CN117253825B - Wafer film sticking machine for semiconductor device - Google Patents
Wafer film sticking machine for semiconductor device Download PDFInfo
- Publication number
- CN117253825B CN117253825B CN202311504195.9A CN202311504195A CN117253825B CN 117253825 B CN117253825 B CN 117253825B CN 202311504195 A CN202311504195 A CN 202311504195A CN 117253825 B CN117253825 B CN 117253825B
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- CN
- China
- Prior art keywords
- film
- shell
- base
- wafer
- gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 239000002699 waste material Substances 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract 3
- 238000003892 spreading Methods 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer film sticking and discloses a wafer film sticking machine for a semiconductor device, which comprises a shell, wherein a base station is fixedly arranged in the center of the shell, the top of the base station is used for accommodating a film sticking ring, a base is arranged at the outer side of the film sticking ring, the shell is hinged with a cover plate, an annular cutter is fixedly arranged at the bottom of the cover plate, a press roller is arranged in the shell beside the base, the press roller is movably connected with the shell, a plurality of expanding wheels are arranged at the outer side of the film sticking ring, a spiral gear is arranged at the top of the base station at the outer side of the expanding wheels, a fluted disc is arranged at the outer side of the spiral gear, and the fluted disc is driven by a motor. Through setting up the exhibition wheel, will wait the film body of laminating to fully tensioning all around, avoid appearing the fold after the laminating, after the film body cutting finishes, stretch out the waste film through the exhibition wheel and make it and the pad pasting on the wafer completely separate for avoid taking off the waste film when taking off and take the film together to take off by mistake.
Description
Technical Field
The invention relates to the technical field of wafer film sticking, in particular to a wafer film sticking machine for a semiconductor device.
Background
The wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, the surface smoothness of the wafer is high, and scribing is needed in the wafer processing process, but the silicon chip is easy to pop up during mechanical processing, so that the silicon chip is damaged, and the performance is affected. Therefore, the wafer needs to be covered with a protective film during the wafer circulation process to prevent the die from being ejected during dicing and other processes.
Most of the existing film pasting modes are to place a wafer and a film pasting ring at a designated position of a film pasting table, pull a blue film or a UV film on a film roll in a mechanical or manual mode, place the blue film or the UV film on the wafer, but the mode can only tension a film body in the length direction and can not effectively tension the film body in the width direction, and therefore the problems of wrinkling and the like can occur during film pasting. The film is attached to the surfaces of the wafer and the film pasting ring through the compression roller, then the surface of the film pasting ring is cut, and then the waste film is torn off, but the cutting mode requires that the cutter is in rigid contact with the surface of the film pasting ring, if a knife edge is damaged, the problem that the cutting mark is discontinuous can occur, the film pasting can be hooked up, and the film pasting is torn off together when the waste film is torn off finally, so that a film pasting machine which can fully tension a film body and ensure that the film pasting and the waste film are completely separated after cutting is necessary is manufactured.
Disclosure of Invention
Aiming at the defects of the prior wafer film sticking machine in the use process, the invention provides the wafer film sticking machine for the semiconductor device, which is characterized in that the film body is completely unfolded by arranging the unfolding wheel in the circumferential direction of the iron ring, and after the film body is cut, the waste film is stretched outwards by using the unfolding wheel to be completely separated from the film on the wafer, so that the problem that the film sticking on the surface of the wafer is carried up when the waste film is manually torn off is avoided.
The invention provides the following technical scheme: the utility model provides a wafer film sticking machine of semiconductor device, includes the shell, the center fixed mounting of shell has the base station, the top of base station is used for settling the pad pasting ring, the outside department of pad pasting ring is equipped with the base, base and base station fixed connection, the shell is articulated with the apron, the bottom fixed mounting of apron has annular cutter, the inside of shell and apron articulated department is equipped with the compression roller, compression roller and shell swing joint, the top surface and the membrane of compression roller rear side shell roll up fixed connection, the outside of pad pasting ring is provided with a plurality of exhibition wheel along its circumference, the outside of exhibition wheel is regular polygon's columnar structure along its radial cross-section, through setting up the membrane body that the exhibition wheel will paste the membrane ring is followed with the exhibition wheel inboard, is maked somebody's hair in the membrane body below with annular cutter in order to carry out abundant cutting to the membrane body.
Preferably, the expanding wheel is rotationally connected with the seat ring, the axial direction of the expanding wheel is sleeved on the tangential direction of the seat ring, the seat ring is fixedly connected with the mounting seat, the mounting seat is fixedly connected with the top of Fang Jitai below the base, the top surface and the bottom surface of the expanding wheel are fixedly connected with side gears, the top surface of a base beside the side gears is provided with a driving wheel, the side gears are meshed with the driving wheel, a spiral gear and a fluted disc are arranged at the top surface of an outer shell of the seat ring, the spiral gear is used for transmitting power on the fluted disc to the expanding wheel and enabling the expanding wheel to rotate so as to tension a film body to be attached, and after the film body is cut, the waste film is stretched so as to be completely separated from a film on the wafer.
Preferably, the spiral gear is fixedly arranged at the top of the base, flat gears are fixedly arranged at the two ends of the spiral gear and meshed with the driving wheel, the fluted disc is of an annular structure, the inner ring of the fluted disc is provided with inner teeth, the inner teeth are meshed with tooth grooves on the side face of the spiral gear, the outer ring of the fluted disc is provided with outer teeth, a motor is fixedly arranged on the inner wall of the shell, and the gears on the motor are meshed with the outer teeth.
The invention has the following beneficial effects:
1. According to the invention, the expanding wheel is arranged on the surface of the base, so that the film body is fully expanded before being attached, and the defect that the traditional wafer film sticking machine cannot tension the width direction of the film body is overcome.
2. According to the invention, the cutting section of the film body is overhead, so that the problem of uneven film cutting caused by broken edges when the traditional wafer film sticking machine directly cuts the surface of the iron ring is avoided, the waste film and the film sticking film are completely separated at the cut through the stretching action of the stretching wheel after cutting, and the problem that the traditional film sticking machine jointly opens the stuck film or causes edge warping when the waste film is torn off is avoided.
Drawings
FIG. 1 is a schematic view of the external structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the present invention;
FIG. 3 is a cross-sectional view of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic view of the structure of the spreader wheel of the present invention;
FIG. 5 is a schematic view of the structure of the toothed disc of the present invention.
In the figure: 1. a housing; 2. a base station; 21. a film sticking ring; 3. a base; 4. a cover plate; 41. an annular cutter; 5. a display wheel; 51. a seat ring; 52. a mounting base; 53. a side gear; 54. a driving wheel; 6. a helical gear; 7. fluted disc; 71. internal teeth; 72. external teeth; 73. a motor; 8. a press roller; 9. and (3) film roll.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, a wafer film sticking machine for semiconductor devices includes a housing 1, a base 2 is fixedly mounted in the housing 1, the base 2 is used for mounting a film sticking ring 21 and a wafer, and the wafer is placed in the ring of the film sticking ring 21. The top of base 2 in the radial outside department of pad pasting ring 21 is equipped with base 3, and antiseized material such as teflon is coated to the top surface of base 3, and base 3 and the top fixed connection of base 2. A plurality of display wheels 5 are arranged along the circumferential direction of the film pasting ring 21.
Referring to fig. 2 and 4, the display wheel 5 has a cylindrical structure with a regular polygon radial cross section, one side surface of the display wheel 5at the uppermost is parallel to the film pasting ring 21 and is higher than the upper surface of the base 3, the display wheel 5 is rotationally connected with the seat ring 51, the seat ring 51 is fixedly connected with the mounting seat 52, the mounting seat 52 is fixedly mounted on the top surface of the base 2 below the base 3, the top surface and the bottom surface of the display wheel 5 are fixedly connected with the side gear 53, the outer side of the side gear 53 is provided with a driving wheel 54 and meshed with the driving wheel 54, the outer side of the driving wheel 54 is provided with a spiral gear 6, and the spiral gear 6 drives the side gear 53 to rotate through the driving wheel 54 so as to rotate the display wheel 5.
Referring to fig. 3 to 5, a spiral gear 6 is fixedly installed at the top of the base 2, flat gears are respectively disposed at two sides of the spiral gear 6, the spiral gear 6 drives a driving wheel 54 to rotate through the flat gears, a fluted disc 7 is disposed at the outer side of the spiral gear 6, the fluted disc 7 is rotationally connected with the top surface of the base 2, the fluted disc 7 is in a ring structure, a plurality of internal teeth 71 are fixedly installed at the inner side of the fluted disc 7, the internal teeth 71 are meshed with spiral tooth grooves on the spiral gear 6, external teeth 72 are disposed at the outer side of the fluted disc 7, a motor 73 is fixedly installed on the inner wall of the housing 1 at the outer side of the fluted disc 7, and gears on the motor 73 are meshed with the external teeth 72.
Referring to fig. 1, a cover plate 4 is disposed above a housing 1, the cover plate 4 is hinged to the housing 1, an annular cutter 41 is fixedly mounted inside the cover plate 4, when the cover plate 4 is buckled at the top of the housing 1, the annular cutter 41 starts to rotate and cut redundant films on a wafer, a press roller 8 is disposed on the housing 1 at a hinge point of the cover plate 4 and the housing 1, and a film roll 9 is disposed at the top of the housing 1 behind the press roller 8.
The working principle of the using method of the invention is as follows: the wafer is placed in the film pasting ring 21, the film body is gradually pressed downwards by the pressing roller 8 above the base 3 on the film roll 9, the film is lightly adhered to the uppermost side surface of the spreading wheel 5 (the film body is tensioned but not stretched, the film body is deformed), the motor 73 is started, the motor 73 pushes the fluted disc 7 to rotate through the external teeth 72, the fluted disc 7 pushes the spiral gear 6 to rotate through the engagement of the internal teeth 71 and the tooth grooves on the side surface of the spiral gear 6, the spiral gear 6 enables the side gear 53 to rotate through the driving wheel 54, the spreading wheel 5 is finally driven to rotate, the film above the wafer is tensioned through the rotation of the spreading wheel 5, and the defect that a traditional film pasting machine cannot enable the film to be tensioned along the width direction of the film is overcome.
The movable press roller 8 attaches the film on the surface of the wafer, the film is fully adhered to the side plane of the unfolding wheel 5, and the unfolding wheel 5 continuously tightens the film body to facilitate the annular cutter 41 to fully cut the film body. The cover plate 4 is buckled with the upper surface of the shell 1, and the annular cutter 41 cuts the film body between the outer edge of the film pasting ring 21 and the unfolding wheel 5, so that the problem that the traditional film pasting machine is incomplete in cutting due to knife edge defect and the like when cutting the surface of the film pasting ring 21 is avoided.
After the annular cutter 41 completes cutting, the spreader wheel 5 stretches the waste film outward to completely separate the waste film from the film on the wafer along the cut. The problem that the traditional film sticking machine can lift off the waste film together with the film on the wafer or cause edge lifting is avoided.
Claims (2)
1. The utility model provides a wafer film sticking machine of semiconductor device, includes shell (1), the center fixed mounting of shell (1) has base station (2), the top of base station (2) is used for settling pad pasting ring (21), the outside department of pad pasting ring (21) is equipped with base (3), base (3) and base station (2) fixed connection, shell (1) are articulated with apron (4), the bottom fixed mounting of apron (4) has annular cutter (41), the inside of shell (1) and apron (4) articulated department is equipped with compression roller (8), compression roller (8) and shell (1) swing joint, the top surface and the membrane of compression roller (8) rear side shell (1) are rolled up (9) fixed connection, its characterized in that: the film pasting device is characterized in that a plurality of spreading wheels (5) are arranged on the outer side of the film pasting ring (21) along the circumferential direction of the film pasting ring, the spreading wheels (5) are of columnar structures with regular polygons in the radial section, the outer edge of the film pasting ring (21) and the film body on the inner side of the spreading wheels (5) are overhead through the arrangement of the spreading wheels (5), and a ring-shaped cutter (41) cuts the film body between the outer edge of the film pasting ring (21) and the spreading wheels (5);
The utility model discloses a film laminating machine, including base (3) and base (5), exhibition wheel (5) and seat circle (51) rotate to be connected, the axial of exhibition wheel (5) cup joints in the tangential of seat circle (51), seat circle (51) and mount pad (52) fixed connection, the top fixedly connected with side gear (53) of mount pad (52) and base (2) below base, the top surface and the bottom surface of exhibition wheel (5) all fixedly connected with side gear (53), the top surface of base (2) next to side gear (53) is equipped with drive wheel (54), side gear (53) and drive wheel (54) meshing, the top surface department of seat circle (51) outside shell (1) is equipped with spiral gear (6) and fluted disc (7), transmits the power on fluted disc (7) to exhibition wheel (5) and makes it rotatory for the film body of tensioning to wait to laminate to stretch waste film after the film body cutting makes it completely separate with the pad on the wafer.
2. The wafer laminator for semiconductor devices according to claim 1, wherein: spiral gear (6) fixed mounting is at the top of base (2), the both ends fixed mounting of spiral gear (6) have flat gear and this gear and drive wheel (54) meshing, fluted disc (7) are annular structure, the inner circle of fluted disc (7) is equipped with internal tooth (71), the tooth's socket of internal tooth (71) and spiral gear (6) side meshes mutually, the outer lane of fluted disc (7) is equipped with external tooth (72), fixed mounting has motor (73) on the inner wall of shell (1), gear and external tooth (72) meshing on motor (73).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311504195.9A CN117253825B (en) | 2023-11-13 | 2023-11-13 | Wafer film sticking machine for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311504195.9A CN117253825B (en) | 2023-11-13 | 2023-11-13 | Wafer film sticking machine for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117253825A CN117253825A (en) | 2023-12-19 |
| CN117253825B true CN117253825B (en) | 2024-04-19 |
Family
ID=89129768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311504195.9A Active CN117253825B (en) | 2023-11-13 | 2023-11-13 | Wafer film sticking machine for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117253825B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659269A (en) * | 2018-12-28 | 2019-04-19 | 安徽龙芯微科技有限公司 | A kind of wafer film covering device |
| CN112864045A (en) * | 2019-11-12 | 2021-05-28 | 力成科技股份有限公司 | Wafer expanding device |
| CN214848513U (en) * | 2021-06-04 | 2021-11-23 | 河南通用智能装备有限公司 | Wafer film sticking machine |
| CN115588642A (en) * | 2022-11-02 | 2023-01-10 | 上海宏轶电子科技有限公司 | Manual wafer sticking film machine |
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
-
2023
- 2023-11-13 CN CN202311504195.9A patent/CN117253825B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109659269A (en) * | 2018-12-28 | 2019-04-19 | 安徽龙芯微科技有限公司 | A kind of wafer film covering device |
| CN112864045A (en) * | 2019-11-12 | 2021-05-28 | 力成科技股份有限公司 | Wafer expanding device |
| CN214848513U (en) * | 2021-06-04 | 2021-11-23 | 河南通用智能装备有限公司 | Wafer film sticking machine |
| CN115588642A (en) * | 2022-11-02 | 2023-01-10 | 上海宏轶电子科技有限公司 | Manual wafer sticking film machine |
| CN116130384A (en) * | 2022-12-16 | 2023-05-16 | 江苏宝浦莱半导体有限公司 | Semiconductor wafer film pasting technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117253825A (en) | 2023-12-19 |
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