JP6851517B1 - Wafer expansion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer expansion device including a wafer expansion ring, a mounting base, a wafer expansion assembly and a fixing mechanism. A wafer expansion ring includes an outer frame and a film, the film is connected to the outer frame, and a wafer is attached. The mounting base is equipped with a wafer expansion ring. A wafer expansion assembly is for pressing and expanding a film, and a wafer expansion assembly includes pressing rolls of different sizes, or pressing rolls with different distances to the center of the wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring together with the mounting base, and expands the film to expand the wafer when the wafer expansion assembly presses the film upward. The present invention further provides a force assembly that applies a force to the film to change the local tension of the film. [Selection diagram] Fig. 3

Description

The present invention relates to a wafer expansion device, and more particularly to a wafer expansion device having a replaceable expansion assembly.

In the current packaging process, a cutting line is formed on the wafer in advance, photolithography is performed on the wafer, and then the wafer is cut into a single chip using a cutter wheel or a laser, and then vacuum suction and push-up pins are used. Chips are picked up one by one using an instrument or expanded after a Dicing Before Grinding (DBG) process or a Stealth Dicing Before Grinding (SDBG) process and then a wafer. The film attached to the bottom of the wafer is pulled to separate it, increasing the distance between the chips and making it easier to pick up the chips. If the separation process fails, the chip cannot be picked up, which causes a decrease in productivity. Therefore, in order to prevent the problem of not being able to pick up chips and increase productivity, the examination of the wafer separation process has become an important theme.

Generally speaking, the wafer expansion assembly uses a fixing jig to perform the expansion process. However, in the case of a design with a single jig, the tension cannot be adjusted and controlled by the conventional wafer expansion assembly, while the expansion tension in a specific direction due to the characteristics of different chips or materials when it comes to new materials and processes. If this is not done, there will be unadjustable problems such as partial under-tension or over-tension. Moreover, since a single fixing jig cannot be shared after fine adjustment, a relatively high process cost is incurred.

The present invention relates to a wafer expansion device, particularly providing a wafer expansion device having a replaceable expansion assembly.

The wafer expansion device provided by the present invention expands a wafer by adjusting the arrangement such as the size and distance of the wafer expansion assembly to change the tension of the film attached to the bottom of the wafer. In this way, by improving the local (single point) film tension or equalizing the tension of the entire film, it is possible to prevent the chip from being unable to be picked up in the next process because the film could not be separated by the film expansion. The yield of the manufacturing process can be increased.

The wafer expansion device provided by the present invention includes a wafer expansion ring, a mounting base, a wafer expansion assembly, and a fixing mechanism. The wafer expansion ring includes an outer frame and a film, the film is connected to the outer frame, and the wafer is attached. The mounting base is equipped with a wafer expansion ring. Wafer expansion assemblies are those that press and expand film, and wafer expansion assemblies include different sizes of presser rolls. The fixing mechanism fixes the outer frame of the wafer expansion ring together with the mounting base, and expands the wafer by expanding the film when the wafer expansion assembly presses the film upward.

The wafer expansion device provided by the present invention includes a wafer expansion ring, a mounting base, a wafer expansion assembly, and a fixing mechanism. The wafer expansion ring includes an outer frame and a film, the film is connected to the outer frame, and the wafer is attached. The mounting base is equipped with a wafer expansion ring. The wafer expansion assembly presses and expands the film, and the wafer expansion assembly includes presser rolls that are at different distances from the center of the wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring together with the mounting base, and expands the wafer by expanding the film when the wafer expansion assembly presses the film upward.

The wafer expansion device provided by the present invention includes a wafer expansion ring, a mounting base, a wafer expansion assembly, a force assembly, and a fixing mechanism. The wafer expansion ring includes an outer frame and a film, and the film is connected to the outer frame to attach the wafer. The mounting base is equipped with a wafer expansion ring. The wafer expansion assembly presses and expands the film. The force assembly applies force to the film to change the local tension in the film. The fixing mechanism fixes the outer frame of the wafer expansion ring together with the mounting base, and expands the wafer by expanding the film when the wafer expansion assembly presses the film upward.

As described above, the wafer expansion device provided by the present invention can be easily assembled and disassembled in the same jig, and a part of the assembly in the wafer expansion assembly can be changed or a force-bearing assembly can be added separately. The wafer expansion device at the time of expansion can change the local tension on the film to reduce the expansion cost and increase the expansion yield.

Top schematic and cross-sectional schematic view showing the wafer expansion apparatus of the preferred embodiment of this invention. The three-dimensional schematic which shows the wafer expansion assembly of the preferred embodiment of this invention. Top schematic and cross-sectional schematic showing an improved wafer expansion device of a preferred embodiment of the present invention. The three-dimensional schematic which shows the wafer expansion assembly of the preferred embodiment of this invention. Top schematic and cross-sectional schematic showing an improved wafer expansion device of a preferred embodiment of the present invention. The three-dimensional schematic which shows the wafer expansion assembly of the preferred embodiment of this invention. Top schematic and cross-sectional schematic showing an improved wafer expansion device of a preferred embodiment of the present invention. The three-dimensional schematic which shows the wafer expansion assembly of the preferred embodiment of this invention.

1A and 1B are a schematic top view and a schematic cross-sectional view showing a wafer expansion device according to a preferred embodiment of the present invention, in which FIG. 1A is a schematic top view of the wafer expansion device and FIG. 1B-. 1 (c) is a schematic cross-sectional view of the wafer expansion device. As shown in FIG. 1, the wafer expansion device 100 includes a wafer expansion ring 110 (for example, an iron ring), a mounting base 120, a wafer expansion assembly 130, and a fixing mechanism 140. The wafer expansion ring 110 can include a film 112 (eg, a plastic film) and an outer frame 114. The film 112 is connected to the outer frame 114, and the wafer 10 is attached to the film 112. The wafer 10 is already cut by a cutting line between the chips in the wafer 10 in the previous step, each chip in the wafer 10 is divided along the cutting line, and is connected only by the film 112. In this embodiment, the wafer 10 is placed on the film 112, and when the film 112 is stretched, if the distance between the chips in the wafer 10 increases enough to tear the film 112, the chips separate from each other. The mounting base 120 mounts a work piece.

The wafer expansion assembly 130 presses and expands the film 112. The fixing mechanism 140 fixes the outer frame 114 of the wafer expansion ring 110 together with the mounting base 120. In this embodiment, when the wafer expansion assembly 130 moves up and presses the film 112, the film 112 is expanded and the wafer 10 is also expanded. In another embodiment, the fixing mechanism 140 expands the wafer 10 by pressing the outer frame 114 of the wafer expansion ring 110 when the outer frame 114 of the wafer expansion ring 110 is on the mounting base 120 and expanding the film 112. You may. In this embodiment, the wafer expansion assembly 130 is configured to include a plurality of presser rolls 132 of the same size. The pressing rolls 132 are installed so as to surround the wafer 10, and the pressing rolls 132 are distributed in a circular shape. In one embodiment, the expansion steps are as shown in FIGS. 1 (b) -1 (c). First, as shown in FIG. 1B, the wafer expansion ring 110 is installed flat on the mounting base 120 and is sandwiched between the mounting base 120 and the fixing mechanism 140. Then, as shown in FIG. 1 (c), the wafer expansion assembly 130 moves upward and presses the film 112, the film 112 is relatively pressed upward by the wafer expansion assembly 130, and the film 112 faces outward. Expansion is performed in the form that the tension F of the film 112 is increased and the film 112 is expanded.

Hereinafter, embodiments of the wafer expansion assembly 130 will be described. FIG. 2 is a three-dimensional schematic showing a wafer expansion assembly of a preferred embodiment of the present invention. In this embodiment, the wafer expansion assembly 130 is configured to include a plurality of presser rolls 132 of the same size. Each presser roll 132 projects onto the pedestal 134, the wafer expansion assembly 130 comes into contact with the film 112 with only the presser roll 132, and the film 112 is aerial placed above the pedestal 134. The distance between each presser roll 132 and the center or edge of the wafer 10 is the same, thereby providing the same tension F for each local position on the film 112 and evenly expanding each local part of the wafer 10. It is possible to increase the yield of the manufacturing process.

With the improvement of new materials and processes, it is necessary to adjust the tension of expansion in the specified direction or in the specified position based on the characteristic conditions of different chips or materials. When a single fixed jig is used, it cannot be shared after fine adjustment, so a relatively high process cost is required, and problems such as insufficient tension or excessive tension occur locally. In order to cope with changes in different chip sizes, film types, etc., the present invention further proposes the following three types of improved wafer expansion devices to adjust tension in all directions.

3A and 3B are a schematic top view and a schematic cross-sectional view showing an improved wafer expansion device according to a preferred embodiment of the present invention, FIG. 3A is a schematic top view of the wafer expansion device, and FIG. 3B is a schematic view of the top surface of the wafer expansion device. It is sectional drawing of the wafer expansion apparatus. As shown in FIG. 3, the wafer expansion device 200 of this embodiment has the same wafer expansion ring 110, mounting base 120, and fixing mechanism 140 as the wafer expansion device 100 of FIG. In this embodiment, the original wafer expansion assembly 130 is only modified to a wafer expansion assembly 230, which includes different sized presser rolls, thereby altering local tension at a single point or region. It is a thing. In this embodiment, the pressing roll includes a plurality of first pressing rolls 232a and a plurality of second pressing rolls 232b, and the diameter of the first pressing roll 232a is larger than the diameter of the second pressing roll 232b. You may. Preferably, the first pressing roll 232a and the second pressing roll 232b are installed so as to provide an even stretching tension to the film 112. More preferably, the distance between the first pressing rolls 232a is equidistant. For example, the first pressing roll 232a and the second pressing roll 232b both have the same distance from the center or the edge of the wafer 10, and the four first pressing rolls 232a center on the wafer 10. Four equidistant parts are defined on the circumference of the center.

FIG. 4 is a three-dimensional schematic view showing the wafer expansion assembly 230 of this embodiment. The wafer expansion assembly 230 is configured to include four first presser rolls 232a and a plurality of second presser rolls 232b equidistant from each other. The first pressing roll 232a and the second pressing roll 232b project onto the pedestal 234, and the wafer expansion assembly 230 comes into contact with the film 112 only by the first pressing roll 232a and the second pressing roll 232b, whereby the film 112. Is installed above the pedestal 234. The distances from the first pressing roll 232a and the second pressing roll 232b to the center or edge of the wafer 10 are the same, but the diameter of the first pressing roll 232a is larger than the diameter of the second pressing roll 232b. large. As a result, the tension F / F1 at each local position of the film 112 can be adjusted, and since the tension F1 is larger than the tension F, the local tension of the wafer 10 can be changed and expanded to meet the needs of the manufacturing process. Further, the yield of the manufacturing process can be increased.

5A and 5B are a schematic top view and a schematic cross-sectional view showing a wafer expansion device according to a preferred embodiment of the present invention, in which FIG. 5A is a schematic top view showing the wafer expansion device and FIG. 5B is a wafer. It is sectional drawing which shows the expansion apparatus. As shown in FIG. 5, the wafer expansion device 100 of this embodiment and FIG. 1 has the same wafer expansion ring 110, a mounting base 120, and a fixing mechanism 140. In this embodiment, the original wafer expansion assembly 130 is only modified to a wafer expansion assembly 330, which includes pressing rolls at different distances from the center of the wafer 10 to equalize tension. Then, for example, the problem that the wafer 10 is displaced from the workbench can be solved. In this embodiment, the pressing rolls may include a plurality of first set of pressing rolls 332a and a plurality of second sets of pressing rolls 332b. The first set of pressing rolls 332a and the second set of pressing rolls 332b are installed so as to surround the wafer 10 and be distributed in a circle. Each first set of presser rolls 332a has the same distance to the center of the wafer 10 or the edge of the wafer 10, and each second set of presser rolls 332b to the center of the wafer 10 or the edge of the wafer 10. The distance is the same, and the distance between the first set of pressing rolls 332a and the center of the wafer 10 is larger than the distance between the second set of pressing rolls 332b and the center of the wafer 10. Preferably, the first set of presser rolls 332a and the second set of presser rolls 332b are installed crossing each other so as to provide the film 112 with an even stretching tension. More preferably, the distances between the first set of pressing rolls 332a are equidistant. For example, the four first set of presser rolls 332a define four equidistant portions on the circumference centered on the wafer 10.

FIG. 6 is a three-dimensional schematic view showing the wafer expansion assembly 330 of this embodiment. The wafer expansion assembly 330 is configured to include four first sets of presser rolls 332a that are equidistant from each other. Each first set of presser rolls 332a and each second set of presser rolls 332b project onto the pedestal 334, and the wafer expansion assembly 330 contains only the first set of presser rolls 332a and the second set of presser rolls 332b. The film 112 comes into contact with the film 112 and is installed above the pedestal 334. The first set of pressing rolls 332a and the second set of pressing rolls 332b have the same size, but the distance from the first set of pressing rolls 332a to the center of the wafer 10 is from the second set of pressing rolls 332b. Greater than the distance to the center of wafer 10. As a result, the tension F2 / F at each local position of the film 112 is adjusted, and the tension F2 applied by the first set of pressing rolls 332a is smaller than the tension F applied by the second set of pressing rolls 332b. The tension in the wafer 10 can be equalized and expanded, and for example, defects in the manufacturing process such as the wafer 10 shifting from the work table can be eliminated, and the yield of the manufacturing process can be further increased.

7A and 7B are a schematic top view and a schematic cross-sectional view showing a wafer expansion device according to a preferred embodiment of the present invention, FIG. 7A is a schematic top view showing a wafer expansion device, and FIG. 7B is a wafer expansion. It is sectional drawing which shows the apparatus. As shown in FIG. 7, the wafer expansion device 100 of this embodiment and FIG. 1 has the same wafer expansion ring 110, mounting base 120, wafer expansion assembly 130, and fixing mechanism 140. In this embodiment, by further providing a force assembly 450, a force is applied to the film 112 to change the local tension such as a single point of the film 112. In this embodiment, the force assembly 450 includes a plurality of pressing rolls 452 and locally presses the film 112 to generate tension F3 in the film 112. Preferably, the pressing rolls 452 are located on the opposite sides of the wafer 10, respectively, and change the tension of the single points on the opposite sides.

FIG. 8 is a three-dimensional schematic view showing the wafer expansion assembly 130 and the force assembly 450 of this embodiment. The force assembly 450 is installed in a circle in which the pressing rolls 132 of the wafer expansion assembly 130 are distributed, and is located above the pedestal 134 of the wafer expansion assembly 130, but does not contact the pedestal 134 and with respect to the film 112. Apply tension locally. The pressing roll 452 of the force assembly 450 preferably has a smooth surface in contact with the film 112 so as not to break the film 112.

An object of the present invention is to achieve an object of increasing the expansion yield rate by attaching another assembly and changing the tension of local expansion with respect to a designated direction or position of the film by a method of applying pressure or traction force. Although the three improved examples have been introduced above, the present invention is not limited to these three examples, and the above examples are independently applied in the same expansion process according to the needs of the manufacturing process or the apparatus. Alternatively, it can be applied at the same time to improve various problems such as insufficient tension, excessive tension or non-uniform tension in the expansion process.

To summarize the above, the wafer expansion device provided by the present invention can be easily assembled and disassembled in the same jig, and a part of the assembly in the wafer expansion assembly can be changed or a force-bearing assembly can be added separately. When the wafer expansion device expands, the local tension on the film can be changed to reduce the expansion cost and increase the expansion yield. Specifically, the wafer expansion device includes a wafer expansion ring, a mounting base, a wafer expansion assembly and a fixing mechanism. The wafer expansion ring includes an outer frame and a film, and the film is connected to the outer frame to attach the wafer. The mounting base mounts the wafer expansion ring. The wafer expansion assembly presses and expands the film. The fixing mechanism fixes the outer frame of the wafer expansion ring together with the mounting base, and expands the wafer by expanding the film when the wafer expansion assembly presses the film upward. Wafer expansion assemblies may include presser rolls of different sizes and / and presser rolls with different distances to the center of the wafer. The force assembly may be located within the distribution curve of the presser rolls of the wafer expansion assembly and above the film, but the invention is not limited to this.

The above are merely preferred embodiments of the present invention, and all equivalent modifications and modifications made based on the claims of the present invention belong to the scope of the present invention.

10 Wafer 100, 200 Wafer expansion device 110 Wafer expansion ring 112 Film 114 Outer frame 120 Mounting base 130, 230, 330 Wafer expansion assembly 132 Pressing roll 134, 234, 334 Pedestal 140 Fixing mechanism 232a First pressing roll 232b Second Pressing roll 332a First set of pressing rolls 332b Second set of pressing rolls 450 Loading assembly 452 Pressing rolls F, F1, F2, F3 Tension

Claims (13)

Wafer expansion device
A wafer expansion ring that includes an outer frame and a film connected to the outer frame and to which a wafer is attached to the film.
A mounting base on which the wafer expansion ring is mounted and
Wafer expansion assemblies that include different sizes of presser rolls to press and expand the film.
It includes a fixing mechanism that fixes the outer frame of the wafer expansion ring together with the mounting base and expands the film to expand the wafer when the wafer expansion assembly presses the film upward. , Wafer expansion device. The first aspect of the present invention, wherein the pressing roll includes a plurality of first pressing rolls and a plurality of second pressing rolls, and the diameter of the first pressing roll is larger than the diameter of the second pressing roll. Wafer expansion device. The wafer expansion device according to claim 2, wherein the first pressing roll and the second pressing roll are installed so as to intersect with each other. The wafer expansion device according to claim 3, wherein the distances between the first pressing rolls are equidistant. The wafer expansion device according to claim 1, wherein the pressing roll is installed so as to surround the wafer. The wafer expansion device according to claim 5, wherein the pressing rolls are distributed in a circular shape. Wafer expansion device
A wafer expansion ring that includes an outer frame and a film that is connected to the outer frame and to which a wafer is attached to the film.
A mounting base on which the wafer expansion ring is mounted and
A wafer expansion assembly that includes pressing rolls that are different distances from the center of the wafer and that presses and expands the film.
It includes a fixing mechanism that fixes the outer frame of the wafer expansion ring together with the mounting base and expands the film to expand the wafer when the wafer expansion assembly presses the film upward. Wafer expansion device. The pressing roll includes a plurality of first set of pressing rolls and a plurality of second sets of pressing rolls, and the distance from the first set of pressing rolls to the center of the wafer is the second set. The wafer expansion device according to claim 7, which is larger than the distance from the pressing roll of the wafer to the center of the wafer. The wafer expansion device according to claim 8, wherein the distances between the first set of pressing rolls are equidistant. The wafer expansion device according to claim 7, wherein the pressing rolls are distributed in a circle around the wafer. Wafer expansion device
A wafer expansion ring that includes an outer frame and a film that is connected to the outer frame and to which a wafer is attached to the film.
A mounting base on which the wafer expansion ring is mounted and
A wafer expansion assembly that presses and expands the film,
A force assembly that applies force to the film to change the local tension of the film,
It includes a fixing mechanism that fixes the outer frame of the wafer expansion ring together with the mounting base and expands the film to expand the wafer when the wafer expansion assembly presses the film upward. Wafer expansion device. The wafer expansion device according to claim 11, wherein the force-applying assembly includes a plurality of pressing rolls and partially presses the film. The wafer expansion device according to claim 12, wherein the pressing rolls are located on both opposite sides of the wafer.

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