CN213905338U

CN213905338U - Crystal expansion device and crystal expansion equipment

Info

Publication number: CN213905338U
Application number: CN202120123169.1U
Authority: CN
Inventors: 罗小虎; 陈为波; 张继栋; 曹诚
Original assignee: Dongguan Ruiqin Electronics Co ltd
Current assignee: Dongguan Ruiqin Electronics Co ltd
Priority date: 2021-01-18
Filing date: 2021-01-18
Publication date: 2021-08-06
Anticipated expiration: 2031-01-18

Abstract

The application discloses expand brilliant device, expand brilliant equipment, this expand brilliant device includes: the first fixing ring is fixedly connected with the first film, the first film at least covers the area surrounded by the inner ring of the first fixing ring, and the bearing area of the first film is used for bearing the wafer; and the second fixing ring is positioned on the first fixing ring and fixedly connected with the second film, the second film is provided with a hollow area and an extension part, the hollow area is opposite to the bearing area of the first film, wherein the first film is extended, so that the bearing area moves along the direction from the first fixing ring to the second fixing ring, and the first film is fixedly contacted with the extension part of the second film. According to the crystal expansion device, the extended first film is fixed by the second film, and a mode of fixing the film by using a crystal expansion ring is replaced, so that the stability of fixing the first film is improved.

Description

Crystal expansion device and crystal expansion equipment

Technical Field

The utility model relates to a semiconductor device makes the field, and more specifically relates to an expand brilliant device, expand brilliant equipment.

Background

In the manufacturing process of semiconductor devices, after the wafer dicing step, the chips separated from the wafer are inspected and sorted, and in order to facilitate the inspection and sorting, the wafer needs to be subjected to a wafer expanding operation. Specifically, the distance between each chip is enlarged by extending the film for bearing the wafer, and after the film is extended, the extended film is clamped and fixed by the inner and outer plastic wafer extending rings, and redundant films are cut.

However, when the inner and outer wafer expanding rings are used to clamp and fix the thin film, once the wafer expanding rings deform, the thin film is easily to fall off partially or completely from between the two wafer expanding rings, so that the problem of uneven spacing between each chip due to retraction of the thin film occurs, and the subsequent operation of the chips is not facilitated.

Therefore, it is desirable to provide an improved wafer expanding device, wafer expanding apparatus and wafer processing method, so that the film can be more firmly fixed after being stretched, and the space between each chip can be maintained.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an expand brilliant device, expand brilliant equipment through adopting the fixed first film after extending of second film, has replaced the mode that uses the fixed film of crystal ring of expanding to the stability of fixed first film has been increased.

According to the utility model discloses an aspect provides an expand brilliant device, includes: the first fixing ring is fixedly connected with a first thin film, the first thin film at least covers an area surrounded by an inner ring of the first fixing ring, and a bearing area of the first thin film is used for bearing a wafer; and the second fixing ring is positioned on the first fixing ring and fixedly connected with a second film, the second film is provided with a hollow area and an extension part, the hollow area is opposite to the bearing area of the first film, wherein the first film is extended, so that the bearing area moves along the direction from the first fixing ring to the second fixing ring, and the first film is in contact with the extension part of the second film for fixation.

Optionally, the bearing device further comprises a spacer block located between the first fixing ring and the second fixing ring to separate the first fixing ring from the second fixing ring, wherein a moving distance of the bearing area corresponds to a thickness of the spacer block.

Optionally, the contact portion of the second film and the first film annularly surrounds the bearing area of the first film.

Optionally, the spacer comprises a split spacer.

Optionally, the inner ring of the first and second retainer rings is the same size.

Optionally, the first fixing ring and the second fixing ring are both metal rings.

According to the utility model discloses a second aspect of the embodiment provides a expand brilliant equipment, includes: the crystal expanding device is described above; and the top film structure is used for reciprocating along the direction from the first fixing ring to the second fixing ring so as to extend the first thin film, wherein the area surrounded by the inner ring of the first fixing ring is not smaller than the size of the top film structure, so that the top film structure passes through the inner ring of the first fixing ring.

Optionally, the top film structure has a contact surface in direct contact with the first thin film.

Optionally, the film pressing structure is further included for providing a force to the contact area of the extension portion of the second film and the first film after the first film is stretched, so as to fixedly connect the extension portion of the second film and the first film.

Optionally, the method further comprises: a first fastener for supporting the first retainer ring; and the second fixing piece is used for fixing the first fixing ring and the second fixing ring together with the first fixing piece.

According to the embodiment of the utility model provides an expand brilliant device, expand brilliant equipment, through first film and the first retainer plate that will have the wafer bearing area be connected, and set up the second retainer plate on first retainer plate, and the second retainer plate is connected with the second film that has fretwork district and extension, this fretwork district is relative with the bearing area of first film, after the first film of extension, first film is by the extension fixed connection of second film, thereby keep first film at the state of being extended, and the wafer on the first film exposes through the fretwork district, so that follow-up operating procedure to the wafer. Compared with the prior art, the utility model discloses creatively adopt the fixed first film after extending of second film that has the fretwork district to replaced the use and expanded the fixed film's of brilliant ring mode, increased the stability of fixed first film.

Furthermore, the cushion block is arranged between the first fixing ring and the second fixing ring, so that the first fixing ring is separated from the second fixing ring, when the first film is extended, the thickness of the cushion block is directly utilized to control the extension degree of the first film, the vertical moving distance of the first film bearing area corresponds to the thickness of the cushion block, and the extension control step of controlling the first film is simplified.

Furthermore, the cushion block is arranged to be split, so that the operation flexibility when the cushion block is placed is improved.

Furthermore, the contact part of the second film and the first film is in an annular shape to surround the bearing area of the first film, so that the second film can be contacted and fixed with the first film in an all-around manner, the stress uniformity of the extended first film is increased, the fixing strength of the first film is improved, and the risks of falling off, damage and the like of the first film are reduced.

Furthermore, by adopting the first fixing ring and the second fixing ring with the same inner ring size to fix the first film and the second film, compared with the inner and outer crystal ring fixing films, the first fixing ring and the second fixing ring do not need to specially match the inner and outer ring sizes of the two fixing rings, so that the processing difficulty is reduced, and the processing efficiency is improved.

Furthermore, through the fixed first film of first retainer plate and the fixed second film of second retainer plate that adopt metal material, compare in plastics and expand brilliant ring, the difficult deformation of metal retainer plate has further improved the fixed stability of film.

Further, in the process of extending the first film, the contact surface of the first film and the top film structure is in direct contact, and compared with the contact of the crystal expansion ring and the film, the contact area of the film is increased, the stress uniformity during extension is increased, and the risks of breakage and the like of the first film are reduced.

In addition, in the process of processing the wafer, the problem of size matching of the inner wafer expanding ring and the outer wafer expanding ring does not need to be considered, the alignment difficulty of the process is reduced no matter in the process of extending the first film or fixing the first film and the second film, and the flexibility of the processing process is improved.

Drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings of the embodiments will be briefly described below, and it should be apparent that the drawings in the following description only relate to some embodiments of the present invention, and are not intended to limit the present invention.

Fig. 1a to 4b are schematic views of a wafer processing method at some stages in a related process.

Fig. 5a to 13 are schematic diagrams of a wafer processing method according to an embodiment of the present invention at some stages.

Fig. 14 is a schematic structural diagram of a wafer expanding apparatus according to an embodiment of the present invention.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown. For simplicity, the semiconductor structure obtained after several steps can be described in one figure.

Fig. 1a to 4b are schematic diagrams of a wafer processing method in a related process at some stages, wherein fig. 1a is a top view of fig. 1b, fig. 2a is a top view of fig. 2b, fig. 3a is a top view of fig. 3b, and fig. 4a is a bottom view of fig. 4 b.

In the related process, the edge of the thin film 101 carrying the diced wafer 100 needs to be clamped and fixed by the clamping structure 110, and then the inner wafer-expanding ring 11 is placed on the top film structure 120, wherein the inner wafer-expanding ring 11 is located below the thin film 101 and needs to be precisely aligned with the wafer 100, as shown in fig. 1a and fig. 1 b. The inner ring size of the inner wafer expansion ring 11 needs to be larger than that of the wafer 100, but the inner ring size of the inner wafer expansion ring 11 is not too large in consideration of factors such as the fixing stability of the subsequent film 101, and therefore the wafers 100 with different sizes need to be matched with the corresponding inner wafer expansion rings 11.

Further, the top film structure 120 is moved toward the film 101, so that the film 101 is extended after contacting the inner wafer-expanding ring 11, thereby expanding the space between each chip 101a on the wafer, as shown in fig. 2a and fig. 2 b.

Further, the outer ring 12 is placed on the film 101, and the outer ring 12 is moved toward the inner ring 11, as shown in fig. 3a and 3 b. The outer die-expanding ring 12 and the inner die-expanding ring 11 need to be precisely aligned, and the inner ring size of the outer die-expanding ring 12 needs to be matched with the outer ring size of the inner die-expanding ring 11, so that the outer die-expanding ring 12 and the inner die-expanding ring 11 are engaged and the film 101 is clamped and fixed, as shown in fig. 4a and 4b, after the outer die-expanding ring 12 and the inner die-expanding ring 11 are engaged, the extra film 101 needs to be cut.

However, in the above-mentioned wafer processing method, once one of the outer wafer expansion ring 12 and the inner wafer expansion ring 11 is deformed, the film 101 is easily partially or completely peeled off from between the two wafer expansion rings, so that the problem of uneven spacing between each chip 101a due to the retraction of the film 101 occurs, which is not favorable for the subsequent operation of the chips. Moreover, the method has strict requirements on the sizes of the outer wafer expansion ring 12 and the inner wafer expansion ring 11, and for each size of the wafer 100, the inner wafer expansion rings 11 with different sizes need to be matched, which increases the complexity of wafer processing. In addition, when the film 101 is stretched, in the force direction, the film 101 is only in contact with the inner wafer expansion ring 11, and the contact area is small, so that the pressure is high, and the film 101 is easily damaged; when the film 101 is stretched, the moving distance of the top film structure 120 and the stretching degree of the film 101 need to be adjusted every time, which increases the time for wafer processing and reduces the processing efficiency.

To improve the above problem, an embodiment of the present invention provides an improved wafer processing method, which will be described in detail with reference to fig. 5a to 13, wherein fig. 5a is a top view of fig. 5b, fig. 6a is a top view of fig. 6b, fig. 7a is a top view of fig. 7b, fig. 9a is a top view of fig. 9b, and fig. 10a is a top view of fig. 10 b.

In the wafer processing method of the present embodiment, the wafer 100 is fixed on the first film 201, and the first film 201 is fixedly connected to the first fixing ring 211, wherein the first film 201 at least covers an area surrounded by the inner ring 211a of the first fixing ring 211, as shown in fig. 5a and fig. 5 b.

In the present embodiment, the first film 201 includes: a carrier region 201a, a connection region 201b, and an edge region 201 c. The carrying region 201a is used for carrying the wafer 100. The edge region 201c surrounds the carrying region 201a, and the edge region 201c is fixedly connected with the first fixing ring 211. The carrier region 201a is connected to the edge region 201c by a connection region 201 b. The first film 201 includes a transparent UV film, a blue film, and the like. The first fixing ring 201 is a metal ring, such as an iron ring or a stainless steel ring.

In some embodiments, the inner ring of the first retaining ring 201 is 8 inches in size, which is a standard jig in wafer processing steps. The first film 201 is a whole circular film with the size not less than 8 inches. However, the present embodiment is not limited thereto, and those skilled in the art may make other arrangements on the materials and sizes of the first film 201 and the first fixing ring 211 as needed.

The first fixing ring 211 and the first thin film 201 in this embodiment are used for fixing the wafer 100 in the dicing step of the wafer 100, and after the dicing is finished, the first fixing ring 211 is placed on the first fixing piece 221 of the wafer expanding apparatus, and the first fixing piece 221 is used for supporting the first fixing ring 211.

Further, the spacer 230 is placed on the first fixing ring 211, as shown in fig. 6a and 6 b.

In this embodiment, the thickness of the spacer 230 is set according to the extension degree of the first film 201. Wherein, the cushion block 230 is a split type cushion block, the shape is two semicircular rings, and the inner diameter size corresponds to the first fixing ring 211. When the pad 230 is placed, the pad 230 may avoid the first film 201, and may press the first film 201.

However, the embodiments of the present invention are not limited thereto, and one skilled in the art may set the cushion block 230 to be an integral ring shape, or to be divided into a plurality of cubes, etc., as needed.

Further, a second retainer ring 212 is placed on the spacer 230, as shown in fig. 7a and 7 b.

In this embodiment, the second fixing ring 212 is fixedly connected to the second film 202, and the second film 202 includes: a hollow-out area 202a, an extension 202b, and an edge area 202 c. The hollow area 202a is opposite to the carrying area 201a of the first film 201, so that the wafer 100 on the carrying area 201a is exposed through the hollow area 202 a. The edge region 202c is fixedly connected to the second fixing ring 212, and the extension portion 202b extends from the edge region 202c to a region surrounded by the inner ring 212a of the second fixing ring 212 by a predetermined length, wherein the second film 202 is ring-shaped. However, the present invention is not limited thereto, and those skilled in the art can make other arrangements to the shape of the second film 202 as required, for example, the second film 202 is segmented, as shown in fig. 8, and the segmented second film 202 includes: the hollow-out area 202a, the extending portion 202b and the edge area 202c, and the segmented second film 202 are uniformly distributed on the second fixing ring 212.

Further, the second fixing member 222 is located on the first fixing ring 212, and the second fixing member 222 and the first fixing member 221 fix the first fixing ring 211 and the second fixing ring 212 together, and after the first fixing ring 211 and the second fixing ring 212 are fixed, the top film structure 240 is moved to stretch the first film 201, so that the plurality of chips 100a on the wafer have a predetermined distance therebetween, as shown in fig. 9a and 9b, wherein fig. 9a does not show the second fixing member 222.

In this embodiment, the top film structure 240 can move back and forth along the direction from the first fixing ring 211 to the second fixing ring 212, or along the thickness direction of the spacer 230, the area surrounded by the inner ring of the first fixing ring 211 is not smaller than the size of the top film structure 240, so that the top film structure 240 passes through the inner ring of the first fixing ring 211, and the vertical projection of at least part of the extension of the second thin film 202 falls on the top film structure 240. The top film structure 240 has a contact surface 241 in direct contact with the first film 201. The carrier region and a portion of the attachment region of the first film 201 are in direct contact with the contact surface 241 and move with the top film structure 240 during the movement of the top film structure 240 toward the second retainer ring 212 to cause the first film 201 to stretch.

In some specific embodiments, the distance that the bearing region of the first film 201 moves along the direction from the first fixing ring 211 to the second fixing ring 212 is consistent with the thickness of the spacer block 230 (wherein, in actual production, the thickness of the second fixing ring 212 is ignored because the thickness of the second fixing ring 212 is small compared with the thickness of the spacer block). Since the second film 202 is made of a flexible material, after the first film 201 is stretched, the extended portion of the second film 202 will contact the first film 201.

In some other embodiments, if the thickness of the second fixing ring 212 is relatively large, the spacer 230 may be omitted, and the distance of the movement of the bearing region of the first film 201 along the direction from the first fixing ring 211 to the second fixing ring 212 is consistent with the thickness of the second fixing ring 212.

Further, the lamination structure 250 is placed on the extension portion of the second film 202, and the lamination structure 250 is moved along the second fixing ring 212 toward the first fixing ring 212 to apply a force to the extension portion of the second film 202, as shown in fig. 10a and 10b, wherein fig. 10a does not show the second fixing member 222.

In the present embodiment, the squeeze film structure 250 is ring-shaped, and the extension of the second film 202 contacting the squeeze film structure 250 also contacts the first film 201.

After the squeeze film structure 250 applies a force to the extension portion of the second film 202, the extension portion of the second film 202 and the first film 201 are fixedly connected, and the contact portion 20 of the second film 202 and the first film 201 annularly surrounds the carrying area of the first film 201, as shown in fig. 11.

Further, the squeeze film structure 250, the top film structure 240 and the second fixing member 222 are reset, the first fixing ring 211, the second fixing ring 212 and the spacers 230 are removed from the first fixing member 221, and the spacers 230 are removed from between the first fixing ring 211 and the second fixing ring 212, as shown in fig. 12. Or the first fixing ring 211 is separated from the first film 201 as shown in fig. 13. At this time, the stretched first film 201 is fixed by the second film 202.

As shown in fig. 14, the wafer expanding apparatus according to the embodiment of the present invention includes: a box 260 for accommodating the top film structure, a squeeze film structure (not shown in fig. 14), a first fixing part 221, a second fixing part 222, and a wafer expanding device, wherein the wafer expanding device comprises: the first fixed ring, the second fixed ring and the cushion block. The detailed structures and functions of the squeeze film structure, the first firmware 221, the second firmware 222 and the wafer expanding device can be described with reference to fig. 5a to 13, and are not described herein again.

According to the embodiment of the utility model provides an expand brilliant device, expand brilliant equipment and wafer processing method, through first film and the first retainer plate that will have the wafer bearing area be connected to set up the second retainer plate on first retainer plate, and the second retainer plate is connected with the second film that has fretwork district and extension, this fretwork district is relative with the bearing area of first film, after the first film of extension, first film is by the extension fixed connection of second film, thereby keep first film at the state of being extended, and the wafer on the first film exposes through the fretwork district, so that follow-up operating procedure to the wafer. Compared with the prior art, the utility model discloses creatively adopt the fixed first film after extending of second film that has the fretwork district to replaced the use and expanded the fixed film's of brilliant ring mode, increased the stability of fixed first film.

Adopt the utility model discloses an expand brilliant device, expand brilliant equipment processing wafer and can simplify process flow, reduce the turnover number of times to do benefit to the reduction of particle (dirty granule) on the chip, do benefit to the cleanness of chip more. Adopt behind the expansion brilliant ring fixed wafer of specific dimension again for expanding on arranging the wafer in the processing equipment (operating the computer) after brilliant, the utility model discloses a such standard component tool commonality of first retainer plate and second retainer plate is very high, has reduced the operation of changing the tool at last machine in-process.

The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present invention, and these alternatives and modifications are intended to fall within the scope of the present invention.

Claims

1. A crystal expansion apparatus, comprising:

the first fixing ring is fixedly connected with a first thin film, the first thin film at least covers an area surrounded by an inner ring of the first fixing ring, and a bearing area of the first thin film is used for bearing a wafer; and

the second fixing ring is positioned on the first fixing ring and is fixedly connected with a second film, the second film is provided with a hollow area and an extension part, the hollow area is opposite to the bearing area of the first film,

wherein the first film is stretched, so that the bearing area moves along the direction from the first fixing ring to the second fixing ring, and the first film is fixed in contact with the extension part of the second film.

2. The crystal expanding device according to claim 1, further comprising a spacer block between said first fixed ring and said second fixed ring to separate said first fixed ring from said second fixed ring,

and the moving distance of the bearing area corresponds to the thickness of the cushion block.

3. The crystal expansion device of claim 1, wherein the contact portion of the second film and the first film annularly surrounds the carrying region of the first film.

4. The crystal expansion apparatus of claim 2, wherein said spacers comprise split spacers.

5. The crystal expanding device according to any one of claims 1 to 4, wherein the inner ring of the first fixed ring and the inner ring of the second fixed ring are the same size.

6. The crystal expanding device according to any one of claims 1 to 4, wherein the first fixing ring and the second fixing ring are both metal rings.

7. A wafer expanding apparatus, comprising:

the crystal expansion apparatus of any one of claims 1 to 6; and

a top film structure for reciprocating in a direction from the first retainer ring to the second retainer ring to stretch the first film,

wherein the area surrounded by the inner ring of the first fixing ring is not smaller than the size of the top membrane structure, so that the top membrane structure passes through the inner ring of the first fixing ring.

8. The wafer spreading apparatus according to claim 7, wherein the top film structure has a contact surface directly contacting the first thin film.

9. The wafer spreading device according to claim 7, further comprising a film pressing structure for providing a force to the extension portion of the second film and the contact region of the first film after the first film is stretched to fixedly connect the extension portion of the second film and the first film.