TW202119521A - Wafer expanding device - Google Patents

Abstract

A wafer expanding device includes a wafer expanding ring, a loading base, a wafer expanding element and a fixing element. The wafer expanding ring includes an outer frame and a film connected to the outer frame for attaching a wafer. The wafer expanding ring is fixed on the loading base. The wafer expanding element is used for pushing the film and expanding the film, wherein the wafer expanding element includes pushing rollers with different sizes or pushing rollers with different distances to the center of the wafer. The fixing element is configured to fix the outer frame on the loading base, and the wafer expanding element pushes up the film to expand the film and then the wafer. A forcing element is optionally configured to press the film.

Description

Wafer expanding device

The present invention relates to a wafer expanding device, and more particularly to a wafer expanding device with a replaceable expansion component.

In the current packaging process, dicing lanes are reserved on the wafer. After the wafer is etched by lithography, it is cut into a single chip using a cutter wheel or a laser, and then the chips are taken out one by one by devices such as vacuum suction and ejector pins. Or after the Dicing Before Grinding (DBG) process or the Stealth Dicing Before Grinding (SDBG) process, expand the film to stretch the film attached to the bottom of the wafer. , Increase the distance between the wafers to facilitate the removal of the wafers. If the above-mentioned segmentation process fails, the chip cannot be removed and the production capacity is reduced. Therefore, how to prevent the chip from being removed and increase production capacity, and the process of wafer slicing has become an important issue.

Generally speaking, the wafer expansion module uses a fixed jig to perform the expansion process. However, under a single design, the existing wafer expansion components cannot adjust and control the tension, and new materials and processes have to adjust the expansion tension in a specific direction according to the characteristics of different wafers or materials, otherwise local tension may occur. Problems that cannot be adjusted such as insufficient or too large. Furthermore, a single fixed fixture cannot be fine-tuned and shared, resulting in higher manufacturing costs.

The present invention provides a wafer expansion device, which adjusts the size and distance of the wafer expansion assembly to change the tension of the adhesive film attached to the bottom of the wafer to expand the wafer. In this way, the local (single point) film tension can be improved or the overall film tension can be evened, so as to prevent the expansion of the film without breaking and the chip cannot be removed in the next process, thereby improving the process yield.

The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component and a fixing mechanism. The wafer expanding iron ring includes an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer. The carrier carries the wafer expanding iron ring. The wafer expansion assembly is used to push and expand the adhesive film, and the wafer expansion assembly includes push rollers of different sizes. The fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring at the same time as the supporting seat, and when the wafer expanding assembly pushes the adhesive film upward, the adhesive film is expanded to expand the wafer.

The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component and a fixing mechanism. The wafer expanding iron ring includes an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer. The carrier carries the wafer expanding iron ring. The wafer expansion assembly is used to push and expand the adhesive film. The wafer expansion assembly includes push rollers with different distances from the center of the wafer. The fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring at the same time as the supporting seat, and when the wafer expanding assembly pushes the adhesive film upward, the adhesive film is expanded to expand the wafer.

The invention provides a wafer expanding device, which comprises a wafer expanding iron ring, a bearing seat, a wafer expanding component, a force applying component and a fixing mechanism. The wafer expanding iron ring includes an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer. The carrier carries the wafer expanding iron ring. The wafer expansion component is used to push and expand the adhesive film. The force application component is used to apply force to the film to change the local tension of the film. The fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring at the same time as the supporting seat, and when the wafer expanding assembly pushes the adhesive film upward, the adhesive film is expanded to expand the wafer.

Based on the above, the present invention provides a wafer expansion device, which can be easily disassembled and assembled on the same jig to change some of the components in a wafer expansion assembly, or additionally add a force component to change the wafer expansion When the device expands the film, the local tension on the film can reduce the expansion cost and improve the expansion yield.

Figure 1 is a schematic top view and a schematic cross-sectional view of a wafer expanding device in a preferred embodiment of the present invention. Figure 1(a) shows a schematic top view of the wafer expanding device, and 1(b)-1 (C) The figure shows a schematic cross-sectional view of the wafer expanding device. As shown in FIG. 1, a wafer expansion device 100 includes a wafer expansion iron ring 110, a carrier 120, a wafer expansion assembly 130 and a fixing mechanism 140. The wafer expanding iron ring 110 may include an adhesive film 112 and an outer frame 114. The adhesive film 112 is connected to the outer frame 114, and the adhesive film 112 is attached to a wafer 10. The wafer 10 has been diced between the dicing lanes between the wafers 10 in the previous process, so that the wafers in the wafer 10 are separated along the dicing lanes and connected to each other only by the adhesive film 112. In this embodiment, the wafer 10 is placed on the adhesive film 112. When the adhesive film 112 is stretched, the distance between the wafers in the wafer 10 increases until the adhesive film 112 is broken and the wafers are separated from each other. The supporting base 120 is used to carry the processed object.

The wafer expansion assembly 130 is used to push and expand the adhesive film 112. The fixing mechanism 140 is used for fixing the outer frame 114 of the wafer expanding iron ring 110 at the same time as the carrier 120. In this embodiment, when the wafer expansion assembly 130 moves upward to push the adhesive film 112, the adhesive film 112 can be expanded to expand the wafer 10. In other embodiments, the fixing mechanism 140 can also be used to press down the outer frame 114 of the wafer expanding iron ring 110 when fixing the outer frame 114 of the wafer expanding iron ring 110 on the carrier 120 to expand the adhesive film 112. The wafer 10 is expanded. In this embodiment, the wafer expansion assembly 130 is configured to include a plurality of push rollers 132 of the same size. The pushing rollers 130 are arranged around the wafer 10, and the pushing rollers 130 are distributed in a circular shape. In one embodiment, the expansion step can be as shown in Figure 1(b)-1(c). First, as shown in FIG. 1( b ), the wafer expanding iron ring 110 is flatly placed on the carrier 120 and sandwiched between the carrier 120 and the fixing mechanism 140. Next, as shown in Figure 1(c), the wafer expansion assembly 130 moves upward to push the adhesive film 112, so that the adhesive film 112 is pushed upward by the wafer expansion assembly 130, thereby increasing the outward tension F of the adhesive film 112 The film 112 is expanded, so as to expand the film.

An implementation aspect of the wafer expansion assembly 130 is presented below. As shown in FIG. 2, a three-dimensional schematic diagram of the wafer expansion assembly in a preferred embodiment of the present invention is shown. In this embodiment, the wafer expansion assembly 130 is configured to include a plurality of push rollers 132 of the same size. Each pushing roller 132 protrudes from a base 134, so that only the pushing roller 132 of the wafer expansion assembly 130 contacts the adhesive film 112, and the adhesive film 112 is suspended above the base 134. Each push roller 132 has the same distance from the center or edge of the wafer 10, so that the same tension F is provided to the adhesive film 112 at each local position, so that the wafer 10 can be evenly expanded in each local area to improve Process yield.

With the improvement of new materials and manufacturing processes, it is necessary to adjust the expansion tension in the specified direction or position according to the characteristics of different wafers or materials. If a single fixed jig is used, it will require a higher process cost for sharing after fine-tuning, and there will be problems such as insufficient or excessive local tension that cannot be adjusted. In order to respond to changes in different chip sizes and types of adhesive films, three improved wafer expansion devices are proposed below to adjust the tension in all directions.

Figure 3 shows a schematic top view and a cross-sectional schematic view of the improved wafer expanding device in a preferred embodiment of the present invention. Figure 3(a) shows a schematic top view of the wafer expanding device, and 3(b) The figure shows a schematic cross-sectional view of a wafer expanding device. As shown in FIG. 3, a wafer expanding device 200 of this embodiment and the wafer expanding device 100 of FIG. 1 have the same wafer expanding iron 110, a carrier 120 and a fixing mechanism 140. This embodiment only improves the original wafer expansion assembly 130 into a wafer expansion assembly 230, where the wafer expansion assembly 230 includes push rollers of different sizes to change the local tension of a single point or a single area. In this embodiment, the pushing roller may include a plurality of first pushing rollers 232a and a plurality of second pushing rollers 232b, and the diameter of the first pushing roller 232a is larger than the diameter of the second pushing roller 232b. Preferably, the first pushing roller 232a and the second pushing roller 232b are alternately arranged to provide uniform stretching tension of the adhesive film 112. More preferably, the first pushing rollers 232a are equidistant from each other. For example, the first pushing roller 232a and the second pushing roller 232b are both at the same distance from the center or edge of the wafer 10, and the four first pushing rollers 232a are placed on the circle centered on the center of the wafer 10, etc. The distance is divided into four parts.

FIG. 4 is a three-dimensional schematic diagram of the wafer expansion assembly 230 of this embodiment. The wafer expansion assembly 230 is configured to include four first pushing rollers 232a and a plurality of second pushing rollers 232b that are equidistant from each other. The first pushing roller 232a and the second pushing roller 232b protrude from a base 234, so that only the first pushing roller 232a and the second pushing roller 232b of the wafer expansion assembly 230 are in contact with the adhesive film 112, and the adhesive film 112 Hanging above the base 234. The first push roller 232a and the second push roller 232b have the same distance from the center or edge of the wafer 10, but the diameter of the first push roller 232a is larger than the diameter of the second push roller 232b, so the adjustment The tension F/F1 of the adhesive film 112 at each local position, wherein the tension F1 is greater than the tension F, so that the wafer 10 can be expanded under the condition of changing the local tension of the wafer 10 to meet the process requirements, thereby improving the process yield.

Figure 5 shows a schematic top view and a schematic cross-sectional view of the wafer expanding device in a preferred embodiment of the present invention. Figure 5(a) shows the top schematic view of the wafer expanding device, and Figure 5(b) shows the top view of the wafer expanding device. The cross-sectional schematic diagram of the wafer expanding device is shown. As shown in FIG. 5, the wafer expanding device 100 of this embodiment and FIG. 1 has the same wafer expanding iron ring 110, the carrier 120 and the fixing mechanism 140. In this embodiment, only the original wafer expansion assembly 130 is improved into a wafer expansion assembly 330, where the wafer expansion assembly 330 includes push rollers with different distances from the center of the wafer 10, so that the tension is even, which can solve problems such as wafer 10 Problems such as offset machine. In this embodiment, the pushing rollers may include a plurality of first group pushing rollers 332a and a plurality of second group pushing rollers 332b. The first set of pushing rollers 332a and the second set of pushing rollers 332b are arranged in a circular distribution around the wafer 10. Each first set of push rollers 332a has the same distance from the center of the wafer 10 or the edge of the wafer 10, and each second set of push rollers 332b has the same distance from the center of the wafer 10 or the edge of the wafer 10, and the first set of pushers The distance between the roller 332a and the center of the wafer 10 is greater than the distance between the second set of push rollers 332b and the center of the wafer 10. Preferably, the first set of pushing rollers 332a and the second set of pushing rollers 332b are alternately arranged to provide uniform stretching tension of the adhesive film 112. More preferably, the first set of pushing rollers 332a are equidistant from each other. For example, the four first-group push rollers 332a divide the circumference with the center of the wafer 10 as the center into four equal parts.

FIG. 6 is a three-dimensional schematic diagram of the wafer expansion assembly 330 of this embodiment. The wafer expansion assembly 330 is configured to include four first set of push rollers 332a that are equidistant from each other. Each first set of pushing rollers 332a and each second set of pushing rollers 332b protrude from the base 334, so that the wafer expansion assembly 330 has only the first set of pushing rollers 332a and the second set of pushing rollers 332b in contact with the film 112 , And the adhesive film 112 is suspended above the base 334. The first group of push rollers 332a and the second group of push rollers 332b have the same size, but the distance from the first group of push rollers 332a to the center of the wafer 10 is greater than the distance from the second group of push rollers 332b to the center of the wafer 10 , So as to adjust the tension F2/F for each local position of the adhesive film 112, wherein the tension F2 applied by the first set of pushing rollers 332a is less than the tension F applied by the second set of pushing rollers 332b, so as to homogenize the wafer 10. The tension in the medium is used to expand the wafer, so as to solve the process defects such as the deviation of the wafer 10 from the machine tool, thereby improving the process yield.

Figure 7 is a schematic top view and a cross-sectional schematic view of the wafer expanding device in a preferred embodiment of the present invention. Figure 7(a) shows the top schematic view of the wafer expanding device, and Figure 7(b) shows the top view of the wafer expanding device. The cross-sectional schematic diagram of the wafer expanding device is shown. As shown in FIG. 7, the wafer expanding device 100 of this embodiment and FIG. 1 has the same wafer expanding iron 110, carrier 120, wafer expanding assembly 130 and fixing mechanism 140. In this embodiment, a force applying component 450 is further provided for applying force to the adhesive film 112 to change the single point and other local tension of the adhesive film 112. In this embodiment, the force application component 450 includes a plurality of pressing rollers 452 to partially press the adhesive film 112 downward, so that the adhesive film 112 generates a tension F3. Preferably, the pressing rollers 452 are respectively located on opposite sides of the wafer 10 to change the single-point tension on the opposite sides.

FIG. 8 is a three-dimensional schematic diagram of the wafer expansion assembly 130 and the force application assembly 450 of this embodiment. The force applying component 450 is disposed in the circle distributed by the pushing roller 132 of the wafer expansion component 130 and above the base 134 of the wafer expansion component 130 but not in contact with the base 134 to locally apply tension to the adhesive film 112. The contact surface between the pressing roller 452 of the force applying component 450 and the adhesive film 112 preferably has a smooth surface to avoid damaging the adhesive film 112.

The inventive spirit of the present invention is to install other components to change the local expansion tension in the specified direction or position in the film by applying pressure or tension, etc., so as to achieve the purpose of improving the expansion yield. Three improved embodiments are provided above, but are not limited to these three embodiments, and these embodiments may be applied separately or simultaneously in the same expansion process depending on the process or device, so as to improve the insufficient tension in various expansion processes. , Excessive tension or uneven tension.

In summary, the present invention provides a wafer expansion device that can be easily disassembled and assembled on the same jig to change some of the components in a wafer expansion assembly, or add a force component to change the wafer The local tension of the film when the expansion device performs expansion can reduce the expansion cost and improve the expansion yield. Specifically, the wafer expansion device includes a wafer expansion iron ring, a carrier, a wafer expansion assembly, and a fixing mechanism. The wafer expanding iron ring includes an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer. The carrier carries the wafer expanding iron ring. The wafer expansion component is used to push and expand the adhesive film. The fixing mechanism is used for fixing the outer frame of the wafer expanding iron ring at the same time as the supporting seat, and when the wafer expanding assembly pushes the adhesive film upward, the adhesive film is expanded to expand the wafer. The wafer expansion assembly can include push rollers of different sizes or/and push rollers with different distances from the center of the wafer; the force application component can be located within the distribution curve of the push roller of the wafer expansion assembly and above the film, but The present invention is not limited to this. The foregoing descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

10: Wafer 100, 200: Wafer expansion device 110: Wafer expanding iron ring 112: Film 114: Outer Frame 120: bearing seat 130, 230, 330: Wafer expansion module 132: Push roller 134, 234, 334: base 140: fixed mechanism 232a: The first push roller 232b: The second push roller 332a: The first set of push rollers 332b: The second set of push rollers 450: force component 452: Downward Roller F, F1, F2, F3: Tension

FIG. 1 shows a schematic top view and a schematic cross-sectional view of a wafer expanding device in a preferred embodiment of the present invention. Figure 2 is a perspective view of a wafer expansion assembly in a preferred embodiment of the present invention. FIG. 3 shows a schematic top view and a schematic cross-sectional view of an improved wafer expanding device in a preferred embodiment of the present invention. Figure 4 is a perspective view of a wafer expansion assembly in a preferred embodiment of the present invention. FIG. 5 shows a schematic top view and a schematic cross-sectional view of an improved wafer expanding device in a preferred embodiment of the present invention. FIG. 6 is a three-dimensional schematic diagram of a wafer expansion assembly in a preferred embodiment of the present invention. FIG. 7 shows a schematic top view and a schematic cross-sectional view of an improved wafer expanding device in a preferred embodiment of the present invention. FIG. 8 is a three-dimensional schematic diagram of a wafer expansion assembly in a preferred embodiment of the present invention.

10: Wafer

110: Wafer expanding iron ring

112: Film

114: Outer Frame

120: bearing seat

140: fixed mechanism

200: Wafer expanding device

230: Wafer expansion module

232a: The first push roller

232b: The second push roller

F, F1: Tension

Claims (13)

A wafer expanding device includes: A wafer expanding iron ring, including an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer; A carrier for carrying the wafer expanding iron ring; A wafer expansion assembly for pushing and expanding the adhesive film, wherein the wafer expansion assembly includes push rollers of different sizes; and A fixing mechanism is used to fix the outer frame of the wafer expanding iron ring at the same time as the carrier, and when the wafer expansion assembly pushes the adhesive film upwards, the adhesive film is expanded to expand the wafer sheet. For the wafer expanding device described in the first item of the scope of patent application, the push rollers include a plurality of first push rollers and a plurality of second push rollers, and the diameter of the first push rollers is larger than The diameter of the second pushing rollers. In the wafer expanding device described in the second item of the scope of patent application, the first push rollers and the second push rollers are staggered. In the wafer expanding device described in item 3 of the scope of patent application, the first pushing rollers are equidistant from each other. In the wafer expanding device described in the first item of the scope of patent application, the pushing rollers are arranged around the wafer. For the wafer expanding device described in item 5 of the scope of patent application, the push rollers are distributed in a circular shape. A wafer expanding device includes: A wafer expanding iron ring, including an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer; A carrier for carrying the wafer expanding iron ring; A wafer expansion assembly for pushing and expanding the adhesive film, wherein the wafer expansion assembly includes push rollers with different distances from the center of the wafer; and A fixing mechanism is used to fix the outer frame of the wafer expanding iron ring at the same time as the carrier, and when the wafer expansion assembly pushes the adhesive film upwards, the adhesive film is expanded to expand the wafer sheet. For the wafer expanding device described in claim 7, wherein the push rollers include a plurality of first sets of push rollers and a plurality of second sets of push rollers, and the first sets of push rollers The distance from the center of the wafer is greater than the distance between the second sets of push rollers and the center of the wafer. In the wafer expanding device described in item 8 of the scope of patent application, the first sets of push rollers are equidistant from each other. In the wafer expanding device described in item 7 of the scope of patent application, the push rollers are distributed in a circle around the wafer. A wafer expanding device includes: A wafer expanding iron ring, including an outer frame and an adhesive film, wherein the adhesive film is connected to the outer frame for attaching a wafer; A carrier for carrying the wafer expanding iron ring; A wafer expansion assembly for pushing and expanding the film; A force applying component for applying force to the film to change the local tension of the film; and A fixing mechanism is used to fix the outer frame of the wafer expanding iron ring at the same time as the carrier, and when the wafer expansion assembly pushes the adhesive film upwards, the adhesive film is expanded to expand the wafer sheet. The wafer expanding device described in claim 11, wherein the force application component includes a plurality of pressing rollers to partially press down the adhesive film. As for the wafer expanding device described in item 12 of the scope of patent application, the pressing rollers are respectively located on opposite sides of the wafer.

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