CN110398792A - A kind of microlens array grinding device and method - Google Patents
A kind of microlens array grinding device and method Download PDFInfo
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- CN110398792A CN110398792A CN201910659557.9A CN201910659557A CN110398792A CN 110398792 A CN110398792 A CN 110398792A CN 201910659557 A CN201910659557 A CN 201910659557A CN 110398792 A CN110398792 A CN 110398792A
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- microlens array
- grinding
- lifting device
- grinding head
- working table
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The present invention discloses a kind of microlens array grinding device and method, it is related to grinding technique field, translating device is slidably mounted on pedestal in microlens array grinding device, lifting device is slidably mounted on translating device, elastic globe body working table is fixedly installed on lifting device, the lifting direction of lifting device, the glide direction of translating device and the glide direction three of lifting device are mutually perpendicular to, support device is fixedly connected with pedestal, grinding head is fixed in support device, and the face machined flat of grinding head is opposite with workpiece to be processed, power device is connect with grinding head, vibration generating arrangement is fixedly connected with elastic globe body working table, when being ground using the microlens array grinding device, vibration generating arrangement, which applies elastic globe body working table, to be vibrated, keep microlens array high in machining efficiency, and pass through lifting device and translating device essence The position of quasi- adjustment workpiece to be processed and working depth, microlens array processing consistency is good, and machining accuracy is high.
Description
Technical field
The present invention relates to grinding technique fields, more particularly to a kind of microlens array grinding device and method.
Background technique
Currently, the processing method of lenticule mainly has grinding, milling, molding, injection molding, ball grinding etc..Grinding is logical
Cross the abrasive grain removal excess stock of a large amount of high-speed motions；Milling Process removes excess stock by cutting edge；Ball grinding passes through
The movement of ball drives free abrasive material movement removal excess stock；Injection molding and molding melt filling using material in a mold
To form lenticule.Above-mentioned lenticule processing method is only applicable to the processing of single lenticule, when progress microlens array processing
When, it can not ensure the consistency between lenticule, consistency is poor between each lenticule, and machining accuracy is low, and time-consuming for processing,
Processing efficiency is low.
Therefore, how a kind of machining accuracy and microlens array grinding device high in machining efficiency are provided and method is current
Urgent problem to be solved.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of microlens array grinding device and method, makes lenticule battle array
Column machining accuracy and high in machining efficiency.
To achieve the above object, the present invention provides following schemes:
The present invention provides a kind of microlens array grinding device, including pedestal, translating device, lifting device, vibration generation
Device, support device, grinding head, power device and the elastic globe body working table for being used to support workpiece to be processed, the translation dress
It sets and is slidably mounted on the pedestal, the lifting device is slidably mounted on the translating device, the elasticity
Globe body working table is fixedly installed on the lifting device, the sliding side for going up and down direction, the translating device of the lifting device
To and the glide direction three of the lifting device be mutually perpendicular to, the support device is fixedly connected with the pedestal, described to grind
Bistrique is fixed in the support device, and the face machined flat of the grinding head is opposite with the workpiece to be processed, the power
Device is connect to drive the grinding head to rotate with the grinding head, and the vibration generating arrangement and the elastic globe body working table are solid
Fixed connection is to drive the elastic globe body working table to vibrate.
Preferably, the vibration generating arrangement includes power supply, the first wave function generator, the second wave function generator,
One power amplifier, the second power amplifier, the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, first piezoelectric ceramic piece
It is fixedly connected with the elastic globe body working table with second piezoelectric ceramic piece, the power supply, first wave function occur
Device, first power amplifier and first piezoelectric ceramic piece are sequentially connected electrically, the power supply, second wave function
Generator, second power amplifier and second piezoelectric ceramic piece are sequentially connected electrically.
Preferably, the first sliding rail is provided on the pedestal, it is sliding that the translating device is slidably mounted on described first
On rail, the second sliding rail is provided on the translating device, the lifting device is slidably mounted on second sliding rail, institute
The first sliding rail is stated to be mutually perpendicular to second sliding rail.
Preferably, the elastic globe body working table is metallic elastic globe body working table.
Preferably, the lifting device is lifting platform.
Preferably, the power device is motor.
Preferably, the support device includes cross bar and vertical bar, the one end of one end of the cross bar perpendicular to the vertical bar
And be fixedly connected with the vertical bar, the other end of the cross bar is fixedly connected with the grinding head, and the other end of the vertical bar hangs down
Directly it is fixedly connected in the pedestal and with the pedestal.
The present invention also provides a kind of microlens array grinding method preferably, uses the microlens array grinding device
Grind microlens array the following steps are included:
Step 1 prepares the grinding head according to the microlens shape to be ground, makes the grinding of the grinding head
End face is identical as the shape of the lenticule；
The workpiece to be processed is fixed on the elastic globe body working table by step 2, and translate the translating device and
The lifting device keeps the workpiece to be processed opposite with the face machined flat of the grinding head；
Step 3 adds grounds travel, starts the power device and the vibration generating arrangement, pass through the lifting device
Adjusting the distance between the workpiece to be processed and the grinding head can be completed the processing of a lenticule；
Step 4, the single lenticule adjust the workpiece to be processed extremely after processing is completed, by the lifting device
Elemental height, and the abrasion site of the translating device and the lifting device to next lenticule is translated, repeat institute
Stating step 3 can be completed the processing of next lenticule；
The processing of microlens array can be completed in step 5, repeating said steps four.
Preferably, the grounds travel is diamond lap powder, and the granular size of the grounds travel is 1-5 μm.
The present invention achieves following technical effect compared with the existing technology:
Microlens array grinding device and grinding method provided by the invention, in microlens array process, vibration hair
Generating apparatus, which applies elastic globe body working table, to be vibrated, and keeps microlens array high in machining efficiency, and elastic globe body working table be used to support to
Workpieces processing, translating device are slidably mounted on pedestal, and lifting device is slidably mounted on translating device, elastomer
Workbench is fixedly installed on lifting device, is precisely adjusted the position of workpiece to be processed by lifting device and translating device and is added
Work depth has ensured the machining accuracy of microlens array.
Detailed description of the invention
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the structural schematic diagram of the microlens array grinding device provided in the embodiment of the present invention；
Fig. 2 is the partial structure diagram of the microlens array grinding device provided in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the microlens array provided in the embodiment of the present invention.
Description of symbols: 1, pedestal；2, translating device；3, lifting device；4, elastic globe body working table；5, work to be processed
Part；6, grinding head；601, face machined flat；7, cross bar；8, vertical bar；9, the first piezoelectric ceramic piece；10, the second piezoelectric ceramic piece；11,
Power device；12, shaft coupling；13, lenticule.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The object of the present invention is to provide a kind of microlens array machining accuracy and microlens array grindings high in machining efficiency
Device and method.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Embodiment one:
The present invention provides a kind of microlens array grinding device, as shown in Figure 1, including pedestal 1, translating device 2, lifting dress
Set 3, vibration generating arrangement, support device, grinding head 6, power device 11 and the elastomer work for being used to support workpiece to be processed 5
Make platform 4, translating device 2 is slidably mounted on pedestal 1, and lifting device 3 is slidably mounted on translating device 2, elasticity
Globe body working table 4 is fixedly installed on lifting device 3, the glide direction and lifting for going up and down direction, translating device 2 of lifting device 3
The glide direction three of device 3 is mutually perpendicular to, and support device is fixedly connected with pedestal 1, and grinding head 6 is fixed in support device,
And the face machined flat 601 of grinding head 6 and workpiece to be processed 5 are opposite, power device 11 is connect to drive grinding head 6 with grinding head 6
Rotation, vibration generating arrangement are fixedly connected to drive elastic globe body working table 4 to vibrate with elastic globe body working table 4, are occurred by vibration
Device, which applies elastic working platform, to be vibrated, and microlens array is high in machining efficiency, is precisely adjusted by lifting device 3 and translating device 2
The position of whole workpiece to be processed 5 and working depth, microlens array processing consistency is good, and machining accuracy is high.
In a specific embodiment of the invention, vibration generating arrangement includes power supply, the first wave function generator, the second wave letter
Number generator, the first power amplifier, the second power amplifier, the first piezoelectric ceramic piece 9 and the second piezoelectric ceramic piece 10, it is optional
, the first piezoelectric ceramic piece 9 and the second piezoelectric ceramic piece 10 are PZT piezoelectric ceramics, the first piezoelectric ceramic piece 9 and the second piezoelectricity
Potsherd 10 is fixedly connected with elastic globe body working table 4, power supply, the first wave function generator, the first power amplifier and
One piezoelectric ceramic piece 9 is sequentially connected electrically, power supply, the second wave function generator, the second power amplifier and the second piezoelectric ceramics
Piece 10 is sequentially connected electrically, and the first wave function generator exports first wave, the second wave producer output the in the specific use process
Two waves, first wave and the second wave-amplitude and frequency are identical, but phase difference is 90 degree, and the direction of propagation of first wave and the second wave
The direction of propagation is perpendicular with the lifting direction of lifting device 3, as shown in Fig. 2, the direction of propagation of first wave is in X direction, second
The direction of propagation of wave is along Y-direction, and the lifting direction of lifting device 3 is along Z-direction, and the first amplitude for involving the second wave is respectively less than 1 μ
M, frequency control generate ultrasonic vibration in 21kHz, the first piezoelectric ceramic piece 9 and the second piezoelectric ceramic piece 10, and then with dynamic elasticity
The two-dimentional circular vibration of workpiece to be processed 5 can be realized with two-dimentional mode ultrasonic vibration in globe body working table 4.
In another specific embodiment of the present invention, the first sliding rail is provided on pedestal 1, translating device 2 is slidably mounted
In on the first sliding rail, being provided with the second sliding rail on translating device 2, lifting device 3 is slidably mounted on the second sliding rail, and first
Sliding rail is mutually perpendicular to the second sliding rail, by the first sliding rail of setting and the second sliding rail, can steadily adjust the position of workpiece to be processed 5
It sets.
In another specific embodiment of the present invention, elastic globe body working table 4 is metallic elastic globe body working table, and optionally, gold
Belonging to elastic globe body working table 4 is SUS304 elasticity globe body working table.
In another specific embodiment of the present invention, lifting device 3 is lifting platform, it should be noted that lifting device 3 is not
It is only limitted to lifting platform, it is any to can be realized accurate lifting, and the structure of elastic globe body working table 4 can be supported.
In another specific embodiment of the present invention, power device 11 is motor, and the revolving speed of motor is in 10-500rpm, motor
Output end connect with grinding head 6 by shaft coupling 12.
In another specific embodiment of the present invention, as shown in Figure 1, support device includes cross bar 7 and vertical bar 8, the one of cross bar 7
Hold perpendicular to vertical bar 8 one end and be fixedly connected with vertical bar 8, the other end of cross bar 7 is fixedly connected with grinding head 6, vertical bar 8 it is another
One end is fixedly connected perpendicular to pedestal 1 and with pedestal 1.
As shown in Figure 1-3, using microlens array grinding device grind microlens array the following steps are included:
Step 1 prepares grinding head 6 according to 13 shape of lenticule to be ground, make the face machined flat 601 of grinding head 6 with
The shape of lenticule 13 is identical, and preferably, and the roughness of face machined flat 601 is controlled in 0.5um or less；
Workpiece to be processed 5 is fixed on elastic globe body working table 4, and translates translating device 2 and lifting device 3 by step 2,
Keep the face machined flat 601 of workpiece to be processed 5 and grinding head 6 opposite；
Step 3 adds grounds travel, and optionally, grounds travel is diamond lap powder, and the granular size of grounds travel is 1-5
μm, start power device 11 and vibration generating arrangement, by lifting device 3 adjust between workpiece to be processed 5 and grinding head 6 away from
From the processing that a lenticule 13 can be completed, and by lifting device 3 adjust between workpiece to be processed 5 and grinding head 6 away from
From adjustment grinding depth and then the size of control lenticule 13；
Step 4, single lenticule 13 adjust workpiece to be processed 5 to elemental height after processing is completed, by lifting device 3,
And the abrasion site of translating device 2 and lifting device 3 to next lenticule 13 is translated, repetition step 3 can be completed next
The processing of lenticule 13；
Step 5, repeating step 4 can be completed the processing of microlens array.
Microlens array grinding device provided by the invention and method by using two dimensional ultrasonic vibration assisted milling side
Method greatly improves the grinding efficiency of microlens array, by accurately controlling position and the grinding depth of grinding head 6, ensure that
The consistency of lenticule 13 in microlens array, and the curvilinear equation by changing grinding head 6, prepare different grinding heads 6, can
Meet the process requirements of different microlens arrays.
Apply that a specific example illustrates the principle and implementation of the invention in this specification, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range.In conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (9)
1. a kind of microlens array grinding device, which is characterized in that filled including pedestal, translating device, lifting device, vibration
It sets, support device, grinding head, power device and the elastic globe body working table for being used to support workpiece to be processed, the translating device
It is slidably mounted on the pedestal, the lifting device is slidably mounted on the translating device, the elastomer
Workbench is fixedly installed on the lifting device, the glide direction for going up and down direction, the translating device of the lifting device
And the glide direction three of the lifting device is mutually perpendicular to, the support device is fixedly connected with the pedestal, the grinding
Head is fixed in the support device, and the face machined flat of the grinding head is opposite with the workpiece to be processed, the power dress
It sets and is connect with the grinding head to drive the grinding head to rotate, the vibration generating arrangement is fixed with the elastic globe body working table
Connection is to drive the elastic globe body working table to vibrate.
2. microlens array grinding device according to claim 1, which is characterized in that the vibration generating arrangement includes electricity
Source, the first wave function generator, the second wave function generator, the first power amplifier, the second power amplifier, the first piezoelectricity pottery
Tile and the second piezoelectric ceramic piece, first piezoelectric ceramic piece and second piezoelectric ceramic piece with the elastic body running
Platform is fixedly connected, the power supply, first wave function generator, first power amplifier and first piezoelectricity pottery
Tile is sequentially connected electrically, the power supply, second wave function generator, second power amplifier and second pressure
Electroceramics piece is sequentially connected electrically.
3. microlens array grinding device according to claim 1, which is characterized in that it is sliding to be provided with first on the pedestal
Rail, the translating device are slidably mounted on first sliding rail, and the second sliding rail is provided on the translating device, described
Lifting device is slidably mounted on second sliding rail, and first sliding rail is mutually perpendicular to second sliding rail.
4. microlens array grinding device according to claim 1, which is characterized in that the elasticity globe body working table is metal
Elastic globe body working table.
5. microlens array grinding device according to claim 1, which is characterized in that the lifting device is lifting platform.
6. microlens array grinding device according to claim 1, which is characterized in that the power device is motor.
7. microlens array grinding device according to claim 1, which is characterized in that the support device include cross bar and
Vertical bar, one end of the cross bar perpendicular to the vertical bar one end and be fixedly connected with the vertical bar, the other end of the cross bar
It is fixedly connected with the grinding head, the other end of the vertical bar is fixedly connected perpendicular to the pedestal and with the pedestal.
8. a kind of microlens array grinding method, which is characterized in that using such as the described in any item lenticule battle arrays of claim 1-7
Column grinding device grind microlens array the following steps are included:
Step 1 prepares the grinding head according to the microlens shape to be ground, makes the face machined flat of the grinding head
It is identical as the shape of the lenticule；
The workpiece to be processed is fixed on the elastic globe body working table by step 2, and translates the translating device and described
Lifting device keeps the workpiece to be processed opposite with the face machined flat of the grinding head；
Step 3 adds grounds travel, starts the power device and the vibration generating arrangement, adjusted by the lifting device
The processing of a lenticule can be completed in the distance between the workpiece to be processed and the grinding head；
Step 4, the single lenticule adjust the workpiece to be processed to initial after processing is completed, by the lifting device
Highly, and the abrasion site of the translating device and the lifting device to next lenticule is translated, repeats the step
Rapid three can be completed the processing of next lenticule；
The processing of microlens array can be completed in step 5, repeating said steps four.
9. microlens array grinding method according to claim 8, which is characterized in that the grounds travel is diamond lap
Powder, and the granular size of the grounds travel is 1-5 μm.
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| CN201910659557.9A CN110398792A (en) | 2019-07-22 | 2019-07-22 | A kind of microlens array grinding device and method |
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| CN201910659557.9A CN110398792A (en) | 2019-07-22 | 2019-07-22 | A kind of microlens array grinding device and method |
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Application publication date: 20191101 |