CN113039637A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN113039637A
CN113039637A CN201880099541.0A CN201880099541A CN113039637A CN 113039637 A CN113039637 A CN 113039637A CN 201880099541 A CN201880099541 A CN 201880099541A CN 113039637 A CN113039637 A CN 113039637A
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China
Prior art keywords
wiring member
resin case
semiconductor device
fixing portion
exposed
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Pending
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CN201880099541.0A
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English (en)
Inventor
吉松直树
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN113039637A publication Critical patent/CN113039637A/zh
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Abstract

本发明的目的在于提供能够使配线部件的高度方向的位置的精度提高的半导体装置。本发明涉及的半导体装置具有：基板(1)，其设置有半导体元件(4)；树脂壳体(7)，其设置于基板(1)的周缘；以及板形状的配线部件(8)，其具有露出部(11)和第2固定部(10)，该露出部(11)与在树脂壳体(7)的壁面内固定的第1固定部(9)相邻而露出至外部，该第2固定部(10)相对于从第1固定部(9)延伸至树脂壳体(7)内的部分而在与第1固定部(9)不同的部位处被固定于树脂壳体(7)的壁面内，在树脂壳体(7)内，该配线部件(8)通过焊料(5)而被接合于半导体元件(4)的与基板(1)相反侧的面之上，该配线部件(8)具有长度、厚度以及宽度，配线部件(8)在树脂壳体(7)内，厚度均匀且平坦，并且第2固定部(10)的宽度比露出部(11)的宽度窄。

Description

半导体装置
技术领域
本发明涉及半导体装置，特别是涉及对电动汽车或者电车等的电动机进行控制的逆变器或者再生用转换器等所使用的半导体装置。
背景技术
当前，公开了具有与树脂壳体一体成形的配线部件的半导体装置(例如，参照专利文献1、2)。配线部件通过焊料而与在半导体元件的上表面设置的电极接合，配线部件的一部分露出至外部。在这样的结构中，为了将配线部件与半导体元件的通过焊料实现的接合设为良好的状态，需要使配线部件的高度方向的精度良好。这里，配线部件的高度方向是指配线部件与半导体元件的间隔方向。
专利文献1：国际公开第2013/058038号小册子
专利文献2：日本特开2015-46416号公报
发明内容
在半导体装置的制造工序中，配线部件与半导体元件在大约200
℃～250℃的高温状态下通过焊料而接合。此时，树脂壳体以及配线部件也成为高温状态，但由于各自的线膨胀系数不同，因此，在树脂壳体与配线部件之间产生应变。
在专利文献1、2中，为了缓和上述应变，对配线部件实施弯折加工。但是，实施了弯折加工的配线部件由于高度方向的位置的精度不良，因此有时无法通过焊料将配线部件与半导体元件良好地接合。
本发明就是为了解决这样的问题而提出的，其目的在于提供能够使配线部件的高度方向的位置的精度提高的半导体装置。
为了解决上述课题，本发明涉及的半导体装置具有：基板，其设置有半导体元件；树脂壳体，其设置于基板的周缘；以及板形状的配线部件，其具有露出部和第2固定部，该露出部与在树脂壳体的壁面内固定的第1固定部相邻而露出至外部，该第2固定部相对于从第1固定部延伸至树脂壳体内的部分而在与第1固定部不同的部位处被固定于树脂壳体的壁面内，在树脂壳体内，该配线部件通过焊料而被接合于半导体元件的与基板相反侧的面之上，该配线部件具有长度、厚度以及宽度，配线部件在树脂壳体内，厚度均匀且平坦，并且第2固定部的宽度比露出部的宽度窄。
发明的效果
根据本发明，由于半导体装置具有：基板，其设置有半导体元件；树脂壳体，其设置于基板的周缘；以及板形状的配线部件，其具有露出部和第2固定部，该露出部与在树脂壳体的壁面内固定的第1固定部相邻而露出至外部，该第2固定部相对于从第1固定部延伸至树脂壳体内的部分而在与第1固定部不同的部位处被固定于树脂壳体的壁面内，在树脂壳体内，该配线部件通过焊料而被接合于半导体元件的与基板相反侧的面之上，该配线部件具有长度、厚度以及宽度，配线部件在树脂壳体内，厚度均匀且平坦，并且第2固定部的宽度比露出部的宽度窄，因此，能够提高配线部件的高度方向的位置的精度。
本发明的目的、特征、方案以及优点通过以下的详细说明和附图变得更清楚。
附图说明
图1是表示本发明的实施方式1涉及的半导体装置的结构的一个例子的俯视图。
图2是图1中的A1-A2的剖面图。
图3是表示本发明的实施方式2涉及的半导体装置的结构的一个例子的俯视图。
图4是图3中的B1-B2的剖面图。
图5是表示本发明的实施方式3涉及的半导体装置的结构的一个例子的俯视图。
图6是图5中的C1-C2的剖面图。
图7是表示本发明的实施方式4涉及的半导体装置的结构的一个例子的俯视图。
图8是图7中的D1-D2的剖面图。
图9是表示本发明的实施方式5涉及的半导体装置的结构的一个例子的俯视图。
图10是图9中的E1-E2的剖面图。
图11是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。
图12是表示图11中的F1-F2的剖面的一个例子的图。
图13是表示图11中的F1-F2的剖面的一个例子的图。
图14是表示图11中的F1-F2的剖面的一个例子的图。
图15是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。
图16是表示图15中的G1-G2的剖面的一个例子的图。
图17是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。
图18是表示图17中的H1-H2的剖面的一个例子的图。
图19是表示图17中的H1-H2的剖面的一个例子的图。
图20是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。
图21是表示图20中的I1-I2的剖面的一个例子的图。
具体实施方式
以下，基于附图，对本发明的实施方式进行说明。
＜相关技术＞
首先，对本实施方式的相关技术进行说明。
图11是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。图12是表示图11中的F1-F2的剖面的一个例子的图。此外，图11、12示出了向树脂壳体7内注入树脂之前的状态。
图11、12所示的半导体装置在基板1之上设置有电路图案2。在电路图案2之上经由焊料3而接合有半导体元件4、6。另外，在基板1的背面设置有散热器12。
在基板1的周缘设置有树脂壳体7。在树脂壳体7一体成形有配线部件27。配线部件27经由焊料5而被接合于半导体元件4、6的与基板1相反侧的面之上，配线部件27的一端露出至树脂壳体7的外部。
在图11、12所示的半导体装置的结构中，配线部件27的高度方向的位置的精度产生波动。在图12的例子中，由于配线部件27的高度方向的位置恰当，因此配线部件27与半导体元件4、6的通过焊料5实现的接合状态良好。但是，如图13、14所示，在配线部件27的高度方向的位置不恰当时，配线部件27与半导体元件4、6的通过焊料5实现的接合状态变差。
具体地说，在图13的例子中，存在配线部件27与半导体元件4之间的间隔变大的部位，在这样的部位处，无法通过焊料5将配线部件27与半导体元件4接合。另外，在图14的例子中，存在配线部件27与半导体元件4之间的间隔变小的部位，在这样的部位处，在配线部件27与半导体元件4的接合时，焊料5溢出。
图15是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。图16是图15中的G1-G2的剖面的一个例子的图。此外，图15、16示出了向树脂壳体7内注入树脂之前的状态。
图15、16所示的半导体装置在基板1之上设置有电路图案29。电路图案29被与电路图案2绝缘。配线部件28的一部分朝向基板1延伸设置，与电路图案29接触。此外，电路图案29也可以是凸起。其它结构与图11、12所示的半导体装置相同，因此，这里省略详细说明。
图15、16所示的半导体装置的结构能够对配线部件28的高度方向的位置进行控制，但需要设置电路图案29的空间和用于将电路图案29与电路图案2绝缘的空间。因此，图15、16所示的半导体装置难以小型化。
图17是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。图18是图17中的H1-H2的剖面的一个例子的图。此外，图17、18示出了向树脂壳体7内注入树脂之前的状态。
就图17、18所示的半导体装置而言，配线部件30的一端从树脂壳体7的壁面内露出至外部，另一端被固定于树脂壳体7的壁面内。其它结构与图11、12所示的半导体装置相同，因此，这里省略详细说明。
在图17、18所示的半导体装置的结构中，当在高温状态下通过焊料5将配线部件30与半导体元件4接合时，在树脂壳体7与配线部件30之间产生应变。由此，如图19所示，配线部件30弯曲。如果配线部件30弯曲，则配线部件30的高度方向的位置产生波动，无法通过焊料5将配线部件30与半导体元件4接合。
图20是表示相关技术涉及的半导体装置的结构的一个例子的俯视图。图21是表示图20中的I1-I2的剖面的一个例子的图。此外，图20、21示出了向树脂壳体7内注入树脂之前的状态。
就图20、21所示的半导体装置而言，对树脂壳体7处的配线部件31实施了弯折加工。其它结构与图17、18所示的半导体装置相同，因此，这里省略详细说明。
在图20、21所示的半导体装置的结构中，当在高温状态下通过焊料5将配线部件31与半导体元件4接合时，能够缓和在树脂壳体7与配线部件31之间产生的应变。但是，实施了弯折加工的配线部件31的高度方向的位置的精度不良，因此有时无法通过焊料5将配线部件31与半导体元件4良好地接合。另外，产生用于对配线部件31实施弯折加工的成本。
这样，就上述所说明的相关技术涉及的半导体装置而言，不能说提高了配线部件的高度方向的位置的精度。本实施方式就是为了解决上述相关技术涉及的半导体装置的问题而提出的，以下，详细进行说明。
＜实施方式1＞
图1是表示本实施方式1涉及的半导体装置的结构的一个例子的俯视图。图2是图1中的A1-A2的剖面图。此外，图1、2示出了向树脂壳体7内注入树脂之前的状态。
如图1、2所示，本实施方式1涉及的半导体装置的特征在于配线部件8的第2固定部10。其它结构与图11、12所示的相关技术涉及的半导体装置相同，因此，这里省略详细说明。
配线部件8具有露出部11和第2固定部10，该露出部11与在树脂壳体7的壁面内固定的第1固定部9相邻而露出至外部，该第2固定部10相对于从第1固定部9延伸至树脂壳体7内的部分而在与第1固定部9不同的部位处被固定于树脂壳体7的壁面内，在树脂壳体7内，该配线部件8通过焊料5而被接合于半导体元件4、6的与基板1相反侧的面之上，呈具有长度、厚度以及宽度的板形状。另外，配线部件8在树脂壳体7内，厚度均匀且平坦，未实施弯折加工。并且，配线部件8的第2固定部10以宽度变窄的方式通过冲裁加工而形成。因此，第2固定部10的宽度比露出部11的宽度窄。
如上所述，在半导体装置的制造工序中，配线部件与半导体元件在大约200℃～250℃的高温状态下通过焊料而接合。此时，树脂壳体以及配线部件也成为高温状态，但由于彼此的线膨胀系数不同，因此，在树脂壳体与配线部件之间产生应变。另一方面，就本实施方式1涉及的半导体装置而言，使配线部件8的第2固定部10的宽度变窄而易于变形，因此，缓和了第2固定部10在高温时产生的应变。
综上所述，根据本实施方式1，缓和了配线部件8的第2固定部10在高温时产生的应变，因此，配线部件8的高度方向的位置不会出现偏移。因此，能够提高配线部件8的高度方向的位置的精度。另外，由于配线部件8的高度方向的位置的精度提高，因此，配线部件8与半导体元件4、6的通过焊料5实现的接合状态良好。并且，由于不对配线部件8实施弯折加工，因此，能够抑制与配线部件8相关的成本。
＜实施方式2＞
图3是表示本实施方式2涉及的半导体装置的结构的一个例子的俯视图。图4是图3中的B1-B2的剖面图。此外，图3、4示出了向树脂壳体7内注入树脂之前的状态。
如图3、4所示，本实施方式2涉及的半导体装置的特征在于配线部件13的第2固定部15。此外，配线部件13的第1固定部14相当于图1、2的第1固定部9，配线部件13的露出部16相当于图1、2的露出部11。其它结构与图1、2所示的实施方式1涉及的半导体装置相同，因此，这里省略详细说明。
配线部件13的第2固定部15在俯视观察时呈弯折形状。具体地说，第2固定部15呈曲柄形状。此外，在图3、4的例子中，示出了第2固定部15呈曲柄形状的情况，但不限于此。例如，第2固定部15也可以呈弯曲形状。
综上所述，根据本实施方式2，通过使配线部件13的第2固定部15呈弯折形状，从而与实施方式1涉及的半导体装置相比，能够提高缓和应变的效果。
＜实施方式3＞
图5是表示本实施方式3涉及的半导体装置的结构的一个例子的俯视图。图6是图5中的C1-C2的剖面图。此外，图5、6示出了向树脂壳体7内注入树脂之前的状态。
如图5、6所示，本实施方式3涉及的半导体装置的特征在于配线部件17的第2固定部19。此外，配线部件17的第1固定部18相当于图1、2的第1固定部9，配线部件17的露出部20相当于图1、2的露出部11。其它结构与图1、2所示的实施方式1涉及的半导体装置相同，因此，这里省略详细说明。
配线部件17的第2固定部19被固定于与固定有第1固定部18的树脂壳体7的壁面相邻的壁面内。
综上所述，根据本实施方式3，由于缓和了第2固定部19在高温时产生的应变，因此，配线部件17的高度方向的位置不会产生偏移。因此，能够提高配线部件17的高度方向的位置的精度。
＜实施方式4＞
图7是表示本实施方式4涉及的半导体装置的结构的一个例子的俯视图。图8是图7中的D1-D2的剖面图。此外，图7、8示出了向树脂壳体7内注入树脂之前的状态。
如图7、8所示，本实施方式4涉及的半导体装置的特征在于树脂壳体7以及配线部件22。其它结构与图11、12所示的相关技术涉及的半导体装置相同，因此，这里省略详细说明。
树脂壳体7设置于基板1的周缘，树脂壳体7具有一部分凸出至内侧的凸起部21。
配线部件22具有露出部25和第2固定部24，该露出部25与在树脂壳体7的壁面内固定的第1固定部23相邻而露出至外部，该第2固定部24在与第1固定部23不同的部位处被固定于凸起部21，该配线部件22通过焊料5被接合于半导体元件4、6的与基板1相反侧的面之上，呈具有长度、厚度以及宽度的板形状。另外，配线部件22在树脂壳体7内，厚度均匀且平坦，未实施弯折加工。
综上所述，根据本实施方式4，由于缓和了树脂壳体7的凸起部21在高温时产生的应变，因此，配线部件22的高度方向的位置不会产生偏移。因此，能够提高配线部件22的高度方向的位置的精度。另外，由于配线部件22的高度方向的位置的精度提高，因此，配线部件22与半导体元件4、6的通过焊料5实现的接合状态良好。并且，未对配线部件22实施弯折加工，因此，能够抑制与配线部件22相关的成本，配线部件22的加工变得容易。
＜实施方式5＞
图9是表示本实施方式5涉及的半导体装置的结构的一个例子的俯视图。图10是图9中的E1-E2的剖面图。此外，图9、10示出了向树脂壳体7内注入树脂之前的状态。
如图9、10所示，本实施方式5涉及的半导体装置的特征在于树脂壳体7。其它结构与图7、8所示的实施方式4涉及的半导体装置相同，因此，这里省略详细说明。
树脂壳体7的凸起部26在俯视观察时呈弯折形状。具体地说，凸起部26呈曲柄形状。此外，在图9、10的例子中，示出了凸起部26呈曲柄形状的情况，但不限于此。例如，凸起部26也可以呈弯曲形状。
综上所述，根据本实施方式5，通过使树脂壳体7的凸起部26呈弯折形状，从而与实施方式4涉及的半导体装置相比，能够提高缓和应变的效果。
此外，本发明能够在本发明的范围内对各实施方式自由地进行组合，对各实施方式适当地进行变形、省略。
对于本发明进行了详细说明，但上述说明在所有方面均为例示，本发明不限定于此。可以理解为在不脱离该发明的范围的情况下能够想到未例示出的无数的变形例。
标号的说明
1基板，2电路图案，3焊料，4半导体元件，5焊料，6半导体元件，7树脂壳体，8配线部件，9第1固定部，10第2固定部，11露出部，12散热器，13配线部件，14第1固定部，15第2固定部，16露出部，17配线部件，18第1固定部，19第2固定部，20露出部，21凸起部，22配线部件，23第1固定部，24第2固定部，25露出部，26凸起部，27、28配线部件，29电路图案，30、31配线部件。

Claims (5)

1.一种半导体装置，其特征在于，具有：
基板(1)，其设置有半导体元件(4)；
树脂壳体(7)，其设置于所述基板(1)的周缘；以及
板形状的配线部件(8)，其具有露出部(11)和第2固定部(10)，该露出部(11)与在所述树脂壳体(7)的壁面内固定的第1固定部(9)相邻而露出至外部，该第2固定部(10)相对于从所述第1固定部(9)延伸至所述树脂壳体(7)内的部分而在与所述第1固定部(9)不同的部位处被固定于所述树脂壳体(7)的壁面内，在所述树脂壳体(7)内，该配线部件(8)通过焊料(5)而被接合于所述半导体元件(4)的与所述基板(1)相反侧的面之上，该配线部件具有长度、厚度以及宽度，
所述配线部件(8)在所述树脂壳体(7)内，所述厚度均匀且平坦，并且所述第2固定部(10)的所述宽度比所述露出部(11)的所述宽度窄。
2.根据权利要求1所述的半导体装置，其特征在于，
所述第2固定部(10)在俯视观察时呈弯折形状。
3.根据权利要求1所述的半导体装置，其特征在于，
所述第2固定部(10)被固定于与固定有所述第1固定部(9)的所述树脂壳体(7)的壁面相邻的壁面内。
4.一种半导体装置，其特征在于，具有：
基板(1)，其设置有半导体元件(4)；
树脂壳体(7)，其设置于所述基板(1)的周缘，该树脂壳体具有一部分凸出至内侧的凸起部(21)；以及
板形状的配线部件(22)，其具有露出部(25)和第2固定部(24)，该露出部(25)与在所述树脂壳体(7)的壁面内固定的第1固定部(23)相邻而露出至外部，该第2固定部(24)在与所述第1固定部(23)不同的部位处被固定于所述凸起部(21)，该配线部件(22)通过焊料(5)而被接合于所述半导体元件(4)的与所述基板(1)相反侧的面之上，该配线部件具有长度、厚度以及宽度，
所述配线部件(22)在所述树脂壳体(7)内，所述厚度均匀且平坦。
5.根据权利要求4所述的半导体装置，其特征在于，
所述凸起部(21)在俯视观察时呈弯折形状。
CN201880099541.0A 2018-11-20 2018-11-20 半导体装置 Pending CN113039637A (zh)

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