CN102490088A - Three-dimensional spiral line grinding method through ultrasonic vibration - Google Patents
Three-dimensional spiral line grinding method through ultrasonic vibration Download PDFInfo
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- CN102490088A CN102490088A CN2011103661727A CN201110366172A CN102490088A CN 102490088 A CN102490088 A CN 102490088A CN 2011103661727 A CN2011103661727 A CN 2011103661727A CN 201110366172 A CN201110366172 A CN 201110366172A CN 102490088 A CN102490088 A CN 102490088A
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Abstract
The invention provides a three-dimensional spiral line grinding method through ultrasonic vibration, which is applicable to high-efficiency precision machining of difficult-to-cut materials. Two-dimensional ultrasonic vibration is applied to a workpiece in the axial direction of a grinding wheel and in the radial direction of the grinding wheel on a common grinder by an ultrasonic transducer, so that the workpiece is in ultrasonic elliptic vibration. As the grinding direction is perpendicular to a plane of ultrasonic elliptic vibration, cutting tracks of abrasive particles relative to the workpiece are three-dimensional spiral lines. The tracks of the abrasive particles on the surface of the workpiece interfere with each other by the aid of the ultrasonic vibration in the axial direction of the grinding wheel, so that roughness is reduced. Besides, the maximum cutting depth of the abrasive particles is increased by the aid of the ultrasonic vibration in the radial direction of the grinding wheel, and the abrasive particles function in intermittent cutting, so that grinding force is reduced, and material removing rate is increased. The method can be used for improving machining surface quality, decreasing surface damage and improving production efficiency, thereby being applicable to high-efficiency precision machining of the difficult-to-cut materials.
Description
Technical field
The present invention relates to the three-dimensional helical method for grinding of a kind of ultrasonic vibration, be applicable to the high-efficiency and precision processing of difficult-to-machine material.
Background technology
Difficult-to-machine materials such as pottery, Semiconductor substrate, Sapphire Substrate, carbide alloy, high-speed steel are increasingly extensive in the application of industrial circles such as aviation, electronics, optics, automobile.Serious affected layer and the face crack of the inevitable generation of traditional grinding produces bigger grinding force and higher grinding temperature in the grinding process, aggravated the wearing and tearing of emery wheel and the damage of finished surface.One side needs finishing in time and changes emery wheel, for removing manufacturing deficiency and improving surface smoothness, needs long follow-up polishing processing on the other hand, has therefore increased processing cost, has reduced working (machining) efficiency.For addressing these problems, ultrasonic vibration is applied in the high efficient grinding of difficult-to-machine material.Using at present comparatively widely, ultrasonic vibration grinding mainly is summed up as two types: a kind of is one dimension axial vibration grinding, i.e. ultrasonic vibration direction be parallel to grinding wheel spindle to or surface of the work, its main feature is to increase substantially surface quality.The axial ultrasonic vibration can produce the near sinusoidal Cutting trajectory, and the grinding sword forever contacts with workpiece, can be used for the manufacturing of high accuracy complicated shape part.A kind of in addition is one dimension radial ultrasonic vibration grinding, i.e. ultrasonic vibration direction along emery wheel radially, its main feature is can significantly reduce grinding force and improve material removing rate, but can cause the increase of abrasion of grinding wheel and the slight increase of surface roughness.The increase of abrasion of grinding wheel is reduced by the abrasive particle ratio of coming off and lower thermal force causes abrasive particle microcosmic wearing and tearing increase.The slight increase of roughness is because under identical materials clearance condition, effectively abrasive grain cutting sword quantity increase and the reducing of surface of the work plastic deformation due to.According to the characteristics of one dimension ultrasonic vibration grinding,, originally researched and proposed the three-dimensional helical method for grinding of a kind of ultrasonic vibration in order to give full play to the processed edge of ultrasonic vibration grinding.
Summary of the invention
The object of the present invention is to provide the three-dimensional helical method for grinding of a kind of ultrasonic vibration, be used to realize the high-efficiency and precision processing of difficult-to-machine material, reduce production costs.
Abrasive particle is removed workpiece material with three dimensions helix mode among the present invention.The cutting speed of abrasive particle and acceleration constantly change along with the variation of abrasive particle space displacement, cause grinding performance to change.Because there is the ultrasonic vibration component of vertical direction in abrasive particle; Cause the continuous cycle of the abrasive grain cutting degree of depth to change and the increase of abrasive particle maximum grinding depth; There is the interrupted cut effect in abrasive particle, and its effective cutting time reduces, simultaneously since the huge acceleration of abrasive particle to the impact and the emollescence effect of workpiece material; Cause grinding force to reduce significantly, thereby can improve working (machining) efficiency.Because there is the ultrasonic vibration component of emery wheel axial direction in abrasive particle, and the Cutting trajectory of different abrasive particles on workpiece interfered each other, impel workpiece surface roughness to reduce on the other hand, surface quality improves.Therefore the three-dimensional helical method for grinding of ultrasonic vibration can reduce grinding force significantly, improves surface quality simultaneously.Therefore this technology has broad application prospects, and can create tangible social value and economic benefit.
The present invention utilizes a kind of elliptical ultrasonic vibration device that workpiece is applied elliptical ultrasonic vibration, and this elliptical vibration plane is perpendicular to the grinding speed direction.The present invention is applied in the efficient precise grinding of sapphire single-crystal, can realize that grinding force reduces 40%, and roughness reduces 30%, and the crackle and the brittle fracture of finished surface significantly reduce, and ductility territory grinding depth significantly increases.At first,, reduced the wearing and tearing of emery wheel, improved the self-sharpening ability of emery wheel, prolonged service life because grinding force reduces significantly.Secondly, because the raising of machined surface quality has reduced the surface damage layer thickness, shortened follow-up polishing process time.
The elliptical ultrasonic vibration device can be easily installed on the general-purpose grinder among the present invention, need not to change grinding machine equipment, so processing cost is lower and simple to operate, can be widely used in the processing of difficult-to-machine material.
Description of drawings
Below in conjunction with accompanying drawing the present invention is elaborated.
Accompanying drawing 1: the three-dimensional helical Principle of Grinding and Cutting of ultrasonic vibration of the present invention sketch map.1 is emery wheel among the figure, and 2 is workpiece.
Accompanying drawing 2: the work sketch map of the three-dimensional helical grinding system of ultrasonic vibration of the present invention.1 is emery wheel among the figure, and 2 is workpiece, and 3 is elliptical ultrasonic vibration, and 4 is anchor clamps, and 5 is workbench, and 6 is bed piece.
The specific embodiment
1. workpiece 2 usefulness paraffin are fixed on the top end face of elliptical ultrasonic vibration 3, after then elliptical ultrasonic vibration oscillator 3 usefulness anchor clamps 4 being clamped, are fixed on the workbench 5 above the bed piece 6.
2. the position of adjustment elliptical ultrasonic vibration 3 guarantees that its elliptical vibration plane is perpendicular to the grinding speed direction.
3. open the wave function generator; Make two identical and dephased ac voltage signals of frequency of its output; After power amplifier amplifies; Be applied on elliptical ultrasonic vibration, the flexible and flexural vibration mode of oscillator is by excitation simultaneously, and this moment, workpiece was along with elliptical ultrasonic vibration 3 is done ultrasonic vibration with elliptical shape.
4. grinding wheel speed V is set
sAnd grinding depth a
p, table feed speed V
wDeng machined parameters, carry out grinding.
5. after machining, workpiece is placed on the electric furnace with ultrasonic vibration, is heated to 100～150 ℃, treat that paraffin melts after, take off workpiece and carry out ultrasonic waves for cleaning, accomplish the processing of workpiece thus.
Claims (5)
1. the three-dimensional helical method for grinding of ultrasonic vibration; In the grinding process workpiece has been applied the two-dimensional elliptic ultrasonic vibration; It is characterized in that: to workpiece applied grinding wheel spindle to emery wheel two dimensional ultrasonic vibration radially; Workpiece is done the two-dimensional elliptic ultrasonic vibration, and the Cutting trajectory of the relative workpiece of abrasive particle is the three dimensions helix.
2. according to the three-dimensional helical method for grinding of the ultrasonic vibration of claim 1, it is characterized in that: this method can directly apply elliptical ultrasonic vibration to workpiece through a kind of elliptical ultrasonic vibration device.
3. elliptical ultrasonic vibration device according to claim 2 is characterized in that: be made up of elliptical ultrasonic vibration, wave function generator, power amplifier and anchor clamps.
4. elliptical ultrasonic vibration device according to claim 2 is characterized in that: oval ultrasonic vibrator is processed by piezoceramics crystal and metallic elastic bonding, under a certain supersonic frequency, has mode of flexural vibration and flexible mode simultaneously.
5. elliptical ultrasonic vibration device according to claim 2; It is characterized in that: when the ac voltage signal with two same frequencys encourages elliptical vibration mode of flexural vibration and flexible mode simultaneously; Oval ultrasonic vibrator produces flexible and flexural vibrations simultaneously, and its motion synthesizes elliptical vibration.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103661727A CN102490088A (en) | 2011-11-17 | 2011-11-17 | Three-dimensional spiral line grinding method through ultrasonic vibration |
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| CN2011103661727A CN102490088A (en) | 2011-11-17 | 2011-11-17 | Three-dimensional spiral line grinding method through ultrasonic vibration |
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| CN102490088A true CN102490088A (en) | 2012-06-13 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
| CN104875083A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Micro-hole precision machining method |
| WO2018049790A1 (en) * | 2016-09-14 | 2018-03-22 | 青岛理工大学 | Multi-angle two-dimensional ultrasonic vibration assisted grinding device of nano-fluid minimum quantity lubrication type |
| CN108693061A (en) * | 2018-05-23 | 2018-10-23 | 天津大学 | A kind of hard brittle material scratch experiment method feeding track based on trochoid |
| CN109849079A (en) * | 2019-04-11 | 2019-06-07 | 北京理工大学 | A kind of ultra-precision processing apparatus of processing micro structure array |
| CN110262397A (en) * | 2019-06-24 | 2019-09-20 | 北京理工大学 | Turn-milling cutting spatially spiral trochoid motion profile and instantaneous Predictive Model of Cutting Force |
| CN110398792A (en) * | 2019-07-22 | 2019-11-01 | 北京理工大学 | A kind of microlens array grinding device and method |
| CN110871370A (en) * | 2019-11-29 | 2020-03-10 | 重庆大学 | Ultrasonic vibration auxiliary abrasive belt grinding equipment |
| CN112647375A (en) * | 2020-09-07 | 2021-04-13 | 湖南大学 | Vibration grinding steel rail grinding method |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
| CN114040831A (en) * | 2019-07-16 | 2022-02-11 | 脸谱科技有限责任公司 | Ultrasonic subaperture polishing of optical elements |
| CN115070517A (en) * | 2022-07-26 | 2022-09-20 | 杭州和昇塑料制品有限公司 | Scraping port processing structure and method for hollow bottle |
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| US20070066191A1 (en) * | 2005-04-11 | 2007-03-22 | Kazumasa Ohnishi | Cutting or grinding machine |
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2011
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070066191A1 (en) * | 2005-04-11 | 2007-03-22 | Kazumasa Ohnishi | Cutting or grinding machine |
Non-Patent Citations (1)
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|---|
| 梁志强等: "垂直于工件平面的二维超声振动辅助磨削单晶硅表面形成机制的试验研究", 《机械工程学报》, vol. 46, no. 19, 5 October 2010 (2010-10-05), pages 171 - 176 * |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
| CN104741979B (en) * | 2015-03-30 | 2017-03-15 | 浙江工业大学 | The small die process equipment of ultrasonic grinding based on dielectrophoresis effect |
| CN104875083A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Micro-hole precision machining method |
| WO2018049790A1 (en) * | 2016-09-14 | 2018-03-22 | 青岛理工大学 | Multi-angle two-dimensional ultrasonic vibration assisted grinding device of nano-fluid minimum quantity lubrication type |
| US10695889B2 (en) | 2016-09-14 | 2020-06-30 | Qingdao Technological University | Multi-angle two-dimensional ultrasonic vibration assisted nanofluid micro-lubrication grinding device |
| CN108693061A (en) * | 2018-05-23 | 2018-10-23 | 天津大学 | A kind of hard brittle material scratch experiment method feeding track based on trochoid |
| CN109849079A (en) * | 2019-04-11 | 2019-06-07 | 北京理工大学 | A kind of ultra-precision processing apparatus of processing micro structure array |
| CN110262397B (en) * | 2019-06-24 | 2020-10-23 | 北京理工大学 | Method for modeling spiral trochoid motion trajectory and instantaneous cutting force in turn-milling machining space |
| CN110262397A (en) * | 2019-06-24 | 2019-09-20 | 北京理工大学 | Turn-milling cutting spatially spiral trochoid motion profile and instantaneous Predictive Model of Cutting Force |
| CN114040831A (en) * | 2019-07-16 | 2022-02-11 | 脸谱科技有限责任公司 | Ultrasonic subaperture polishing of optical elements |
| CN110398792A (en) * | 2019-07-22 | 2019-11-01 | 北京理工大学 | A kind of microlens array grinding device and method |
| CN110871370A (en) * | 2019-11-29 | 2020-03-10 | 重庆大学 | Ultrasonic vibration auxiliary abrasive belt grinding equipment |
| CN112647375A (en) * | 2020-09-07 | 2021-04-13 | 湖南大学 | Vibration grinding steel rail grinding method |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
| CN115070517A (en) * | 2022-07-26 | 2022-09-20 | 杭州和昇塑料制品有限公司 | Scraping port processing structure and method for hollow bottle |
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Application publication date: 20120613 |