or configured) to perform A, B, and C" may include a dedicated processor (eg, embedded processor) to perform the operation, or by executing one or more software programs stored in a memory device. , may mean a general-purpose processor (eg, CPU or application processor) capable of performing corresponding operations.

Terms used in this document are only used to describe a specific embodiment, and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly dictates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by a person of ordinary skill in the technical field described in this document. Among the terms used in this document, terms defined in a general dictionary may be interpreted as having the same or similar meaning as the meaning in the context of the related art, and unless explicitly defined in this document, an ideal or excessively formal meaning. not be interpreted as In some cases, even terms defined in this document cannot be interpreted to exclude the embodiments of this document.

Electronic devices according to various embodiments of the present document include, for example, a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, and an e-book reader. , desktop personal computer (laptop personal computer), netbook computer, workstation, server, PDA (personal digital assistant), PMP (portable multimedia player), MP3 player, mobile It may include at least one of a medical device, a camera, or a wearable device. According to various embodiments, the wearable device may be an accessory (eg, watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), fabric or clothing integrated ( For example, it may include at least one of an electronic clothing), a body attachment type (eg, a skin pad or tattoo), or a living body implantable type (eg, an implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances include, for example, televisions, digital video disk (DVD) players, audio systems, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, and home automation controls. Home automation control panel, security control panel, TV box (eg Samsung HomeSync ^TM , Apple TV ^TM , or Google TV ^TM ), game console (eg Xbox ^TM , PlayStation ^TM ), electronic dictionary , an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include various types of medical devices (e.g., various portable medical measuring devices (such as blood glucose meter, heart rate monitor, blood pressure monitor, or body temperature monitor), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computed tomography), imager, or ultrasonicator, etc.), navigation device, GNSS (global navigation satellite system), EDR (event data recorder), FDR (flight data recorder), automotive infotainment ) devices, marine electronics (e.g. marine navigation systems, gyrocompasses, etc.), avionics, security devices, automotive head units, industrial or home robots, automatic teller's machines (ATMs) of financial institutions , point of sales (POS) in stores, or internet of things devices (e.g. light bulbs, sensors, electric or gas meters, sprinklers, smoke alarms, thermostats, street lights, toasters) , Exercise equipment, hot water tank, heater, boiler, etc.) may include at least one.

According to some embodiments, the electronic device is a piece of furniture or a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, Water, electricity, gas, radio wave measuring devices, etc.) may include at least one. In various embodiments, the electronic device may be a combination of one or more of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. In addition, the electronic device according to the embodiment of this document is not limited to the above-described devices, and may include new electronic devices according to technological development.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (eg, an artificial intelligence electronic device).

1 is a perspective view showing the front of an electronic device. 2 is a perspective view showing the back of the electronic device. The electronic device 10 may be a smart phone or a wearable device. Components of an electronic device such as a smart phone will be described with reference to FIGS. 1 and 2 .

As shown in FIG. 1 , a touch screen 11 may be disposed at the center of the front surface of the electronic device 10 . The touch screen 11 may occupy most of the front surface of the electronic device 10 . 1 shows an example in which the main home screen is displayed on the touch screen 11 . The main home screen is the first screen displayed on the touch screen 11 when the power of the electronic device 10 is turned on. Also, when the electronic device 10 has multiple pages of different home screens, the main home screen may be a first home screen among the multiple pages of home screens. Shortcut icons for executing frequently used applications, a main menu switching key, time, weather, and the like may be displayed on the home screen. The main menu conversion key may display a menu screen on the touch screen 11 . In addition, a status bar 11d may be formed at the top of the touch screen 11 to display conditions such as a battery charging state, received signal strength, and current time. A home key 11a, a menu button 11b, and a back button 11c may be formed below the touch screen 11 .

The home key 11a may display a main home screen on the touch screen 11 . For example, when the home button 11a is touched while any home screen different from the main home screen or menu screen is displayed on the touch screen 11, the main home screen appears on the touch screen 11. A screen may be displayed. In addition, when the home key 11a is touched while applications are running on the touch screen 11, the main home screen may be displayed on the touch screen 11. Also, the home key 11a may be used to display recently used applications or a task manager on the touch screen 11 . The menu button 11b may provide a connection menu that can be used on the touch screen 11 . The connection menu may include a widget addition menu, a background screen change menu, a search menu, an edit menu, an environment setting menu, and the like. The back button 11c may display a screen executed immediately before the currently executed screen or terminate the most recently used application.

According to various embodiments of the present disclosure, as shown in FIG. 1 mentioned above, a first camera 12a, an illuminance sensor 12b, or a proximity sensor 12c may be included in the upper front area of the electronic device 10. there is.

As shown in FIG. 2 , a second camera 13a, a flash 13b, or a speaker 13c may be included on the rear surface of the electronic device 10 .

In addition, the heat dissipation material used in this embodiment can be applied to portable terminals, refrigerators, and buildings, but the present invention is not limited thereto and may be equally applied to heat dissipation materials used in other industrial fields.

A configuration of a heat dissipation structure provided in the electronic device 10 according to various embodiments of the present disclosure will be described in detail.

3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. 5 is a side view briefly illustrating a side of an electronic device according to various embodiments of the present disclosure.

3 and 5, the electronic device 10 includes a cover glass 110, a display 120, a first plate 140, a printed circuit unit 150, a second plate 160, and a rear cover 130. can include

A cover glass 110 may be disposed on the outermost front surface of the electronic device 10 . The cover glass 110 may use a reinforced material having high hardness to protect internal components of the electronic device 10 from an external impact and to prevent scratches on an external surface. In addition, the cover glass 110 can enhance the external appearance of the electronic device 10 so that the user can have a sense of aesthetics.

The electronic device 10 includes a first plate 140 disposed under the cover glass 110 to face in a first direction (eg, facing the front) and a plate corresponding to a direction opposite to the first direction. It may include a second plate 160 disposed to face a second direction (eg, to face a rear surface).

According to an embodiment, the first plate 140 may serve to receive and diffuse heat generated from various heat sources 151 disposed in the printed circuit unit 150 of the electronic device 10, and The plate 160 may serve to fix each component of the electronic device 10 . Depending on the electronic device 10, the first plate 140 may not exist, and the second plate may be made of a metal type or an injection type.

According to one embodiment, the first plate 140 and the second plate 160 may be formed of a flexible shape including a curved part in addition to being formed of a flat plate shape. In addition, outer surfaces of the side surface of the first plate 140 and the second plate 160 other than the front surface may also be manufactured in a shape including some curved parts so that the user can easily grip them with his or her hands. Accordingly, in the case of the electronic device 10 including the curved portion, the user can easily click each button while holding the electronic device 10 comfortably.

The display 120 is a concept including the above-described touch screen 11 (see FIG. 1 ) and the like, and in one embodiment of the present invention, it is configured to include a screen area exposed through a partial area of the first plate 140 It can be. The display 120 may be manufactured using organic, inorganic, or natural materials that emit light to display a screen. The configuration of the display 120 will be described later, and specific details will be omitted.

The printed circuit unit 150 is disposed between the first plate 140 and the second plate 160, and is a central processing unit (CPU), an application processor (AP), or a communication processor ( communication processor (CP)) may include one or more. The CPU, AP, CP, etc. may execute operations or data processing related to control and/or communication of at least one other component of the electronic device 10 as a heat source 151 that generates heat. A network between components disposed on the printed circuit unit 150 and a network with other components will be described later.

The rear cover 130 is positioned on the outermost rear surface of the electronic device 10 to correspond to the cover glass 110 and serves to protect the rear surface of the device, such as a battery. The rear cover 130 may use a reinforced material having high hardness to protect internal components of the electronic device 10 from an external impact and to minimize scratches on the external surface. In addition, the rear cover 130, like the glass cover 110, can enhance the external appearance of the electronic device 10 so that the user can have a sense of aesthetics.

If the rear cover 130 is configured such that the battery pack of the electronic device 10 is detachable, the lower surface of the electronic device 10 may be a detachable battery cover 15 (see FIG. 2 ). The rear cover 130 may be implemented in a shape in which at least a portion forms a curved surface so that a user can easily grip it.

Hereinafter, the electronic device 10 including the heat dissipating material 170 will be described in detail through additional drawings.

4 is a diagram illustrating an improved heat dissipation structure of a printed circuit unit according to various embodiments of the present disclosure. 5 and 6 are schematic diagrams structurally illustrating a side portion of a second plate to improve heat dissipation according to various embodiments of the present disclosure. FIG. 7 is a photograph showing an effect of improving heat generation by improving the structure of FIG. 5 or 6 .

First, referring to FIGS. 4 and 5 , the electronic device 10 includes a first plate 140 directed in a first direction, a second plate 160 directed in a second direction opposite to the first direction, and A printed circuit unit including a display 120 disposed to be exposed through a partial area of one plate and at least one heat source 151 disposed in a space between the first plate 140 and the second plate 160 (150) may be included.

In one embodiment, the first plate 140 may include a bracket made of metal or plastic, and the second plate 160 may include a rear made of a metal material to surround a side area. there is. In addition, the printed circuit unit 150 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

For example, since the second plate 160 made of a metal material has thermal conductivity, the heat generated from the heat source 151 of the printed circuit unit 150 increases the diffusion effect to the side area 161 and the side area Excessive heat is concentrated in (161) and a phenomenon in which the temperature rises may occur. The side area 161 of the electronic device 10 is a portion directly contacted by a palm or a finger when a user grips the electronic device 10, and corresponds to a portion where temperature is essential to decrease.

Therefore, according to one embodiment of the present invention, at least one open slit 163 may be formed in the side area 161 of the second plate 160 . In addition, a heat insulating material may be inserted into the opened slit 163 . The heat insulating material serves to prevent heat transfer, thereby suppressing a temperature increase. In addition, the heat dissipation material 170 may be disposed on the side area 161 of the second plate 160 together with the open slit 163 . The portion where the heat dissipating material 170 is disposed may be the upper or lower surface of the open slit 163 , including the open slit 163 . According to the present invention, the opening of the opened slit 163 is configured in a long oval shape, but is not limited thereto, and may be designed in various shapes in a region where heat is generated according to a heat diffusion path. In addition, the heat dissipation material 170 may be variously formed of a solid sheet or a liquid paint in order to dissipate heat on all surfaces of the front and rear surfaces in addition to the side areas.

4(a) is a structure showing the second plate 160 made of a metal material before improvement, and has a shape in which the front surface is closed due to the metal. In the above structure, excessive heat is generated on the side of the electronic device 10, resulting in performance degradation and user inconvenience. 4(b) shows a structure in which an open slit 163 is formed on the side area 611 of the second plate 160, and FIG. It is a structure filled with an insulating material made of synthetic plastic material. 4(d) is a heating point viewed from the side of the electronic device 10 .

Due to the open slit 163 according to the improved structure, the transfer path of heat diffused toward the side area 161 is blocked or bypassed, and due to the heat insulating material or the heat dissipating material 170, heat conduction is lowered and heat distribution and diffusion are reduced. It is possible to realize the effect of lowering the temperature of the side part of the electronic device 10 by inducing it.

Referring to FIG. 7, FIG. 7(a) is a thermal distribution diagram showing the thermal diffusion effect before the structural improvement, and FIG. 7(b) is a thermal distribution diagram showing the thermal diffusion effect after the structural improvement. (The redder color means higher temperature)

Comparing FIGS. 7(a) and 7(b) , it can be seen that heat is diffused to the side region 161 without any hindrance before improvement. Then, after structurally disposing the opened slit 163 and the heat insulating material, it was confirmed that the temperature of the side region 161 was relatively decreased.

According to an embodiment of the present invention, heat generated from a heat source 151 located on a side area 161 of the electronic device 10, that is, a power amplifier module (PAM) or an application processor (AP) is transferred to the side area 161. ) has the effect of spreading to other places. In addition, there is an effect of solving the high heat generation problem of the side surface of the electronic device 10 that the user continuously raised as a problem while using the electronic device 10 .

6 is a simplified diagram illustrating a structure for reducing heat generation in a side region of an electronic device according to another embodiment of the present invention.

Referring to FIG. 6 , the electronic device 10 includes a first plate 140 directed in a first direction, a second plate 160 directed in a second direction opposite to the first direction, and a part of the first plate. The display 120 disposed to be exposed through the area and the printed circuit unit 150 disposed in the space between the first plate 140 and the second plate 160 and including at least one heat source 151 can include

According to one embodiment, the first plate 140 may include a bracket made of a metal material to surround a side area, and the second plate 160 is made of a metal or plastic material and disposed on the rear (rear). Rear) may be included. In addition, the printed circuit unit 150 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

According to one embodiment, since the first plate 140 made of a metal material has thermal conductivity, the effect of heat generated from the heat source 151 of the printed circuit unit 150 being diffused to the side area is increased and the side area is increased. Excessive heat may be concentrated in it, causing the temperature to rise. Therefore, according to the embodiment of the present invention, at least one open slit 143 may be formed in the side area of the first plate 140 . In addition, a heat insulating material may be inserted into the opened slit 163 . The heat insulating material serves to prevent heat transfer, thereby suppressing a temperature increase. In addition, the heat dissipation material 170 may be disposed on the side region of the first plate 140 together with the open slit 143 . The portion where the heat dissipating material 170 is disposed may be the upper or lower surface of the open slit 163, including the open slit 143. According to the present invention, the opening of the opened slit 163 is configured in a long oval shape, but is not limited thereto, and may be designed in various shapes in a region where heat is generated according to a heat diffusion path. In addition, the heat dissipation material 170 may be variously formed of a solid sheet or a liquid paint in order to dissipate heat on all surfaces of the front and rear surfaces in addition to the side areas.

Through this embodiment, the diffusion path of heat generated in the side area of the electronic device 10 can be changed to the peripheral area, so that the user can use the electronic device 10 without discomfort. Other specific details are the same as those of the previous embodiment, so they are omitted.

8 is a simplified diagram illustrating a heat dissipation structure for improving heat generation on the front surface of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 8 , the electronic device 10 includes a first plate 240 directed in a first direction, a second plate 260 directed in a second direction opposite to the first direction, and a part of the first plate. The display 220 disposed to be exposed through the area and the printed circuit unit 250 disposed in the space between the first plate 240 and the second plate 260 and including at least one heat source 251 can include In addition, a rear cover 230 disposed below the second plate 260 and protecting the electronic device 10 from an external shock transferred to the rear side may be included.

In one embodiment, the first plate 240 may include a bracket made of metal or plastic, and the second plate 260 may include a rear made of metal or plastic. In addition, the printed circuit unit 250 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

At least one heat source 251 disposed on the printed circuit unit 250 of the electronic device 10 generates heat according to driving of the circuit, and the heat can be diffused in the first direction. In addition, the heat source 251 disposed on the rear surface of the printed circuit unit 250 is driven so that heat can be diffused in the second direction. Accordingly, excessive concentration of heat may occur in the display 220 located on the front of the electronic device 10, and in order to suppress this, it is necessary to dispose a heat dissipation material 270 that disperses the heat diffusion path around the display 220. there is. In addition, excessive heat concentration may occur on the rear cover 230 located on the rear side of the electronic device 10, and in order to suppress this, a heat dissipation material 270 distributing the heat diffusion path to the periphery of the rear cover 230 may be disposed. There is a need.

First of all, a structure for improving heat generation in a specific region (eg, a display) in the first direction is proposed.

The first heat dissipating material 270 (a) is disposed between the display 220 and the first plate 240 and dissipates heat generated from the heat source 251 disposed on the printed circuit unit 250 moving in the first direction. play a role For example, the heat source 251 of the printed circuit unit 250 may be at least one chip disposed on the printed circuit unit 250 and may include a PMIC, PAM, AP, CP, and the like.

In addition, the first heat dissipation material 270 (a) may include, for example, a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint. Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

The first heat-dissipating material 270 (a) may be disposed to face and contact the display 220 and may be disposed to face the first plate 240 with a predetermined gap therebetween. The reason why the planar first gap layer g1 including the gap is placed on one surface of the first heat dissipation material 270 (a) is that the heat diffused from the heat source 251 directly passes through the first heat dissipation material 270 (a). This is to generate initial diffusion through the first interstitial layer (g1) without going through. Accordingly, after the heat is evenly distributed over the entire surface of the first heat dissipating material 270 (a) according to the initial diffusion, the diffusion effect may be maximized by contacting the first heat dissipating material 270 (a).

In addition, the first plate 240 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible.

Therefore, according to the present embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 passes through the first plate 240, the first gap g1, and the first heat dissipation material 270 (a) to display ( 220) can be reached. Heat is primarily diffused through the first plate 240 made of a metal material, and secondary and tertiary diffusion may be achieved through the first gap g1 and the first heat dissipation material 270 (a). In particular, the first heat-dissipating material 270 (a) effectively dissipates the path of heat toward the display 220 located in the first direction of the heat source 251, substantially reducing the temperature of a specific part of the display 220. can make it

The front area of the electronic device 10 corresponds to a portion where a user's finger contacts the touch screen when using the electronic device 10 or a portion where the face surface directly contacts when making a call, and is essential for temperature reduction.

According to the heat dissipation improvement structure, the arrangement of the first heat dissipation material 270 (a) and the first gap g1 inside the electronic device 10 reduced heat generation in the portion where the user's skin contacts. Due to this, there is an effect of solving the heating problem that the user continuously raised as a problem while using the electronic device 10 .

9 is a simplified diagram illustrating a heat dissipation structure for improving heat generation on the front surface of an electronic device according to another embodiment of the present invention.

Referring to FIG. 9 , the electronic device 10 includes a first plate 240 directed in a first direction, a second plate 260 directed in a second direction opposite to the first direction, and a part of the first plate. The display 220 disposed to be exposed through the area and the printed circuit unit 250 disposed in the space between the first plate 240 and the second plate 260 and including at least one heat source 251 can include In addition, a rear cover 230 disposed below the second plate 260 and protecting the electronic device 10 from an external shock transferred to the rear side may be included.

In one embodiment, the first plate 240 may include a bracket made of metal or plastic, and the second plate 260 may include a rear made of metal or plastic. In addition, the printed circuit unit 250 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

According to this embodiment, a plurality of heat dissipation materials 270 may be disposed inside the electronic device 10 .

The heat dissipation material 270 is disposed as a first heat dissipation material 270 (a) and a second heat dissipation material 270 (b) between the display 220 and the first plate 240, respectively, and the printed circuit unit 250 It serves to dissipate heat moving in the first direction from the heat source 251 in the upper region. For example, the heat source 251 of the printed circuit unit 250 may be at least one chip disposed on the printed circuit unit 250, a Power Management IC (PMIC), a Power Amplifier Module (AP) ( Application Processor), CP (Communication Processor), and the like.

In addition, the first heat dissipation material 270 (a) and the second heat dissipation material 270 (b) may include, for example, a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint. . Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

The first heat-dissipating material 270 (a) may be disposed in face-to-face contact with the display 220, and may be disposed face-to-face with the second heat-dissipating material 270 (b) with a predetermined gap therebetween. The first gap layer (g1) of the plane including the gap is disposed on one surface of the first heat dissipation material 270(a) and the second heat dissipation material 270(b), so that the heat diffused from the heat source 251 This is to maximize the diffusion effect by contacting the first heat dissipating material 270 (a) after being evenly dispersed over the entire surface of the first heat dissipating material 270 (a) by diffusion through the gap layer g1.

The second heat dissipation material 270 (b) is disposed facing the first heat dissipation material 270 (a) and the first gap layer g1, and may be disposed in contact with the first plate 240. In addition, the first plate 240 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible.

Therefore, according to this embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 is transferred to the first plate 240, the first heat dissipation material 270 (a), the first gap layer (g1), and the second It may reach the display 220 through the heat dissipating material 270 (b). Heat is primarily diffused through the first plate 240 made of a metal material, and further diffused through the first gap layer g1 and the first and second heat dissipation materials 270 (a) and 270 (b). It can be done. In particular, the first heat dissipation material 270 (a) and the second heat dissipation material 270 (b) effectively dissipate the path of heat toward the display 220 located on the first direction of the heat source 251, thereby substantially displaying the display. (220) can significantly reduce the temperature of a specific area.

According to one embodiment, the second heat dissipation material 270 (b) is composed of a single layer on the entire surface of the first plate 240, but a plurality of layers corresponding to the size of the heat source 251 are placed on top of the heat source 251. Can be placed face to face.

The front area of the electronic device 10 corresponds to a portion where a user's finger contacts the touch screen when using the electronic device 10 or a portion where the user's face directly contacts the electronic device 10 during a call, and is essential for temperature reduction. According to the heat dissipation improvement structure, the arrangement of the first heat dissipation material 270 (a), the second heat dissipation material 270 (b), and the first gap g1 inside the electronic device 10 is such that the user's skin is in contact with the skin. The heat reduction was achieved in the part. Due to this, there is an effect of solving the heating problem that the user continuously raised as a problem while using the electronic device 10 .

10 is a simplified view showing a heat dissipation structure for improving heat generation on the front surface of an electronic device according to another embodiment of the present invention.

Referring to FIG. 10 , the electronic device 10 includes a first plate 240 facing in a first direction, a second plate 260 facing in a second direction opposite to the first direction, and a part of the first plate. The display 220 disposed to be exposed through the area and the printed circuit unit 250 disposed in the space between the first plate 240 and the second plate 260 and including at least one heat source 251 can include In addition, a rear cover 230 disposed under the second plate 260 and protecting the electronic device 10 from an external shock transmitted to the rear side may be included.

According to this embodiment, a plurality of heat dissipation materials 270 may be disposed inside the electronic device 10 . The heat dissipation material 270 includes a first heat dissipation material 270 (a), a second heat dissipation material 270 (b) and a third heat dissipation material 270 (c) between the display 220 and the printed circuit unit 250. is disposed, and serves to dissipate heat moving in the first direction from the heat source 251 in the area on the printed circuit unit 250. For example, the heat source 251 of the printed circuit unit 250 may be at least one chip disposed on the printed circuit unit 250 and may include a PMIC, PAM, AP, CP, and the like.

In addition, the first heat dissipation material 270 (a), the second heat dissipation material 270 (b), or the third heat dissipation material 270 (c) is, for example, a heat pipe, solid heat dissipation It may include a sheet or a liquid heat-dissipating paint. Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

The first heat-dissipating material 270 (a) may be disposed in face-to-face contact with the display 220, and may be disposed face-to-face with the second heat-dissipating material 270 (b) with a predetermined gap therebetween. The first gap layer (g1) of the plane including the gap is disposed on one surface of the first heat dissipation material 270(a) and the second heat dissipation material 270(b), so that the heat diffused from the heat source 251 This is to maximize the diffusion effect by contacting the first heat dissipating material 270 (a) after being evenly dispersed over the entire surface of the first heat dissipating material 270 (a) by diffusion through the gap layer g1.

The second heat dissipation material 270 (b) is disposed facing the first heat dissipation material 270 (a) and the first gap layer g1, and may be disposed in contact with the first plate 240. In addition, the first plate 240 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible.

The third heat dissipation material 270 (c) is disposed parallel to the first heat dissipation material 270 (a) and the second heat dissipation material 270 (b), and may be disposed facing the printed circuit unit 250 . For example, the third heat dissipation material 270 (c) may have one surface disposed in contact with the first plate 240 and the other surface disposed with a predetermined gap between the printed circuit unit 250 and the printed circuit unit 250 . In this embodiment, the third heat dissipation material 270 (c) is shown to be disposed in parallel over the front area of the printed circuit unit 250 facing each other, but is not limited thereto, and the heat source 251 of the printed circuit unit 250 A plurality of heat sources 251 may be disposed on the upper surface in a size corresponding to the size of the heat source 251 .

According to this embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 is transferred to the first heat dissipating material 270 (a), the first plate 240, the second heat dissipating material 270 (b), It may reach the display 220 through the first gap g1 and the third heat dissipation material 270 (c). The heat diffused from the heat source 251 is preferentially dissipated by the first heat dissipating material 270 (a), and the primarily dissipated heat is diffused to the first plate 240 made of a metal material. It can be done. In addition, additional diffusion may be achieved through the second heat dissipation material 270 (b), the first gap g1, and the third heat dissipation material 270 (c). In particular, the first heat dissipation material 270 (a), the second heat dissipation material 270 (b), and the third heat dissipation material 270 (c) are disposed on the first direction of the heat source 251, the display 220 By effectively dissipating the path of heat toward the display 220, the temperature rising at a specific part of the display 220 can be substantially reduced.

The front area of the electronic device 10 corresponds to a portion where a user's finger contacts the touch screen when using the electronic device 10 or a portion where the user's face directly contacts the electronic device 10 during a call, and is essential for temperature reduction. According to the heat dissipation improvement structure, the first heat dissipation material 270 (a), the second heat dissipation material 270 (b), the third heat dissipation material 270 (c) and the first gap inside the electronic device 10 The arrangement of (g1) achieved a reduction in heat generation in the part where the user's skin contacts. Due to this, there is an effect of solving the heating problem that the user continuously raised as a problem while using the electronic device 10 .

11 is a simplified view showing a heat dissipation structure for improving heat generation on the front surface of an electronic device according to another embodiment of the present invention.

Referring to FIG. 11 , the electronic device 10 is designed to have a structure without a first plate unlike the above embodiments. Therefore, from the upper side, the display 220, the first heat dissipating material 270 (a), the first gap layer g1, the printed circuit unit 250 including at least one heat source 251, the second plate 260, and The rear cover 230 may be configured to be laminated.

According to this embodiment, when heat is dissipated from the heat source 251 of the printed circuit unit 250 to the front surface, that is, in the first direction, in order to dissipate the heat concentrated on the display 220, the first heat dissipating material 270 (a) )) can be placed.

The first heat dissipating material 270 (a) is disposed between the display 220 and the printed circuit unit 250, and serves to dissipate heat moving in the first direction from the heat source 251 in the area on the printed circuit unit 250. do The first heat dissipating material 270 (a) may be disposed facing the display 220 and may be disposed facing the printed circuit unit 250 with a predetermined gap therebetween. In the first gap layer g1 between the first heat dissipating material 270 (a) and the printed circuit unit 250, the heat transferred from the heat source 251 is primarily diffused to form the first heat dissipating material 270 (a). This is to maximize the diffusion effect by contacting the first heat dissipating material 270 (a) after being evenly distributed over the entire surface. Hereinafter, specific details are omitted because they are the same as those of the embodiment of FIG. 9 .

According to FIGS. 8 to 11 described above, a structure for reducing heat generated from the front surface of the electronic device 10 has been described, and hereinafter, FIGS. 12 and 13 describe a structure for reducing heat generated from the rear surface of the electronic device 10. let it do

12 is a simplified diagram illustrating a structure for reducing heat generated from a rear surface of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 12 , the electronic device 10 includes a first plate 340 facing in a first direction, a second plate 360 facing in a second direction opposite to the first direction, and a part of the first plate. The display 320 disposed to be exposed through the area and the printed circuit unit 350 disposed in the space between the first plate 340 and the second plate 360 and including at least one heat source 351 can include In addition, a rear cover 330 disposed below the second plate 360 and protecting the electronic device 10 from an external shock transferred to the rear side may be included.

In one embodiment, the first plate 340 may include a bracket made of metal or plastic, and the second plate 360 may include a rear made of a metal material to surround a side area. there is. In addition, the printed circuit unit 350 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

At least one heat source 351 disposed on the printed circuit unit 350 of the electronic device 10 is driven by the heat source 351 disposed on the rear side according to the driving of the circuit, so that heat can be dissipated in the second direction.

Therefore, the fourth heat dissipation material 370 (a) of the present embodiment is disposed between the second plate 360 and the rear cover 330, and is generated from the heat source 351 in the lower area of the printed circuit unit 350 to spread in the second direction. It serves to dissipate the heat dissipated by the For example, the heat source 351 of the printed circuit unit 350 may be at least one chip disposed on the printed circuit unit 350 and may include a PMIC, PAM, AP, CP, and the like.

In addition, the fourth heat dissipation material 370 (a) may include, for example, a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint. Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

The fourth heat dissipation material 370 (a) may be disposed to face the rear cover 330 and may be disposed to face the second plate 360 with a predetermined gap therebetween. The reason why the planar third gap layer (g3) including the gap is placed on one side of the heat dissipation material 270 is that heat transferred from the heat source 351 does not directly pass through the fourth heat dissipation material 370 (a), and This is to generate initial diffusion through the three-gap layer g3. Accordingly, after the heat is evenly distributed over the entire surface of the fourth heat dissipation material 370 (a) according to the initial diffusion, the diffusion effect may be maximized by contacting the fourth heat dissipation material 370 (a).

According to this embodiment, the second plate 360 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible. In addition, a second gap layer g2 may be provided between the second plate 360 and the heat source 351 of the printed circuit unit 350 to further distribute heat.

Therefore, according to this embodiment, the heat diffused from the heat source 351 of the printed circuit unit 350 is transferred to the second gap layer g2, the second plate 360, the third gap layer g3, and the heat dissipation material 270. It is possible to reach the rear cover 330 through. Primary diffusion is performed through the second interstitial layer g2, and additional diffusion of heat can be performed through the second plate 360 made of a metal material, the third interstitial layer g3, and the heat dissipation material 270. . In particular, the heat dissipation material 270 can effectively dissipate the heat path toward the rear cover 330 located in the second direction of the heat source 351 to substantially reduce the temperature of a specific part of the rear cover 330 significantly. there is.

The rear surface of the electronic device 10 is a part that is directly contacted while being supported by a user's hand when using the electronic device 10, and thus, temperature reduction is essential. The heat dissipation material and the interstitial layer inside the electronic device 10, which is the improved structure, reduced heat generation in the area where the user's skin comes into contact. Due to this, there is an effect of solving the heating problem that the user continuously raised as a problem while using the electronic device 10 .

13 is a simplified diagram illustrating a structure for reducing heat generated from a rear surface of an electronic device according to another embodiment of the present invention.

Referring to FIG. 13 , the electronic device 10 includes a first plate 340 directed in a first direction, a second plate 360 directed in a second direction opposite to the first direction, and a part of the first plate. The display 320 disposed to be exposed through the area and the printed circuit unit 350 disposed in the space between the first plate 340 and the second plate 360 and including at least one heat source 351 can include In addition, a rear cover 330 disposed below the second plate 360 and protecting the electronic device 10 from an external shock transferred to the rear side may be included.

According to another embodiment, the first plate 340 may include a bracket made of metal or plastic, and the second plate 360 includes a rear configured to surround a side area with a metal material. can do. In addition, the printed circuit unit 350 may include a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB).

At least one heat source 351 disposed on the printed circuit unit 350 of the electronic device 10 is driven by the heat source 351 disposed on the rear side according to the driving of the circuit, so that heat can be dissipated in the second direction.

According to this embodiment, a plurality of heat dissipation materials 270 may be disposed inside the electronic device 10 . The fourth heat dissipation material 370 (a) is disposed between the second plate 160 and the back cover 130, and the fifth heat dissipation material 370 (b) is disposed between the printed circuit unit 350 and the second plate 160. It serves to sequentially dissipate heat generated from the heat source 351 in the lower area of the printed circuit unit 350 and dissipated in the second direction. For example, the heat source 151 of the printed circuit unit 350 may be at least one chip disposed on the printed circuit unit 350 and may include a PMIC, PAM, AP, CP, and the like.

In addition, the fourth heat dissipation material 370 (a) and the fifth heat dissipation material 370 (b) may include, for example, a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint. there is. Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

The fourth heat dissipation material 370 (a) may be disposed to face the rear cover 330 and may be disposed to face the second plate 360 with a predetermined gap therebetween. The reason why the planar third gap layer (g3) including the gap is placed on one side of the heat dissipation material 270 is that heat transferred from the heat source 351 does not directly pass through the fourth heat dissipation material 370 (a), and This is to generate initial diffusion through the three-gap layer g3. Accordingly, after the heat is evenly distributed over the entire surface of the fourth heat dissipation material 370 (a) according to the initial diffusion, the diffusion effect may be maximized by contacting the fourth heat dissipation material 370 (a).

The fifth heat dissipation material 370 (b) is disposed parallel to the fourth heat dissipation material 370 (a) and may be disposed facing the printed circuit unit 350 and the third gap layer g3 therebetween. For example, one surface of the fifth heat dissipation material 370 (b) may be disposed in contact with the second plate 240 and the other surface may be disposed with the printed circuit unit 250 and a predetermined gap therebetween. In this embodiment, the fifth heat dissipation material 370 (b) is shown to be disposed in parallel across the front area of the printed circuit unit 350, but is not limited thereto, and the heat source 351 of the printed circuit unit 350 A plurality of heat sources 351 may be disposed on the upper surface in a size corresponding to the size of the heat source 351 .

In addition, the second plate 160 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible.

Therefore, according to this embodiment, the heat diffused from the heat source 151 of the printed circuit unit 350 is transferred to the second gap layer g2, the fifth heat dissipation material 370 (b), the second plate 360, and the third gap. The rear cover 130 may be reached through the layer g3 and the fourth heat dissipating material 370 (a). The primary diffusion is performed through the second interstitial layer g2, and the fifth heat dissipation material 370(b), the second plate 160 made of a metal material, the third interstitial layer g3, and the heat dissipation material 170 ) through which additional diffusion of heat can be achieved. In particular, the fourth heat dissipation material 370 (a) and the fifth heat dissipation material 370 (b) effectively dissipate the path of heat toward the rear cover 130 located in the second direction of the heat source 151 to substantially As a result, the temperature of a specific part of the rear cover 130 can be significantly reduced.

The rear surface of the electronic device 10 is a part that is directly contacted while being supported by a user's hand when using the electronic device 10, and thus, temperature reduction is essential. The heat dissipation material and the interstitial layer inside the electronic device 10, which is the improved structure, reduced heat generation in the area where the user's skin comes into contact. Due to this, there is an effect of solving the heating problem that the user continuously raised as a problem while using the electronic device 10 .

14 is a front view of a printed circuit unit according to various embodiments of the present disclosure. 15 is a side view illustrating a heat dissipation material disposed in a heat source of a printed circuit unit according to various embodiments of the present disclosure.

Referring to FIG. 14, a heat source 151, a shield can 472 or a shielding member 471 including a shielding film, and a heat transfer material 473 may be included on the upper and lower surfaces of the printed circuit unit 450. there is.

The heat source 151 is a key element that drives the electronic device 10 and processes calculations and the like, and serves to generate heat. The heat source 151 of the printed circuit unit 150 may be at least one chip disposed on the printed circuit unit 150 and may include a PMIC, PAM, AP, CP, and the like. The shielding member 471 includes a shield can 472 or a shielding film, is disposed to surround the heat source 151, and serves to improve RF performance. For example, the shield can 472 may be made of a SUS material. The heat transfer material 473 is disposed above the heat source 151 and may be used to transfer and dissipate heat. The heat transfer material 473 may include a material that transfers heat, such as a thermal interface material (TIM) or a phase change material (PCM).

Referring to FIG. 15 , the electronic device 10 includes a first plate 440 directed in a first direction, a second plate 460 directed in a second direction opposite to the first direction, and a part of the first plate. The display 420 disposed to be exposed through the area and the printed circuit unit 450 disposed in the space between the first plate 440 and the second plate 460 and including at least one heat source 451 can include In addition, a rear cover 430 disposed below the second plate 460 and protecting the electronic device 10 from an external shock transmitted to the rear side may be included.

At least one heat source 451 disposed on the printed circuit unit 450 of the electronic device 10 is driven by the heat source 451 disposed on the front side according to the driving of the circuit, so that heat can be diffused in the first direction. In addition, the heat source 451 disposed on the rear surface of the printed circuit unit 450 is driven so that heat can be diffused in the second direction. Accordingly, excessive heat may be concentrated on the display 420 located on the front side of the electronic device 10 or the rear cover 430 located on the rear side of the electronic device 10. It is necessary to arrange a heat dissipation material 470 that disperses the diffusion path of heat.

In this embodiment, by disposing the shielding member 471 and the heat dissipating material 170 around each heat source 151, the heat can be diffused to the surrounding area. The shielding member 471 may be disposed to cover the heat source 451 disposed on the upper and lower surfaces of the printed circuit unit 450 . Since the inside of the shielding member 471 constitutes an empty space, it may have the effect of the gap layer.

The heat dissipation material 470 is adhesively disposed on the upper or lower surface of the shielding member 471 so that the heat generated from the heat source 451 passes through the space inside the shielding member 471 and then comes into contact with the shield member 471 to cause heat dissipation. do.

According to this embodiment, heat diffused from the heat source 451 of the printed circuit unit 450 may reach the display 420 or the rear cover 430 via the shielding member 471 and the heat dissipating material 470.

The heat generated from the heat source 451 is primarily diffused through the space of the shielding member 471 and may be additionally diffused through the heat dissipating material 470 . In particular, the heat dissipation material 470 effectively radiates the path of heat toward the display 420 located in the first direction of the heat source 451 or the rear cover 430 located in the second direction, thereby substantially reducing the electronic device 10. The temperature of a specific area on the outer surface can be significantly reduced.

16 is a side view illustrating a heat transfer material disposed in a heat source of a printed circuit unit according to another embodiment of the present invention.

Referring to FIG. 16 , the electronic device 10 includes a first plate 540 directed in a first direction, a second plate 560 directed in a second direction opposite to the first direction, and a part of the first plate. The display 520 disposed to be exposed through the area and the printed circuit unit 550 disposed in the space between the first plate 540 and the second plate 560 and including at least one heat source 551 can include In addition, a rear cover 530 disposed below the second plate 560 and protecting the electronic device 10 from an external shock transferred to the rear side may be included.

At least one heat source 551 disposed on the printed circuit unit 550 of the electronic device 10 is driven by the heat source 551 disposed on the front side according to the driving of the circuit, so that heat can be diffused in the first direction and the second direction. there is.

In this embodiment, the heat may be diffused by disposing the shielding member 571 and the heat transfer material 573 around each heat source 551 . The shielding member 571 may be disposed to cover the heat source 551 disposed on the upper and lower surfaces of the printed circuit unit 550 . Since the inside of the shielding member 571 constitutes an empty space, it may have the effect of the gap layer.

The heat transfer material 571 may form at least one hole in the shielding member 571, and heat generated from the heat source 551 and directed in a first direction may be transferred in a second direction. For example, the heat transfer material 573 may play a role in that heat dissipated toward the display 520 is reflected on the back side and transferred to the rear cover 530 so that the front and rear heat is equally diffused. The heat transfer material 573 is a silicon material, and solid silicon or liquid silicon made of a polymer may be used, and it is made of a material having a high extrusion rate.

Although the present invention has described a structure in which heat transmitted in a first direction through a heat source 551 is diffused in a second direction, the heat transmitted in a second direction from the heat source 551 is diffused in the first direction, so that the heat transfer material ( 573) can be placed, of course.

Due to the structure of the electronic device 10 as described above, the temperature of a specific area on the outer surface of the electronic device 10 can be significantly reduced.

17 is a side view illustrating a heat transfer material and a heat dissipation material disposed in a heat source of a printed circuit unit according to another embodiment of the present invention.

Referring to FIG. 17 , at least one heat source 651 disposed on the printed circuit unit 650 of the electronic device 10 is driven by the heat source 651 disposed on the front side according to the driving of the circuit, so that the heat source 651 moves in the first and second directions. As a result, heat diffusion can be achieved.

In this embodiment, in the embodiment of FIG. 17 , the heat dissipation material 670 may be additionally disposed on the upper side of the heat transfer material 673 facing the gap. Therefore, the heat generated by the heat source 651 diffuses in a significant portion in different directions through the heat transfer material 673, and the heat concentration in a specific area can be suppressed by the gap and the heat dissipation material 670.

In the above embodiment, the heat transfer material 673 and the heat dissipation material 670 corresponding to the heat directed in the first direction are disposed, but the present embodiment is not limited thereto, and the heat transfer material 670 and the heat dissipation material 670 corresponding to the heat directed in the second direction are disposed. ) can be disposed on the lower side of the printed circuit unit 650, of course. In addition, although the heat dissipation material 670 is arranged in a size corresponding to that of the heat source 651 and the heat transfer material 673, the first plate 640 may be disposed on the entire surface or divided into a plurality of pieces.

In addition, it can be manufactured to have a heat dissipation effect by using a method of directly applying a liquid heat dissipation paint to a product where it is difficult to apply a solid heat dissipation material to the inner surface of the electronic device. A place where it is difficult to apply a solid heat dissipation material may be, for example, a side surface of a device or an inside of a product that is structurally complex and has many bends.

Hereinafter, a manufacturing process of the heat dissipation structure of the electronic device 10 will be described in detail.

18 is a flowchart illustrating a method of manufacturing a heat dissipation structure of an electronic device according to an embodiment of the present invention.

Referring to FIG. 18, first, a step of detecting the position of at least one heat source 151 disposed in the electronic device 10 or the path of heat diffused from the heat source 151 (FIG. 5, S10) is performed. can do.

According to an embodiment, the heat source 151 disposed in the electronic device 10 includes a chip of the printed circuit unit 150, an active matrix organic light-emitting diode (AMOLED) of the display 120, and a light-emitting diode (LED). Emitting Diodes, LCDs (Liquid Crystal Displays) and batteries, power motors, vibrators, cameras, and other parts that emit heat may be included. Here, the display 120 may include all products of a new display using organic, inorganic, natural materials, etc. in the future that show a screen by emitting light.

In addition, the heat source 151 disposed on the printed circuit unit 150 may be at least one chip disposed on the printed circuit unit 150 and may include a PMIC, PAM, AP, CP, and the like.

For example, when the display 120 is the heat source 151, heat is dissipated toward the lower portion of the electronic device 10 (in the second direction) and a diffusion path may be formed. In addition, when the chip disposed on the printed circuit unit 150 is the heat source 151, since the printed circuit unit 150 is disposed between the first plate 140 and the second plate 160, the heat source 150 Heat is dissipated toward the first plate 140 or the second plate 160 and may form a diffusion path.

After detecting the location of the heat source 151 and the diffusion path of the heat emitted from the heat source 151, a step of selecting a heat dissipation structure to correspond to the detected location of the heat source or the diffusion path (FIG. 5, S20) is performed. can do. In the step of selecting a heat dissipation structure, the heat dissipation structure may be manufactured corresponding to an area where heat is concentrated by being diffused from the heat source 151, and the area where heat is concentrated is a side surface or a front surface of the electronic device 10. , the rear part, or the inner area of the electronic device 10 may be at least one of them.

According to the embodiment according to the present invention, the side portion is an edge area of the electronic device 10 including the side key, and is a portion that directly contacts the user's palm or finger, and needs to suppress the concentration of heat. In addition, the front portion is a portion of the display 120 including the touch screen, and is in direct contact with the user's finger or face (during a call), and it is necessary to suppress the concentration of heat. Also, the rear part may be an area of the rear cover 130 covering the battery, and the inner area may be each area inside the electronic device 10 . The rear part is a part that the user's palm directly contacts to support the electronic device 10, and it is necessary to suppress the concentration of heat. there is

In addition, a step of selecting a heat dissipation material disposed according to the selected heat dissipation structure and radiating heat transferred from the heat source (FIG. 5, S30) may be performed. The heat dissipation material 170 may include, for example, a heat pipe, a solid heat dissipation sheet, or a liquid heat dissipation paint. Here, the material of the heat pipe, the solid heat dissipation sheet, or the liquid heat dissipation paint may include, for example, a high thermal conductivity material such as graphite, carbon nanotube, natural recycled material, silicon, or silicon.

Thereafter, a step of forming the selected heat dissipation structure or disposing the selected heat dissipation material 170 in the peripheral area of the heat source 151 or the diffusion path (FIG. 5, S40) may be performed. As described above, the heat dissipation structure may be at least one of the side part, the front part, the rear part, or the inner region of the electronic device 10, and first, the step of forming the side heat dissipation structure (S40(a)) will be described. In addition, the above steps (S10 to S40) are described in the embodiment of FIG. 5 as an example, but can be applied to all drawings of the present invention.

The step of forming the side heat dissipation structure and disposing the heat dissipation material (S40 (a) of FIGS. 5 and 6) includes the first plate 140 or the second plate 160 disposed above or below the printed circuit part 150. Forming at least one open slit 163 on the side area 161 (S41 (a)) and the heat dissipation material 170, which is a non-conductive material, on the side area including the formed open slit 163 It may include a step of arranging (S43 (a)).

According to an embodiment, the electronic device 10 includes a first plate 140 directed in a first direction, a second plate 160 directed in a second direction opposite to the first direction, and a portion of the first plate. The display 120 disposed to be exposed through the area and the printed circuit unit 150 disposed in the space between the first plate 140 and the second plate 160 and including at least one heat source 151 can include

First, the heat generation improvement structure of the side area of the second plate 160 will be described. In one embodiment of the present invention, since the second plate 160 made of a metal material has thermal conductivity, the effect of spreading heat generated from the heat source 151 of the printed circuit unit 150 to the side surface area 161 is increased. and excessive heat is concentrated on the side region 161, and a phenomenon in which the temperature rises may occur. The side area 161 of the electronic device 10 is a portion directly contacted by a palm or a finger when a user grips the electronic device 10, and corresponds to a portion where temperature is essential to decrease.

Accordingly, at least one open slit 163 may be formed in the side area 161 of the second plate 160 . In addition, the heat dissipation material 170 may be disposed on the side area 161 of the second plate 160 together with the open slit 161 . The portion where the heat dissipation material 170 is disposed may include the open slit 163 and may be formed on an upper or lower surface of the open slit 163 . According to the present invention, the opening of the opened slit 163 is configured in a long oval shape, but is not limited thereto, and may be designed in various shapes in a region where heat is generated according to a heat diffusion path.

Due to the open slit 163 according to the improved structure, the transfer path of heat diffused toward the side area 161 is blocked or detoured, and due to the heat dissipation material 170, heat conduction is lowered and heat distribution and diffusion are induced, so that the electron The effect of reducing the temperature of the side portion of the device 10 can be realized.

Next, the heating improvement structure of the side region of the first plate 140 will be described. In another embodiment of the present invention, since the first plate 140 made of a metal material has thermal conductivity, the heat generated from the heat source 151 of the printed circuit unit 150 increases the effect of spreading to the side surface area and Excessive heat may be concentrated in an area, causing a temperature increase. Therefore, according to the embodiment of the present invention, at least one open slit 143 may be formed in the side area of the first plate 140 . In addition, the heat dissipation material 170 may be disposed on the side region of the first plate 140 together with the open slit 143 . The portion where the heat dissipating material 170 is disposed may include the open slit 143 and may be formed on an upper or lower surface of the open slit 143 .

Through this embodiment, the diffusion path of heat generated in the side area of the electronic device 10 can be changed to the peripheral area, so that the user can use the electronic device 10 without discomfort. Other specific details are the same as those of the previous embodiment, so they are omitted.

Next, the steps of forming the front heat dissipation structure and disposing the heat dissipation material (FIG. 8 to 11, S40(b)) will be described.

In the step of forming the front heat dissipation structure (S40(b)), the heat source 251 disposed on the printed circuit unit 250 transfers heat to the display 220 disposed in a first direction. If detected, disposing the heat dissipating material 270 facing the printed circuit unit 250 on top of the printed circuit unit 250 so that heat dissipated in the first direction is dissipated (S41(b)). can In addition, a step of forming at least one gap layer g1 above or below the heat dissipation material 270 to sequentially diffuse the heat dissipated in the first direction (S43(b)) may be further included. there is.

At least one heat source 251 disposed on the printed circuit unit 250 of the electronic device 10 generates heat according to driving of the circuit, and the heat can be diffused in the first direction. Accordingly, excessive concentration of heat may occur on the display 220 located on the front of the electronic device 10, and in order to suppress this, it is necessary to dispose a heat dissipation material 270 distributing the heat diffusion path to the periphery of the display 220. there is.

According to an embodiment, the first heat dissipating material 270 (a) is disposed between the display 220 and the first plate 240, and is generated from the heat source 251 disposed on the printed circuit unit 250 in the first direction. It serves to dissipate heat moving towards the For example, the first heat-dissipating material 270 (a) may be disposed to face and contact the display 220, and may be disposed to face the first plate 240 with a predetermined gap therebetween. . The reason why the planar first gap layer g1 including the gap is placed on one surface of the first heat dissipation material 270 (a) is that the heat diffused from the heat source 251 directly passes through the first heat dissipation material 270 (a). This is to generate initial diffusion through the first interstitial layer (g1) without going through. Accordingly, after the heat is evenly distributed over the entire surface of the first heat dissipating material 270 (a) according to the initial diffusion, the diffusion effect may be maximized by contacting the first heat dissipating material 270 (a).

In addition, the first plate 240 may include a metal material, for example Al or Mg. Since the metal material has heat spreading performance, additional heat distribution is possible.

Therefore, according to the present embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 passes through the first plate 240, the first gap g1, and the first heat dissipation material 270 (a) to display ( 220) can be reached. Heat is primarily diffused through the first plate 240 made of a metal material, and secondary and tertiary diffusion may be achieved through the first gap g1 and the first heat dissipation material 270 (a). In particular, the first heat-dissipating material 270 (a) effectively dissipates the path of heat toward the display 220 located in the first direction of the heat source 251, substantially reducing the temperature of a specific part of the display 220. can make it

According to another embodiment, the heat dissipation material 270 is disposed as a first heat dissipation material 270 (a) and a second heat dissipation material 270 (b) between the display 220 and the first plate 240, respectively. , serves to dissipate heat moving in the first direction from the heat source 251 in the area on the printed circuit unit 250.

Therefore, according to this embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 is transferred to the first plate 240, the first heat dissipation material 270 (a), the first gap layer (g1), and the second It may reach the display 220 through the heat dissipating material 270 (b). Heat is primarily diffused through the first plate 240 made of a metal material, and further diffused through the first gap layer g1 and the first and second heat dissipation materials 270 (a) and 270 (b). It can be done. In particular, the first heat dissipation material 270 (a) and the second heat dissipation material 270 (b) effectively dissipate the path of heat toward the display 220 located on the first direction of the heat source 251, thereby substantially displaying the display. (220) can significantly reduce the temperature of a specific area. As the specific details have been described above, they are omitted.

According to another embodiment, a plurality of heat dissipation materials 270 may be disposed. The heat dissipation material 270 includes a first heat dissipation material 270 (a), a second heat dissipation material 270 (b) and a third heat dissipation material 270 (c) between the display 220 and the printed circuit unit 250. is disposed, and serves to dissipate heat moving in the first direction from the heat source 251 in the area on the printed circuit unit 250.

According to this embodiment, the heat diffused from the heat source 251 of the printed circuit unit 250 is transferred to the first heat dissipating material 270 (a), the first plate 240, the second heat dissipating material 270 (b), It may reach the display 220 through the first gap g1 and the third heat dissipation material 270 (c). The heat diffused from the heat source 251 is preferentially dissipated by the first heat dissipating material 270 (a), and the primarily dissipated heat is diffused to the first plate 240 made of a metal material. It can be done. In addition, additional diffusion may be achieved through the second heat dissipation material 270 (b), the first gap g1, and the third heat dissipation material 270 (c). In particular, the first heat dissipation material 270 (a), the second heat dissipation material 270 (b), and the third heat dissipation material 270 (c) are disposed on the first direction of the heat source 251, the display 220 By effectively dissipating the path of heat toward the display 220, the temperature rising at a specific part of the display 220 can be substantially reduced. As the specific details have been described above, they are omitted.

Next, the steps of forming the rear heat dissipation structure and disposing the heat dissipation material (FIGS. 12 and 13, S40(c)) will be described.

In the step of forming the rear heat dissipation structure (S40(c)), the heat source 351 disposed on the printed circuit unit 350 transfers heat to the rear cover 330 disposed in the second direction. If detected, disposing the heat dissipating material 370 facing the printed circuit unit 350 under the printed circuit unit 350 so that heat dissipated in the second direction is dissipated (S41(c)). can do. In addition, a step (S43(c)) of forming at least one gap layer (g2, g3) above or below the heat dissipation material 370 to sequentially dissipate the heat dissipated in the second direction is included. can do.

At least one heat source 351 disposed on the printed circuit unit 350 of the electronic device 10 is driven by the heat source 351 disposed on the rear side according to driving of the circuit, so that heat can be diffused in the second direction. Accordingly, excessive heat concentration may occur on the rear cover 330 located on the rear surface of the electronic device 10, and in order to suppress this, a heat dissipation material 370 dispersing the heat diffusion path should be disposed around the rear cover 330. There is a need.

According to one embodiment, the fourth heat dissipation material 370 (a) is disposed between the second plate 360 and the rear cover 330, and is generated from the heat source 351 in the lower area of the printed circuit unit 350 to remove the heat. It serves to dissipate heat dissipating in two directions. For example, the fourth heat dissipation material 370 (a) may be disposed in face-to-face contact with the back cover 330 and may be disposed face-to-face with the second plate 360 with a predetermined gap therebetween. . The reason why the planar third gap layer (g3) including the gap is placed on one side of the heat dissipation material 270 is that heat transferred from the heat source 351 does not directly pass through the fourth heat dissipation material 370 (a), and This is to generate initial diffusion through the three-gap layer g3. Accordingly, after the heat is evenly distributed over the entire surface of the fourth heat dissipation material 370 (a) according to the initial diffusion, the diffusion effect may be maximized by contacting the fourth heat dissipation material 370 (a).

Therefore, according to this embodiment, the heat diffused from the heat source 351 of the printed circuit unit 350 is transferred to the second gap layer g2, the second plate 360, the third gap layer g3, and the heat dissipation material 270. It is possible to reach the rear cover 330 through. Primary diffusion is performed through the second interstitial layer g2, and additional diffusion of heat can be performed through the second plate 360 made of a metal material, the third interstitial layer g3, and the heat dissipation material 270. . In particular, the heat dissipation material 270 can effectively dissipate the heat path toward the rear cover 330 located in the second direction of the heat source 351 to substantially reduce the temperature of a specific part of the rear cover 330 significantly. there is.

According to another embodiment, a plurality of heat dissipation materials 270 may be disposed. The fourth heat dissipation material 370 (a) is disposed between the second plate 160 and the rear cover 130, and the fifth heat dissipation material 370 (b) is disposed between the printed circuit unit 350 and the second plate 160. It serves to sequentially dissipate heat generated from the heat source 351 in the lower area of the printed circuit unit 350 and dissipated in the second direction.

Therefore, according to this embodiment, the heat diffused from the heat source 151 of the printed circuit unit 350 is transferred to the second gap layer g2, the fifth heat dissipation material 370 (b), the second plate 360, and the third gap. The rear cover 130 may be reached through the layer g3 and the fourth heat dissipating material 370 (a). The primary diffusion is performed through the second interstitial layer g2, and the fifth heat dissipation material 370(b), the second plate 160 made of a metal material, the third interstitial layer g3, and the heat dissipation material 170 ) through which additional diffusion of heat can be achieved. In particular, the fourth heat dissipation material 370 (a) and the fifth heat dissipation material 370 (b) effectively dissipate the path of heat toward the rear cover 130 located in the second direction of the heat source 151 to substantially As a result, the temperature of a specific part of the rear cover 130 can be significantly reduced. As the specific details have been described above, they are omitted.

Next, the step of packing the heat source 451 and forming the heat dissipation structure ( FIGS. 15 to 17 , S 40 (d)) will be described.

In the step of forming the packing structure around the heat source 451 (S40(d)), the heat source 451 is disposed to surround at least a portion thereof, and the shielding member 471 including a shield can or a shielding film to improve RF radiation performance. ) may be disposed (S41 (d)) and attaching the heat dissipation material 470 to the top of the shielding member 471 (S43 (d)).

In one embodiment of the present invention, by disposing the shielding member 471 and the heat dissipation material 170 around each heat source 151, the heat can be diffused to the surrounding area. The shielding member 471 may be disposed to cover the heat source 451 disposed on the upper and lower surfaces of the printed circuit unit 450 . Since the inside of the shielding member 471 constitutes an empty space, it may have the effect of the gap layer. The heat dissipation material 470 is adhesively disposed on the upper or lower surface of the shielding member 471 so that the heat generated from the heat source 451 passes through the space inside the shielding member 471 and then comes into contact with the shield member 471 to cause heat dissipation. do.

According to this embodiment, heat diffused from the heat source 451 of the printed circuit unit 450 may reach the display 420 or the rear cover 430 via the shielding member 471 and the heat dissipating material 470.

The heat generated from the heat source 451 is primarily diffused through the space of the shielding member 471 and may be additionally diffused through the heat dissipating material 470 . In particular, the heat dissipation material 470 effectively radiates the path of heat toward the display 420 located in the first direction of the heat source 451 or the rear cover 430 located in the second direction, thereby substantially reducing the electronic device 10. The temperature of a specific area on the outer surface can be significantly reduced.

In another embodiment of the present invention, the forming of the heat source 551 peripheral packing structure (S40 (d)) is arranged to surround at least a portion of the heat source 551, and a shield can or a shielding film to improve RF radiation performance. Disposing a shielding member 571 including a step (S41 (d)), forming at least one hole in the shielding member 571, and distributing heat generated from the heat source 551 and directed in a first direction to a second A step (S45(d)) of arranging a heat transfer material 573 so as to face the hole for transfer in the same direction may be included.

The heat transfer material 573 may play a role in that heat dissipated toward the display 520 is reflected on the rear side and transferred to the rear cover 530 so that the heat on the front and rear surfaces is equally diffused. The heat transfer material 573 is a silicon material, and solid silicon or liquid silicon made of a polymer may be used, and it is made of a material having a high extrusion rate.

Due to the structure of the electronic device 10 as described above, the temperature of a specific area on the outer surface of the electronic device 10 can be significantly reduced.

In addition, it can be manufactured to have a heat dissipation effect by using a method of directly applying a liquid heat dissipation paint to a product where it is difficult to apply a solid heat dissipation material to the inner surface of the electronic device. A place where it is difficult to apply a solid heat dissipation material may be, for example, a side surface of a device or an inside of a product that is structurally complex and has many bends.

After forming the selected heat dissipation structure or disposing the selected heat dissipation material in the heat source periphery or in the diffusion path (S40), according to the heat dissipation material 170 disposed on the heat dissipation structure, the heat source 151 ) and confirming a change in heat distributed in the electronic device 10 (S50) may be performed.

According to various embodiments of the present disclosure, there is an effect of maximizing heat generation by improving the structure of a heat generating path of an electronic device and selecting and disposing a heat generating material at an appropriate location. In addition, the effect of effectively realizing the performance of the product by spreading the heat concentration due to the heat generated in a specific area on the outer surface of the electronic device to other areas, and the heat generation in the area in direct contact with the user's skin in models using metal materials By implementing a structure that improves the area, there is an effect of satisfying the needs of consumers.

Referring to FIG. 19 , an electronic device 10 in a network environment 1800 in various embodiments is described. The electronic device 10 may include a bus 1810, a processor 1820, a memory 1830, an input/output interface 1850, a display 120, and a communication interface 1870. In some embodiments, the electronic device 10 may omit at least one of the components or may additionally include other components.

Bus 1810 may include, for example, circuitry that couples components 1810-1870 together and carries communications (eg, control messages and/or data) between components.

The processor 1820 may include one or more of a central processing unit (CPU), an application processor (AP), or a communication processor (CP). The processor 1820 may, for example, execute calculations or data processing related to control and/or communication of at least one other component of the electronic device 10 .

The memory 1830 may include volatile and/or non-volatile memory. The memory 1830 may store, for example, commands or data related to at least one other component of the electronic device 10 . According to one embodiment, memory 1830 may store software and/or programs 1840 . The program 1840 may include, for example, a kernel 1841, middleware 1843, an application programming interface (API) 1845, and/or an application program (or "application") 1847, etc. can include At least a part of the kernel 1841, middleware 1843, or API 1845 may be referred to as an operating system (OS).

The kernel 1841, for example, includes system resources (eg, middleware 1843, API 1845, or application programs 1847) used to execute operations or functions implemented in other programs. : A bus 1810, a processor 1820, or a memory 1830, etc.) may be controlled or managed. In addition, the kernel 1841 may provide an interface capable of controlling or managing system resources by accessing individual components of the electronic device 10 from the middleware 1843, API 1845, or application program 1847. can

The middleware 1843 may perform an intermediary role so that, for example, an API 1845 or an application program 1847 communicates with the kernel 1841 to exchange data.

Also, the middleware 1843 may process one or more task requests received from the application program 1847 according to priority. For example, the middleware 1843 may use system resources (eg, a bus 1810, a processor 1820, or a memory 1830, etc.) of the electronic device 10 for at least one of the application programs 1847. You can give priority. For example, the middleware 1843 may perform scheduling or load balancing of the one or more task requests by processing the one or more task requests according to the priority given to the at least one task.

The API 1845 is an interface for the application 1847 to control functions provided by the kernel 1841 or the middleware 1843, for example, file control, window control, image processing, or text. It may include at least one interface or function (eg, command) for control.

The input/output interface 1850 may serve as an interface capable of transferring commands or data input from a user or other external device to other component(s) of the electronic device 10 . Also, the input/output interface 1850 may output commands or data received from other element(s) of the electronic device 10 to a user or other external device.

The display 120 may be, for example, a liquid crystal display (LCD), a light-emitting diode (LED) display, an organic light-emitting diode (OLED) display, or It may include a microelectromechanical systems (MEMS) display, or an electronic paper display. The display 120 may display, for example, various types of content (eg, text, image, video, icon, symbol, etc.) to the user. The display 120 may include a touch screen, and may receive, for example, a touch, gesture, proximity, or hovering input using an electronic pen or a part of the user's body.

The communication interface 1870 establishes communication between the electronic device 10 and an external device (eg, the first external electronic device 12, the second external electronic device 14, or the server 1806). can For example, the communication interface 1870 may be connected to the network 1862 through wireless communication or wired communication to communicate with an external device (eg, the second external electronic device 14 or the server 1806).

Wireless communication is, for example, a cellular communication protocol, for example, long-term evolution (LTE), LTE Advance (LTE-A), code division multiple access (CDMA), wideband CDMA (WCDMA), universal At least one of a mobile telecommunications system), WiBro (Wireless Broadband), GSM (Global System for Mobile Communications), and the like may be used. Wireless communication may also include, for example, short range communication 1864 . The short-range communication 1864 may include, for example, at least one of wireless fidelity (WiFi), Bluetooth, near field communication (NFC), or global navigation satellite system (GNSS). GNSS is a global positioning system (GPS), global navigation satellite system (glonass), Beidou navigation satellite system (hereinafter referred to as “Beidou”) or Galileo, the European global satellite-based navigation system, depending on the region of use or bandwidth. may contain at least one. Hereinafter, in this document, "GPS" may be interchangeably used with "GNSS". Wired communication may include, for example, at least one of universal serial bus (USB), high definition multimedia interface (HDMI), recommended standard 232 (RS-232), or plain old telephone service (POTS). The network 162 may include at least one of a telecommunications network, for example, a computer network (eg, a LAN or WAN), the Internet, or a telephone network.

Each of the first and second external electronic devices 12 and 14 may be the same as or different from the electronic device 10 . According to one embodiment, server 1806 may include a group of one or more servers. According to various embodiments, all or part of operations executed in the electronic device 10 may be executed in one or more electronic devices (eg, the electronic devices 12 and 14, or the server 1806). According to an example, when the electronic device 10 needs to perform a certain function or service automatically or upon request, the electronic device 10 instead of or in addition to executing the function or service by itself, at least related thereto Some functions may be requested from other devices (eg, electronic devices 12 and 14 or server 1806). A function or additional function may be executed and the result may be transmitted to the electronic device 10. The electronic device 10 may provide the requested function or service by processing the received result as it is or additionally. For example, cloud computing, distributed computing, or client-server computing technologies may be used.

The electronic device 10 to be described below may include any one of the aforementioned wearable devices, laptops, netbooks, smart phones, tablet PCs, Galaxy tabs, iPads, and wireless charging devices. there is. In this embodiment, it may be made of the smart phone.

The wireless charging device according to various embodiments of the present disclosure refers to a device for charging an electronic device by wirelessly transmitting and receiving power at a short distance.

In addition, the display unit of the electronic device minimizes the bezel area to increase the display unit, implements a luxurious design, provides a flexible display unit, or implements a convex or concave display unit.

That is, the peripheral portion of the display unit may be bent so that the screen area may be extended to the side portion. As the screen area of the display unit is bent and provided to the side portion, the screen area can be enlarged and used, or a separate screen can be used on the side portion, and luxury can be realized in terms of design. In other words, the display unit may include a first screen area (view area) and a second screen area (view area) provided on both sides of the first screen area.

20 is a block diagram of an electronic device 1901 according to various embodiments. The electronic device 1901 may include all or part of the electronic device 10 shown in FIG. 1 , for example. The electronic device 1901 includes one or more processors (eg, an application processor (AP)) 1910, a communication module 1920, a subscriber identification module 1924, a memory 1930, a sensor module 1940, and an input device 1950. ), display 1960, interface 1970, audio module 1980, camera module 1991, power management module 1995, battery 1996, indicator 1997, and motor 1998. there is.

The processor 1910 may control a plurality of hardware or software components connected to the processor 1910 by driving, for example, an operating system or an application program, and may perform various data processing and calculations. The processor 1910 may be implemented as, for example, a system on chip (SoC). According to one embodiment, the processor 1910 may further include a graphic processing unit (GPU) and/or an image signal processor. The processor 1910 may include at least some of the components shown in FIG. 19 (eg, a cellular module 1921). The processor 1910 loads and processes commands or data received from at least one of the other components (eg, non-volatile memory) into the volatile memory, and stores various data in the non-volatile memory. there is.

The communication module 1920 may have the same or similar configuration as the communication interface 170 of FIG. 3 . The communication module 1920 includes, for example, a cellular module 1921, a WiFi module 1923, a Bluetooth module 1925, and a GNSS module 1927 (eg, a GPS module, a Glonass module, a Beidou module, or a Galileo module). , an NFC module 1928 and a radio frequency (RF) module 1929.

The cellular module 1921 may provide, for example, a voice call, a video call, a text service, or an Internet service through a communication network. According to an embodiment, the cellular module 1921 may identify and authenticate the electronic device 1901 within a communication network using the subscriber identification module (eg, SIM card) 1924 . According to one embodiment, the cellular module 1921 may perform at least some of the functions that the processor 1910 may provide. According to one embodiment, the cellular module 1921 may include a communication processor (CP).

Each of the WiFi module 1923, the Bluetooth module 1925, the GNSS module 1927, or the NFC module 1928 may include, for example, a processor for processing data transmitted and received through the corresponding module. According to some embodiments, at least some (eg, two or more) of the cellular module 1921, the WiFi module 1923, the Bluetooth module 1925, the GNSS module 1927, or the NFC module 1928 are integrated into one integrated chip. (IC) or within an IC package.

The RF module 1929 may transmit and receive communication signals (eg, RF signals), for example. The RF module 1929 may include, for example, a transceiver, a power amp module (PAM), a frequency filter, a low noise amplifier (LNA), or an antenna. According to another embodiment, at least one of the cellular module 1921, the WiFi module 1923, the Bluetooth module 1925, the GNSS module 1927, or the NFC module 1928 transmits and receives an RF signal through a separate RF module. can

The subscriber identification module 1924 may include, for example, a card including the subscriber identification module and/or an embedded SIM, and unique identification information (eg, integrated circuit card identifier (ICCID)) or Subscriber information (eg, international mobile subscriber identity (IMSI)) may be included.

The memory 1930 (eg, the memory 130) may include, for example, an internal memory 1932 or an external memory 1934. The built-in memory 1932 may include, for example, volatile memory (e.g., dynamic RAM (DRAM), static RAM (SRAM), or synchronous dynamic RAM (SDRAM)), non-volatile memory (e.g., OTPROM (one time programmable ROM), PROM (programmable ROM), EPROM (erasable and programmable ROM), EEPROM (electrically erasable and programmable ROM), mask ROM, flash ROM, flash memory (such as NAND flash or NOR flash, etc.), It may include at least one of a hard drive or a solid state drive (SSD).

The external memory 1934 is a flash drive, for example, a compact flash (CF), secure digital (SD), micro secure digital (Micro-SD), mini secure digital (Mini-SD), extreme (xD) digital), a multi-media card (MMC), or a memory stick. The external memory 1934 may be functionally and/or physically connected to the electronic device 1901 through various interfaces.

The sensor module 1940 may, for example, measure a physical quantity or detect an operating state of the electronic device 1901 and convert the measured or sensed information into an electrical signal. The sensor module 1940 includes, for example, a gesture sensor 1940A, a gyro sensor 1940B, an air pressure sensor 1940C, a magnetic sensor 1940D, an acceleration sensor 1940E, a grip sensor 1940F, and a proximity sensor ( 1940G), color sensor (1940H) (e.g. RGB (red, green, blue) sensor), bio sensor (1940I), temperature/humidity sensor (1940J), light sensor (1940K), or UV (ultra violet) ) sensor 1940M. Additionally or alternatively, the sensor module 1940 may include, for example, an E-nose sensor, an electromyography sensor (EMG sensor), an electroencephalogram sensor (EEG sensor), and an electrocardiogram sensor (ECG sensor). , an infrared (IR) sensor, an iris sensor, and/or a fingerprint sensor. The sensor module 1940 may further include a control circuit for controlling one or more sensors included therein. In some embodiments, the electronic device 1901 further includes a processor, either as part of the processor 1910 or separately, configured to control the sensor module 1940 so that while the processor 1910 is in a sleep state, The sensor module 1940 may be controlled.

The input device 1950 may include, for example, a touch panel 1952, a (digital) pen sensor 1954, a key 1956, or an ultrasonic input device ( 1958) may be included. The touch panel 1952 may use at least one of, for example, a capacitive type, a pressure-sensitive type, an infrared type, or an ultrasonic type. Also, the touch panel 1952 may further include a control circuit. The touch panel 1952 may further include a tactile layer to provide a tactile response to the user.

The (digital) pen sensor 1954 may be, for example, part of a touch panel or may include a separate recognition sheet. Keys 1956 may include, for example, physical buttons, optical keys, or keypads. The ultrasonic input device 1958 may detect ultrasonic waves generated from an input tool through a microphone (eg, the microphone 1988) and check data corresponding to the detected ultrasonic waves.

The display 1960 (eg, the display 160 ) may include a panel 1962 , a hologram device 1964 , or a projector 1966 . The panel 1962 may include the same or similar configuration as the display 160 of FIG. 1 . Panel 1962 may be implemented as flexible, transparent, or wearable, for example. The panel 1962 and the touch panel 1952 may be configured as one module. The hologram device 1964 may display a 3D image in the air by using light interference. The projector 1966 may display an image by projecting light onto a screen. The screen may be located inside or outside the electronic device 1901, for example. According to one embodiment, the display 1960 may further include a control circuit for controlling the panel 1962 , the hologram device 1964 , or the projector 1966 .

The interface 1970 may be, for example, a high-definition multimedia interface (HDMI) 1972, a universal serial bus (USB) 1974, an optical interface 1976, or a D-subminiature (D-sub). ) (1978). Interface 1970 may be included in, for example, communication interface 170 shown in FIG. 3 . Additionally or alternatively, interface 1970 may include, for example, a mobile high-definition link (MHL) interface, a secure digital (SD) card/multi-media card (MMC) interface, or an infrared (IrDA) interface. data association) can include a standard interface.

The audio module 1980 may bidirectionally convert a sound and an electrical signal, for example. At least some components of the audio module 1980 may be included in the input/output interface 145 shown in FIG. 1 , for example. The audio module 1980 may process sound information input or output through, for example, a speaker 1982, a receiver 1984, an earphone 1986, or a microphone 1988.

The camera module 1991 is, for example, a device capable of capturing still images and moving images, and according to one embodiment, one or more image sensors (eg, a front sensor or a rear sensor), a lens, and an image signal processor (ISP) , or a flash (eg, LED or xenon lamp, etc.).

The power management module 1995 may manage power of the electronic device 1901 , for example. According to one embodiment, the power management module 1995 may include a power management integrated circuit (PMIC), a charger integrated circuit (IC), or a battery or fuel gauge. A PMIC may have a wired and/or wireless charging method. The wireless charging method includes, for example, a magnetic resonance method, a magnetic induction method, or an electromagnetic wave method, and may further include an additional circuit for wireless charging, for example, a coil loop, a resonance circuit, or a rectifier. there is. The battery gauge may measure, for example, remaining capacity of the battery 1996, voltage, current, or temperature during charging. Battery 1996 may include, for example, a rechargeable battery and/or a solar battery.

The indicator 1997 may indicate a specific state of the electronic device 1901 or a part thereof (eg, the processor 1910), for example, a booting state, a message state, or a charging state. The motor 1998 may convert electrical signals into mechanical vibrations and generate vibrations or haptic effects. Although not shown, the electronic device 1901 may include a processing device (eg, GPU) for supporting mobile TV. A processing device for supporting mobile TV may process media data according to standards such as digital multimedia broadcasting (DMB), digital video broadcasting (DVB), or mediaFlo ^™ .

Each of the components described in this document may be composed of one or more components, and the name of the corresponding component may vary depending on the type of electronic device. In various embodiments, an electronic device may include at least one of the components described in this document, and some components may be omitted or additional components may be further included. In addition, some of the components of the electronic device according to various embodiments are combined to form a single entity, so that the functions of the corresponding components before being combined can be performed the same.

21 is a block diagram of program modules according to various embodiments. According to one embodiment, the program module 2010 (eg, the program 140) may control resources related to an electronic device (eg, the electronic device 10) and/or an operating system (OS). It may include various applications (eg, the application program 147) running on the system. The operating system may be, for example, Android, iOS, Windows, Symbian, Tizen, or bada.

The program module 2010 may include a kernel 2020 , middleware 2030 , an application programming interface (API) 2060 , and/or an application 2070 . At least a part of the program module 2010 may be preloaded on the electronic device or downloaded from an external electronic device (eg, the electronic device 102 or 104, the server 106, etc.).

The kernel 2020 (eg, the kernel 1841 ) may include, for example, a system resource manager 2021 and/or a device driver 2023 . The system resource manager 2021 may control, allocate, or recover system resources. According to one embodiment, the system resource manager 2021 may include a process management unit, a memory management unit, or a file system management unit. The device driver 2023 may include, for example, a display driver, a camera driver, a Bluetooth driver, a shared memory driver, a USB driver, a keypad driver, a WiFi driver, an audio driver, or an inter-process communication (IPC) driver. .

The middleware 2030, for example, provides a function commonly required by the application 2070 or uses various APIs 2060 so that the application 2070 can efficiently use limited system resources inside the electronic device. Functions may be provided as an application 2070 . According to one embodiment, the middleware 2030 (eg, the middleware 143) includes a runtime library 2035, an application manager 2041, a window manager 2042, and a multimedia manager. ) (2043), resource manager (2044), power manager (2045), database manager (2046), package manager (2047), connectivity manager ) 2048, notification manager 2049, location manager 2050, graphic manager 2051, or security manager 2052. can do.

The runtime library 2035 may include, for example, a library module used by a compiler to add new functions through a programming language while the application 2070 is being executed. The runtime library 2035 may perform functions for input/output management, memory management, or arithmetic functions.

The application manager 2041 may manage, for example, the life cycle of at least one application among the applications 2070 . The window manager 2042 may manage GUI resources used in the screen. The multimedia manager 2043 may determine a format necessary for reproducing various media files and encode or decode the media file using a codec suitable for the format. The resource manager 2044 may manage resources such as source code, memory, or storage space of at least one of the applications 2070 .

The power manager 2045 may, for example, operate in conjunction with a basic input/output system (BIOS) to manage a battery or power and provide power information required for operation of the electronic device. The database manager 2046 may create, search, or change a database to be used by at least one of the applications 2070 . The package manager 2047 may manage installation or update of applications distributed in the form of package files.

The connection manager 2048 may manage wireless connections such as WiFi or Bluetooth. The notification manager 2049 may display or notify events such as arriving messages, appointments, and proximity notifications in a non-intrusive manner to the user. The location manager 2050 may manage location information of the electronic device. The graphic manager 2051 may manage graphic effects to be provided to users or user interfaces related thereto. The security manager 2052 may provide various security functions necessary for system security or user authentication. According to one embodiment, when the electronic device (eg, the electronic device 10) includes a phone function, the middleware 2030 further includes a telephony manager for managing the voice or video call function of the electronic device. can do.

The middleware 2030 may include a middleware module that forms a combination of various functions of the aforementioned components. The middleware 2030 may provide modules specialized for each type of operating system in order to provide differentiated functions. Also, the middleware 2030 may dynamically delete some existing components or add new components.

The API 2060 (eg, the API 185) is, for example, a set of API programming functions, and may be provided in different configurations depending on the operating system. For example, in the case of Android or iOS, one API set can be provided for each platform, and in the case of Tizen, two or more API sets can be provided for each platform.

The application 2070 (eg, the application program 147) includes, for example, a home 2071, a dialer 2072, an SMS/MMS 2073, an instant message (IM) 2074, a browser 2075, Camera (2076), Alarm (2077), Contacts (2078), Voice Dial (2079), Email (2080), Calendar (2081), Media Player (2082), Album (2083), or Clock (2084), Health Care It may include one or more applications capable of performing functions such as health care (eg, measurement of exercise or blood sugar) or provision of environment information (eg, provision of atmospheric pressure, humidity, or temperature information).

According to one embodiment, the application 2070 is an application that supports information exchange between an electronic device (eg, the electronic device 10) and an external electronic device (eg, the electronic devices 12 and 14) (hereinafter, the description of For convenience, "information exchange application") may be included. The information exchange application may include, for example, a notification relay application for delivering specific information to an external electronic device or a device management application for managing an external electronic device.

For example, the notification delivery application transmits notification information generated from other applications (eg, SMS/MMS applications, email applications, health management applications, or environmental information applications) of the electronic device to an external electronic device (eg, the electronic device 102 ). , 104)). Also, the notification delivery application may receive notification information from an external electronic device and provide the notification information to the user.

The device management application is, for example, at least one function of an external electronic device (eg, the electronic device 12 or 14) communicating with the electronic device (eg, a turn of the external electronic device itself (or some component parts)). On/off or brightness (or resolution) control of the display), management (e.g. installation, deletion) of applications running on external electronic devices or services provided by external electronic devices (e.g. call service or message service, etc.) , or update).

According to an embodiment, the application 2070 may include an application (eg, a health management application of a mobile medical device) designated according to properties (eg, the electronic devices 12 and 14) of the external electronic device. According to one embodiment, the application 2070 may include an application received from an external electronic device (eg, the server 186 or the electronic devices 12 and 14). According to one embodiment, the application 2070 may include a preloaded application or a third party application downloadable from a server Names of components of the program module 2010 according to the illustrated embodiment depend on the type of operating system. Therefore, it may vary.

According to various embodiments, at least a portion of the program module 2010 may be implemented as software, firmware, hardware, or a combination of at least two or more of these. At least some of the program modules 2010 may be implemented (eg, executed) by, for example, a processor (eg, the processor 1820). At least some of the program modules 2010 perform one or more functions. It may include, for example, a module, program, routine, set of instructions or process to perform.

The term "module" used in this document may refer to a unit including one or a combination of two or more of, for example, hardware, software, or firmware. “Module” may be used interchangeably with terms such as, for example, unit, logic, logical block, component, or circuit. A “module” may be a minimum unit or part of an integrally formed part. A “module” may be a minimal unit or part thereof that performs one or more functions. A “module” may be implemented mechanically or electronically. For example, a "module" is any known or future developed application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs), or programmable-logic device that performs certain operations. may contain at least one.

At least some of the devices (eg, modules or functions thereof) or methods (eg, operations) according to various embodiments may be stored on computer-readable storage media in the form of, for example, program modules. It can be implemented as a command stored in . When the command is executed by a processor (eg, the processor 1820), the one or more processors may perform a function corresponding to the command. The computer-readable storage medium may be, for example, the memory 1830.

Computer-readable recording media include hard disks, floppy disks, magnetic media (eg magnetic tape), optical media (eg CD-ROM (compact disc read only memory), DVD ( digital versatile disc), magneto-optical media (such as floptical disk), hardware devices (such as read only memory (ROM), random access memory (RAM), or flash memory, etc.) ), etc. In addition, the program command may include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter, etc. The above-described hardware device may include various It may be configured to act as one or more software modules to perform the operations of an embodiment, and vice versa.

A module or program module according to various embodiments may include at least one or more of the aforementioned components, some may be omitted, or additional other components may be included. Operations performed by modules, program modules, or other components according to various embodiments may be executed in a sequential, parallel, repetitive, or heuristic manner. Also, some actions may be performed in a different order, omitted, or other actions may be added.

The electronic devices of various embodiments of the present invention described above are not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present invention. It will be clear to those who have knowledge of

Electronics: 10
Cover Glass: 110,210,310,410,510,610
Display: 120,220,320,420,520,620
1st plate: 140,240,340,440,540,640
Printed Circuit: 150,250,350,450,550,650
Second plate: 160,260,360,460,560,660
Back cover: 130,230,330,430,530,630
Thermal material: 170,270,370,470,570,670
Heat source: 151,251,351,451,551,651
1st heat dissipation material: 270(a)
2nd heat dissipation material: 270(b)
Third heat dissipation material: 270(c)
4th heat dissipation material: 370(a)
Fifth heat dissipation material: 370(b)
First interstitial layer: g1
Second interstitial layer: g2
Third interstitial layer: g3

Claims (23)

In the method of manufacturing an electronic device,
detecting a location of at least one heat source disposed on a printed circuit unit or a display of the electronic device or a path of heat diffused from the heat source;
selecting a heat dissipation structure to correspond to the detected location of the heat source or the diffusion path;
selecting a heat-insulating material or a heat-dissipating material disposed according to the selected heat-dissipating structure to block or radiate heat transferred from the heat source; and
Forming the selected heat dissipation structure or disposing the selected heat dissipation material or heat dissipation material in the vicinity of the heat source or in the diffusion path;
Forming the heat dissipation structure and disposing the heat insulating material,
forming at least one open slit in a side region of a first plate disposed above the printed circuit unit or a second plate disposed below the printed circuit unit; and
and disposing the insulating material, which is a non-conductive material, on the side surface area including the formed slit.
According to claim 1,
and confirming a change in heat diffused from the heat source and distributed in the electronic device according to the heat insulating material or the heat dissipating material disposed in the heat dissipating structure.
delete The method of claim 1, wherein the steps of forming the heat dissipation structure and disposing the heat dissipation material,
When detecting that the heat source disposed in the printed circuit unit transfers heat to a display disposed in a first direction,
and arranging the heat-dissipating material on top of the printed circuit unit facing the printed circuit unit so that heat dissipated in the first direction is diffused to a peripheral area.
According to claim 4,
The electronic device manufacturing method of claim 1, further comprising forming at least one gap layer on or under the heat dissipation material to sequentially diffuse the heat dissipated in the first direction.
◈Claim 6 was abandoned when the registration fee was paid.◈ The method of claim 1, wherein the steps of forming the heat dissipation structure and disposing the heat dissipation material,
and arranging the heat dissipation material on the lower surface of the display to dissipate heat dissipated downward when the heat source is sensed by the display disposed on the upper surface of the device.
◈Claim 7 was abandoned when the registration fee was paid.◈ The method of claim 1, wherein the steps of forming the heat dissipation structure and disposing the heat dissipation material,
When it is sensed that the heat source disposed in the printed circuit unit transfers heat to the rear cover disposed in the second direction,
and arranging the heat dissipation material under the printed circuit unit facing the printed circuit unit so that heat dissipated in the second direction is diffused to a peripheral portion.
◈Claim 8 was abandoned when the registration fee was paid.◈ According to claim 7,
and forming at least one gap layer on or under the heat dissipating material to sequentially diffuse the heat dissipated in the second direction.
The method of claim 1, wherein the steps of forming the heat dissipation structure and disposing the heat dissipation material,
arranging a shielding member formed to surround at least a portion of the heat source to shield electromagnetic waves generated from the element and to spread the generated heat by forming a gap above the heat source. .
◈Claim 10 was abandoned when the registration fee was paid.◈ According to claim 9,
and attaching the heat dissipation material to an upper portion of the shielding member.
◈Claim 11 was abandoned when the registration fee was paid.◈ According to claim 9,
and forming at least one hole in the shielding member and arranging a heat transfer material to face the hole so as to transfer heat dissipated from the heat source toward a first direction to a second direction.
◈Claim 12 was abandoned when the registration fee was paid.◈ The method of claim 1, wherein in the step of selecting the heat dissipation structure,
The location of the heat dissipation structure is an area where the heat transferred from the heat source is concentrated, and is at least one of a side surface, a front surface, a rear surface area, or an inner area of the electronic device.
◈Claim 13 was abandoned when the registration fee was paid.◈ The method of claim 1, wherein in the step of selecting the heat dissipation material,
The electronic device manufacturing method according to claim 1 , wherein the heat dissipation material is at least one of a heat pipe, a solid heat dissipation sheet, and a liquid heat dissipation paint that can be disposed in the heat dissipation structure.
a first plate facing in a first direction;
a second plate directed in a second direction opposite to the first direction;
a display disposed to be exposed through a partial area of the first plate and including at least one heat source;
a printed circuit unit disposed in a space between the first plate and the second plate and including at least one heat source; and
A heat insulating material or heat dissipating material disposed facing the heat source of the printed circuit unit or display or disposed adjacent to a path of heat diffused from the heat source to insulate or dissipate the heat,
At least one open slit is included in the side region of the first plate or the second plate,
The electronic device according to claim 1 , wherein the heat insulating material is disposed inside or outside the opened slit to block heat generated in the side area from spreading.
delete According to claim 14,
The electronic device, characterized in that the first plate or the second plate comprises a metal material.
According to claim 14,
The heat dissipation material includes a first heat dissipation material disposed between the display and the first plate,
The electronic device of claim 1 , wherein the first heat dissipation material is disposed to face the first plate while forming a gap, and sequentially diffuses heat emitted from the heat source in a first direction.
According to claim 17,
The heat dissipation material further includes a second heat dissipation material or a third heat dissipation material positioned below the display,
The electronic device, characterized in that the second heat dissipation material or the third heat dissipation material forms an air gap layer on one surface and is disposed on a diffusion path of heat dissipated from the heat source in the first direction.
◈Claim 19 was abandoned when the registration fee was paid.◈ According to claim 14,
Further comprising a rear cover disposed under the second plate and preventing damage due to external impact,
The heat dissipation material includes a fourth heat dissipation material disposed between the second plate and the rear cover,
The electronic device of claim 1 , wherein the fourth heat dissipation material is disposed facing the second plate while forming a gap, and diffuses heat from the heat source toward the second direction.
◈Claim 20 was abandoned when the registration fee was paid.◈ According to claim 19,
The heat dissipation material further includes a fifth heat dissipation material disposed between the printed circuit unit and the second plate,
The electronic device of claim 1, wherein the fifth heat dissipation material forms an air gap layer on one surface and is disposed on a diffusion path of heat emitted from the heat source in the second direction.
According to claim 14,
Further comprising a shielding member that surrounds the at least one heat source and is disposed to form a gap above the heat source and shields electromagnetic waves;
The electronic device according to claim 1 , wherein the heat dissipation material is disposed in contact with an upper surface of the shield member to diffuse heat generated from the heat source to a peripheral area.
◈Claim 22 was abandoned when the registration fee was paid.◈ According to claim 21,
The electronic device further comprises a heat transfer material disposed on an upper surface of the at least one heat source and transferring heat emitted in a first direction from the heat source to a second direction.
◈Claim 23 was abandoned when the registration fee was paid.◈ 23. The method of claim 22,
The electronic device according to claim 1 , wherein the heat dissipation material is disposed between the heat transfer material and the first plate and/or between the heat transfer material and the second plate, and diffuses heat from the heat source toward the first direction to a peripheral area.

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