CN112864045A - Wafer expanding device - Google Patents
Wafer expanding device Download PDFInfo
- Publication number
- CN112864045A CN112864045A CN201911211800.7A CN201911211800A CN112864045A CN 112864045 A CN112864045 A CN 112864045A CN 201911211800 A CN201911211800 A CN 201911211800A CN 112864045 A CN112864045 A CN 112864045A
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- CN
- China
- Prior art keywords
- wafer
- expanding
- adhesive film
- chip
- pushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002313 adhesive film Substances 0.000 claims abstract description 69
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 18
- 230000008859 change Effects 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 150
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A chip expanding device comprises a chip expanding iron ring, a bearing seat, a chip expanding component and a fixing mechanism. The chip expanding iron ring comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip. The bearing seat bears the wafer expanding iron ring. The chip expanding assembly is used for pushing and expanding the adhesive film, wherein the chip expanding assembly comprises pushing rollers with different sizes or pushing rollers with different distances from the center of the chip. The fixing mechanism is used for fixing the outer frame of the chip expanding iron ring together with the bearing seat, and expanding the adhesive film to expand the chip when the chip expanding assembly pushes the adhesive film upwards. The invention also provides a force application assembly for applying force to the adhesive film so as to change the local tension of the adhesive film.
Description
Technical Field
The present invention relates to a wafer expander, and more particularly, to a wafer expander with a replaceable expanding assembly.
Background
In the conventional packaging process, a Dicing street is reserved on a wafer, the wafer is cut into single wafers by using a cutter wheel or laser after being etched by photolithography, and then the wafers are taken down one by using a vacuum suction device, a thimble device, or after a cutting and Grinding (DBG) process or a Stealth cutting and Grinding (SDBG) process, a film expanding operation is performed to stretch and break a film adhered to the bottom of the wafer, thereby increasing the distance between the wafers and facilitating the taking down of the wafers. If the above-mentioned dividing process fails, the chip can not be taken down and the production capacity is reduced. Therefore, it is an important issue to discuss the wafer dividing process to prevent the wafer from being taken off and to improve the productivity.
Generally, the wafer expansion assembly employs a fixture for the wafer expansion process. However, in a single design, the tension of the conventional wafer expansion assembly cannot be adjusted and controlled, and new materials and manufacturing processes have to be adjusted in terms of expansion tension in a specific direction according to the characteristics of different wafers or materials, otherwise, problems such as insufficient or excessive local tension may occur. Moreover, the single fixture can not be fine-tuned and then be shared, which results in higher manufacturing cost.
Disclosure of Invention
The invention provides a wafer expanding device, which can change the tension of a glue film attached to the bottom of a wafer to expand the wafer by adjusting the size, the distance and other configurations of a wafer expanding component. Therefore, the tension of the adhesive film at local (single point) can be improved or the tension of the whole adhesive film can be even, so that the situation that the wafer cannot be taken down in the next manufacturing process due to the fact that the adhesive film is not broken due to expansion is prevented, and the yield of the manufacturing process is improved.
The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component and a fixing mechanism. The chip expanding iron ring comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip. The bearing seat bears the wafer expanding iron ring. The chip expansion assembly is used for pushing and expanding the adhesive film, wherein the chip expansion assembly comprises pushing rollers with different sizes. The fixing mechanism is used for fixing the outer frame of the chip expanding iron ring together with the bearing seat, and expanding the adhesive film to expand the chip when the chip expanding assembly pushes the adhesive film upwards.
The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component and a fixing mechanism. The chip expanding iron ring comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip. The bearing seat bears the wafer expanding iron ring. The chip expanding assembly is used for pushing and expanding the adhesive film, wherein the chip expanding assembly comprises pushing rollers with different distances from the center of the chip. The fixing mechanism is used for fixing the outer frame of the chip expanding iron ring together with the bearing seat, and expanding the adhesive film to expand the chip when the chip expanding assembly pushes the adhesive film upwards.
The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component, a force application component and a fixing mechanism. The chip expanding iron ring comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip. The bearing seat bears the wafer expanding iron ring. The chip expanding component is used to push and expand the adhesive film. The force application assembly is used for applying force to the adhesive film so as to change the local tension of the adhesive film. The fixing mechanism is used for fixing the outer frame of the chip expanding iron ring together with the bearing seat, and expanding the adhesive film to expand the chip when the chip expanding assembly pushes the adhesive film upwards.
In view of the above, the present invention provides a wafer expanding device, which is easily assembled and disassembled on the same jig to change a part of components in a wafer expanding assembly, or additionally add a force applying assembly to change the local tension of the adhesive film when the wafer expanding device expands the wafer, so as to reduce the cost of expanding the wafer and improve the yield of expanding the wafer.
Drawings
The embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale and are merely illustrative. In fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the embodiments of the present invention.
FIG. 1 is a schematic top view and a schematic cross-sectional view of a wafer expanding apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a perspective view of a preferred embodiment of the wafer spreader assembly of the present invention;
FIG. 3 is a schematic top view and a schematic cross-sectional view of an improved wafer expanding apparatus according to a preferred embodiment of the present invention;
FIG. 4 is a perspective view of a preferred embodiment of the wafer spreader assembly of the present invention;
FIG. 5 is a schematic top view and a schematic cross-sectional view of an improved wafer spreader apparatus according to a preferred embodiment of the present invention;
FIG. 6 is a perspective view of a preferred embodiment of the wafer spreader assembly of the present invention;
FIG. 7 is a schematic top view and a schematic cross-sectional view of an improved wafer spreader apparatus according to a preferred embodiment of the present invention;
FIG. 8 is a perspective view of a wafer spreader assembly according to a preferred embodiment of the present invention.
Description of the symbols
10: wafer with a plurality of chips
100. 200: wafer expanding device
110: wafer expanding iron ring
112: glue film
114: outer frame
120: bearing seat
130. 230, 330: wafer expansion assembly
132: pushing roller
134. 234, 334: base seat
140: fixing mechanism
232 a: first pushing roller
232 b: second pushing roller
332 a: the first group of pushing rollers
332 b: second group of pushing rollers
450: force application assembly
452: down-pressing roller
F. F1, F2, F3: tension force
Detailed Description
Fig. 1 is a schematic top view and a schematic cross-sectional view of a wafer expanding apparatus according to a preferred embodiment of the invention, wherein fig. 1(a) is a schematic top view of the wafer expanding apparatus, and fig. 1(b) and fig. 1(c) are schematic cross-sectional views of the wafer expanding apparatus. As shown in fig. 1, a wafer expanding apparatus 100 includes a wafer expanding iron ring 110, a carrier 120, a wafer expanding assembly 130, and a fixing mechanism 140. The die spreader 110 may include a film 112 and a frame 114. The adhesive film 112 is connected to the frame 114, and the adhesive film 112 is attached to a chip 10. The wafers 10 have been cut in the previous manufacturing process to form streets between the wafers 10, such that the wafers 10 are separated along the streets and connected to each other only by the adhesive film 112. In the present embodiment, the wafers 10 are placed on the adhesive film 112, and when the adhesive film 112 is stretched, the distance between the wafers in the wafers 10 increases until the wafers are separated from each other after the adhesive film 112 is broken. The supporting base 120 is used for supporting the workpiece.
The chip expanding assembly 130 is used to push and expand the adhesive film 112. The fixing mechanism 140 is used to fix the outer frame 114 of the wafer expanding iron ring 110 with the carrier 120. In the present embodiment, when the wafer expanding assembly 130 moves upward to push the film 112, the film 112 can be expanded to expand the wafer 10. In other embodiments, the fixing mechanism 140 can also be used to press the outer frame 114 of the wafer expanding iron ring 110 downward when the outer frame 114 of the wafer expanding iron ring 110 is fixed on the susceptor 120, so as to expand the adhesive film 112 to expand the wafer 10. In the present embodiment, the wafer expansion assembly 130 is configured to include a plurality of pushing rollers 132 of the same size. The pushing rollers 130 are disposed around the wafer 10, and the pushing rollers 130 are distributed in a circle. In one embodiment, the expanding step may be as shown in fig. 1(b) and 1(c) of fig. 1. First, as shown in fig. 1(b), the wafer expanding iron ring 110 is disposed on the carrier 120 and clamped between the carrier 120 and the fixing mechanism 140. Then, as shown in fig. 1(c), the wafer expanding assembly 130 moves upward to push the adhesive film 112, so that the adhesive film 112 is pushed upward by the wafer expanding assembly 130, and the outward tension F of the adhesive film 112 is increased to expand the adhesive film 112, thereby performing the film expansion.
An embodiment of a wafer spreader 130 is provided below, and is shown in fig. 2, which illustrates a perspective view of a wafer spreader in a preferred embodiment of the present invention. In the present embodiment, the wafer expansion assembly 130 is configured to include a plurality of pushing rollers 132 of the same size. Each pushing roller 132 protrudes from a base 134, so that only the pushing roller 132 of the chip expansion assembly 130 contacts the adhesive film 112, and the adhesive film 112 is suspended above the base 134. Each pushing roller 132 has the same distance with the center or the edge of the wafer 10, so as to provide the same tension F to the adhesive film 112 at each local position, so as to uniformly expand the wafer at each local position of the wafer 10, thereby improving the yield of the manufacturing process.
With the improvement of new materials and manufacturing processes, it is necessary to adjust the tension of the wafer to a specific direction or a specific position according to the characteristic conditions of different wafers or materials. If a single fixed jig is used, the problem of the lack of local tension or the excessive local tension is caused by the high manufacturing cost of the common jig after the fine adjustment is impossible. In order to adapt to the variation of different chip sizes and types of adhesive films, three improved chip expanding devices are proposed to adjust the tension in all directions.
Fig. 3 is a schematic top view and a schematic cross-sectional view of an improved wafer expanding device according to a preferred embodiment of the present invention, wherein fig. 3(a) is a schematic top view of the wafer expanding device, and fig. 3(b) is a schematic cross-sectional view of the wafer expanding device. As shown in fig. 3, a wafer expanding device 200 of the present embodiment and the wafer expanding device 100 of fig. 1 have the same wafer expanding iron ring 110, susceptor 120 and fixing mechanism 140. The present embodiment merely modifies the original wafer spreader assembly 130 into a wafer spreader assembly 230, wherein the wafer spreader assembly 230 includes pushing rollers of different sizes to vary the local tension at a single point or area. In this embodiment, the pushing rollers may include a plurality of first pushing rollers 232a and a plurality of second pushing rollers 232b, and the diameter of the first pushing rollers 232a is larger than that of the second pushing rollers 232 b. Preferably, the first pushing roller 232a and the second pushing roller 232b are disposed alternately to provide a uniform tension to the adhesive film 112. Preferably, the first pushing rollers 232a are equidistant from each other. For example, the first pushing roller 232a and the second pushing roller 232b have the same distance from the center or edge of the wafer 10, and the four first pushing rollers 232a equally divide the circumference of the wafer 10 into four parts.
Fig. 4 is a perspective view illustrating the wafer expansion assembly 230 according to the present embodiment. The wafer expansion assembly 230 is configured to include four first urging rollers 232a and a plurality of second urging rollers 232b that are equidistant from each other. The first pushing roller 232a and the second pushing roller 232b protrude from a base 234, so that only the first pushing roller 232a and the second pushing roller 232b of the wafer expanding assembly 230 contact the adhesive film 112, and the adhesive film 112 is suspended above the base 234. The first pushing roller 232a and the second pushing roller 232b have the same distance to the center or edge of the wafer 10, but the diameter of the first pushing roller 232a is larger than that of the second pushing roller 232b, so as to adjust the tension F/F1 for the adhesive film 112 at each local position, wherein the tension F1 is larger than the tension F, so as to perform film expansion under the condition of changing the local tension of the wafer 10, so as to meet the requirement of the manufacturing process and further improve the yield of the manufacturing process.
Fig. 5 is a schematic top view and a schematic cross-sectional view of a wafer expanding device according to a preferred embodiment of the invention, wherein fig. 5(a) is a schematic top view of the wafer expanding device, and fig. 5(b) is a schematic cross-sectional view of the wafer expanding device. As shown in fig. 5, the wafer expanding device 100 of the present embodiment has the same wafer expanding iron ring 110, the susceptor 120 and the fixing mechanism 140 as those of the wafer expanding device 100 of fig. 1. In the present embodiment, the original wafer expansion assembly 130 is simply modified to a wafer expansion assembly 330, wherein the wafer expansion assembly 330 includes pushing rollers with different distances from the center of the wafer 10, so that the tension is even, and the problems such as the wafer 10 being deviated from the middle stage can be solved. In this embodiment, the pushing rollers may include a plurality of first pushing rollers 332a and a plurality of second pushing rollers 332 b. The first pushing roller 332a and the second pushing roller 332b are disposed in a circular distribution around the wafer 10. Each first pushing roller 332a has the same distance to the center of the wafer 10 or the edge of the wafer 10, each second pushing roller 332b has the same distance to the center of the wafer 10 or the edge of the wafer 10, and the distance from the first pushing roller 332a to the center of the wafer 10 is greater than the distance from the second pushing roller 332b to the center of the wafer 10. Preferably, the first set of pushing rollers 332a and the second set of pushing rollers 332b are disposed alternately to provide a uniform stretching tension for the adhesive film 112. More preferably, the first set of pushing rollers 332a are equidistant from each other. For example, the first set of four pushing rollers 332a equally divides the circle centered on the center of the wafer 10 into four parts.
Fig. 6 is a perspective view illustrating the wafer expansion assembly 330 according to the present embodiment. The wafer expansion assembly 330 is configured to include a first set of four ejection rollers 332a that are equidistant from one another. Each of the first pushing rollers 332a and the second pushing rollers 332b protrudes from the base 334, so that only the first pushing rollers 332a and the second pushing rollers 332b of the wafer expanding assembly 330 contact the adhesive film 112, and the adhesive film 112 is suspended above the base 334. The first pushing roller 332a and the second pushing roller 332b have the same size, but the distance from the first pushing roller 332a to the center of the wafer 10 is greater than the distance from the second pushing roller 332b to the center of the wafer 10, so as to adjust the tension F2/F applied to each local position of the adhesive film 112, wherein the tension F2 applied by the first pushing roller 332a is smaller than the tension F applied by the second pushing roller 332b, so as to equalize the tension in the wafer 10 for expanding the wafer, thereby solving the manufacturing defects such as the offset of the wafer 10 to the middle test stage, and further improving the yield of the manufacturing process.
FIG. 7 is a schematic top view and a schematic cross-sectional view of a wafer expanding device according to a preferred embodiment of the present invention, wherein FIG. 7(a) of FIG. 7 is a schematic top view of the wafer expanding device, and FIG. 7(b) of FIG. 7 is a schematic cross-sectional view of the wafer expanding device. As shown in fig. 7, the wafer expanding device 100 of the present embodiment has the same wafer expanding iron ring 110, the susceptor 120, the wafer expanding assembly 130 and the fixing mechanism 140 as those of the wafer expanding device 100 of fig. 1. The embodiment further includes a force-applying component 450 for applying a force to the adhesive film 112 to change the local tension of the adhesive film 112 at a single point. In the present embodiment, the force applying assembly 450 includes a plurality of pressing rollers 452, which partially press the adhesive film 112, so as to generate a tension F3 on the adhesive film 112. Preferably, the down-pressure rollers 452 are respectively disposed on two opposite sides of the wafer 10 to change the single-point tension on the two opposite sides.
Fig. 8 is a perspective view illustrating the wafer expansion assembly 130 and the force application assembly 450 according to the present embodiment. The force application assembly 450 is disposed within the circle of the pushing rollers 132 of the wafer expansion assembly 130 and above the base 134 of the wafer expansion assembly 130 without contacting the base 134 to locally apply tension to the adhesive film 112. The contact surface between the lower roller 452 of the force applying assembly 450 and the adhesive film 112 preferably has a smooth surface to avoid damaging the adhesive film 112.
The invention is characterized in that other components are mounted, and the local expansion tension of the designated direction or position in the adhesive film is changed by applying pressure or pulling force, so as to achieve the purpose of improving the yield of the film expansion. Three modified embodiments are provided above, but not limited to these three embodiments, and these embodiments can be applied separately or simultaneously in the same sheet expanding process according to the requirement of the manufacturing process or apparatus, so as to improve the problems of insufficient tension, excessive tension or uneven tension in various sheet expanding processes.
In summary, the present invention provides a wafer expanding device, which is easily assembled and disassembled on the same fixture to change some components in a wafer expanding assembly, or additionally add a force applying assembly to change the local tension of the adhesive film when the wafer expanding device expands the wafer, so as to reduce the cost of expanding the wafer and increase the yield rate of expanding the wafer. Specifically, the wafer expanding device comprises a wafer expanding iron ring, a bearing seat, a wafer expanding assembly and a fixing mechanism. The chip expanding iron ring comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip. The bearing seat bears the wafer expanding iron ring. The chip expanding component is used to push and expand the adhesive film. The fixing mechanism is used for fixing the outer frame of the chip expanding iron ring together with the bearing seat, and expanding the adhesive film to expand the chip when the chip expanding assembly pushes the adhesive film upwards. The wafer expansion assembly may comprise pushing rollers of different sizes or/and comprise pushing rollers of different distances from the center of the wafer; the force application component can be located in the distribution curve of the pushing roller of the wafer expansion component and above the adhesive film, but the invention is not limited thereto.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.
Claims (13)
1. A wafer expanding device, comprising:
a chip expanding iron ring, which comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip;
a bearing seat for bearing the wafer expanding iron ring;
a chip expansion assembly for pushing and expanding the adhesive film, wherein the chip expansion assembly comprises pushing rollers with different sizes; and
and the fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring with the bearing seat simultaneously, and expanding the adhesive film to expand the wafer when the wafer expanding assembly pushes the adhesive film upwards.
2. The wafer expanding device as claimed in claim 1, wherein the plurality of pushing rollers comprises a plurality of first pushing rollers and a plurality of second pushing rollers, and a diameter of the plurality of first pushing rollers is larger than a diameter of the plurality of second pushing rollers.
3. The wafer expanding device as claimed in claim 2, wherein the first pushing rollers and the second pushing rollers are disposed alternately.
4. The wafer expanding device as claimed in claim 3, wherein the plurality of first urging rollers are equidistant from each other.
5. The wafer expanding device as claimed in claim 1, wherein a plurality of the pushing rollers are disposed around the wafer.
6. The wafer spreader apparatus of claim 5, wherein the plurality of pushing rollers are arranged in a circular pattern.
7. A wafer expanding device, comprising:
a chip expanding iron ring, which comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip;
a bearing seat for bearing the wafer expanding iron ring;
a wafer expansion assembly for pushing and expanding the adhesive film, wherein the wafer expansion assembly comprises pushing rollers with different distances from the center of the wafer; and
and the fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring with the bearing seat simultaneously, and expanding the adhesive film to expand the wafer when the wafer expanding assembly pushes the adhesive film upwards.
8. The wafer expanding device as claimed in claim 7, wherein the plurality of pushing rollers comprises a plurality of first pushing rollers and a plurality of second pushing rollers, and a distance between the first pushing rollers and the center of the wafer is greater than a distance between the second pushing rollers and the center of the wafer.
9. The wafer expanding device as claimed in claim 8, wherein the plurality of first pushing rollers are equidistant from each other.
10. The wafer expanding device as claimed in claim 7, wherein a plurality of the pushing rollers are distributed in a circle around the wafer.
11. A wafer expanding device, comprising:
a chip expanding iron ring, which comprises an outer frame and a glue film, wherein the glue film is connected with the outer frame and is used for attaching a chip;
a bearing seat for bearing the wafer expanding iron ring;
a chip expanding component for pushing and expanding the adhesive film;
the force application assembly is used for applying force to the adhesive film so as to change the local tension of the adhesive film; and
and the fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring with the bearing seat simultaneously, and expanding the adhesive film to expand the wafer when the wafer expanding assembly pushes the adhesive film upwards.
12. The wafer expanding device as defined in claim 11, wherein the force applying assembly comprises a plurality of pressing rollers for partially pressing the adhesive film.
13. The wafer spreader apparatus of claim 12, wherein the plurality of down-pressure rollers are respectively located on opposite sides of the wafer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108141009 | 2019-11-12 | ||
| TW108141009A TW202119521A (en) | 2019-11-12 | 2019-11-12 | Wafer expanding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112864045A true CN112864045A (en) | 2021-05-28 |
Family
ID=75154683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911211800.7A Withdrawn CN112864045A (en) | 2019-11-12 | 2019-12-02 | Wafer expanding device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6851517B1 (en) |
| KR (1) | KR20210058606A (en) |
| CN (1) | CN112864045A (en) |
| TW (1) | TW202119521A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117253825A (en) * | 2023-11-13 | 2023-12-19 | 江苏星辉半导体有限公司 | Wafer film sticking machine for semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783920B (en) * | 2022-06-22 | 2022-09-06 | 四川明泰微电子有限公司 | Wafer blue membrane overspeed device tensioner |
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| JP2015204362A (en) * | 2014-04-14 | 2015-11-16 | 株式会社ディスコ | chip interval maintenance method |
| JP6570942B2 (en) * | 2015-09-18 | 2019-09-04 | 株式会社ディスコ | Dividing device and wafer dividing method |
| JP6710889B2 (en) * | 2016-07-29 | 2020-06-17 | 株式会社東京精密 | Work dividing device and work dividing method |
| CN109891556B (en) * | 2016-10-28 | 2022-11-22 | 株式会社东京精密 | Workpiece dividing device and workpiece dividing method |
| JP6896990B2 (en) * | 2017-03-27 | 2021-06-30 | 株式会社東京精密 | Work division method |
| JP7110540B2 (en) * | 2018-01-11 | 2022-08-02 | 株式会社東京精密 | Work dividing device and work dividing method |
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2019
- 2019-11-12 TW TW108141009A patent/TW202119521A/en unknown
- 2019-12-02 CN CN201911211800.7A patent/CN112864045A/en not_active Withdrawn
- 2019-12-27 KR KR1020190176576A patent/KR20210058606A/en not_active Application Discontinuation
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2020
- 2020-01-15 JP JP2020004031A patent/JP6851517B1/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117253825A (en) * | 2023-11-13 | 2023-12-19 | 江苏星辉半导体有限公司 | Wafer film sticking machine for semiconductor device |
| CN117253825B (en) * | 2023-11-13 | 2024-04-19 | 江苏星辉半导体有限公司 | Wafer film sticking machine for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210058606A (en) | 2021-05-24 |
| TW202119521A (en) | 2021-05-16 |
| JP2021077841A (en) | 2021-05-20 |
| JP6851517B1 (en) | 2021-03-31 |
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