CN113196460A - Holding table - Google Patents
Holding table Download PDFInfo
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- CN113196460A CN113196460A CN201980082928.XA CN201980082928A CN113196460A CN 113196460 A CN113196460 A CN 113196460A CN 201980082928 A CN201980082928 A CN 201980082928A CN 113196460 A CN113196460 A CN 113196460A
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- Prior art keywords
- holding
- support portion
- circumferential support
- inner circumferential
- holding table
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000037303 wrinkles Effects 0.000 abstract description 6
- 238000001179 sorption measurement Methods 0.000 abstract description 2
- 230000007480 spreading Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention provides a holding table which can prevent air inclusion and wrinkles from generating in a chip holding area for holding a chip component after dicing, can shorten the time until the completion of adsorption, and has a relatively simple structure. Specifically, a holding table for holding a die-attach-to-die-ring-attached extended piece of a diced chip component, the extended piece having an adhesive first surface and a non-adhesive second surface, the holding table comprising: an outer periphery support portion which abuts against the second surface side and supports an outer periphery portion of a chip holding region holding the chip component in the extending sheet in a predetermined posture; an inner peripheral support portion which abuts against the second surface side and supports an inner peripheral portion including the chip holding region in the extending sheet in a flat posture; and a negative pressure suction unit that makes a region where the outer circumferential support and the inner circumferential support abut against the second surface of the extension sheet negative pressure, wherein the outer circumferential support includes a protruding portion protruding from the inner circumferential support inside the region where the wafer ring is disposed.
Description
Technical Field
The present invention relates to a holding table for holding a stretchable expanding piece attached to an annular wafer ring for holding a chip component after dicing in a predetermined posture.
Background
In a semiconductor device, a plurality of semiconductor device circuits are formed on 1 semiconductor wafer, and the semiconductor device is singulated into individual chip components, and the chip components are packaged, whereby the semiconductor device is shipped as an electronic component in a single unit or incorporated into an electric product.
Further, 1 semiconductor wafer is handled in a state of being bonded and fixed to an expandable and contractible expanding sheet (also referred to as a dicing tape) attached to a ring-shaped wafer ring (also referred to as an expanding ring or a dicing frame), and the semiconductor wafer is diced and singulated into a plurality of chip components (for example, patent document 1).
Then, the diced chip components are attached to the spreading sheet, and after inspection, good products are picked up and packaged (for example, patent documents 2 and 3).
The ring-shaped wafer ring includes a ring-shaped wafer ring in which an extended piece is bonded and fixed to a nearly annular metal plate, a ring-shaped wafer ring in which an extended piece is sandwiched and fixed by a double ring-shaped frame such as an embroidery frame, and the like.
Documents of the prior art
Patent document
Patent document 1: international publication No. 2018/079536
Patent document 2: japanese patent No. 5917492
Patent document 3: japanese patent laid-open No. 2006 and 332468
Disclosure of Invention
Technical problem to be solved by the invention
The expansion sheet attached to the annular wafer ring loses rigidity after the wafer is diced, and is liable to be loosened or wrinkled. Therefore, when the extended piece is placed on a holding table formed of a flat surface and suction-held, there are problems such as the following: air inclusions (エア recessed into み) are generated in the chip holding region holding the diced chip components (air pockets not discharged are scattered in the adhesion region), or wrinkles remain, and the expansion sheet cannot be held in a predetermined posture.
On the other hand, in the structure in which the tension is applied by pushing up the extension piece in advance by the mechanism that raises the portion corresponding to the cavity of the wafer ring to a position above the portion supporting the wafer ring, there are problems that the structure and mechanism are complicated, and the work time for applying the tension is additionally consumed.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a holding table that can reduce the time until completion of suction without generating air entrapment and wrinkles in a chip holding region for holding a diced chip component, and has a relatively simple structure.
Means for solving the problems
In order to solve the above-described problems, one aspect of the present invention is a holding table for holding a stretchable extended piece attached to a ring-shaped wafer ring for holding a chip component after dicing in a predetermined posture,
the spreading sheet has an adhesive first surface for holding the chip component and a non-adhesive second surface in a front-to-back relationship with the first surface,
the holding table includes:
an outer periphery support portion which abuts against the second surface side and supports an outer periphery portion of the chip holding region holding the chip component in the extending sheet in a predetermined posture;
an inner peripheral support portion which abuts against the second surface side and supports an inner peripheral portion including the chip holding region in the extending sheet in a flat posture; and
a negative pressure suction part which makes the areas where the outer circumference supporting part and the inner circumference supporting part are contacted with the second surface of the expansion piece as negative pressure,
wherein the content of the first and second substances,
the outer circumferential support portion includes a protruding portion protruding from the inner circumferential support portion inside a region where the wafer ring is disposed.
Effects of the invention
According to the present invention, air entrapment and wrinkles are not generated in the chip holding region holding the diced chip component, and the time until completion of the suction can be shortened. Further, the holding table having a relatively simple structure can be embodied.
Drawings
Fig. 1 is a perspective view showing an example of an embodiment of the present invention.
Fig. 2 is a cross-sectional view showing a key part of an embodiment of the present invention.
Fig. 3 is a perspective view showing a modification of the embodiment of the present invention.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
In the following description, the three axes of the orthogonal coordinate system are represented as X, Y, Z, the horizontal direction is represented as the X direction and the Y direction, and the direction perpendicular to the XY plane (i.e., the direction of gravity) is represented as the Z direction. In addition, regarding the Z direction, a direction opposite to the gravity is denoted as up, and a direction in which the gravity acts is denoted as down. The direction of rotation about the Z direction as the central axis is defined as the θ direction.
Fig. 1 is a perspective view showing an example of an embodiment of the present invention. Fig. 1 is a perspective view of a holding table 1 according to the present invention.
The holding table 1 holds an expandable expanding piece Ws (simply referred to as a workpiece W) attached to the annular wafer ring Wr for holding the diced chip components D in a predetermined posture. Specifically, the holding table 1 includes an outer circumferential support portion 2, an inner circumferential support portion 3, a negative pressure suction portion 4, and the like.
The spreading sheet Ws forms the following structure: the chip component D is held with adhesiveness on the side of the first surface (e.g., upper surface) S1 and non-adhesiveness on the side of the second surface (e.g., lower surface) S2 in front-back relation with the first surface S1. The diced chip components D are bonded (i.e., held) to the first surface S1 side having adhesiveness. Further, the spreading sheet Ws is made of a resin film in which a material having excellent flexibility, such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or Polyolefin (PO), is blended, and has stretchability.
The wafer ring Wr fixes the outer periphery of the extended piece Ws. Specifically, the wafer ring Wr has a ring shape with a circular outer peripheral edge Wx and inner peripheral edge Wn and is hollowed out, and is made of a thin plate of aluminum, stainless steel, resin, or the like. More specifically, the extension sheet Ws is bonded to the lower surface side of the wafer ring Wr, and the outer peripheral edge Wt of the extension sheet Ws is disposed on the same side as or inside the outer peripheral edge Wx of the wafer ring Wr.
The outer peripheral support portion 2 abuts against and supports an outer peripheral portion of the extending piece Ws on the outer side of the chip holding region Rd holding the chip component D from the non-adhesive second surface S2 side, and supports the workpiece W in a predetermined posture.
Specifically, the outer periphery support portion 2 includes the contact surface 21, a hole portion 41 described in detail later, and the protruding portion 5.
The abutment surface 21 is a portion that abuts and supports the outer peripheral portion of the expanding piece Ws from the second surface S2 side. Specifically, the upper surface of the contact surface 21 is formed of a smooth surface, and a negative pressure is applied to the annular region Rw outside the portion (indicated by the broken line Cn) where the inner peripheral edge Wn of the annular wafer ring Wr is disposed and inside the portion (indicated by the broken line Ct) where the outer peripheral edge Wt of the affixed extended piece Ws is disposed, thereby closely holding the extended piece Ws.
The smoothness required for the contact surface 21 includes not only a polished state (a narrow smooth surface) but also a state (a wide smooth surface) in which a predetermined negative pressure is applied to the annular region Rw and molding, cutting, or the like is performed to such an extent that the expanded pieces Ws can be closely held.
The inner peripheral support portion 3 abuts on the non-adhesive second surface S2 side and supports the inner peripheral portion of the extending piece Ws including the chip holding region R holding the chip component D in a flat posture.
Specifically, the inner circumferential support portion 3 has a structure in which a portion (i.e., the contact surface 31) that contacts the chip holding region R of the expanding piece Ws is a rough surface (also referred to as a non-smooth surface), and the head top portion of each mountain of the rough surface is substantially flat in the XY direction.
More specifically, the rough surface is obtained by subjecting the surface of a smooth plate-like member to physical treatment such as sandblasting, cutting, and hot pressing, and chemical treatment such as etching, and performing unevenness processing at a repetition pitch finer than the outer dimension of the chip component D after dicing. Therefore, in the inner circumferential support portion 3, the contact surface 31 with the chip holding region R of the spreading piece Ws has the following shape: macroscopically, the top portions of the peaks of the rough surface are substantially flat, and the chip components D can be supported in a horizontal state.
The negative pressure suction unit 4 sets a negative pressure (also referred to as a reduced pressure, lower than atmospheric pressure) at a portion where the non-adhesive layer side surface (i.e., lower surface) S2 of the expanded sheet Ws contacts the outer circumferential support 2.
Specifically, the negative pressure suction unit 4 includes a hole portion 41, a negative pressure generating unit 42, a switching valve 44, and the like.
The groove 41 allows negative pressure to act on a predetermined region of the contact surface 21 against which the spreading piece Ws contacts. Specifically, the hole groove portion 41 is formed of holes scattered in the contact surface 21 and arc-shaped grooves, and is connected to a negative pressure generating unit or the like. The hole-groove portion 41 can apply negative pressure to the annular region Rw of the contact surface 21 by applying negative pressure to the inside in a state where the expansion pieces Ws cover the upper portions of the holes and grooves.
The negative pressure generating unit 42 makes the hole groove portion 41 negative pressure. Specifically, the negative pressure generating means 42 may be exemplified by a container (so-called vacuum tank) having an inside of a negative pressure, in addition to a vacuum pump, an ejector, and the like provided outside the holding table 1. More specifically, the negative pressure generating unit 42 is connected to a connection port 43 communicating with the orifice portion 41 via a pressure regulator (so-called vacuum regulator) not shown, a switching valve 44.
The connection port 43 can bring the groove portion 41 into a negative pressure state, or a state called vacuum break or atmospheric release, by a switching operation of the switching valve 44.
The switching valve 44 may be exemplified by a manual valve and an electromagnetic valve.
When the expanding pieces Ws are supported by the inner periphery supporting portion 3, the protruding portions 5 apply tension to the expanding pieces Ws. The projecting portion 5 is disposed at a position projecting upward from the inner circumferential support portion 3 inside the region of the outer circumferential support portion 2 where the wafer ring Wr is disposed.
Specifically, the protruding portion 5 is disposed inside the region of the outer circumferential support 2 where the inner circumferential edge Wn of the wafer ring Wr is disposed and outside the chip holding region Rd of the expansion piece Ws where the chip component D is held, when the holding table 1 is viewed in plan (i.e., when viewed in plan from above), and the protruding portion 5 is disposed so as to protrude further than the contact surface 31 of the inner circumferential support 3 (specifically, the head portion of each mountain of the rough surface) when viewed from the side (or also referred to as cross section).
More specifically, the protrusion 5 is formed of concentric step d. The corner of the step d is circumferentially continuous 360 degrees. In other words, the holding table 1 is in a state in which the inner circumferential support portion 3 is recessed from the outer circumferential support portion 2 by the concentric step d, and the corner of the step d of the outer circumferential support portion 2 constitutes the protruding portion 5.
Fig. 2 is a cross-sectional view showing a key part of an embodiment of the present invention. Fig. 2 (a) to (d) show a case where the workpiece W is placed on and held by the holding table 1 of the present invention in time series.
First, fig. 2 (a) shows a state immediately before the workpiece W is placed on the holding table 1. The workpiece W is handled by an operator, a transfer robot, or the like, and is conveyed to a position facing the holding table 1 as shown in the drawing. Then, the workpiece W is directly placed on the holding table 1, or after the workpiece W is temporarily placed on the upper and lower rod-shaped support members by an elevator device called an elevator pin, not shown, the elevator pin is lowered to place the workpiece W on the holding table 1.
Fig. 2 (b) shows a state immediately after the workpiece W is placed on the holding table 1. At this time, the outer peripheral portion of the lower surface S2 of the expansion piece Ws abuts against the abutment surface 21 of the outer peripheral support portion 2. On the other hand, the lower surface S2 of the chip holding region Rd of the expanding piece Ws is not in contact with the inner circumferential support portion 3, or is in contact with the inner circumferential support portion 3 at a portion near the center portion.
Therefore, when the expanded pieces Ws are supported by the outer circumferential support portion 2, the projecting portion 5 can slightly separate the expanded pieces Ws from the inner circumferential support portion 3 by the step d of the projecting portion 5 without bringing the second surface S2 of the expanded pieces Ws into contact with the entire inner circumferential support portion 3, so that the air pockets P can be formed.
Fig. 2(c) shows a state in which the negative pressure suction portion 4 is brought into a negative pressure state and the lower surface S2 of the expansion sheet Ws is brought into contact with the inner circumferential support portion 3.
Then, the negative pressure suction unit 4 is brought into a negative pressure state, and the space surrounded by the lower surface S2 of the extending piece Ws, the protruding portion 5 and the wall surface of the outer circumferential support portion 2, and the surface of the inner circumferential support portion 3 is depressurized (a pressure lower than the atmospheric pressure). At this time, due to the difference between the atmospheric pressure applied to the upper surface S1 and the pressure applied to the lower surface S2 and the elastic deformation (expansion) of the expansion pieces Ws, the center portion of the chip holding region Rd of the expansion pieces Ws is in a state of sagging downward, and the area of contact with the surface of the inner periphery support portion 3 gradually increases from the vicinity of the center portion. Further, although the air pockets P are formed near the protruding portion 5, the close contact region of the spreading piece Ws spreads toward the outer peripheral portion as the pressure is reduced.
That is, the negative pressure suction expansion sheet Ws comes into close contact with the surface of the inner circumferential support 3 from the central portion of the chip holding region Rd away from the protruding portion 5 while following the surface, and the portion in close contact gradually expands from the central portion toward the outer circumferential side, and the volume of the air pool P gradually decreases. At this time, the expansion sheet Ws follows the surface of the inner circumferential support portion 3 while being applied with tension and is in close contact therewith, so that the occurrence of slack and wrinkles can be prevented. Further, the generation of air entrainment can be prevented, and the suction and exhaust can be efficiently performed.
Fig. 2(d) shows a state in which the pressure reduction is continued by the negative pressure suction portion 4 and the lower surface S2 of the spread sheet Ws is finally in contact with the inner circumferential support portion 3.
At this time, the space surrounded by the lower surface S2 of the expansion piece Ws, the protruding portion 5 and the wall surface of the outer circumferential support portion 2, and the surface of the inner circumferential support portion 3 is brought into a state closer to vacuum, and the expansion piece Ws follows the surface of the inner circumferential support portion 3 by interacting with the stretchability of the expansion piece Ws. The air pockets P near the protruding portion 5 are reduced, and the lower surface S2 of the spreading piece Ws is in close contact with the surface of the inner circumferential support portion 3 not only over the entire chip holding region Rd but also up to the vicinity of the side surface of the protruding portion 5. At this time, the spreading pieces Ws are brought into close contact with the stepped portions of the surface of the inner circumferential support portion 3 and the protruding portions 5, and are stretched, thereby generating tension.
Thereafter, the workpiece W is subjected to a predetermined process while being held on the holding table 1. Then, if the predetermined process is finished, the negative pressure suction from the negative pressure suction unit 4 is released.
In this way, the air pool P in the vicinity of the protruding portion 5 is returned from the negative pressure to the atmospheric pressure, and the lower surface S2 of the expanding sheet Ws is peeled from the inner circumferential support portion 3 by the tension acting on the expanding sheet Ws. The separation gradually expands from the outer peripheral side (i.e., the vicinity of the protruding portion 5) toward the center Rc side of the chip holding region Rd. At this time, since the protruding portion 5 is present, the tension acting when the expansion piece Ws and the inner circumferential support portion 3 are in close contact acts as a restoring force to return the expansion piece Ws from the expanded state to the original state, and therefore, the separation rapidly progresses.
Since the holding table 1 of the present invention has the above-described configuration, air entrapment and wrinkling in the chip holding region Rd holding the diced chip component D are not generated, and the time until completion of the suction can be shortened. Further, the holding table having a relatively simple structure can be realized. Further, since the protrusion 5 is present at the time of releasing the suction, the restoring force of the expanded pieces Ws acts, and thus the separation can be performed quickly, and the time until the completion of the suction release can be shortened.
[ inner periphery support part 3]
In the above, an example is shown in which the portion (also referred to as an abutment surface) 31 of the inner circumferential support portion 3 that abuts the chip holding region R of the spreading piece Ws is formed of a rough surface. Therefore, when suction is performed or suction is released, since the expansion sheet Ws is not in surface contact but in a state of close point contact, it is possible to prevent wrinkles and slack from occurring without hindering the expansion and contraction of the expansion sheet Ws. Further, since the contact surface 31 is preferably formed of a rough surface, it is possible to reduce the stagnation of air when in close contact with the spreading sheet Ws, prevent the occurrence of air entrapment, and the like, and to discharge air more efficiently than a smooth surface, and therefore, it is possible to further shorten the time until the completion of suction. Further, when the negative pressure suction is released, the vacuum-broken air easily flows back, and therefore, the time until the expanded pieces Ws can be peeled off from the inner circumferential support portion 3 can be shortened.
However, the contact surface 31 is not limited to a rough surface, and may be a structure in which grooves finer than the outer dimensions of the chip components D are radially or randomly formed. This enables the plurality of chip components D to be supported on substantially the same plane in a horizontal state.
On the other hand, in the case where the expanded pieces Ws are easily peeled off from the inner circumferential support portion 3, the contact surface 31 may be formed of a smooth surface.
[ concerning the protruding part 5]
In embodying the present invention, the protruding portion 5 is not limited to the above-described configuration shown in fig. 1 and 2, and may be configured in various shapes and arrangements. A modification of the protruding portion 5 is shown below.
Fig. 3 is a perspective view showing a modification of the embodiment of the present invention. In fig. 3(a) to (D), the external appearance of the holding tables 1A to 1D of the present invention is illustrated in a perspective view, and the holding tables are configured to have protrusions 5A to 5D having different shapes and different arrangements, respectively.
For example, as illustrated in fig. 3(a), the holding table 1A has a structure including 2 or more protruding portions 5A arranged at the same interval with respect to the center of the inner circumferential support portion 3.
The protruding portions 5A are 3 cylindrical members arranged inside the region of the outer circumferential support portion 2 where the wafer ring Wr is arranged, and outside the chip holding region Rd of the inner circumferential support portion 3 at equal intervals (also referred to as equal angles) at the same distance as the center Rc of the chip holding region Rd. The protruding portion 5A is disposed at a position protruding upward from the inner circumferential support portion 3.
The number of cylindrical members constituting the protruding portion 5A may be 2, or 4 or more. For example, 6 cylindrical members may be arranged including 3 of the positions indicated by the broken lines in fig. 3 (a). The shape of the protruding portion 5A is not limited to a cylindrical shape, and may be a hemispherical shape, a prismatic shape, a fan shape, or the like.
In the holding table 1A, the abutment surface 21 of the outer circumferential support portion 2 and the abutment surface 31 of the inner circumferential support portion 3 may be formed to have the same height (i.e., the same plane) or may have a step (not necessarily the same plane).
On the other hand, as illustrated in fig. 3(B), the holding table 1B includes 2 or more arc island-shaped protrusions 5B arranged at predetermined intervals from each other, and the predetermined intervals have a structure extending radially toward the center Rc of the inner circumferential support portion 3.
The protruding portion 5B is disposed at a position protruding upward from the inner circumferential support portion 3 inside the region of the outer circumferential support portion 2 where the wafer ring Wr is disposed and outside the chip holding region Rd of the inner circumferential support portion 3.
The arc-shaped island-shaped protrusions 5B may be arranged at equal intervals 5g in the same shape by 2 or more, or may be arranged at unequal intervals in different shapes.
In the holding table 1B, the abutment surface 21 of the outer circumferential support portion 2 and the abutment surface 31 of the inner circumferential support portion 3 may be formed to have the same height (i.e., the same plane) or may have a step (not necessarily the same plane).
On the other hand, as illustrated in fig. 3(C), the holding table 1C includes a protrusion 5C arranged in a concentric annular island shape with respect to the center Rc of the inner circumferential support portion 3.
The protruding portion 5C is disposed at a position protruding upward from the inner circumferential support portion 3 inside the region of the outer circumferential support portion 2 where the wafer ring Wr is disposed and outside the chip holding region Rd of the inner circumferential support portion 3.
In the holding table 1C, the abutment surface 21 of the outer circumferential support portion 2 and the abutment surface 31 of the inner circumferential support portion 3 may be formed to have the same height (i.e., the same plane) or may have a step (not necessarily the same plane).
On the other hand, as illustrated in fig. 3(D), the holding table 1D is configured to have 2 or more discontinuous uneven inner peripheral shaped protruding portions 5D.
The protruding portion 5D is formed of a step provided inside the region of the outer circumferential support 2 where the wafer ring Wr is disposed and outside the chip holding region Rd of the inner circumferential support 3, and protrudes upward from the inner circumferential support 3. The surface of the protruding portion 5D is formed by a plane substantially identical to the contact surface 21 of the outer circumferential support 2.
The protruding portions 5, 5A to 5D may be formed of smooth surfaces, but may be formed of rough surfaces. The rough surface is preferable because the movement of air during negative pressure suction can be performed quickly, and the time required for completion of adsorption can be shortened. The same applies to the case of releasing the suction.
Alternatively, the surface of the protruding portions 5, 5A to 5D may have groove portions 5g extending radially toward the center Rc of the inner circumferential support portion 3.
Specifically, the protrusion 5B illustrated in fig. 3(B) may be provided with a groove 5g such as the protrusion 5C illustrated in fig. 3 (C). Alternatively, the protrusion 5 illustrated in fig. 1 may be provided with a groove 5g such as the protrusion 5D illustrated in fig. 3 (D).
In this way, the groove portions 5g provided on the surface of the protruding portion are preferably configured to radially extend toward the center Rc of the inner circumferential support portion 3, and therefore, the air can rapidly move during the negative pressure suction, and the time until the completion of the suction can be shortened. The same applies to the case of releasing the suction.
With this configuration, when the outer circumferential support portion 2 supports the expanded pieces Ws, the holding tables 1A to 1D including the projecting portions 5A to 5D can form the air pools P by slightly separating the expanded pieces Ws from the inner circumferential support portion 3 by the step D of the projecting portion 5 without bringing the second surfaces S2 of the expanded pieces Ws into contact with the entire inner circumferential support portion 3. Therefore, when the expanding pieces Ws are supported by the inner circumferential support portion 3, tension can be applied to the expanding pieces Ws.
[ with respect to the work W ]
In the above description, the circular wafer ring Wr is shown as an example of the workpiece W to explain in detail. However, the embodiment of the wafer ring Wr is not limited to such a configuration, and may be configured by, for example, a nearly annular, quadrangular, octagonal, or other annular thin plate member having a linear portion (orientation flat) for orientation in a part of the outer periphery.
In the above description, as an example of the workpiece W, a workpiece in which the wafer ring Wr is formed of an annular thin plate member is shown, and a configuration in which the extension piece Ws is affixed to the lower surface of the wafer ring Wr is exemplified. However, the embodiment of the workpiece W is not limited to such a configuration, and for example, a configuration may be adopted in which the expanding pieces Ws are sandwiched and fixed by a double frame (an inner frame called an inner ring and an outer frame called an outer ring) of a circular shape or a square shape.
[ outer periphery supporting part 2]
In the above, the configuration in which the expansion sheet Ws is closely held to the contact surface 21 by the negative pressure of the negative pressure suction portion 4 is exemplified as the outer circumferential support portion 2. However, the holding table 1 of the present invention is not limited to this configuration, and may have a configuration (so-called clamp mechanism) in which the wafer ring Wr is pressed downward from above. In this case, the spreading pieces Ws are held in close contact with the abutment surface 21 in an atmospheric pressure state, and then the air pool P is sucked in a negative pressure state to bring the spreading pieces Ws into close contact with the inner circumferential support portion 3.
[ with respect to holding tables ]
The holding table of the present invention can be used by incorporating the workpiece W into various devices and systems for carrying, processing, treating, observing, inspecting, etc., in addition to a system for using alone for holding the workpiece W.
Description of the symbols
1 holding table
2 outer circumference support part
3 inner circumference support part
4 negative pressure suction part
5 projecting part
5g groove (space)
21 contact surface
31 contact surface
41 hole groove part
42 negative pressure generating unit
43 connection port
44 switching valve
W workpiece
Wr wafer ring
Inner periphery of Wn wafer ring
Outer periphery of Wx wafer ring
Ws expansion sheet
Outer peripheral edge of Wt expansion sheet
S1 side of adhesive layer
S2 side of non-adhesive layer
D chip component
difference of d section
Rd chip holding region
Center of Rc
P air accumulation
Claims (6)
1. A holding table for holding a stretchable extended piece attached to an annular wafer ring for holding a chip component after dicing in a predetermined posture,
the expansion sheet has a first surface having adhesive properties for holding the chip component and a second surface having non-adhesive properties in a front-back relationship with the first surface,
the holding table includes:
an outer periphery support portion that abuts against the second surface side and supports an outer periphery portion of the chip holding region holding the chip component in the extending sheet in a predetermined posture;
an inner peripheral support portion that abuts from the second surface side and supports an inner peripheral portion including the chip holding region in the extended piece in a flat posture; and
a negative pressure suction unit that makes a region where the outer circumferential support portion and the inner circumferential support portion abut against the second surface of the extension sheet negative pressure,
the outer circumferential support portion includes a protruding portion protruding upward from the inner circumferential support portion inside a region where the wafer ring is disposed.
2. The holding table according to claim 1, wherein the protruding portions are arranged at equal intervals of 2 or more with respect to the center of the inner circumferential support portion.
3. The holding table according to claim 1 or 2, wherein the protrusion includes 2 or more arc-island-shaped protrusions arranged at a predetermined interval from each other, the predetermined interval extending radially toward a center side of the inner circumferential support portion.
4. The holding table according to claim 1, wherein the protruding portion is arranged in a concentric annular island shape with respect to a center of the inner circumferential support portion.
5. The holding table according to any one of claims 1 to 4, wherein a groove portion extending radially toward a center side of the inner circumferential support portion is provided on a surface of the protruding portion.
6. The holding table according to any one of claims 1 to 5, wherein a portion of the inner circumferential support portion that abuts the second surface of the expanding piece is formed of a rough surface,
the protruding portion protrudes upward from the top of each mountain of the rough surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018240772A JP2020102569A (en) | 2018-12-25 | 2018-12-25 | Holding table |
| JP2018-240772 | 2018-12-25 | ||
| PCT/JP2019/048444 WO2020137543A1 (en) | 2018-12-25 | 2019-12-11 | Holding table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113196460A true CN113196460A (en) | 2021-07-30 |
Family
ID=71128223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980082928.XA Pending CN113196460A (en) | 2018-12-25 | 2019-12-11 | Holding table |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020102569A (en) |
| CN (1) | CN113196460A (en) |
| TW (1) | TW202042338A (en) |
| WO (1) | WO2020137543A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024014307A1 (en) * | 2022-07-13 | 2024-01-18 | 三星ダイヤモンド工業株式会社 | Scribe table and scribe device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057158A (en) * | 2003-08-07 | 2005-03-03 | Tokyo Seimitsu Co Ltd | Method and device for expansion |
| JP2010108996A (en) * | 2008-10-28 | 2010-05-13 | Lintec Corp | Expanding device and expanding method |
| JP2014103196A (en) * | 2012-11-19 | 2014-06-05 | Disco Abrasive Syst Ltd | Chip gap maintenance device |
| JP2016021501A (en) * | 2014-07-15 | 2016-02-04 | 株式会社ディスコ | Wafer processing method |
| CN107808847A (en) * | 2016-09-09 | 2018-03-16 | 株式会社迪思科 | Chip distance maintaining method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4090416B2 (en) * | 2003-09-30 | 2008-05-28 | 日東電工株式会社 | Separation method and separation device for workpiece with adhesive tape |
| JP2007067278A (en) * | 2005-09-01 | 2007-03-15 | Tokyo Seimitsu Co Ltd | Expanding method and expanding apparatus |
| JP5563423B2 (en) * | 2010-10-19 | 2014-07-30 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5992803B2 (en) * | 2012-11-07 | 2016-09-14 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP6842352B2 (en) * | 2017-04-25 | 2021-03-17 | 株式会社ディスコ | How to protect barcode stickers |
-
2018
- 2018-12-25 JP JP2018240772A patent/JP2020102569A/en active Pending
-
2019
- 2019-12-11 WO PCT/JP2019/048444 patent/WO2020137543A1/en active Application Filing
- 2019-12-11 CN CN201980082928.XA patent/CN113196460A/en active Pending
- 2019-12-20 TW TW108146907A patent/TW202042338A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057158A (en) * | 2003-08-07 | 2005-03-03 | Tokyo Seimitsu Co Ltd | Method and device for expansion |
| JP2010108996A (en) * | 2008-10-28 | 2010-05-13 | Lintec Corp | Expanding device and expanding method |
| JP2014103196A (en) * | 2012-11-19 | 2014-06-05 | Disco Abrasive Syst Ltd | Chip gap maintenance device |
| JP2016021501A (en) * | 2014-07-15 | 2016-02-04 | 株式会社ディスコ | Wafer processing method |
| CN107808847A (en) * | 2016-09-09 | 2018-03-16 | 株式会社迪思科 | Chip distance maintaining method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020102569A (en) | 2020-07-02 |
| TW202042338A (en) | 2020-11-16 |
| WO2020137543A1 (en) | 2020-07-02 |
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