CN1129648C - 用于环氧固化体系的潜伏催化剂 - Google Patents

用于环氧固化体系的潜伏催化剂 Download PDF

Info

Publication number
CN1129648C
CN1129648C CN98802989A CN98802989A CN1129648C CN 1129648 C CN1129648 C CN 1129648C CN 98802989 A CN98802989 A CN 98802989A CN 98802989 A CN98802989 A CN 98802989A CN 1129648 C CN1129648 C CN 1129648C
Authority
CN
China
Prior art keywords
epoxy resin
composition according
acid
resin composition
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN98802989A
Other languages
English (en)
Chinese (zh)
Other versions
CN1249772A (zh
Inventor
J·甘
J·P·埃弗雷特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Blue Cube IP LLC
Original Assignee
Dow Chemical Co
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26310844&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1129648(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GBGB9701294.2A external-priority patent/GB9701294D0/en
Application filed by Dow Chemical Co, Dow Global Technologies LLC filed Critical Dow Chemical Co
Publication of CN1249772A publication Critical patent/CN1249772A/zh
Application granted granted Critical
Publication of CN1129648C publication Critical patent/CN1129648C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN98802989A 1997-01-21 1998-01-20 用于环氧固化体系的潜伏催化剂 Expired - Lifetime CN1129648C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3594897P 1997-01-21 1997-01-21
US60/035,948 1997-01-21
GBGB9701294.2A GB9701294D0 (en) 1997-01-22 1997-01-22 Latent catalysts for epoxy curing systems
GB9701294.2 1997-01-22

Publications (2)

Publication Number Publication Date
CN1249772A CN1249772A (zh) 2000-04-05
CN1129648C true CN1129648C (zh) 2003-12-03

Family

ID=26310844

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98802989A Expired - Lifetime CN1129648C (zh) 1997-01-21 1998-01-20 用于环氧固化体系的潜伏催化剂

Country Status (9)

Country Link
EP (1) EP0954553B2 (OSRAM)
JP (1) JP4080546B2 (OSRAM)
KR (1) KR100569617B1 (OSRAM)
CN (1) CN1129648C (OSRAM)
AT (1) ATE273348T1 (OSRAM)
DE (1) DE69825561T3 (OSRAM)
MY (1) MY128727A (OSRAM)
TW (1) TW503246B (OSRAM)
WO (1) WO1998031750A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341181B (zh) * 2005-12-22 2013-09-04 陶氏环球技术有限责任公司 可固化环氧树脂组合物及由其制造的层压材料

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI261059B (en) * 1999-12-13 2006-09-01 Dow Global Technologies Inc Flame retardant phosphorus element-containing epoxy resin compositions
US6641923B2 (en) 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
US6617400B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
ATE279474T1 (de) * 2002-10-19 2004-10-15 Leuna Harze Gmbh Härtbare epoxidharzzusammensetzung
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
CN102653598B (zh) 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
US20090234080A1 (en) * 2005-09-27 2009-09-17 Sumitomo Dakelite Co., Ltd. Process for producing latent catalyst and epoxy resin composition
JP5460583B2 (ja) * 2007-06-11 2014-04-02 ビーエーエスエフ ソシエタス・ヨーロピア エポキシ硬化のための触媒
KR101547874B1 (ko) 2007-07-26 2015-08-27 아지노모토 가부시키가이샤 수지 조성물
JP5144572B2 (ja) * 2009-03-26 2013-02-13 太陽ホールディングス株式会社 熱硬化性樹脂組成物
SG176923A1 (en) * 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
CN102695744A (zh) * 2009-11-06 2012-09-26 陶氏环球技术有限责任公司 用于电层合体的存储稳定的环氧树脂组合物
CN102031082B (zh) * 2010-12-10 2013-04-03 东华大学 苯并咪唑二胺固化型环氧胶粘剂及其制备方法
EP2705090A1 (en) * 2011-05-02 2014-03-12 Dow Global Technologies LLC Trimethyl borate in epoxy resins
JP6273213B2 (ja) * 2012-02-17 2018-01-31 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー ベンズオキサジン、エポキシ及び無水物の混合物
DK2695903T3 (en) 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
EP2695727B1 (en) 2012-08-08 2017-12-06 Siemens Aktiengesellschaft Method of accelerating the curing process in resin overflow systems for the use in casting processes and resin overflow container
US10662304B2 (en) 2013-12-31 2020-05-26 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
US11550220B2 (en) 2019-10-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Negative tone photoresist for EUV lithography
CN113278251A (zh) * 2021-04-26 2021-08-20 厦门理工学院 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备
DE102024103231A1 (de) 2024-02-06 2025-08-07 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung und dafür geeignete Härtersysteme
CN119285906B (zh) * 2024-10-25 2025-10-14 厦门艾贝森电子有限公司 一种生物质阻燃环氧电子封装材料及其制备方法
CN119661811B (zh) * 2024-12-02 2026-03-27 江南大学 基于酸酐-叔胺动态离子对潜伏型促进剂及其制法和用途

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732332A (en) † 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3997499A (en) * 1974-08-29 1976-12-14 Gulf Oil Corporation Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
US4873273A (en) * 1986-03-20 1989-10-10 James River-Norwalk, Inc. Epoxide coating composition
JPH072829B2 (ja) † 1987-11-04 1995-01-18 株式会社日立製作所 積層板
EP0328020B1 (en) * 1988-02-12 1996-10-09 The Dow Chemical Company Use of a catalyst in epoxy compositions
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
SG43193A1 (en) † 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
ZA913801B (en) * 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE69423234T2 (de) † 1993-11-02 2000-08-10 The Dow Chemical Co., Midland Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate
DE69505410T2 (de) † 1994-09-08 1999-05-20 Akzo Nobel N.V., Arnheim/Arnhem Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung
GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341181B (zh) * 2005-12-22 2013-09-04 陶氏环球技术有限责任公司 可固化环氧树脂组合物及由其制造的层压材料

Also Published As

Publication number Publication date
KR100569617B1 (ko) 2006-04-11
DE69825561D1 (de) 2004-09-16
KR20000070360A (ko) 2000-11-25
ATE273348T1 (de) 2004-08-15
EP0954553B1 (en) 2004-08-11
EP0954553A1 (en) 1999-11-10
CN1249772A (zh) 2000-04-05
WO1998031750A1 (en) 1998-07-23
JP4080546B2 (ja) 2008-04-23
HK1023586A1 (en) 2000-09-15
MY128727A (en) 2007-02-28
JP2001508828A (ja) 2001-07-03
DE69825561T2 (de) 2005-08-11
TW503246B (en) 2002-09-21
DE69825561T3 (de) 2009-07-09
EP0954553B2 (en) 2008-12-10

Similar Documents

Publication Publication Date Title
JP4080546B2 (ja) エポキシ硬化系のための潜触媒
US6613839B1 (en) Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100229301B1 (ko) 에폭시 수지 조성물 및 폴리에폭사이드 경화용 잠재성 촉매
JP4643272B2 (ja) エポキシ樹脂用硬化剤組成物
KR20120101096A (ko) 에폭시 수지 조성물
CN103547609B (zh) 具有高热稳定性和韧性的环氧树脂
CN100336838C (zh) 环氧树脂组合物,其制备方法和由其制备的制品
CN1069658C (zh) 含固化抑制剂的环氧树脂组合物及由该组合物制成的层压板
JPS6119621A (ja) エポキシ樹脂組成物
HK1023586B (en) Latent catalysts for epoxy curing systems
HK1094509A (en) Curable flame retardant epoxy resin compositions
HK1044009A1 (zh) 難燃性樹脂及含該樹脂的難燃性樹脂組合物

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
PB01 Publication
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: DOW GLOBAL TECHNICAL COMPANY

Free format text: FORMER OWNER: THE DOW CHEMICAL CO.

Effective date: 20021228

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20021228

Address after: Michigan

Applicant after: Dow Global Technologies Inc.

Address before: Michigan

Applicant before: The Dow Chemical Co.

C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Michigan

Patentee after: Dow Global Technologies Llc

Address before: Michigan

Patentee before: Dow Global Technologies Inc.

TR01 Transfer of patent right

Effective date of registration: 20151225

Address after: Michigan

Patentee after: Blue cube IP LLC

Address before: Michigan

Patentee before: Dow Global Technologies Llc

CX01 Expiry of patent term

Granted publication date: 20031203

CX01 Expiry of patent term