CN102490088A - Three-dimensional spiral line grinding method through ultrasonic vibration - Google Patents
Three-dimensional spiral line grinding method through ultrasonic vibration Download PDFInfo
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- CN102490088A CN102490088A CN2011103661727A CN201110366172A CN102490088A CN 102490088 A CN102490088 A CN 102490088A CN 2011103661727 A CN2011103661727 A CN 2011103661727A CN 201110366172 A CN201110366172 A CN 201110366172A CN 102490088 A CN102490088 A CN 102490088A
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000006061 abrasive grain Substances 0.000 claims abstract description 7
- 239000013078 crystal Substances 0.000 claims description 2
- 230000005428 wave function Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 12
- 238000003754 machining Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002245 particle Substances 0.000 description 11
- 229910001651 emery Inorganic materials 0.000 description 8
- 238000005299 abrasion Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
本发明提供一种超声振动三维螺线磨削方法，适用于难加工材料的高效精密加工。在普通磨床上采用超声换能器对工件施加砂轮轴向以及砂轮径向的二维超声振动，工件作椭圆超声振动。由于磨削速度方向是垂直于椭圆超声振动的平面，磨粒相对于工件的切削轨迹为三维空间螺旋线。本发明中，砂轮轴向的超声振动使磨粒在工件表面上的轨迹相互干涉，从而实现了粗糙度的降低；同时砂轮径向的超声振动导致磨粒的最大切削深度增加，磨粒发生断续性切削作用，从而实现磨削力的降低以及材料去除率的提高。该方法可提高加工表面质量，减少表面损伤，提高生产效率，因此适用于难加工材料的高效精密加工。The invention provides an ultrasonic vibration three-dimensional spiral grinding method, which is suitable for high-efficiency and precise machining of difficult-to-machine materials. On ordinary grinding machines, ultrasonic transducers are used to apply two-dimensional ultrasonic vibrations in the axial direction and radial direction of the grinding wheel to the workpiece, and the workpiece undergoes elliptical ultrasonic vibration. Since the direction of the grinding speed is perpendicular to the plane of the elliptical ultrasonic vibration, the cutting trajectory of the abrasive grains relative to the workpiece is a three-dimensional space helix. In the present invention, the ultrasonic vibration in the axial direction of the grinding wheel causes the trajectories of the abrasive grains to interfere with each other on the surface of the workpiece, thereby reducing the roughness; at the same time, the ultrasonic vibration in the radial direction of the grinding wheel causes the maximum cutting depth of the abrasive grains to increase, and the abrasive grains break. Continuous cutting action, so as to achieve the reduction of grinding force and the improvement of material removal rate. The method can improve the quality of the machined surface, reduce surface damage, and improve production efficiency, so it is suitable for efficient and precise machining of difficult-to-machine materials.
Description
Technical field
The present invention relates to the three-dimensional helical method for grinding of a kind of ultrasonic vibration, be applicable to the high-efficiency and precision processing of difficult-to-machine material.
Background technology
Difficult-to-machine materials such as pottery, Semiconductor substrate, Sapphire Substrate, carbide alloy, high-speed steel are increasingly extensive in the application of industrial circles such as aviation, electronics, optics, automobile.Serious affected layer and the face crack of the inevitable generation of traditional grinding produces bigger grinding force and higher grinding temperature in the grinding process, aggravated the wearing and tearing of emery wheel and the damage of finished surface.One side needs finishing in time and changes emery wheel, for removing manufacturing deficiency and improving surface smoothness, needs long follow-up polishing processing on the other hand, has therefore increased processing cost, has reduced working (machining) efficiency.For addressing these problems, ultrasonic vibration is applied in the high efficient grinding of difficult-to-machine material.Using at present comparatively widely, ultrasonic vibration grinding mainly is summed up as two types: a kind of is one dimension axial vibration grinding, i.e. ultrasonic vibration direction be parallel to grinding wheel spindle to or surface of the work, its main feature is to increase substantially surface quality.The axial ultrasonic vibration can produce the near sinusoidal Cutting trajectory, and the grinding sword forever contacts with workpiece, can be used for the manufacturing of high accuracy complicated shape part.A kind of in addition is one dimension radial ultrasonic vibration grinding, i.e. ultrasonic vibration direction along emery wheel radially, its main feature is can significantly reduce grinding force and improve material removing rate, but can cause the increase of abrasion of grinding wheel and the slight increase of surface roughness.The increase of abrasion of grinding wheel is reduced by the abrasive particle ratio of coming off and lower thermal force causes abrasive particle microcosmic wearing and tearing increase.The slight increase of roughness is because under identical materials clearance condition, effectively abrasive grain cutting sword quantity increase and the reducing of surface of the work plastic deformation due to.According to the characteristics of one dimension ultrasonic vibration grinding,, originally researched and proposed the three-dimensional helical method for grinding of a kind of ultrasonic vibration in order to give full play to the processed edge of ultrasonic vibration grinding.
Summary of the invention
The object of the present invention is to provide the three-dimensional helical method for grinding of a kind of ultrasonic vibration, be used to realize the high-efficiency and precision processing of difficult-to-machine material, reduce production costs.
Abrasive particle is removed workpiece material with three dimensions helix mode among the present invention.The cutting speed of abrasive particle and acceleration constantly change along with the variation of abrasive particle space displacement, cause grinding performance to change.Because there is the ultrasonic vibration component of vertical direction in abrasive particle; Cause the continuous cycle of the abrasive grain cutting degree of depth to change and the increase of abrasive particle maximum grinding depth; There is the interrupted cut effect in abrasive particle, and its effective cutting time reduces, simultaneously since the huge acceleration of abrasive particle to the impact and the emollescence effect of workpiece material; Cause grinding force to reduce significantly, thereby can improve working (machining) efficiency.Because there is the ultrasonic vibration component of emery wheel axial direction in abrasive particle, and the Cutting trajectory of different abrasive particles on workpiece interfered each other, impel workpiece surface roughness to reduce on the other hand, surface quality improves.Therefore the three-dimensional helical method for grinding of ultrasonic vibration can reduce grinding force significantly, improves surface quality simultaneously.Therefore this technology has broad application prospects, and can create tangible social value and economic benefit.
The present invention utilizes a kind of elliptical ultrasonic vibration device that workpiece is applied elliptical ultrasonic vibration, and this elliptical vibration plane is perpendicular to the grinding speed direction.The present invention is applied in the efficient precise grinding of sapphire single-crystal, can realize that grinding force reduces 40%, and roughness reduces 30%, and the crackle and the brittle fracture of finished surface significantly reduce, and ductility territory grinding depth significantly increases.At first,, reduced the wearing and tearing of emery wheel, improved the self-sharpening ability of emery wheel, prolonged service life because grinding force reduces significantly.Secondly, because the raising of machined surface quality has reduced the surface damage layer thickness, shortened follow-up polishing process time.
The elliptical ultrasonic vibration device can be easily installed on the general-purpose grinder among the present invention, need not to change grinding machine equipment, so processing cost is lower and simple to operate, can be widely used in the processing of difficult-to-machine material.
Description of drawings
Below in conjunction with accompanying drawing the present invention is elaborated.
Accompanying drawing 1: the three-dimensional helical Principle of Grinding and Cutting of ultrasonic vibration of the present invention sketch map.1 is emery wheel among the figure, and 2 is workpiece.
Accompanying drawing 2: the work sketch map of the three-dimensional helical grinding system of ultrasonic vibration of the present invention.1 is emery wheel among the figure, and 2 is workpiece, and 3 is elliptical ultrasonic vibration, and 4 is anchor clamps, and 5 is workbench, and 6 is bed piece.
The specific embodiment
1. workpiece 2 usefulness paraffin are fixed on the top end face of elliptical ultrasonic vibration 3, after then elliptical ultrasonic vibration oscillator 3 usefulness anchor clamps 4 being clamped, are fixed on the workbench 5 above the bed piece 6.
2. the position of adjustment elliptical ultrasonic vibration 3 guarantees that its elliptical vibration plane is perpendicular to the grinding speed direction.
3. open the wave function generator; Make two identical and dephased ac voltage signals of frequency of its output; After power amplifier amplifies; Be applied on elliptical ultrasonic vibration, the flexible and flexural vibration mode of oscillator is by excitation simultaneously, and this moment, workpiece was along with elliptical ultrasonic vibration 3 is done ultrasonic vibration with elliptical shape.
4. grinding wheel speed V is set
sAnd grinding depth a
p, table feed speed V
wDeng machined parameters, carry out grinding.
5. after machining, workpiece is placed on the electric furnace with ultrasonic vibration, is heated to 100～150 ℃, treat that paraffin melts after, take off workpiece and carry out ultrasonic waves for cleaning, accomplish the processing of workpiece thus.
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103661727A CN102490088A (en) | 2011-11-17 | 2011-11-17 | Three-dimensional spiral line grinding method through ultrasonic vibration |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103661727A CN102490088A (en) | 2011-11-17 | 2011-11-17 | Three-dimensional spiral line grinding method through ultrasonic vibration |
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| CN102490088A true CN102490088A (en) | 2012-06-13 |
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| CN2011103661727A Pending CN102490088A (en) | 2011-11-17 | 2011-11-17 | Three-dimensional spiral line grinding method through ultrasonic vibration |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
| CN104875083A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Micro-hole precision machining method |
| WO2018049790A1 (en) * | 2016-09-14 | 2018-03-22 | 青岛理工大学 | Multi-angle two-dimensional ultrasonic vibration assisted grinding device of nano-fluid minimum quantity lubrication type |
| CN108693061A (en) * | 2018-05-23 | 2018-10-23 | 天津大学 | A kind of hard brittle material scratch experiment method feeding track based on trochoid |
| CN109849079A (en) * | 2019-04-11 | 2019-06-07 | 北京理工大学 | An ultra-precision machining device for machining microstructure arrays |
| CN110262397A (en) * | 2019-06-24 | 2019-09-20 | 北京理工大学 | Turn-milling cutting spatially spiral trochoid motion profile and instantaneous Predictive Model of Cutting Force |
| CN110398792A (en) * | 2019-07-22 | 2019-11-01 | 北京理工大学 | A microlens array grinding device and method |
| CN110871370A (en) * | 2019-11-29 | 2020-03-10 | 重庆大学 | Ultrasonic vibration auxiliary abrasive belt grinding equipment |
| CN112647375A (en) * | 2020-09-07 | 2021-04-13 | 湖南大学 | Vibration grinding steel rail grinding method |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
| CN114040831A (en) * | 2019-07-16 | 2022-02-11 | 脸谱科技有限责任公司 | Ultrasonic subaperture polishing of optical elements |
| CN115070517A (en) * | 2022-07-26 | 2022-09-20 | 杭州和昇塑料制品有限公司 | Scraping port processing structure and method for hollow bottle |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070066191A1 (en) * | 2005-04-11 | 2007-03-22 | Kazumasa Ohnishi | Cutting or grinding machine |
-
2011
- 2011-11-17 CN CN2011103661727A patent/CN102490088A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070066191A1 (en) * | 2005-04-11 | 2007-03-22 | Kazumasa Ohnishi | Cutting or grinding machine |
Non-Patent Citations (1)
| Title |
|---|
| 梁志强等: "垂直于工件平面的二维超声振动辅助磨削单晶硅表面形成机制的试验研究", 《机械工程学报》, vol. 46, no. 19, 5 October 2010 (2010-10-05), pages 171 - 176 * |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN104741979A (en) * | 2015-03-30 | 2015-07-01 | 浙江工业大学 | Ultrasonic grinding tiny female die machining equipment based on dielectrophoresis effect |
| CN104741979B (en) * | 2015-03-30 | 2017-03-15 | 浙江工业大学 | The small die process equipment of ultrasonic grinding based on dielectrophoresis effect |
| CN104875083A (en) * | 2015-06-03 | 2015-09-02 | 浙江工业大学 | Micro-hole precision machining method |
| WO2018049790A1 (en) * | 2016-09-14 | 2018-03-22 | 青岛理工大学 | Multi-angle two-dimensional ultrasonic vibration assisted grinding device of nano-fluid minimum quantity lubrication type |
| US10695889B2 (en) | 2016-09-14 | 2020-06-30 | Qingdao Technological University | Multi-angle two-dimensional ultrasonic vibration assisted nanofluid micro-lubrication grinding device |
| CN108693061A (en) * | 2018-05-23 | 2018-10-23 | 天津大学 | A kind of hard brittle material scratch experiment method feeding track based on trochoid |
| CN109849079A (en) * | 2019-04-11 | 2019-06-07 | 北京理工大学 | An ultra-precision machining device for machining microstructure arrays |
| CN110262397B (en) * | 2019-06-24 | 2020-10-23 | 北京理工大学 | Method for modeling spiral trochoid motion trajectory and instantaneous cutting force in turn-milling machining space |
| CN110262397A (en) * | 2019-06-24 | 2019-09-20 | 北京理工大学 | Turn-milling cutting spatially spiral trochoid motion profile and instantaneous Predictive Model of Cutting Force |
| CN114040831A (en) * | 2019-07-16 | 2022-02-11 | 脸谱科技有限责任公司 | Ultrasonic subaperture polishing of optical elements |
| CN110398792A (en) * | 2019-07-22 | 2019-11-01 | 北京理工大学 | A microlens array grinding device and method |
| CN110871370A (en) * | 2019-11-29 | 2020-03-10 | 重庆大学 | Ultrasonic vibration auxiliary abrasive belt grinding equipment |
| CN112647375A (en) * | 2020-09-07 | 2021-04-13 | 湖南大学 | Vibration grinding steel rail grinding method |
| CN112658818A (en) * | 2020-12-19 | 2021-04-16 | 华中科技大学 | Ultrasonic vibration auxiliary grinding device for ultra-precision machining of wafer |
| CN115070517A (en) * | 2022-07-26 | 2022-09-20 | 杭州和昇塑料制品有限公司 | Scraping port processing structure and method for hollow bottle |
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Application publication date: 20120613 |