CN112839771A - Saw wire - Google Patents

Saw wire Download PDF

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Publication number
CN112839771A
CN112839771A CN201980067898.5A CN201980067898A CN112839771A CN 112839771 A CN112839771 A CN 112839771A CN 201980067898 A CN201980067898 A CN 201980067898A CN 112839771 A CN112839771 A CN 112839771A
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China
Prior art keywords
fold
wave
imparting
wave component
imparting portion
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Granted
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CN201980067898.5A
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Chinese (zh)
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CN112839771B (en
Inventor
藤原伸彦
飞田政志
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Tokusen Kogyo Co Ltd
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Tokusen Kogyo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The saw wire (2) of the present invention has a first fold imparting portion (4), a second fold imparting portion (6), a third fold imparting portion (8), and a straight portion (10). The first fold imparting unit (4) has a wave shape that vibrates in a plane. The second fold-imparting section (6) has folds including a first wave component that vibrates in a plane and a second wave component that vibrates in a plane different from the plane of the first wave component. The third fold-imparting portion (6) has a wave shape that vibrates in a plane different from the plane of the first fold-imparting portion (4). The linear part (10) does not have a wave shape. The vibration direction of the first wave component substantially coincides with the vibration direction of the wave in the first fold imparting portion. The vibration direction of the second wave component substantially coincides with the vibration direction of the wave in the third fold imparting portion.

Description

Saw wire
Technical Field
The invention relates to a saw wire. In particular, the present invention relates to an improvement in the creasing of a saw wire.
Background
The semiconductor ingot is cut using a saw wire. The wafer is obtained by dicing. Fixed abrasive grain type saw wires and free abrasive grain type saw wires were used. The fixed abrasive grain type saw wire is excellent in cutting efficiency. However, the cut surface obtained by the fixed abrasive grain type saw wire has poor dimensional accuracy. Free abrasive type saw wires are advantageous from the point of view of the properties of the wafer.
In free abrasive grain type saw wires, the slurry is sprayed onto the wire prior to cutting. The slurry includes abrasive particles. By the travel of the saw wire, abrasive grains are introduced between the ingot and the saw wire. The ingot is cut by the movement of the abrasive grains, thereby achieving cutting. The saw wire capable of introducing a large amount of abrasive grains is excellent in cutting efficiency. Saw wires capable of introducing a large amount of abrasive particles also contribute to the dimensional accuracy of the cut face.
Japanese patent laid-open publication No. 2004-276207 discloses a saw wire to which a fold is imparted. The fold has a wave shape. The wave has a peak and a trough. Abrasive particles are replenished into the valleys and travel inside the ingot. The saw wire is capable of introducing a large amount of abrasive particles.
Japanese patent application laid-open No. 2008-519698 discloses a saw line to which the same fold is given. The saw wire has two waves. The vibration direction of one wave is different from that of the other wave.
Patent document 1: japanese patent laid-open publication No. 2004-276207
Patent document 2: japanese Kokai publication 2008-519698
Disclosure of Invention
It is desirable to improve the cutting efficiency of the saw wire. It is also desirable to further improve the accuracy of the cutting face. The object of the present invention is to provide a sawing wire that meets the above-mentioned needs.
The saw wire according to the present invention includes a first fold-imparting portion and a second fold-imparting portion. The first crease imparting portion has a wave shape vibrating in a plane. The second fold-imparting portion has a fold including a first wave component that vibrates in a plane and a second wave component that vibrates in a plane different from the plane of the first wave component.
Preferably, the vibration direction of the second wave component is substantially perpendicular to the vibration direction of the first wave component.
In the first crease imparting portion, peaks and valleys may be alternately arranged. Preferably, the number of peaks in one first crease imparting portion is 5 or more and 300 or less.
In the first wave component of the second fold imparting portion, peaks and valleys may be alternately arranged. Preferably, the number of peaks of the first wave component in one second fold-imparting portion is 5 or more and 300 or less.
In the second wave component of the second fold imparting portion, peaks and valleys may be alternately arranged. Preferably, the number of peaks of the second wave component in one second fold-imparting portion is 5 or more and 300 or less.
Preferably, the saw wire further includes a third fold imparting portion. The third fold-imparting portion has a wave shape that vibrates in a plane different from the plane of the first fold-imparting portion.
Preferably, the direction of vibration of the wave in the third fold-imparting portion is substantially perpendicular to the direction of vibration of the wave in the first fold-imparting portion.
Preferably, the vibration direction of the first wave component substantially coincides with the vibration direction of the wave in the first fold imparting portion, and the vibration direction of the second wave component substantially coincides with the vibration direction of the wave in the third fold imparting portion.
In the third crease imparting portion, peaks and valleys may be alternately arranged. The number of peaks in one third fold-imparting portion is 5 or more and 300 or less.
Preferably, the saw wire further includes a straight portion.
The saw wire according to the present invention has two or more fold-imparting portions, and therefore has excellent abrasive grain drawing performance. By the saw wire, efficient cutting can be realized. By this saw wire, a cut surface with high dimensional accuracy can be obtained.
Drawings
Fig. 1 (a) is a front view showing a part of a saw wire according to an embodiment of the present invention, and fig. 1 (b) is a plan view showing the saw wire of fig. 1 (a).
Fig. 2 is an enlarged right side view showing a first fold imparting portion of the saw wire of fig. 1.
Fig. 3 is an enlarged front view showing a part of the first fold-imparting portion of fig. 2.
Fig. 4 is an enlarged right side view showing a part of the second fold imparting portion of the saw lane of fig. 1.
Fig. 5 is a schematic view showing the first wave component of the second fold-imparting section of fig. 4.
Fig. 6 is a schematic view showing a second wave component of the second fold-imparting section shown in fig. 4.
Fig. 7 is an enlarged right side view showing a third fold imparting portion of the saw wire of fig. 1.
Fig. 8 is an enlarged front view showing a part of the third fold-imparting portion of fig. 7.
Fig. 9 is a schematic view showing a part of a crease imparting device used for the saw wire of fig. 1.
Detailed Description
Hereinafter, the present invention will be described in detail based on preferred embodiments with reference to the accompanying drawings as appropriate.
In fig. 1 (a) and (b), and fig. 2, a saw wire 2 is shown. In fig. 1 (a), the vertical direction (Y direction) is a vertical direction, and the horizontal direction (X direction) is a horizontal direction. In fig. 1 (b), the vertical direction (Z direction) is a horizontal direction, and the horizontal direction (X direction) is also a horizontal direction. The X direction is also the length direction of the saw wire 2. The Saw wire 2 is mounted on a sawing Machine (Saw Machine) and travels leftward in fig. 1 (a).
The saw wire 2 includes a first fold-imparting portion 4, a second fold-imparting portion 6, a third fold-imparting portion 8, and a straight portion 10. The second fold imparting unit 6 is located downstream of the first fold imparting unit 4. The third fold-imparting portion 8 is located downstream of the second fold-imparting portion 6. The linear portion 10 is located downstream of the third fold-imparting portion 8. The first fold-imparting portion 4, the second fold-imparting portion 6, the third fold-imparting portion 8, and the straight portion 10 form one cycle. In the saw wire 2, a plurality of cycles are regularly arranged in the longitudinal direction. The plurality of first crease imparting portions 4, the plurality of second crease imparting portions 6, the plurality of third crease imparting portions 8, and the plurality of straight portions 10 may be irregularly arranged.
Fig. 2 shows the first fold-imparting portion 4. The first crease imparting portion 4 has a wave shape. As can be seen from fig. 2 together with fig. 1 (a) and (b), the wave of the first fold imparting portion 4 vibrates in the X-Y plane. The wave does not vibrate in other planes. The wave is a two-dimensional wave. The wave oscillates at a constant wavelength. The vibration direction of the wave is the Y direction.
Fig. 3 is an enlarged front view showing a part of the first fold imparting portion 4 of the saw wire 2 of fig. 1 (a). As described above, the shape of the first crease imparting portion 4 is a wave vibrating in the Y direction. The first crease-imparting portion 4 has peaks 12 and valleys 14. The plurality of peaks 12 and the plurality of valleys 14 are alternately arranged (see also fig. 1 (a)). The first crease imparting portion 4 replenishes the crests 12 or the troughs 14 with abrasive grains and introduces them into the cut surface. The number of peaks 12 in one first crease-imparting portion 4 is preferably 5 or more and 300 or less, and preferably 10 or more and 200 or less. The number of valleys 14 is almost the same as the number of peaks 12.
In fig. 3, the wavelength is represented by an arrow WL1, and the wave height is represented by an arrow WH 1. The wavelength WL1 is preferably 0.2mm or more and 50mm or less, particularly preferably 0.3mm or more and 40mm or less. The height WH1 is preferably 0.10mm or more and 0.25mm or less, and particularly preferably 0.11mm or more and 0.20mm or less.
Preferably, the wavelength WL1 satisfies the following equation.
1.1＊Di≤WL1≤50＊Di
In this equation, Di represents a wire diameter (see fig. 2). In other words, the wavelength WL1 is 1.1 times or more and 50 times or less the wire diameter Di. Preferably, the wavelength WL1 is 3 times or more and 40 times or less the wire diameter Di.
Preferably, the wave height WH1 satisfies the following formula.
1.05＊Di≤WH1≤5＊Di
In this equation, Di represents a wire diameter (see fig. 2). In other words, the wave height WH1 is 1.05 times or more and 5 times or less the wire diameter Di. Preferably, the wave height WH1 is 1.10 times or more and 3 times or less the wire diameter Di.
Fig. 4 is an enlarged right side view showing a part of the second fold imparting unit 6 of the saw line 2 of fig. 1. The second fold imparting portion 6 has wavy folds. The fold has a shape obtained by combining the first wave component 16 and the second wave component 18 schematically shown in fig. 4. In other words, in the second fold-imparting portion 6, the vibration of the first wave component 16 and the vibration of the second wave component 18 are simultaneously performed in the longitudinal direction of the saw wire 2. The fold may have a shape in which three or more wave components are combined.
The first wave component 16 is schematically shown in fig. 5. As can be seen from fig. 4 and 5, the first wave component 16 vibrates in the X-Y plane. The first wave component 16 does not vibrate in other planes. The first wave component 16 is a two-dimensional wave. The first wave component 16 oscillates at a constant wavelength. The vibration direction of the wave of the first wave component 16 is the Y direction. The vibration direction of the wave of the first wave component 16 coincides with the wave vibration direction of the first fold imparting portion 4. The direction of wave vibration of the first wave component 16 may be different from the direction of wave vibration of the first fold imparting portion 4.
As shown in FIG. 5, the first wave component 16 has a plurality of peaks 20 and a plurality of valleys 22. These peaks 20 and valleys 22 are alternately arranged in the X direction. The saw wire 2 is supplemented with abrasive grains in the peaks 20 or valleys 22 of the first wave component 16 and is guided into the cutting face. The number of peaks 20 of the first wave component 16 in one second fold-imparting portion 6 is preferably 5 or more and 300 or less, and preferably 10 or more and 200 or less. The number of valleys 22 is almost the same as the number of peaks 20. In fig. 5, an arrow WL21 indicates the wavelength of the one wave component 16, and an arrow WH21 indicates the wave height of the first wave component 16.
Preferably, the wavelength WL21 of the first wave component 16 satisfies the following expression.
1.1＊Di≤WL21≤50＊Di
In this equation, Di represents a wire diameter (see fig. 4). In other words, the wavelength WL21 of the first wave component 16 is 1.1 times or more and 50 times or less the wire diameter Di. Preferably, the wavelength WL21 is 3 times or more and 40 times or less the wire diameter Di.
Preferably, the wave height WH21 of the first wave component 16 satisfies the following formula.
1.05＊Di≤WH21≤5＊Di
In this equation, Di represents a wire diameter (see fig. 4). In other words, the wave height WH21 of the first wave component 16 is 1.05 times or more and 5 times or less the wire diameter Di. Preferably, the wave height WH21 is 1.10 times or more and 3 times or less the wire diameter Di.
In fig. 6, a second wave component 18 is schematically shown. As can be seen from fig. 4 and 6, the second wave component 18 vibrates in the X-Z plane. The second wave component 18 does not vibrate in the other planes. The second wave component 18 is a two-dimensional wave. The second wave component 18 oscillates at a constant wavelength. The vibration direction of the wave of the second wave component 18 is the Z direction. The direction of vibration of the second wave component 18 is different from the direction of vibration of the first wave component 16. In the present embodiment, the vibration direction of the first wave component 16 is substantially perpendicular to the vibration direction of the second wave component 18. In other words, the angle θ of the vibration direction of the second wave component 18 with respect to the vibration direction of the first wave component 1621-22Is 90 ° (refer to fig. 4). Angle theta21-22Values other than 90 ° are also possible. Angle theta21-22Preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less.
As shown in fig. 6, the second wave component 18 has a plurality of peaks 24 and a plurality of valleys 26. These peaks 24 and valleys 26 are alternately arranged in the X direction. The saw wire 2 is supplemented with abrasive grains in the peaks 24 or valleys 26 of the second wave component 18 and is guided into the cutting face. The number of peaks 24 of the second wave component 18 in one second fold-imparting portion 6 is preferably 5 or more and 300 or less, and preferably 10 or more and 200 or less. The number of valleys 26 is almost the same as the number of peaks 24. In fig. 6, an arrow WL22 indicates the wavelength of the second wave component 18, and an arrow WH22 indicates the wave height of the second wave component 18.
Preferably, the wavelength WL22 of the second wave component 18 satisfies the following equation.
1.1＊Di≤WL22≤50＊Di
In this equation, Di represents a wire diameter (see fig. 4). In other words, the wavelength WL22 of the second wave component 18 is 1.1 times or more and 50 times or less the wire diameter Di. Preferably, the wavelength WL22 is 3 times or more and 40 times or less the wire diameter Di.
Preferably, the wave height WH22 of the second wave component 18 satisfies the following formula.
1.05＊Di≤WH22≤5＊Di
In this equation, Di represents a wire diameter (see fig. 4). In other words, the wave height WH22 of the second wave component 18 is preferably 1.05 times or more and 5 times or less the wire diameter Di. Preferably, the wave height WH22 is 1.10 times or more and 3 times or less the wire diameter Di.
The wavelength WL22 of the second wave component 18 may also be the same as the wavelength WL21 of the first wave component 16. Wavelength WL22 may also be different from wavelength WL 21. The wave height WH22 of the second wave component 18 may also be the same as the wave height WH21 of the first wave component 16. The wave height WH22 may also be different from the wave height WH 21.
The first wave component 16 and the second wave component 18 are two-dimensional waves as described above. By combining the first wave component 16 and the second wave component 18, a three-dimensional wave is formed. The second fold of the saw line 22 gives the fold 6 a three-dimensional shape.
Fig. 7 shows a third fold-imparting portion 8. The third crease imparting portion 8 has a wave shape. As can be seen from fig. 7 together with fig. 1 (a) and (b), the wave of the third fold-imparting portion 8 vibrates in the X-Z plane. The wave does not vibrate in other planes. The wave is a two-dimensional wave. The wave oscillates at a constant wavelength. The vibration direction of the wave is the Z direction. The vibration direction is different from the vibration direction of the wave of the first fold imparting portion 4. The vibration direction is substantially perpendicular to the vibration direction of the wave of the first fold imparting portion 4. In other words, the angle θ formed by the vibration direction of the wave of the third fold imparting portion 8 with respect to the vibration direction of the wave of the first fold imparting portion 41-3Is 90 deg.. Angle theta1-3Values other than 90 ° are also possible. Angle theta1-3Preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less.
The direction of vibration of the wave of the third fold-imparting portion 8 coincides with the direction of vibration of the wave of the second wave component. The direction of vibration of the wave of the third fold-imparting portion 8 may be different from the direction of vibration of the wave of the second wave component.
Fig. 8 is an enlarged front view of a part of the third fold-imparting portion 8 shown in fig. 7. As described above, the shape of the third fold imparting portion 8 is a wave that vibrates in the Z direction. The third crease-imparting portion 8 has a peak 28 and a valley 30. The plurality of peaks 28 and the plurality of valleys 30 are alternately arranged (see also fig. 1 (b)). The third fold-imparting portion 8 replenishes the crests 28 or the troughs 30 with abrasive grains and introduces them into the cut surface. The number of peaks 28 in one third fold-imparting portion 8 is preferably 5 or more and 300 or less, and preferably 10 or more and 200 or less. The number of troughs 30 is almost the same as the number of peaks 28.
In fig. 8, the wavelength is represented by an arrow WL3, and the wave height is represented by an arrow WH 3. The wavelength WL3 is preferably 0.2mm or more and 50mm or less, particularly preferably 0.3mm or more and 40mm or less. The height WH3 is preferably 0.10mm or more and 0.25mm or less, and particularly preferably 0.11mm or more and 0.20mm or less.
Preferably, the wavelength WL3 satisfies the following equation.
1.1＊Di≤WL3≤50＊Di
In this equation, Di represents a wire diameter (see fig. 7). In other words, the wavelength WL3 is 1.1 times or more and 50 times or less the wire diameter Di. Preferably, the wavelength WL3 is 3 times or more and 40 times or less the wire diameter Di.
Preferably, the wave height WH3 satisfies the following formula.
1.05＊Di≤WH3≤5＊Di
In this equation, Di represents a wire diameter (see fig. 7). In other words, the wave height WH3 is 1.05 times or more and 5 times or less the wire diameter Di. Preferably, the wave height WH3 is 1.10 times or more and 3 times or less the wire diameter Di.
The wavelength WL3 of the third fold providing part 8 may be the same as the wavelength WL1 of the first fold providing part 4. Wavelength WL3 may also be different from wavelength WL 1. The wave height WH3 of the third fold-imparting portion 8 may be the same as the wave height WH1 of the first fold-imparting portion 4. The wave height WH3 may also be different from the wave height WH 1. The saw wire 2 may not have the third fold imparting portion 8. The saw wire 2 not having the third fold-imparting portion 8 has two types of fold-imparting portions, i.e., the first fold-imparting portion 4 and the second fold-imparting portion 6. The saw wire 2 may have four or more kinds of fold giving portions.
In the saw wire 2, abrasive grains are introduced into the plurality of types of fold-imparting portions. These crease imparting portions have different creases from each other, and therefore a large amount of abrasive grains are introduced. And, these abrasive grains can be introduced without variation. The saw wire 2 can achieve excellent cutting efficiency. The saw wire 2 can also contribute to the dimensional accuracy of the cutting face.
The linear portion 10 does not have a wave shape. The embodiment of the saw wire 2 with the straight portion 10 is rich in variations as a whole. The straight portion 10 can also contribute to the introduction of abrasive grains. The saw wire 2 may also not have a straight portion 10. In fig. 1 (b), the length of the linear portion 10 is indicated by an arrow Lm. The length is preferably 5mm or more and 50mm or less, and preferably 10mm or more and 40mm or less.
In the present embodiment, the linear portion 10 is sandwiched between the first fold-imparting portion 4 and the third fold-imparting portion 8. The linear portion 10 may be sandwiched between the first fold-imparting portion 4 and the second fold-imparting portion 6. The linear portion 10 may be sandwiched between the second fold-imparting portion 6 and the third fold-imparting portion 8. The linear portion 10 may be sandwiched between the two first fold-imparting portions 4. The linear portion 10 may be sandwiched between the two second fold-imparting portions 6. The linear portion 10 may be sandwiched between the two third fold-imparting portions 8. The saw wire 2 may also not have a straight portion 10.
The wire diameter Di of the saw wire 2 is preferably 0.05mm or more and 1.00mm or less, and particularly preferably 0.10mm or more and 0.20mm or less. The material of the saw wire 2 is metal. A typical metal is carbon steel. The saw wire 2 is preferably brass plated on the surface of the main part consisting of carbon steel.
Fig. 9 is a schematic view showing a part of the crease imparting device 32 used for the saw line 2 of fig. 1. Also shown in fig. 9 is a busbar 34 for the saw wire 2. The bus bar 34 travels in the direction of arrow a in fig. 9. The crease imparting means has a first gear pair 36 and a second gear pair 38. The second gear pair 38 is located downstream of the first gear pair 36. The second gear pair 38 has a different axial direction than the first gear pair 36. The angle of the axial direction of the second gear pair 38 with respect to the axial direction of the first gear pair 36 is preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less. In the present embodiment, the angle is 90 °.
The first gear pair 36 is composed of an upper gear 40 and a lower gear 42. The upper gear 40 is composed of a tooth portion 44 and a blank portion 46. The teeth 44 are engraved with a plurality of teeth 48. The blank 46 does not have teeth 48. The lower gear 42 is also composed of a tooth portion 44 and a blank portion 46. The teeth 44 are engraved with a plurality of teeth 48. The blank 46 does not have teeth 48. The tooth portion 44 of the lower gear 42 is located at a position corresponding to the tooth portion 44 of the upper gear 40. Therefore, the tooth portions 44 of the lower gear 42 mesh with the tooth portions 44 of the lower gear 42. The blank portion 46 of the lower gear 42 is located at a position corresponding to the blank portion 46 of the upper gear 40. When the first gear pair 36 rotates, the teeth 44 and the spaces 46 alternately appear in the sandwiched portion between the upper gear 40 and the lower gear 42.
The second gear pair 38 is composed of a left gear 50 and a right gear. In fig. 9, the right gear is not shown. The right gear is hidden by the left gear 50. The left gear 50 is composed of a tooth portion 44 and a blank portion 46. The teeth 44 are engraved with a plurality of teeth 48. The blank 46 does not have teeth 48. Although not shown, the right gear is also constituted by the tooth portion 44 and the blank portion 46, similarly to the left gear 50. The teeth 44 are engraved with a plurality of teeth 48. The blank 46 does not have teeth 48. The tooth portion 44 of the right gear is located at a position corresponding to the tooth portion 44 of the left gear 50. Therefore, the tooth portion 44 of the right gear meshes with the tooth portion 44 of the left gear 50. The blank portion 46 of the right gear is located at a position corresponding to the blank portion 46 of the left gear 50. When the second gear pair 38 rotates, the teeth 44 and the spaces 46 alternately appear in the sandwiched portions of the left gear 50 and the right gear.
The bus bar 34 passes through a first gear pair 36. The portion that passes through the first gear pair 36 when the clamped portion in the bus bar 34 is the tooth portion 44 is plastically deformed. This plastic deformation imparts a wave component oscillating in the Y direction to the bus bar 34. The portion of the bus bar 34 that passes through the first gear pair 36 when the holding portion is the blank portion 46 does not plastically deform.
Following the first gear pair 36, the busbar 34 passes through a second gear pair 38. Plastic deformation occurs in the portion of the busbar 34 that passes through the second gear pair 38 when the clamped portion is the toothed portion 44. This plastic deformation imparts a wave component oscillating in the Z direction to the bus bar 34. The portion of the bus bar 34 that passes through the second gear pair 38 when the clamped portion is the blank portion 46 does not plastically deform.
The portion of the bus bar 34 that is plastically deformed by the first gear pair 36 and is not plastically deformed by the second gear pair 38 has the shape of a wave that vibrates in the Y direction. This portion is the first fold imparting portion 4.
The portion of the busbar 34 plastically deformed by the first gear pair 36 and also plastically deformed by the second gear pair 38 has a fold containing a wave component that vibrates in the Y direction and a wave component that vibrates in the Z direction. This portion is the second fold imparting portion 6.
The portion of the busbar 34 that is not plastically deformed by the first gear pair 36 and is plastically deformed by the second gear pair 38 has the shape of a wave that vibrates in the Z direction. This portion is the third crease imparting portion 8.
The portion of the busbar 34 that is not plastically deformed by the first gear pair 36 and is not plastically deformed by the second gear pair 38 does not have a wave shape. This portion is a straight portion 10.
Examples
The effects of the present invention will be clarified by the following examples, but the present invention should not be construed as being limited to the descriptions of the examples.
[ example 1]
The saw wire shown in fig. 1-8 was made. The specifications of the saw wire are shown in table 1 below. The saw wire is composed of brass plated carbon steel.
[ example 2]
A saw wire of example 2 was obtained in the same manner as in example 1, except that no straight portion was provided.
[ example 3]
A saw wire of example 3 was obtained in the same manner as in example 1, except that the third fold-imparting portion was not provided.
[ example 4]
A saw wire of example 4 was obtained in the same manner as in example 1, except that the straight portion and the third fold-imparting portion were not provided.
Comparative example 1
A saw wire of comparative example 1 was obtained in the same manner as in example 1, except that only the second fold-imparting portion was provided.
Comparative example 2
A conventional saw wire was prepared. The saw wire does not have a wave shape.
[ test 1]
Each saw wire is mounted to a sawing machine. The surface of the saw wire is coated with a slurry containing abrasive particles. The glass sheet was cut by running the saw wire at a speed of 0.6 mm/min. The roughness and waviness of the obtained cut surface were observed and evaluated. The results are shown in tables 1 and 2 below as indices. The larger the value, the more excellent the evaluation.
[ test 2]
The roughness and waviness of the cut surface were evaluated in the same manner as in experiment 1 except that the running speed of the wire was set to 0.8 mm/min. The results are shown in tables 1 and 2 below as indices. The larger the value, the more excellent the evaluation.
[ Table 1]
TABLE 1 evaluation results
Figure BDA0003020542360000111
[ Table 2]
TABLE 2 evaluation results
Figure BDA0003020542360000121
As shown in tables 1 and 2, the saw wires of the examples were evaluated to be superior to those of the comparative examples. From the evaluation results, the superiority of the present invention can be clarified.
Industrial applicability
The saw wire according to the invention can be used for cutting off various articles.
Description of the reference numerals
Sawing wires; a first crease imparting portion; a second fold imparting portion; a third crease imparting portion; a straight portion; 12. 20, 24, 28.. peaks; 14. 22, 26, 30.. trough; a first wave component; a second wave component; a crease imparting means; a bus; a first gear pair; a second gear pair; an upper gear; a lower gear; a tooth portion; a blank portion; 48.. teeth; a left gear.

Claims (9)

1. A saw wire, wherein,
comprises a first fold-imparting portion and a second fold-imparting portion,
the first crease imparting portion has a shape of a wave vibrating in a plane,
the second fold-imparting portion has a fold including a first wave component that vibrates in a plane and a second wave component that vibrates in a plane different from the plane of the first wave component.
2. The sawing wire according to claim 1 wherein,
the vibration direction of the second wave component is substantially perpendicular to the vibration direction of the first wave component.
3. The sawing wire according to claim 1 or 2 wherein,
in the first fold-imparting portions, the peaks and valleys are alternately arranged, and the number of peaks in one first fold-imparting portion is 5 or more and 300 or less.
4. The sawing wire according to any one of claims 1 to 3 wherein,
in the first wave component of the second fold-imparting portions, the peaks and valleys are alternately arranged, the number of peaks of the first wave component in one second fold-imparting portion is 5 or more and 300 or less,
in the second wave component of the second fold-imparting portions, the peaks and valleys are alternately arranged, and the number of peaks of the second wave component in one second fold-imparting portion is 5 or more and 300 or less.
5. The sawing wire according to any one of claims 1 to 4 wherein,
the saw wire further includes a third fold imparting portion having a wave shape that vibrates in a plane different from a plane of the first fold imparting portion.
6. The sawing wire according to claim 5 wherein,
the third fold-imparting portion has a wave vibration direction substantially perpendicular to a wave vibration direction of the first fold-imparting portion.
7. The sawing wire according to claim 5 or 6 wherein,
the vibration direction of the first wave component substantially coincides with the vibration direction of the wave in the first fold imparting portion, and the vibration direction of the second wave component substantially coincides with the vibration direction of the wave in the third fold imparting portion.
8. The sawing wire according to any one of claims 5 to 7 wherein,
in the third fold-imparting portions, the peaks and valleys are alternately arranged, and the number of peaks in one third fold-imparting portion is 5 or more and 300 or less.
9. The sawing wire according to any one of claims 1 to 8 wherein,
the saw wire is further provided with a straight portion.
CN201980067898.5A 2018-11-15 2019-05-20 Saw wire Active CN112839771B (en)

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CN101039771A (en) * 2004-12-23 2007-09-19 贝唐堡阿赛勒股份公司 Monofilament metal saw wire
CN102029573A (en) * 2009-10-07 2011-04-27 硅电子股份公司 Method for grinding semiconductor wafer
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CN204912935U (en) * 2014-02-04 2015-12-30 弘德产业株式会社 Structure sawline that keeps fold characteristic under segmentation tension

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