CN112996235A - 一种柔性电路板、显示面板及绝缘膜 - Google Patents
一种柔性电路板、显示面板及绝缘膜 Download PDFInfo
- Publication number
- CN112996235A CN112996235A CN202110181150.7A CN202110181150A CN112996235A CN 112996235 A CN112996235 A CN 112996235A CN 202110181150 A CN202110181150 A CN 202110181150A CN 112996235 A CN112996235 A CN 112996235A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- fluorine
- insulating film
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 199
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 106
- 239000011737 fluorine Substances 0.000 claims abstract description 106
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 95
- 239000003292 glue Substances 0.000 claims abstract description 85
- 239000007788 liquid Substances 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000000126 substance Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 10
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical class OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 21
- 239000010408 film Substances 0.000 description 81
- 239000010409 thin film Substances 0.000 description 27
- 238000010586 diagram Methods 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 125000001153 fluoro group Chemical group F* 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000269 nucleophilic effect Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110181150.7A CN112996235B (zh) | 2021-02-10 | 2021-02-10 | 一种柔性电路板、显示面板及绝缘膜 |
US17/337,223 US11564315B2 (en) | 2021-02-10 | 2021-06-02 | Flexible circuit board, display panel, and insulating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110181150.7A CN112996235B (zh) | 2021-02-10 | 2021-02-10 | 一种柔性电路板、显示面板及绝缘膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112996235A true CN112996235A (zh) | 2021-06-18 |
CN112996235B CN112996235B (zh) | 2022-09-27 |
Family
ID=76393039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110181150.7A Active CN112996235B (zh) | 2021-02-10 | 2021-02-10 | 一种柔性电路板、显示面板及绝缘膜 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11564315B2 (zh) |
CN (1) | CN112996235B (zh) |
Citations (19)
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US4526836A (en) * | 1983-09-16 | 1985-07-02 | Victor Company Of Japan, Ltd. | Magnetic recording media comprising a reaction product of a specific type of fluorine resin and a curing polymer material as a binder in the magnetic layer thereof |
JPH0372552A (ja) * | 1989-05-26 | 1991-03-27 | Daikin Ind Ltd | 含フッ素ゴム組成物 |
JP2007059311A (ja) * | 2005-08-26 | 2007-03-08 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンスパネルおよびその製造方法 |
KR20130066527A (ko) * | 2011-12-12 | 2013-06-20 | 주식회사 엘지화학 | 연성 금속박 적층판 |
WO2014029545A1 (de) * | 2012-08-24 | 2014-02-27 | Tesa Se | Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung |
US20140291621A1 (en) * | 2013-04-02 | 2014-10-02 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus and method of manufacturing the same |
CN104716270A (zh) * | 2015-03-16 | 2015-06-17 | 上海和辉光电有限公司 | 一种薄膜封装结构和具有该结构的有机发光装置 |
CN106833166A (zh) * | 2017-03-21 | 2017-06-13 | 深圳市阿拉町科技发展有限公司 | 一种防水氟化液及其制备方法和应用 |
CN106854330A (zh) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | 一种含氟树脂混合物及其制备的半固化片和覆铜板 |
US20170236819A1 (en) * | 2016-02-17 | 2017-08-17 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method |
CN208207435U (zh) * | 2018-06-08 | 2018-12-07 | 信利光电股份有限公司 | 一种液晶显示屏fog绑定位保护结构 |
CN208207448U (zh) * | 2018-06-08 | 2018-12-07 | 信利光电股份有限公司 | 一种能防止偏光片中碘分子流失的液晶显示屏 |
CN208684837U (zh) * | 2018-07-24 | 2019-04-02 | 盐城大丰阿特斯阳光电力科技有限公司 | 封边胶带 |
US20190293855A1 (en) * | 2018-03-23 | 2019-09-26 | Beijing Boe Optoelectronics Technology Co., Ltd. | Backlight module and display device |
US20190386244A1 (en) * | 2017-10-16 | 2019-12-19 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | An encapsulation method of oled panel and a encapsulation structure thereof |
CN210381456U (zh) * | 2019-08-05 | 2020-04-21 | 深圳市科晟电子有限公司 | 具有新型补强结构的柔性线路板 |
CN211403400U (zh) * | 2019-12-11 | 2020-09-01 | 深圳市鸿合创新信息技术有限责任公司 | 一种触控感应器、触控装置以及触控显示终端 |
US20210014968A1 (en) * | 2018-04-04 | 2021-01-14 | Sumitomo Electric Printed Circuits, Inc. | Cover film for flexible printed circuit board and flexible printed circuit board |
WO2021003695A1 (en) * | 2019-07-10 | 2021-01-14 | Dic Corporation | Pressure-sensitive adhesive composition and surface protective film |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109852320A (zh) | 2018-12-04 | 2019-06-07 | 顺德职业技术学院 | 氧化石墨烯改性含氟阻燃聚氨酯热熔胶及其制备方法 |
-
2021
- 2021-02-10 CN CN202110181150.7A patent/CN112996235B/zh active Active
- 2021-06-02 US US17/337,223 patent/US11564315B2/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4526836A (en) * | 1983-09-16 | 1985-07-02 | Victor Company Of Japan, Ltd. | Magnetic recording media comprising a reaction product of a specific type of fluorine resin and a curing polymer material as a binder in the magnetic layer thereof |
JPH0372552A (ja) * | 1989-05-26 | 1991-03-27 | Daikin Ind Ltd | 含フッ素ゴム組成物 |
JP2007059311A (ja) * | 2005-08-26 | 2007-03-08 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンスパネルおよびその製造方法 |
KR20130066527A (ko) * | 2011-12-12 | 2013-06-20 | 주식회사 엘지화학 | 연성 금속박 적층판 |
WO2014029545A1 (de) * | 2012-08-24 | 2014-02-27 | Tesa Se | Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung |
US20150240134A1 (en) * | 2012-08-24 | 2015-08-27 | Tese Se | Pressure-sensitive adhesive material particularly for encasing an electronic arrangement |
US20140291621A1 (en) * | 2013-04-02 | 2014-10-02 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus and method of manufacturing the same |
CN104716270A (zh) * | 2015-03-16 | 2015-06-17 | 上海和辉光电有限公司 | 一种薄膜封装结构和具有该结构的有机发光装置 |
US20170236819A1 (en) * | 2016-02-17 | 2017-08-17 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method |
CN106854330A (zh) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | 一种含氟树脂混合物及其制备的半固化片和覆铜板 |
CN106833166A (zh) * | 2017-03-21 | 2017-06-13 | 深圳市阿拉町科技发展有限公司 | 一种防水氟化液及其制备方法和应用 |
US20190386244A1 (en) * | 2017-10-16 | 2019-12-19 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | An encapsulation method of oled panel and a encapsulation structure thereof |
US20190293855A1 (en) * | 2018-03-23 | 2019-09-26 | Beijing Boe Optoelectronics Technology Co., Ltd. | Backlight module and display device |
US20210014968A1 (en) * | 2018-04-04 | 2021-01-14 | Sumitomo Electric Printed Circuits, Inc. | Cover film for flexible printed circuit board and flexible printed circuit board |
CN208207435U (zh) * | 2018-06-08 | 2018-12-07 | 信利光电股份有限公司 | 一种液晶显示屏fog绑定位保护结构 |
CN208207448U (zh) * | 2018-06-08 | 2018-12-07 | 信利光电股份有限公司 | 一种能防止偏光片中碘分子流失的液晶显示屏 |
CN208684837U (zh) * | 2018-07-24 | 2019-04-02 | 盐城大丰阿特斯阳光电力科技有限公司 | 封边胶带 |
WO2021003695A1 (en) * | 2019-07-10 | 2021-01-14 | Dic Corporation | Pressure-sensitive adhesive composition and surface protective film |
CN210381456U (zh) * | 2019-08-05 | 2020-04-21 | 深圳市科晟电子有限公司 | 具有新型补强结构的柔性线路板 |
CN211403400U (zh) * | 2019-12-11 | 2020-09-01 | 深圳市鸿合创新信息技术有限责任公司 | 一种触控感应器、触控装置以及触控显示终端 |
Also Published As
Publication number | Publication date |
---|---|
US11564315B2 (en) | 2023-01-24 |
US20220256696A1 (en) | 2022-08-11 |
CN112996235B (zh) | 2022-09-27 |
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Address after: 201201 No. 3809, Lingkong North Road, Pudong New Area, Shanghai Applicant after: SHANGHAI TIANMA AM-OLED Co.,Ltd. Address before: 201202 room 509, building 1, 6111 Longdong Avenue, Pudong New Area, Shanghai Applicant before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |
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Effective date of registration: 20211028 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Applicant after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Address before: 201201 No. 3809, Lingkong North Road, Pudong New Area, Shanghai Applicant before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |
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