CN1497282A - Lenticular array and manufacturing method thereof - Google Patents

Lenticular array and manufacturing method thereof Download PDF

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Publication number
CN1497282A
CN1497282A CNA2003101045707A CN200310104570A CN1497282A CN 1497282 A CN1497282 A CN 1497282A CN A2003101045707 A CNA2003101045707 A CN A2003101045707A CN 200310104570 A CN200310104570 A CN 200310104570A CN 1497282 A CN1497282 A CN 1497282A
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China
Prior art keywords
hole
substrate
pin insertion
lens
insertion holes
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CNA2003101045707A
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Chinese (zh)
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中朊舨
中嶋敏博
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Yamaha Corp
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Yamaha Corp
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Abstract

A micro lens array has a quartz substrate and a coupling plate made of plated metal and mounted on the substrate. On one principal surface of the substrate, lenses and fitting pins made of plated metal are formed. The coupling plate has a transparent window which allows light from the lenses to pass therethrough and guide pin insertion holes gradually increasing the size from one principal surface toward the other principal surface. A taper of an opening end of each guide pin insertion hole defined by a plated layer can be formed by forming a plating seed layer and a plating area defining pillar on the substrate, with the plating seed layer being spaced apart from the pillar by a predetermined distance.

Description

Microlens array and manufacture method thereof
Technical field
The present invention relates to a kind of being suitable for and microlens array such as the coupling of the optics of fiber array, and the manufacture method of this microlens array.
Background technology
Known conventional microlens shown in Figure 102.For example, with reference to the open No.9-90162 of Japanese patent unexamined (laid-open).Figure 99 represents the manufacture method of microlens array to Figure 101.
In the step shown in Figure 99, be on the first type surface of silicon substrate 3 of 500 μ m at thickness, forming thickness is the quartz glass layer 4 of 50 μ m, forms resist layer 5a corresponding to required lens pattern then to 5c on quartz glass layer 4, and forms protruding spherical shape by photoetching and thermal treatment.
In the step shown in Figure 100, by active-ion-etch (RIE) etching resist layer 5a to 5c and quartz glass layer 4, resist layer 5a is transferred to the upper surface layer of quartz glass layer 4 to the corrosion-resisting pattern of 5c, forms with resist layer 5a to the corresponding convex lens 4a of 5c to 4c.The diameter of each convex lens can be 60 μ m.Then, on another first type surface of substrate 3, have the resist layer 6 of hole 6a to 6c by photoetching formation, hole 6a is used to form contact hole to 6c.
In the step shown in Figure 101, use resist layer 6 as mask, by dry ecthing in silicon substrate 3, forms face convex lens 4a to the contact hole 3a of 4c to 3c.The degree of depth of each contact hole can be 500 μ m, and diameter is 125 μ m (corresponding with the diameter of optical fiber).
Figure 102 represents to insert the optical fiber 7 among the contact hole 3a of microlens array shown in Figure 101.Because the degree of depth of contact hole 3a is the twice of contact hole 3a diameter or more times, optical fiber 7 can be installed among the contact hole 3a reliably.The central shaft of convex lens 4a overlaps with the central shaft of contact hole 3a, and the focal length of convex lens 4a equates to the distance between the contact hole 3a bottom surface with the summit of convex lens 4a.Thereby, if optical fiber 7 inserts among the contact hole 3a, the front end of optical fiber 7 is contacted with the bottom surface of contact hole 3a, the focus of convex lens 4a is overlapped with the mid point of optical fiber front end.
According to above-mentioned prior art, in the step shown in Figure 100 and 101, in fact be difficult to form contact hole 3a, make central shaft and the focal length coupling of convex lens 4a.In order will suitably to collimate from the light of optical fiber 7 at convex lens 4a place, must be by light being incided the position of regulating optical fiber in this optical fiber at every turn when every optical fiber being inserted contact hole.This is a kind of consuming time and hard work.
Owing to the synthetic substrate that has quartz glass layer 4 by processing, made by silicon substrate 3 forms the microlens array with optical fiber contact hole, so can not quartz glass layer 4 be formed with convex lens 4a and on the surperficial facing surfaces of 4c, form convex lens, perhaps can not be to the described apparent surface grinding of tilting.In other words, in order to form lenticular lens type microlens array, or have the microlens array of the lapped face that is used for the inhibitory reflex return light may, must use two surfaces of quartz glass layer 4.Thus, can not use silicon substrate 3 to form the optical fiber contact hole, and can not be coupled with fiber array.
Summary of the invention
One object of the present invention is to provide a kind of novel microlens array and manufacture method thereof, can be easy to and accurately microlens array is coupled to the optical devices such as fiber array.
According to one aspect of the invention, a kind of microlens array is provided, described microlens array comprises: one has the transparency carrier of a plurality of lens and a plurality of metal rigging pilotages, and lens and rigging pilotage are respectively formed on the first type surface of described substrate; With a coupling plate that is made of metal, described coupling plate has the lamination area that is layered on the described first type surface and extends continuously from described lamination area, be not layered in the non-lamination area on the described first type surface, described lamination area have one with the corresponding transparent window of described a plurality of lens and with the corresponding a plurality of pilot holes of described a plurality of rigging pilotages, described non-lamination area has a plurality of guide pin insertion holes, and by described a plurality of rigging pilotages are installed in described a plurality of pilot hole, become described lamination area and be layered in state on the described first type surface, and this coupling plate is installed on the substrate.
According to this microlens array of the present invention, be easy on a first type surface of transparency carrier, form a plurality of lens and metal rigging pilotage by a film formation process with degree of precision.Be easy to form coupling plate by a film formation process with a plurality of pilot holes and guide pin insertion holes with degree of precision.Can improve the assembly precision of the relative pilot hole of rigging pilotage, and improve the assembly precision of the relative guide pin insertion holes of pilot pin.By inserting in the guide pin insertion holes of microlens array of the present invention, be easy to realize coupling between optical devices and the microlens array with degree of precision such as a plurality of pilot pins of the fiber device of fiber array.
In microlens array of the present invention, towards the first type surface direction of coupling plate in substrate one side, the size of pilot hole and/or guide pin insertion holes increases gradually.This size Expressing diameter, side length etc.Thereby be easy to rigging pilotage is inserted in the pilot hole, perhaps pilot pin inserted in the guide pin insertion holes.Can when guaranteeing accurately assembling, form pilot hole and/or guide pin insertion holes as far as possible little.
According to a further aspect of the invention, a kind of fabricating method of microlens array is provided, described method comprises step: prepare a transparency carrier and a coupling plate, this transparency carrier has a plurality of rigging pilotages that a plurality of lens and plated metal are made, and lens and rigging pilotage are respectively formed on the first type surface of this substrate; With the coupling plate of making by plated metal, described coupling plate has the lamination area that is layered on the described first type surface and extends continuously and be not layered in non-lamination area on the described first type surface from described lamination area, described lamination area have one with the corresponding transparent window of described a plurality of lens and with the corresponding a plurality of pilot holes of described a plurality of rigging pilotages, described non-lamination area has a plurality of guide pin insertion holes; And, become described lamination area and be layered in state on the described first type surface, and this coupling plate is installed on the described substrate by described a plurality of rigging pilotages are installed in described a plurality of pilot hole.
According to this fabricating method of microlens array of the present invention, form step by a film that comprises electroplating process etc. and can form microlens array with degree of precision at an easy rate.
As mentioned above, the lens with substrate of a plurality of metal rigging pilotages form surface and metal coupling plate, have with described substrate on the corresponding optical transmission window of lens, with corresponding pilot hole of rigging pilotage and guide pin insertion holes.Rigging pilotage is installed in the pilot hole,, forms microlens array so that coupling plate is installed on the substrate.Thereby,, be easy to realize coupling between optical devices and the microlens array with degree of precision by inserting in the guide pin insertion holes of microlens arrays such as a plurality of pilot pins of the optical devices of fiber array.Form step by a film that comprises electroplating process etc., be easy to form microlens array of the present invention with degree of precision.
According to another aspect of the invention, a kind of microlens array is provided, described microlens array comprises: a transparency carrier is formed with a plurality of lens on a first type surface of described substrate; With a coupling plate that is made of metal, described coupling plate has the lamination area that is layered on the described first type surface and extends continuously and be not layered in non-lamination area on the described first type surface from described lamination area, this lamination area have one with the corresponding transparent window of described a plurality of lens, this non-lamination area has a plurality of guide pin insertion holes.
According to this microlens array, can form step by a film and on a first type surface of transparency carrier, form a plurality of lens with degree of precision at an easy rate.Can form step by a film that comprises electroplating process and form coupling plate with degree of precision at an easy rate with optical transmission window and a plurality of guide pin insertion holes.Can improve the positional precision of the relative lens of guide pin insertion holes, and improve the assembly precision of the relative guide pin insertion holes of pilot pin.Therefore, by being inserted in the pilot pin insertion groove (or hole) of a plurality of pilot pins insertions in the microlens array guide pin insertion holes, be easy to the coupling between degree of precision realization optical devices and the microlens array such as the optical devices of fiber array.
In this microlens array, can form a plurality of guide pin insertion holes, thereby towards the first type surface direction of the relative side with substrate of coupling plate increased in size gradually.Described size Expressing diameter, side length etc.Be easy to pilot pin is inserted in the guide pin insertion holes.Guaranteeing accurately can to form guide pin insertion holes as far as possible little in the assembling.
In this microlens array, can a plurality of lens be arranged to delegation by a kind of like this mode, the line that promptly connects a plurality of lens centers is the straight line on the described first type surface, another first type surface of this substrate is formed the inclined-plane, be used to guide the light that is incident on described a plurality of lens, and reflex to the direction different with the array direction of described a plurality of lens from this; And can form a plurality of guide pin insertion holes in the lens arra both sides that comprise a plurality of lens, the center of described a plurality of guide pin insertion holes is set to depart from a certain amount of position of described straight line, the amount of each lens center of optical axis deviation that described amount causes corresponding to the inclined-plane.In this structure,,, be easy to set up light path along the lens center with the optical axis alignment of described optical devices by being inserted into simply in the pilot pin insertion groove (or hole) of pilot pin insertion in the microlens array guide pin insertion holes such as the optical devices of optical fiber.
According to a further aspect of the present invention, provide a kind of manufacture method of microlens array, described method comprises step: prepare a transparency carrier, be formed with a plurality of lens on the first type surface of this substrate; Form on a described first type surface of this substrate and electroplate kind of a film, this electroplates kind of film around described a plurality of lens; On described plating kind film, form metal coupling plate by select electroplating, this coupling plate have one with the corresponding transparent window of described a plurality of lens and a plurality of guide pin insertion holes; And remove the substrate that is layered on described a plurality of guide pin insertion holes, thereby described a plurality of guide pin insertion holes is opened wide in substrate one side.
According to this fabricating method of microlens array, can comprise that a film of electroplating process etc. forms step, forms microlens array with degree of precision at an easy rate by use.
According to a further aspect of the invention, provide a kind of microlens array, described microlens array comprises: a transparency carrier is formed with a plurality of lens on a first type surface of described substrate; With a setting element that is connected, has a plurality of guide pin insertion holes with described substrate.
According to this microlens array, can on described transparency carrier and by described transparency carrier, form lens and guide pin insertion holes with degree of precision at an easy rate by using a film to form step.Can improve the positional precision of the relative lens of guide pin insertion holes, and improve the assembly precision of the relative guide pin insertion holes of pilot pin.Therefore, by being inserted in the pilot pin insertion groove (or hole) of a plurality of pilot pins insertions in the microlens array guide pin insertion holes such as the optical devices of fiber array, can be at an easy rate with the coupling between degree of precision realization optical devices and the microlens array.
In this microlens array, described a plurality of guide pin insertion holes can be formed towards first type surface direction of substrate increased in size gradually.Equally, pilot pin is easy to insert in the guide pin insertion holes, and guarantees the accurate assembling of the relative guide pin insertion holes of pilot pin.
In this microlens array, can a plurality of lens be arranged to delegation by a kind of like this mode, the line that promptly connects a plurality of lens centers is the straight line on the described first type surface; Another first type surface of this substrate can form the inclined-plane, is used to guide the light that is incident on described a plurality of lens, and reflexes to the different direction of array direction of described a plurality of lens at this place; And can form described a plurality of guide pin insertion holes in the lens arra both sides that comprise a plurality of lens, the center of described a plurality of guide pin insertion holes is arranged on departs from a certain amount of position of described straight line, the amount of each lens center of optical axis deviation that described amount causes corresponding to the inclined-plane.Equally, utilize to insert the pilot pin in the guide pin insertion holes, be easy to set up suitable light path along the lens center.
According to another aspect of the invention, a kind of manufacture method of microlens array is provided, described method comprises step: prepare a transparency carrier, have a plurality of lens on a first type surface of this substrate; By forming a plurality of grooves on the described first type surface of selecting to be etched in substrate; And grind another first type surface of the B.B.P of a plurality of grooves, described a plurality of grooves are become a plurality of guide pin insertion holes.
According to this fabricating method of microlens array, comprise by use and to select a film of etching process etc. to form step, be easy to form microlens array with degree of precision.
Described fabricating method of microlens array also is included in and forms after described a plurality of grooves, before grinding another first type surface of this substrate, by selecting etching, make each opening in described a plurality of groove on top the step of increased in size gradually.The guide groove patchhole on a first type surface of described substrate on top increased in size gradually.
As mentioned above, the described coupling plate that is formed with the substrate of a plurality of lens and has with the corresponding optical transmission window of described lens and a plurality of guide pin insertion holes on a first type surface is bonded together, form microlens array.Therefore, by inserting in the pilot pin insertion groove (or hole) of a plurality of pilot pins insertions in a plurality of guide pin insertion holes of microlens array, be easy to the coupling between degree of precision realization optical devices and the lens arra such as the optical devices of fiber array.Be easy to form step and form microlens array accurately by a film that comprises electroplating process etc.
Have described transparency carrier, and on an one first type surface, be formed with in the microlens array of a plurality of lens, forming a plurality of guide pin insertion holes by described substrate.Therefore, by being inserted in the pilot pin insertion groove (or hole) of a plurality of pilot pins insertions in the microlens array guide pin insertion holes, be easy to the coupling between degree of precision realization optical devices and the microlens array such as the optical devices of fiber array.Be easy to form step and form microlens array accurately by a film that comprises electroplating process etc.
Another object of the present invention is to provide a kind of device, can prevent that pilot pin from causing splitting when inserting or extracting described guide pin insertion holes with guide pin insertion holes.
According to a further aspect of the invention, provide a kind of device with guide pin insertion holes, comprising: one by the nonmetal substrate of making and having the through hole of the guide pin insertion holes of being used to form; With one cover each through-hole wall and have the metal level of size less than the guide pin insertion holes of hole size.
According to this device with guide pin insertion holes, the described metal level of the inwall of the through hole that the non-metal base plate of being made by for example quartz by covering forms limits guide pin insertion holes.Therefore, when pilot pin inserts or extracts guide pin insertion holes, pilot pin and metal layer contacting.Even substrate is made by quartz etc., can prevent that also pilot pin from inserting or splitting takes place when extracting guide pin insertion holes.
In described device with guide pin insertion holes, can be arranged on two first type surfaces of substrate on one of them with having the sheet metal of size less than the pin insertion hole of hole size, this sheet metal covers the fringe region of an openend of through hole, and the position of pin insertion hole and through-hole alignment, and can form metal level continuously from this sheet metal, and cover the fringe region of the above another openend of through hole of another first type surface of this substrate.Thereby this metal level engages by the fringe region of an openend of sheet metal and through hole of a first type surface of this substrate, engages with the fringe region of this another openend of through hole by a part of metal level on another first type surface of this substrate.Thereby metal level is fixed firmly to substrate, and metal level breaks away from described substrate when preventing the pilot pin insertion or extracting in the guide pin insertion holes.
In described device with guide pin insertion holes, can form described metal level, cover the fringe region of via openings end on two first type surfaces of this substrate.This metal level can engage with the fringe region of via openings end on two first type surfaces of substrate, thus prevent that pilot pin from inserting or when extracting guide pin insertion holes metal level break away from described substrate.
According to a further aspect of the present invention, provide a kind of manufacture method with device of guide pin insertion holes, described method comprises: preparation is by the nonmetal substrate of making and having the through hole of the guide pin insertion holes of being used to form; The pin insertion hole size is arranged on two first type surfaces of described substrate on one of them less than the sheet metal of clear size of opening, this sheet metal covers the fringe region of an openend of described through hole, and the position of described pin insertion hole and described through-hole alignment, and setting forms pin by nonmetal hole of making, by a kind of like this mode the hole is set and forms pin, make that the hole forms pin by through hole another extension in two first type surfaces of substrate when the hole forms the pin insertion hole of pin insertion sheet metal; Use described sheet metal to carry out a metal plating process, form the metal level of making and cover each through-hole wall by plated metal, plated metal is set in the above described manner, and formation pin in hole is set in the above described manner as plating kind of a layer; And remove hole formation from the pin insertion hole of sheet metal and metal level and sell, described metal level forms has size and the big or small metal level of guide pin insertion holes accordingly of hole formation pin.
According to described manufacture method with device of guide pin insertion holes, on a first type surface of described substrate, the sheet metal with pin insertion hole covers the fringe region of an openend of through hole, and described pin insertion hole is suitably aimed at pin insertion hole.Nonmetal hole is formed in the pin insertion hole of pin insertion sheet metal, and stretch out by this through hole another first type surface from described substrate.In this state,, carry out the metal plating process, in through hole, form metal level with guide pin insertion holes by using this sheet metal as electroplating kind of a plate.Size and position that the guide pin insertion holes relative opening forms pin can have degree of precision.
In the manufacture method of described device with guide pin insertion holes, the pin insertion hole of the sheet metal that uses in the sheet metal step is set, towards sheet metal and through hole one side facing surfaces the time, size can increase gradually.Be installed in the pin insertion hole of sheet metal owing to be easy to that the hole is formed pin, and realize accurately assembling, can further improve the precision of guide pin insertion holes.By with sheet metal as the pilot pin guide hole, can insert pilot pin at an easy rate.
According to a further aspect of the invention, provide a kind of manufacture method with device of guide pin insertion holes, described method comprises: form on a first type surface of mounting plate and electroplate kind of a layer; By adhesive linkage bonding nonmetal that make and have the guide pin insertion holes of being used to form through hole substrate with electroplate kind of a layer, and described substrate is fixed to this mounting plate; In each through hole, form size less than each through hole, but than the thick resist layer of distance between two first type surfaces of this substrate, make substrate be fixed to mounting plate, and use resist layer as mask, remove resist layer adhesive linkage on every side selectively, a part is electroplated kind of layer expose to pattern, the adhesive linkage below remaining this resist layer around this resist layer; By using resist layer, the adhesive linkage part below the resist layer, adhesive linkage and substrate are being electroplated plating on kind of the layer as mask, constitute plated metal and form the metal level that also covers by the hole inwall; By removing resist layer and described adhesive linkage part, form metal level with guide pin insertion holes; Remove and electroplate kind of a layer, mounting plate is separated with the substrate with metal level, described metal level has guide pin insertion holes.
According to described manufacture method with device of guide pin insertion holes, using adhesive linkage to be fixed to via electrodeposited coating in the through hole of substrate of mounting plate, form resist layer by photoetching, and use this resist layer as mask, remove described adhesive linkage selectively by the removal process, to the exposure of the plating kind layer around the described resist layer, stay the adhesive linkage below the resist layer.Then, by the use resist layer, following adhesive linkage part, adhesive linkage and substrate are being electroplated plating on kind of the layer as mask, form the metal level with guide pin insertion holes in through hole.Therefore, can set the size and the position of guide pin insertion holes accurately corresponding to resist layer and following adhesive linkage stepped construction partly.
In the manufacture method of this device with guide pin insertion holes, substrate is fixed to substrate used in the installation step, each through hole is increased gradually being fixed to mounting plate one side opposite side top major surface direction size towards substrate and described substrate.Since on top when the resist layer metal plating decreased growth, and increase in the size of top via openings end, be easy to pilot pin is inserted in the guide pin insertion holes.
As mentioned above, by cover the inwall of the through hole that forms by non-metal base plate with metal level, form guide pin insertion holes.Therefore, even substrate is made by quartz etc., also can prevent from pilot pin inserted or cause splitting when extracting guide pin insertion holes.
Description of drawings
Fig. 1 is the skeleton view according to microlens array before one embodiment of the invention, the assembling.
Fig. 2 for assembling and with the cross-sectional view of microlens array shown in Fig. 1 of fiber array coupling.
Fig. 3 is the planimetric map of fiber array shown in Fig. 2.
Fig. 4 is the cross-sectional view of another example of expression lenticule base plate.
Fig. 5 is the cross-sectional view of the another example of expression lenticule base plate.
Fig. 6 is the cross-sectional view of the lenticule base plate of making along the line Y-Y ' shown in Fig. 5.
Fig. 7 to 16 is the cross-sectional view of expression fabricating method of microlens array of the present invention, described method comprises that resist layer forms step (Fig. 7), sputter step and strip step (Fig. 8), resist layer forms step (Fig. 9), resist soft heat step (Figure 10), and lens form step (Figure 11), resist layer forms step (Figure 12), sputter step (Figure 13), strip step and resist layer form step (Figure 14), select plating step (Figure 15) and resist to remove step (Figure 16).
Figure 17 to 22 is the cross-sectional view of expression coupling plate manufacture method of the present invention, described method comprises that electroplating kind of a layer forms step (Figure 17), resist layer forms step (Figure 18), resist layer forms step (Figure 19), select plating step (Figure 20), resist is removed step (Figure 21) and separating step (Figure 22).
Figure 23 to 26 is the cross-sectional view of explanation another example of coupling plate manufacture method of the present invention, described method comprises that electroplating kind of a layer forms step and resist layer formation step (Figure 23), select plating step (Figure 24), resist is removed step (Figure 25) and separating step (Figure 26).
Figure 27 A and 27B are the cross-sectional view of explanation another example of coupling plate manufacture method of the present invention, and described method comprises that resist layer forms step (Figure 27 A) and selects plating step and resist removal step (Figure 27 B).
Figure 28 is the skeleton view of microlens array according to an embodiment of the invention.
Figure 29 is the top view with couple state between microlens array shown in part cross-sectional form explanation Figure 28 and the fiber array.
Figure 30 to 44 is the cross-sectional view of an example of explanation fabricating method of microlens array, described method comprises that resist layer forms step (Figure 30), resist soft heat step (Figure 31), lens form step (Figure 32), resist layer forms step (Figure 33), sputter step (Figure 34), strip step and resist layer form step (Figure 35), sputter step (Figure 36), strip step and resist layer form step (Figure 37), resist layer forms step (Figure 38), select plating step (Figure 39), sputter step (Figure 40), resist is removed step, resist layer forms step and selects plating step (Figure 41), mechanical processing steps (Figure 42), cured and substrate remove step and resist is removed step (Figure 43) and the Cu film is removed step (Figure 44).
Figure 45 to 51 is the cross-sectional view of another example of explanation fabricating method of microlens array, described method comprises that electroplating kind of film forms step, resist layer forms step and sputter step (Figure 45), strip step (Figure 46), resist soft heat step (Figure 47), select plating step (Figure 48), mechanical processing steps (Figure 49), step removed by cured and substrate and resist is removed step (Figure 50) and the Cu film is removed step (Figure 51).
Figure 52 is an index path, and the fiber coupling system of microlens array is used in expression.
53 for representing to form according to another embodiment of the present invention lens the planimetric map of the planar structure of microlens array on the surperficial side.
The cross-sectional view of Figure 54 for making along the line Y-Y ' shown in Figure 53.
Figure 55 is the skeleton view of microlens array according to another embodiment of the present invention.
Figure 56 to 62 is the cross-sectional view of the manufacture method example of microlens array shown in expression Figure 55, described method comprises that resist layer forms step (Figure 56), lens form step (Figure 57), resist layer forms step (Figure 58), select etching step (Figure 59), step removed by resist and resist layer forms step (Figure 60), selects etching step (Figure 61) and removal step against corrosion and grinding steps (Figure 62).
Figure 63 is the skeleton view of microlens array according to another embodiment of the present invention.
The cross-sectional view of Figure 64 for making along Figure 63 center line A-A '.
Figure 65 to 75 is the cross-sectional view of expression fabricating method of microlens array example of the present invention; described method comprises that resist layer forms step (Figure 65); sputter step and strip step (Figure 66); resist layer forms step (Figure 67); hot soft heat step and diaphragm form step (Figure 68); dry etching steps (Figure 69); alignment layers forms step (Figure 70); the hole forms step (Figure 71); lower surface grinding steps (Figure 72); preparation plating step (Figure 73), plating step (Figure 74) and plating mask are removed step (Figure 75).
Figure 76 is assemblied in the top view of this state in the endoporus of alignment layers for the expression sheet metal.
Figure 77 to 79 comprises that for the cross-sectional view of expression sheet metal formation method example, described method resist layer forms step (Figure 77), and plating step (Figure 78) and resist are removed step and sheet metal separating step (Figure 79).
Figure 80 to 93 is the cross-sectional view of another example of fabricating method of microlens array of the present invention; described method comprises that resist layer forms step (Figure 80); hot soft heat step (Figure 81); protective seam forms step (Figure 82); dry etching steps (Figure 83); the hole forms step (Figure 84); lower surface grinding steps (Figure 85); substrate installation step (Figure 86), resist-coating step (Figure 87), resist patterning step (Figure 88); resist-coating step (Figure 89); resist patterning step (Figure 90), plating step (Figure 91), removal step against corrosion (Figure 92) and substrate separating step (Figure 93).
The cross-sectional view of Figure 94 for amplifying, the expression plating area.
The cross-sectional view of Figure 95 for amplifying, a kind of modification of expression plating area.
Figure 96 is the skeleton view of contact probe according to another embodiment of the present invention.
The cross-sectional view of Figure 97 for making along Figure 96 center line B-B '.
Figure 98 is the exploded cross section views of electrophoresis analyzer according to another embodiment of the present invention.
Figure 99 to 101 is the cross-sectional view of expression conventional microlens manufacture method, and described method comprises that resist layer forms step (Figure 99), and lens form step and resist layer forms step (Figure 100) and selects etching step (Figure 101).
Figure 102 is installed in the cross-sectional view of the state on the fiber array shown in Figure 101 for expression optical fiber.
Embodiment
Fig. 1 represents according to the microlens array before the one embodiment of the invention assembling, the microlens array after Fig. 2 represents to assemble.The cross-sectional view of Fig. 2 for making along Fig. 1 center line X-X '.Microlens array LA has quartz base plate 10 and the coupling plate 20 that is made of metal and is installed on the described substrate.
On a first type surface of quartz base plate 10, convex lens L 1To L 5Be in line, and lens L is being set 1To L 5The capable both sides of lens form rigging pilotage 12 and 14.The lens pattern of resist being made by means of etching is transferred on the first type surface of substrate 10, forms lens L 1To L 5Rigging pilotage 12 and 14 uses plating kind of a layer to be plated on the described first type surface of substrate 10 by making such as the metal of Ni-Fe alloy.This electroplates kind of layer corresponding to the Cu/ Cr layer laminate 50 and 52 shown in Figure 13, has omitted this plating kind of layer among Fig. 1 to 5.
Substrate 10 is that 6mm, bond length are that 1.5mm, thickness T are the rectangle of 1.25mm for for example having long edge lengths A.For example, each lens such as L 1Diameter be 0.5mm, and the spacing P between the adjacent lens center is 0.5mm.
Coupling plate 20 has the lamination area that is layered on the substrate 10 described first type surfaces and extends and be not layered in non-lamination area on the substrate 10 described first type surfaces from described lamination area.Lamination area has and lens L 1To L 5Corresponding optical transmission window 22 and corresponding with rigging pilotage 12 and 14 respectively pilot hole 24 and 26.Non-lamination area has guide pin insertion holes 28 and 30, and its inside surface is coated with the plated metal such as the Ni-Fe alloy.Optical transmission window 22 sees through from lens L 1To L 5The light that transmission comes.For each each lens such as L 1Can form this optical transmission window. Form pilot hole 24 and 26 from an one first type surface to another first type surface by coupling plate 20, and increase towards another first type surface direction diameter (size).Form guide pin insertion holes 28 and 30 from an one first type surface to another first type surface by coupling plate 20, and increase towards another first type surface direction diameter (size).
Coupling plate 20 is that 11mm, bond length b are that 3mm, thickness t are the rectangular shape of 50 to 100 μ m for for example having long edge lengths a.Optical transmission window 22 is that 3mm, bond length d are the rectangular shape of 1mm for for example having long edge lengths c.In guide pin insertion holes 28 and 30, insertion (installation) is formed on the pilot pin 32 and 34 on the coupling object optical devices (for example fiber array).The opening size of the guide pin insertion holes of reduced size is for example 1mm on 20 1 first type surface one sides of coupling plate, and the guide pin insertion holes opening size of large-size is for example 1.2mm on coupling plate 20 another first type surface one sides.Pilot pin 32 and 34 is cylindrical, and is made by stainless steel or pottery.The diameter of pilot pin is for example 1mm.
Pilot hole 24 and 26 is arranged on the diagonal line of optical transmission window 22, and rigging pilotage 12 and 14 is formed on and pilot hole 24 and 26 corresponding positions.Can near 22 4 angles of optical transmission window, pilot hole and pin be set.Can change the position and the quantity of hole or pin according to needs.This change also is applicable to guide pin insertion holes 28 and 30.
As shown in Figure 2, when assembling microlens array LA, rigging pilotage 12 and 14 is installed in pilot hole 24 and 26, and the first type surface that forms coupling plate 20 is layered in the state on the first type surface of substrate 10, and coupling plate 20 and substrate 10 are linked together.In this case, register pin from large-size one side is inserted pilot hole, thereby insert without lifting an eyebrow and smoothly.
Will describe as the back, and use lens position to form formation rigging pilotage 12 and 14 on the surface by means of film formation process at the lens of substrate 10 as a reference.Thereby the positional precision of rigging pilotage 12 and 14 relative lens positions might be set in ± 0.2 mu m range in.Thereby the assembly precision of the relative pilot hole 24 of rigging pilotage 12 and 26 with 14 be set in ± 0.3 mu m range in, and the assembly precision of the relative guide pin insertion holes 28 of pilot pin 32 and 30 with 34 be set in ± 0.5 mu m range in.
In example shown in Figure 2, fiber array FA and microlens array LA coupling.Shown in Fig. 2 and 3, fiber array FA is by the clamping hole H of optics clamper 36 from an one end face to the parallel formation in other end 1To H 5In accommodate optical fiber F 1To F 5Outside the end face of optical fiber is exposed on an end face of fibre holder 36, and with a described end face, form common flat board.At described accommodation hole group H 1To H 5Both sides form guide pin insertion holes P by fibre holder 36 from an one end face to the other end 1And P 2In the mode that can in the hole, slide, pilot pin 32 and 34 is inserted guide pin insertion holes P 1And P 2In.
With microlens array LA and fiber array FA coupling the time, pilot pin 32 and 34 is inserted in (being assembled to) pin- guide hole 28 and 30, make the first type surface (with lens form surperficial facing surfaces) of the end face of fiber array FA in the face of substrate 20.The end face that makes array FA near or contact with the first type surface of substrate 10.In this case, pilot pin inserts the guide pin insertion holes from large-size one side, thereby inserts simple and level and smooth.Afterwards, the position along optical axis direction adjusting microlens array LA so that obtain required collimated light, and is fixed to fiber array FA with bonding agent with microlens array LA.Owing to can in the unit of microlens array LA, carry out adjusting work, therefore can increase work efficiency.Microlens array LA of the present invention can realize relative fiber array ± 0.1 μ m or shorter positional precision.
The pilot pin 32 and 34 of fiber array FA slidably, and they can be for being formed on the projection on 36 1 end faces of fibre holder.Not only can use fiber array, but also can use the light emitting devices array, optical pickup apparatus array etc.Microlens array substrate is not limited to one-sided lenticular lens type, also can use the other types shown in Figure 4 and 5.
Lenticule base plate shown in Fig. 4 is formed with convex lens L in the above described manner on a first type surface of quartz base plate 10 1To L 5And metal rigging pilotage 12 and 14, and at quartz base plate 10 and lens L 1To L 5Form convex lens L on the opposed major surfaces 11To L 15With lens L 1To L 5Identical, by etching corrosion-resisting pattern is transferred on substrate 10 another first type surfaces, form lens L 11To L 15
Lenticule base plate shown in Fig. 5 and 6 forms convex lens L in the above described manner on a first type surface of quartz base plate 10 1To L 5And metal rigging pilotage 12 and 14, at quartz base plate 10 and lens combination L 1To L 5Form the inclined-plane on the opposed major surfaces and form zone 16.As shown in Figure 6, the inclined-plane form the zone 16 relative substrates 10 another first type surface have ° inclined-plane, tiltangle=5 to 15 ° (being preferably 8 °).The direction on inclined-plane is perpendicular to lens L 1To L 5Array direction.
When using microlens array, lens L as shown in Figure 6 1Typical case the same, light 18 is from optical fiber F 1Form zone 16 by the inclined-plane and incide lens L 1On, and by lens L 1Collimation (formation parallel luminous flux).In this case, the inclined-plane light 18r that forms the reflection of 16 place, inclined-plane, zone will not enter optical fiber F 1, avoid optical fiber F 1, as shown in Figure 6.That is, the inclined-plane forms zone 16 and has reduced and enter optical fiber F 1Reflected light and enter the reflected light of adjacent fiber.
The manufacture method of the lenticular lens type of single face shown in Fig. 1 and 2 lenticule base plate is described with reference to Fig. 7 to 16 below.
In step shown in Figure 7, on a first type surface of quartz base plate 10, form resist layer 40 by photoetching, the corrosion-resisting pattern 40 with pattern 40m is used to constitute the position alignment mark.
In step shown in Figure 8, by sputtering at the Cr film that forms the about 300nm of thickness on the resist layer 40.At this moment, portion C r film forms on the surface of pattern 40m attached to substrate 10 by the position alignment mark.Afterwards by peel off with resist layer 40 with its on the Cr film that deposited come along and remove.On the first type surface of substrate 10, stay the position alignment mark M that adheres to the Cr film.
In step shown in Figure 9, utilize described position alignment mark M on the surface of substrate 10, to form and five resist layer R that lens are corresponding by photoetching 1To R 5
In step shown in Figure 10, resist layer R 1To R 5Steady heat soft heat (heat reflow) is handled, and makes each resist layer have protruding spherical shape.
In step shown in Figure 11, use to comprise fluorine gas such as CF 4, CHF 3And C 3F 8Etching gas, resist layer R 1To R 5Accept dry etch process with the surface of quartz base plate 10, with resist layer R 1To R 5Corrosion-resisting pattern be transferred to the surface of quartz base plate 10, form and resist layer R 1To R 5Corresponding lens L 1To L 5
In step shown in Figure 12, use described position alignment mark M on the surface of substrate 10, to form resist layer 42 by means of photoetching as a reference, described resist layer 42 has corresponding with rigging pilotage two holes 44 and 46.This resist layer 42 covers lens L 1To L 5With position alignment mark M.
In step shown in Figure 13, form Cu/Cr stacked (Cu is stacked in the lamination on the Cr layer layer by layer) on the resist layer 42 by sputtering at.At this moment, top is the lamination 50 and 52 of Cr for the Cu bottom, attached to institute exposed substrate surface in the hole 44 and 46 of resist layer 42.For example, the thickness of Cu layer and Cr layer is respectively 30nm and 300nm.The Cr layer is used to improve the tight contact of the relative substrate 10 of Cu layer.
In step shown in Figure 14, remove resist layer 42 and Cu/Cr lamination 48 by peeling off, on the surface of substrate 10, stay Cu/Cr stacked 50 and 52.Use described position alignment mark M to form resist layer 54 by means of photoetching on the surface of substrate 10 as a reference, this mark against corrosion has Cu/Cr stacked 50 and 52 is exposed to outer hole 56 and 58.The thickness of resist layer 54 is for example about 50 to 100 μ m.
In step shown in Figure 15, use resist layer 54 as mask, carry out the selection of Ni-Fe and electroplate, thereby in the hole 56 and 50 of resist layer 54, on Cu/ Cr lamination 50 and 52, form Ni-Fe alloy rigging pilotage 12 and 14.
In step shown in Figure 16, remove resist layer 54 by chemical substance or additive method.Made lenticule base plate has the quartz base plate of being formed on 10 lip-deep convex lens L 1To L 5, and at lens L 1To L 5The lens arra both sides be layered in rigging pilotage 12 and 14 on Cu/Cr stacked 50 and 52.
According to the described this method of Fig. 7 to 16, use location alignment mark M is used to form lens L as the reference point of reduced projection formula litho machine 1To L 5Photoetching and be used to form the photoetching of rigging pilotage 12 and 14.With respect to design attitude, can obtain corresponding to ± 0.2 μ m or shorter positional precision.
In above-mentioned lenticule base plate manufacture method, though used lens L 1To L 5Alignment, but can have the lenticule base plate of two-dimensional lens array by the same procedure manufacturing.
Below, an example of coupling plate manufacture method is described with reference to Figure 17 to 22.
In step shown in Figure 17, be that Cu, bottom are the lamination 62 of Cr by forming top on the first type surface that sputters at the substrate 60 that glass, quartz, silicon etc. make, as electroplating kind of a layer.For example, the thickness of Cr layer and Cu layer is respectively 30nm and 300nm.
In step shown in Figure 180, on Cu/Cr stacked 62, form: the resist layer R corresponding with required optical transmission window pattern by photoetching 11The resist layer R corresponding with required pilot hole pattern 12And R 13With the resist layer R corresponding with required guide pin insertion holes pattern 14And R 15Resist layer R 11The size size of being a bit larger tham optical transmission window.Resist layer R 12And R 13Size (diameter) size of being a bit larger tham optical transmission window, and resist layer R 14And R 15Size (diameter) be a bit larger tham the size of guide pin insertion holes.Resist layer R 11To R 15Make that opening size increases gradually when upper open end.
In step shown in Figure 19, on substrate, form the pattern R of resist layer 64 by photoetching 22To R 30Resist layer 64 have one with the corresponding hole 64a of flat shape of required coupling plate.At resist layer R 11, R 12, R 13, R 14And R 15Last formation corrosion-resisting pattern R 22, R 24, R 26, R 28And R 30Corrosion-resisting pattern R 22Size corresponding to the size of optical transmission window.Corrosion-resisting pattern R 24And R 26Size (diameter) corresponding to the size of pilot hole.Corrosion-resisting pattern R 28And R 30Size (diameter) corresponding to the size of guide pin insertion holes.
In step shown in Figure 20, use resist layer 64 and resist layer R 11To R 15And corrosion-resisting pattern R 22To R 30As mask, carry out the selection of Ni-Fe alloy and electroplate, form the coupling plate of making by the Ni-Fe alloy-layer 20.At this moment, suppress resist layer R 11To R 15The progress of electroplating below, and beginning to electroplate with the corresponding position of resist layer sidewall.Avoid corrosion-resisting pattern R on top 22To R 30, form Ni-alloy-layer (increasing opening size at the top gradually).Compare with lucky position on Cu/Cr stacked 62, slowed down greatly and electroplated progress, because at each corrosion-resisting pattern such as R 22Fringe region, resist layer such as R 11Covered as electroplating kind of the Cu/Cr stacked 62 of layer.
In step shown in Figure 21, remove resist layer by chemical substance or additive method, form and have optical transmission window 22, pilot hole 24 and 26 and the coupling plate 20 of guide pin insertion holes 28 and 30.
In step shown in Figure 22, the Cu layer by etching removal Cu/Cr stacked 62 separates coupling plate 20 with substrate 60.Cr layer 62a stays on the substrate 60.By on Cr layer 62a, forming the Cu layer, can use substrate 60 repeatedly.
The another kind of manufacture method of Figure 23 to 26 expression coupling plate.In Figure 23 to 26,, and omit its detailed description with components identical shown in same reference numerals/symbolic representation and Figure 17 to 22.
In step shown in Figure 23, on a first type surface of substrate 60, form Cu/Cr lamination 62, as electroplating kind of a layer 62.The Cu/Cr lamination has and the corresponding hole Q of required optical transmission window pattern 1, with the corresponding hole Q of required pilot hole 2And Q 3, and with the corresponding hole Q of required guide pin insertion holes 4And Q 5Hole Q 1The size size of being a bit larger tham optical transmission window.Hole Q 2And Q 3Size (diameter) size of being a bit larger tham pilot hole, hole Q 4And Q 5Size (diameter) be a bit larger tham the size of guide pin insertion holes.Hole Q 1To Q 5Increasing gradually towards upper open end direction opening size.
Has hole Q according to following process formation 1To Q 5Cu/Cr stacked 62.Peel off with substrate 60 surfaces on the hole Q that forms 1To Q 5After the corresponding resist layer, form Cu/Cr lamination 62 on the substrate surface, cover described resist layer by sputtering at, and by peeling off the Cu/Cr lamination of removing described resist layer and forming on it.For example, the Cr layer of the Cu/Cr lamination 62 that forms by sputter and the thickness of Cu layer are respectively 15nm and 200nm.
Then, similar to step shown in Figure 19, formation has corrosion-resisting pattern R on the surface of substrate 60 22To R 30Resist layer 64.Resist layer 64 has and the corresponding hole 64a of the flat shape of required coupling plate.Respectively at hole 64a and hole Q 1, Q 2, Q 3, Q 4With Q 5The inner corrosion-resisting pattern R that forms 22, R 24, R 26, R 28And R 30At corrosion-resisting pattern R 22To R 30Outer peripheral areas, the surperficial expose portion of substrate 60 is rectangle and annular.
In step shown in Figure 24, use resist layer 64 and corrosion-resisting pattern R 22To R 30As mask, carry out the selection of Ni-Fe alloy and electroplate, form the coupling plate of making by the Ni-Fe alloy-layer 20.At this moment, because not at each corrosion-resisting pattern such as R 22Rectangle or annular peripheral region in form Cu/Cr stacked 62 as electroplating kind of a layer, beginning to electroplate with the corresponding position of sidewall of electroplating bottom 62.Thereby the progress of electroplating in described rectangle or the annular region is than the zone on Cu/Cr stacked 62 is slow just.Thereby avoid corrosion-resisting pattern R on top 22To R 30Form coupling plate 20 (increasing gradually) in the open top size.
In step shown in Figure 25, remove resist layer 64 by chemical substance or additive method, provide have optical transmission window 22, pilot hole 24 and 26 and the coupling plate 20 of guide pin insertion holes 28 and 30.
In step shown in Figure 26, the Cu layer by etching removal Cu/Cr lamination 62 separates coupling plate 20 with substrate 60.Cr layer 62a stays on the substrate 60.
Figure 27 A and 27B represent the another kind of manufacture method of coupling plate.In Figure 27 A and 27B,, and omit its detailed description with components identical shown in same reference numerals/symbolic representation and Figure 17 to 26.
In the step shown in Figure 27 A, on the Cu/Cr stacked 62 of 60 1 first type surfaces of covered substrate, form the corrosion-resisting pattern R of resist layer 64 22, R 24And R 28Resist layer 64 has and the corresponding hole 64a of the flat shape of required coupling plate.In each opening 64a bottom, increase corrosion-resisting pattern R gradually 22, R 24And R 28Size.In order to form the corrosion-resisting pattern R of positive conical in shape 22, R 24And R 28If, use steeper (reduced projection formula litho machine), then use a kind of in the following method:
(1) focal position is arranged in the resist layer;
(2) set exposure less (for positive corrosion-resisting agent) in the described resist layer lower area; And
(3) change exposed mask gradually and cover the transmission coefficient of part (fringe region in the open area forms half-tone regions, so that increase the more transmission coefficient of depths).
In the step shown in Figure 27 B, use resist layer 64 and corrosion-resisting pattern R 22, R 24And R 28As mask, carry out the selective electroplating of Ni-Fe alloy, form the coupling plate of making by the Ni-Fe alloy 20.Remove resist layer 64 and corrosion-resisting pattern R by chemical substance or additive method 22, R 24And R 28Owing to removed corrosion-resisting pattern R 1To R 4And R 21To R 24, coupling plate 20 has optical transmission window 22, pilot hole 24 and guide pin insertion holes 28.In coupling plate 20 bottoms, optical transmission window 22, the size of pilot hole 24 and guide pin insertion holes 28 all increases, because all increase in the size of the corresponding corrosion-resisting pattern in bottom.Afterwards, the Cu layer by etching removal Cu/Cr stacked 62 separates coupling plate 20 with substrate 60.In Figure 27 A and 27B, though express only about half of coupling plate, all the other half coupling plates formed by mode same as described above.
According to the described coupling plate manufacture method of reference Figure 23 to 26, can realize following additional effect (a) and (b).
(a) in step shown in Figure 180, because corrosion-resisting pattern R 11To R 15Be 2 μ m or thicker, the unevenness of substrate surface is bigger.Thereby, may reduce the flatness of etch-resistant coating in the step shown in Figure 19 and resist layer 64 and corrosion-resisting pattern R 22To R 30Size might change.On the contrary, in step shown in Figure 23, owing to removed the resist layer that is used to peel off, and the thickness of Cu/Cr stacked 62 is that about 200nm is thin like that, and the flatness of substrate surface is better.Thereby, in step shown in Figure 23, improved the homogeneity of etch-resistant coating, and suppressed resist layer 64 and corrosion-resisting pattern R 22To R 30Size change.Can also improve the throughput rate of coupling plate 20.
(b) in step shown in Figure 20, at corrosion-resisting pattern R 22, R 24, R 26, R 28And R 30Under have corrosion-resisting pattern R 11, R 12, R 13, R 14And R 15Condition under electroplate.Thereby, remove the Cu etching step shown in step and Figure 22 even carry out the resist shown in Figure 21, also pilot hole 24 and 26 and the guide pin insertion holes 28 and 30 of coupling plate 20 in more residual resists, thereby may pollute.Pollution has reduced as shown in Figure 2 the position alignment precision when inserting pilot pin and rigging pilotage in the coupling plate 20.On the contrary, in the described step of Figure 24, because at corrosion-resisting pattern R 22To R 30Do not have below to carry out electroplating process under the condition of resist layer pattern, adhere to and to remain in the amount of the resist on the coupling plate 20 less, can reduce pollution.Thereby the position alignment precision in the time of can improving in pilot pin and the rigging pilotage insertion coupling plate 20.
In the above-described embodiments, have lenticular substrate and have guide hole, pilot pin and have a kind of like this structure by the coupling plate that this guide hole inserts, wherein said substrate and coupling plate can be dismantled.They can form as one.
Figure 28 represents microlens array according to an embodiment of the invention.Figure 29 represents the cross-sectional view of making along the line X-X ' shown in Figure 28.Microlens array LS has quartz base plate 110 and coupling plate 112 metal and that substrate 110 integrates.
On a first type surface of quartz base plate 110, convex lens L 1To L 5Be arranged to delegation.By etching lens pattern against corrosion, and it is transferred on the surface of substrate 110, forms lens L 1To L 5On the described surface of substrate 110, around lens L 1To L 5Form and electroplate kind of a film.Electroplate kind of film corresponding to the Ni-Fe alloy film 142a shown in following Figure 34 that will describe, in Figure 28 and 29, omit it and do not draw.Substrate 110 for example is a rectangle.
Coupling plate 112 has the substrate of being layered in 110 lip-deep lamination area and extends continuously and be not layered in substrate 110 lip-deep non-lamination area from described lamination area.This lamination area has and lens L 1To L 5Corresponding optical transmission window 114, this non-lamination area has guide pin insertion holes 116 and 118.Coupling plate 112 is made of metal, and as the Ni-Fe alloy, is plated on the above-mentioned plating kind layer on the extensional surface of a described first type surface and its substrate 110.Optical transmission window 114 sees through from lens L 1To L 5The light that transmission comes.Can be at each lens such as L 1Form this optical transmission window.Form guide pin insertion holes 116 and 118, with electroplate that the size (diameter) at coupling plate 112 upper guide pin insertion holes increases gradually on kind of the film opposed major surfaces.Coupling plate 112 for example is a rectangle.Guide pin insertion holes 116 and 118 diameter for example are 0.125mm.
On another first type surface of substrate 110, shown in Figure 29 and Figure 52 and 53, can form the inclined-plane and form zone 120.This inclined-plane forms zone 120 to have and makes from optical fiber F 1To F 5Be incident on lens L 1To L 5On light change the inclined-plane of direction, and reflex to the direction different with this incident light direction at the lens place.For example, form this inclined-plane by another first type surface that tilts to grind substrate 110.The back is described the inclined-plane with reference to Figure 52 and 53 and is formed zone 120.
By using the film formation process of lens position, form at the lens of substrate 110 and to form coupling plate 112 on the surface as the reference position.Thereby the positional precision (error of off-design position) of coupling plate 112 relative lens positions can be arranged to ± 0.2 μ m, and the positional precision of guide pin insertion holes 116 and 118 relative lens positions is ± 0.2 μ m.Thereby, the assembly precision of the relative guide pin insertion holes 116 with 134 of pilot pin 132 and 118 can be set at ± 0.3 μ m.Pilot pin 132 and 134 is made by stainless steel or pottery, and diameter is about 0.125mm.Pilot pin 132 and 134 has head 132a and the 134a of diameter greater than the pilot pin main body.
Figure 29 represents an example of the assembly of fiber array FA and microlens array LA.Fiber array FA and put holding tank H in fibre holder 130 upper areas 1To H 5Middle receiving optical fiber F 1To F 5In optics clamper 130 upper areas, comprising groove H 1To H 5Holding tank group both sides on form pilot pin holding tank P 1And P 2Each holding tank H 1To H 5, P 1And P 2V-font groove for V-font xsect with vertical axial.
When assembling microlens array LA and microlens array LA, pilot pin 132 and 133 is inserted in (being installed to) guide pin insertion holes 116 and 118, make with substrate 110 lens and form the end face that surperficial facing surfaces (inclined-plane forms the surface in zone 120) moves to close fiber array FA, or contact, thereby make pilot pin 132 and 134 be contained in the holding tank P of fibre holder 130 with the end face of fiber array FA 1And P 2In.Pilot pin 132 and 134 is easy to and inserts smoothly in guide pin insertion holes 116 and 118, because pilot pin inserts from guide pin insertion holes large-size one side.At optical fiber F 1To F 5Be contained in holding tank H with pilot pin 132 and 134 1To H 5, P 1And P 2In state under, by pressing plate (not shown) such as glass plate upper surface fixed fiber F at fibre holder 130 1To F 5With pilot pin 132 and 134, thus not mobile holding tank H 1To H 5, P 1And P 2In optical fiber and pilot pin.
Then, along the position that optical axis direction moves microlens array LA, the light that makes the emission of each optical fiber and pass lens is collimated light.When obtaining required collimated light, substrate 110 is fixed to the end face of fiber array FA with bonding agent.Owing to can in microlens array unit, carry out adjusting work, therefore can increase work efficiency.Microlens array LA of the present invention can realize relative fiber array ± 0.5 μ m or shorter positional precision.
Fiber array FA can have a plurality of accommodation holes that are used for holding in a suitable manner multifiber, is used in the accommodation hole that holds pilot pin 132 and 134.The optical element that is coupled is not only limited to fiber array, and can use miscellaneous part such as light emitting devices array and optical pickup apparatus array yet.Microlens array LA is not only limited to the single face lenticular lens type, can use lenticular lens type array yet.
Below, the manufacture method of single face lenticular lens type microlens array is described with reference to Figure 30 to 54.
In step shown in Figure 30, on a first type surface of substrate 110, form and five corresponding resist layer R of lens by photoetching 1To R 5
In step shown in Figure 31, resist layer R 1To R 5Handle through the soft heat of being heated, make each resist layer have protruding spherical shape.
In step shown in Figure 32, resist layer R 1To R 5Stand dry etch process with the surface of quartz base plate 110, with resist layer R 1To R 5Corrosion-resisting pattern be transferred to the surface of quartz base plate 110, form and resist layer R 1To R 5Corresponding convex lens L 1To L 5
In step shown in Figure 33, form on the surface of substrate 110 by photoetching and to peel off resist layer 140.Resist layer 140 covers lens L 1To L 5Lens combination, outside will being exposed to around the surface of the substrate 110 of described lens combination.
In step shown in Figure 34,, on the upper surface of resist layer 140 and substrate 110, form Ni-Fe alloy film 142 and 142a respectively for example by sputter Ni-Fe alloy on substrate surface.Ni-Fe alloy film 142 is around resist layer 140 and lens L 1To L 5, and as the plating kind film of back electroplating process.
In step shown in Figure 35, the Ni-Fe alloy film 142 on resist layer 140 and top is removed, and stayed Ni-Fe alloy film 142a on the substrate surface.Form resist layer 144 by photoetching, cover lens L 1To L 5, and the inward flange zone of Ni-Fe alloy film 142a.
In step shown in Figure 36,, on resist layer 144 and Ni-Fe alloy film 142a, form Cu film 146 and 146a respectively for example by Cu is splashed on the substrate surface.Cu film 146a is centered around lens L 1To L 5On every side, and as the plating kind film of back electroplating process.Though Ni-Fe alloy and Cu plant the material of film 142a and 146a as plating, but if do not carry out etching simultaneously, also can use other materials.
In step shown in Figure 37, by peeling off resist layer 144 and top Cu film 146 are removed, and stayed Cu film 146a on the Ni-Fe alloy film 142a.
Afterwards, by photoetching at lens combination L 1To L 5The lens arra both sides on Cu film 146a, form corrosion-resisting pattern R 6And R 8Corrosion-resisting pattern R 6And R 8Opening size (diameter) towards bottom surface direction guide pin insertion holes is increased gradually, and size (diameter) is a bit larger tham the size of guide pin insertion holes.
In step shown in Figure 38, on substrate surface, form resist layer 148 and be formed on corrosion-resisting pattern 148A in the described opening with opening by photoetching.Resist layer 148 is formed on the Cu film 146a, and has and the corresponding hole 148a of coupling plate pattern.Corrosion-resisting pattern 148A covers lens L in the 148a of hole 1To L 5, and the inward flange zone of Ni-Fe alloy film 142a, consistent with the optical transmission window pattern.In this case, though corrosion-resisting pattern 148A also covers the inward flange zone of Cu film 146a, but can not cover this zone.
In step shown in Figure 39, by with resist layer 148, corrosion-resisting pattern 148A, R 6And R 8As mask, carry out the selection of Cu and electroplate, forming thickness is the Cu film 150 of several microns (μ m).This Cu film 150 is used as the plating kind film of the described electroplating process in back, and as diaphragm, is not subjected to the influence of cutting edge in the described in the back machining processes of protection coupling plate.
In step shown in Figure 40, by with metal sputtering to substrate surface, respectively at resist layer 148, at corrosion-resisting pattern 148A with at Cu film 150 and corrosion-resisting pattern R 6And R 8Last formation metal film 151,151A and 151a.From being not to select by splash-proofing sputtering metal, as Cr the etched material simultaneously with Cu and Ni-Fe alloy.
Afterwards, remove resist layer 148 and corrosion-resisting pattern 148A and be formed on upper metal film 151 and 151A on the substrate 110, remaining Cu film 150 and the corrosion-resisting pattern R of covering by peeling off 6And R 8Metal film 151a.Remove metal film 151a by etching, with Cu film 150 and corrosion-resisting pattern R 6And R 8Outside being exposed to.
In step shown in Figure 41, on substrate surface, form resist layer 152 and be in corrosion-resisting pattern R in the described opening with opening by photoetching 14, R 16And R 18Be formed on resist layer 152 on the Cu film 152 have one to the similar hole of hole 148a shown in Figure 38.Corrosion-resisting pattern R 14Be formed in the described hole of resist layer 152, cover and the corresponding lens L of optical transmission window pattern 1To L 5Corrosion-resisting pattern R 14Can cover or can not cover the inward flange zone (in this case, have the contact area of plated metal of Ni-Fe alloy film 142a bigger) of Ni-Fe alloy film 142a.Resist layer R 6And R 8The corrosion-resisting pattern R of last formation 16And R 18Have and the corresponding shape of guide pin insertion holes pattern.Corrosion-resisting pattern R 16And R 18Size (diameter) corresponding to the size of guide pin insertion holes.
After this, by using resist layer 152 and corrosion-resisting pattern R 6, R 8And R 14To R 18As mask, carry out the selection of Ni-Fe alloy and electroplate, form the coupling plate of making by the Ni-Fe alloy 112.Coupling plate 112 is around corrosion-resisting pattern R 16And R 18Upper area be the taper that increases from top to bottom (shape that increases in the upper opening size).Its reason is at each corrosion-resisting pattern such as R 16Outer peripheral areas in, as the Cu film 146a that electroplates kind of film by corrosion-resisting pattern such as R 16Cover, and have circular void, thereby the plating tempo in the resist layer fringe region is than just the zone on Cu film 150 is slow as electroplating kind of the Cu film 150 of layer.Can be about 50 to 100 μ m with the thickness setting of coupling plate 112.
In step shown in Figure 42, substrate 110 is fixed to the surface of mounting plate 154 by cured layer 156 on the surface of resist layer 152 1 sides.Under this stationary state, with cutting edge 158A profile cut substrate 110, Ni-Fe alloy film 142a, Cu film 146a and 150, corrosion-resisting pattern 152 and coupling plate 112 along the final outward flange pattern (rectangular patterns) of coupling plate 112.With the profile cut substrate 110 of cutting edge 158B along substrate 110 final outward flange patterns, Ni-Fe alloy film 142a and Cu film 146a.In this case, Cu film 150 protection coupling plates 112 are not subjected to the influence of cutting edge 158B.At substrate 110, form grooving 158b shown in Figure 43 among Ni-Fe alloy film 142a and the Cu film 146a.
In step shown in Figure 43, remove the cured layer 156 of substrate 110 at resist layer 152 1 side surfaces, separate mounting plate 153 and substrate 110.Thereby removed near the zone of the region exterior that cuts out with cutting edge the substrate 110 fringe region 110A.
After this, remove corrosion-resisting pattern R by chemical substance or additive method 14, R 16, R 18, R 6And R 8, form coupling plate 112 with optical transmission window 114 and guide pin insertion holes 116 and 118.Lens L 1To L 5Be exposed in this optical transmission window 114.In described guide pin insertion holes 116 and 118, outside a part of surface of Cu film 146a is exposed to.Two guide pin insertion holes 116 and 118 all increase gradually in the upper opening size, and are removing corrosion-resisting pattern R 6And R 8The position have more large scale (diameter).
In step shown in Figure 44, remove Cu film 146a and 150 by etching.Thereby come along outer peripheral areas 110a except substrate 110 with top Ni-Fe alloy film 142a.Can form the microlens array with coupling plate 112 that the Ni-Fe alloy makes, wherein the lens of coupling plate 112 by Ni-Fe alloy film 142A and substrate 110 form the surface and form as one.
The another kind of manufacture method of Figure 45 to 51 expression microlens array.With the same reference numerals/symbolic representation of the components identical of element shown in Figure 30 to 44, and omit its detailed description.
In step shown in Figure 45, by forming step and sputter and strip step, on a first type surface of quartz base plate 110, form Ni-Fe alloy film 160, as electroplating kind of a film with the described identical resist layer of reference Figure 33 to 35.Ni-Fe alloy film 160 is around comprising lens L 1Deng in interior lens combination, and have one with the corresponding hole Q of guide pin insertion holes 6Hole Q 6Size (diameter) be a bit larger tham the size of guide pin insertion holes.
Then, on substrate surface, form resist layer 162 and 162A by photoetching.Resist layer 162A covers and comprises lens L 1Deng in interior lens combination, and the inward flange zone of Ni-Fe alloy film 160.Resist layer 162A is that diameter is slightly smaller than hole Q 6Diameter cylindrical.Hole Q 6Be circular hole around resist layer 162A.
Afterwards, Cu is splashed on the substrate surface,, forms Cu film 164,164A and 164a on resist layer 162 and the Ni-Fe alloy film 160 respectively at resist layer 162.Cu film 164a is filled in hole Q 6In.Identical with the Cu film 150 shown in Figure 39, be the gross thickness of Cu film 164a and Cu film 150 with the thickness setting of Cu film 164a, so that form the Cu film 164a that has the diaphragm function at cutting edge.
In step shown in Figure 46, remove Cu film 164 and 164A and top resist layer 162 and 162A by peeling off, stay Cu film 164a.Thereby such as L 1Lens be exposed to outside, and hole Q 6Be circle.
In step shown in Figure 47, identical with the described step of reference Figure 41, formation has corrosion-resisting pattern R on substrate surface 14And R 16Resist layer 152.The resist layer 152 that is formed on the Cu film 164a has and the identical hole of hole 148a shown in Figure 38.Corrosion-resisting pattern R 14Corresponding to the optical transmission window pattern, and comprise lens L in covering resist layer 152 holes 1Deng in interior lens combination.Corrosion-resisting pattern R 14The annular region of exposing a sealing of substrate surface, and spaced apart slightly with Ni-Fe alloy film 160.This design makes the size of optical transmission window increase gradually at the top, and has increased the contact area between Cu film 160 and the plated metal.
Corrosion-resisting pattern R 16For cylindrical, its pattern is corresponding to hole Q 6In guide pin insertion holes.Corrosion-resisting pattern R 16The size of size (diameter) and guide pin insertion holes corresponding, and be slightly smaller than hole Q 6Size.Hole Q 6Outside a circle ring area of substrate surface is exposed to.This design can make the opening size of guide pin insertion holes increase gradually on top.
In step shown in Figure 48, by using resist layer 152 and corrosion-resisting pattern R 14And R 16, carry out the selection of Ni-Fe alloy and electroplate, form the coupling plate of making by the Ni-Fe alloy.Coupling plate 112 is around corrosion-resisting pattern R 16Upper area be from top to bottom taper (shape that increases gradually at the opening size of top guide pin insertion holes), and coupling plate 112 is around corrosion-resisting pattern R 14Upper area have from top to bottom the taper that increases (shape that increases at top optical transmission window opening size).Its reason is at corrosion-resisting pattern R 14Or R 16Fringe region in, as the Ni-Fe alloy film 160 of electroplating bottom or annular gap or the annular gap that Cu film 164a has sealing, thereby in the fringe region of corrosion-resisting pattern, electroplate tempo than the zone on Ni-Fe alloy film 160 or Cu film 164a is slow just.
In step shown in Figure 49, substrate 110 is fixed to the surface of mounting plate 154 by cured layer 156 on the surface of resist layer 152 1 sides.Under this stationary state, use the same way as with reference Figure 42 described use cutting edge 58A and 58B, carry out machining.Thereby, form grooving 158b as shown in Figure 50 among Ni-Fe alloy film 160 and the Cu film 164a at substrate 110.Cu film 164a protection coupling plate 112 is not subjected to the influence of cutting edge 158B.
In step shown in Figure 50, by removing wax layer 156 and mounting plate 154 with reference identical mode shown in Figure 43.Thereby removed near the zone (if any) of using the region exterior that cutting edge 158A cuts out the substrate 110 fringe region 110A.After this, remove corrosion-resisting pattern R by chemical substance or additive method 14And R 16, form coupling plate 112 with optical transmission window 114 and guide pin insertion holes 116.
In the step shown in Figure 51, remove Cu film 164a by etching.Thereby come along fringe region 110a except substrate 110 with Ni-Fe alloy film 160.Can form the microlens array with coupling plate 112 that the Ni-Fe alloy makes, coupling plate 112 forms as one by the surface of Ni-Fe alloy film 160 with substrate 110.Though express half of microlens array among Figure 45 to 51, but can produce all the other half by same way as.
According to the manufacture method of the described microlens array of reference Figure 30 to 51, use the reference of the position alignment mark M (not shown) be formed on the substrate 110 as reduced projection formula litho machine, carry out lens L 1To L 5Photoetching process and the photoetching process of coupling plate 112.For such as L 1Lens, optical transmission window 114 and guide pin insertion holes 116 and 118 can obtain relative design attitude corresponding to ± 0.2 μ or shorter good positional precision.
Can realize following additional effect (a) and (b) with reference to the described fabricating method of microlens array of Figure 45 to 51.
In step shown in Figure 41, because corrosion-resisting pattern R 6And R 8Be present in corrosion-resisting pattern R 16And R 18Below, though in step shown in Figure 43 the etching resist and in step shown in Figure 44 etching Cu, resist also may remain in the guide pin insertion holes 116 and 118 of coupling plate 112, thereby is easy to pollute.Pollution has reduced pilot pin shown in Figure 29 and has inserted the guide pin insertion holes 116 of coupling plate 112 and 118 o'clock position alignment precision.On the contrary, in step shown in Figure 48, at corrosion-resisting pattern R 16Do not have below to carry out electroplating process under the state of resist layer, thereby the amount of residual resist that is attached to coupling plate 12 is less, but pollution abatement.Thereby can improve pilot pin and insert the guide pin insertion holes 116 of coupling plate 112 and 118 position alignment precision.
(b) the method more complicated shown in Figure 37 to 41 is because must form corrosion-resisting pattern R 6And R 8, form Cu film 150 and metal film 151a, and remove metal film 151a.On the contrary, in the method shown in Figure 45 to 48, do not need these complicated processes, but can reduce number of steps, thereby can improve the throughput rate of coupling plate 112.
Figure 52 represents to use the fiber coupling system of microlens array.Use the microlens array LA and the LA ' that make by another embodiment of the present invention method.Microlens array LA and LA ' have same structure.Express microlens array LA among Figure 53 and form the planar structure of a surperficial side at lens, and the cross-sectional view that expression is made along the line Y-Y ' shown in Figure 53 in Figure 54.With the same reference numerals/symbolic representation of element components identical shown in Figure 28 and 29, and omit its detailed description.
In the fiber coupling system shown in Figure 52, optical fiber F 1The light of launching is incident on the microlens array LA.Microlens array LA has quartz base plate 110.On a first type surface of substrate 110, shown in Figure 52 to 54, form the convex lens L of delegation 1To L 7, and on another first type surface of substrate 110, formation has inclined-plane K shown in Figure 52 and 54 1The inclined-plane form the zone 120.Inclined-plane K 1Be used to make optical fiber F 1Launch and at lens L 1The light S of place's reflection rDirection be different from lens L 1On the incident light direction.In the present embodiment, form all seven lens L 1To L 7A shared inclined-plane forms zone 120, with reflected light S rBe converted to perpendicular to lens L 1To L 7The direction of array direction.For example, can form this inclined-plane by the surface that tilts to grind substrate 110 and form zone 120.Suppose that shown in Figure 54 plane M is parallel to the surface of substrate 110, then inclined-plane K 1Angle θ with respect to plane M is about 5 to 15 ° (being preferably 8 °).If plane M is the surface (θ=0 °) of substrate 110, then lens L 1Lens center and optical axis L CConsistent.
As inclined-plane K 1When being used as another first type surface of substrate 110, light is by inclined-plane K 1Refraction, shown in Figure 52, thus lens L 1The misalignment optical axis L CIn order to obtain optical fiber F 1The direct scioptics L of the light of launching 1The light path at center, make optical fiber F 1Front surface be that angle is the inclined-plane of θ, and be parallel to inclined-plane K 1In this case, make from optical axis L CSlightly upwards the light of refraction is incident on inclined-plane K 1On, so that output light is at inclined-plane K 1The place is from lens L 1The center reflect slightly downwards.
In microlens array LA ', with substrate 110 corresponding quartz base plates 110 ' a first type surface on form and lens L 1Corresponding convex lens L 10, and substrate 110 ' another first type surface on form with the inclined-plane form zone 120 ' corresponding inclined-planes form zone 120 '.With inclined-plane K 1Similar, the inclined-plane forms zone 120 ' formation and has the inclined-plane K of angle θ 10Lens L 1The light S of output is parallel to optical axis L CPropagate forward, and be incident on lens L 10The center.This light is at inclined-plane K 10The place is slight to be reflected, and incides optical fiber F along optical axis direction 10On.
The difference of microlens array LA is shown in microlens array LA shown in Figure 52 to 54 and Figure 28 and 29, at first be not on the surface of substrate 110, to form five lens, but seven lens L 1To L 7Be in a straight line, wherein connect lens L 1To L 7The line at center is straight line C LThe second, comprising lens L 1To L 7The lens combination both sides, guide pin insertion holes 116 is arranged on parallel and off-straight C with 118 center LDistance D SStraight line C GOn.By inclined-plane K 1Optical axis that produces and the bias of lens center decision distance D S
In microlens array LA, each lens is as being formed on the lens L on the quartz base plate 110 1Diameter can be 0.5mm, the spacing of adjacent lens (distance between the adjacent lens center) P can be 0.5mm.The long edge lengths A of coupling plate 112 can be 8.5mm, and bond length B can be 1.5mm.The long edge lengths a of optical transmission window 114 can be 3.5mm, and bond length b can be 1mm.Guide pin insertion holes 116 and 118 can be 0.125mm, and thickness can be 0.1mm.If angle θ is set at 8 °, substrate 110 is in a side thickness T 1Be 1.04mm, in a relative side thickness T 2Be about 1.25mm, and straight line C LWith C GBetween distance D SBe about 13 μ m.
Be not to be all lens L 1To L 7Provide a shared inclined-plane to form zone 120, provide the inclined-plane to form zone 120 and can be each lens.Inclined-plane K 1Direction be not only limited to perpendicular to lens L 1To L 7Array direction, as long as reflected light do not enter in the optical fiber, then can adopt any direction.
Figure 55 represents microlens array according to another embodiment of the present invention.This microlens array is made by silicon substrate 170.
On a first type surface of substrate 170, convex lens L 11To L 14Be in line.Comprising lens L 11To L 14The lens arra both sides, form guide pin insertion holes 172 and 174.Towards described first type surface direction, guide pin insertion holes 172 and 174 size (diameter) increase.
For example, substrate 170 is a rectangle, and long edge lengths J is 8mm, and bond length N is 2mm, and thickness is 0.28mm.Lens L 11To L 14Diameter can be 0.99mm, the interval P between the adjacent lens can be 1mm.Distance between the guide pin insertion holes 172 and 174 can be 7mm.
Will be the time such as the optical element of optical fiber and the coupling of the microlens array shown in Figure 55, identical with the described mode of reference Figure 29, insert at pilot pin under the state of guide pin insertion holes 172 and 174, pilot pin inserts in two pilot pin insertion grooves (or hole) of this optical element.Identical with the microlens array shown in Figure 28, the coupling energy of optical element is realized the position alignment precision of ± 0.5 μ m.
Microlens array shown in Figure 55 can adopt with reference to the described identical structure of Figure 52 to 54.That is lens L, 11To L 14On a first type surface of substrate 170, be in line along the straight line that connects the lens center, and on another first type surface of substrate 170, be formed for the inclined-plane of inhibitory reflex return light may.Comprising lens L 11To L 14The lens arra both sides form guide pin insertion holes 172 and 174, the misalignment that is in guide pin insertion holes connects a certain amount of position of straight line of lens center, the optical axis that described bias causes corresponding to the inclined-plane and the bias of lens center.Under this structure, described identical with reference Figure 52 to 54, by using a plurality of pilot pins, can obtain the suitable light path that overlaps with the lens center simply with this microlens array and optical element coupling.
The manufacture method of microlens array shown in Figure 56 to 62 expression Figure 55.
In the step shown in Figure 56, by means of forming and four corresponding corrosion-resisting pattern R of lens on the first type surface that is engraved in silicon substrate 170 21To R 24Corrosion-resisting pattern experiences hot soft heat to be handled, and makes each corrosion-resisting pattern have protruding spherical shape.
In the step shown in Figure 57, corrosion-resisting pattern R 21To R 24Stand dry etch process with the surface of substrate 170, with corrosion-resisting pattern R 21To R 24Pattern transfer to substrate surface, form and corrosion-resisting pattern R 21To R 24Corresponding convex lens L 11To L 14
In the step shown in Figure 58, on the surface of substrate 170, form resist layer 176 by photoetching, this resist layer covers lens L 11To L 14, and have and two corresponding hole 176a of guide pin insertion holes and 176b.
In the step shown in Figure 59,,, form and hole 176a and 176b corresponding grooves 172A and 174A substrate 170 dry ecthings by using resist layer 176 as mask.
In the step shown in Figure 60, after removing resist layer 176, on the surface of substrate 170, form resist layer 178 by means of photoetching by chemical substance or additive method.Form resist layer 78 by a kind of like this mode, make hole 178a and 178b will utilize outside the bight of groove 172A that resist forms attached to this phenomenon among groove 172A and the 174A and 174A is exposed to.
In the step shown in Figure 61, use resist layer 178 as mask, make the bight that is exposed among groove 172A and the 174A become circle by dried or wet etching.The opening size of groove 172A and 174A increases towards top the time gradually.
In the step shown in Figure 62, after removing resist layer 178, grind another first type surface of substrate 170 by chemical substance or additive method, until the bottom surface of groove 172A and 174A, grinding substrate 170 obtains planar bottom surface until the line Z-Z ' shown in Figure 61.Thereby obtain to have the substrate of being formed on 170 lip-deep lens L 11To L 14And be formed on and comprise lens L 11To L 14The guide pin insertion holes 172 of lens arra both sides and 174 microlens array.
In above-mentioned fabricating method of microlens array, though use lenticule L 1To L 5Or lens L 11To L 14Linear array, but can be by make the two-dimensional array of a plurality of lens with quadrat method.
In the above-described embodiments, can realize the high size and the positional precision of guide pin insertion holes, because form guide pin insertion holes by film formation process.If substrate is made by quartz or silicon, when pilot pin inserts or extracts guide pin insertion holes, might split or break in the zone of limiting hole.Below, will the embodiment that suppress splitting be described.
Figure 63 represents microlens array according to an embodiment of the invention, the cross-sectional view of Figure 64 for making along the line A-A ' shown in Figure 63.
Microlens array 210 has transparency carrier 212 that nonmetallic materials such as quartz make and the protruding spherical lens L that is arranged to delegation on a first type surface of substrate 212 1To L 4The protruding spherical lens pattern transfer of resist being made by dry ecthing forms each lens such as L to substrate surface 1
Comprising lens L 1To L 4The lens arra both sides form the circular orientation layer of making by for example resist 218 and 220.Owing to can form alignment layers 218 and 220, lens L with degree of precision (with sub-micrometer precision) by photoetching 1To L 4Positional precision also higher.Use accurate boring to wait, form through hole 214a and the 216a that constitutes guide pin insertion holes by substrate at alignment layers 218 and 220 centers.Through hole 214a and 216a run through substrate 212 from a surface to another surface.
Endoporus 218a and 220 around alignment layers 218 and 220 is provided with the annular metal sheet of being made by for example Ni-Fe alloy 222 and 224.Sheet metal 222 and 224 has guide pin insertion holes 222a and 224a, forms with sub-micrometer precision by film formation process.The size of guide pin insertion holes 222a and 224a (diameter) is less than the size of through hole 214a and 216a, and a relative side with through hole at the inwall place outwards (top) size increase gradually.
The metal level of being made by for example Ni-Fe alloy 226 and 228 covers the inwall of through hole 214a and 216a.The surface that is covered defines guide pin insertion holes 214 and 216.The corresponding amount with metal level 226 and 228 thickness of guide pin insertion holes 214 and 216 size (diameter) less than the size of through hole 214a and 216a.Form metal level 226 and 228 continuously by sheet metal 222 and 224, and on another surface of substrate 212, cover the open end edge zone (as wheel rim) of through hole 214a and 216a.For example form these metal levels 226 and 228 by following manner.Nonmetal hole forms pin and inserts among pin insertion hole 222a and the 224a, and stretches out from another surface of substrate 212 via through hole 214a and 216a.In this state,, carry out electroplating process, form electrodeposited coating 226 and 228 by using sheet metal 222 and 224 as electroplating kind of a layer.Afterwards, the hole is formed pin and extract pin insertion hole 222a and 224a and metal level 226 and 228.Guide pin insertion holes 214 and 216 size (diameter) are approximately equal to the size of pin insertion hole 222a and 224a, and form continuously with pin insertion hole 222a and 224a.Under the user mode of microlens array 210, with pilot pin P 1And P 2Insert in the guide pin insertion holes 214 and 216.
Microlens array 210 shown in Figure 63 and 64 has for example following size.The length a of substrate 212, width b and thickness k are respectively 6.5mm, 1.5mm and 0.5mm.Each lens such as L 1Opening diameter be 0.24mm, lens L 1With L 4Distance c between the center is 0.75mm, adjacent lens such as L 1With L 2Spacing (between the center) e be 0.25mm.The interior diameter h of alignment layers such as layer 218, overall diameter f and thickness j are respectively 2.0mm, 2.4mm and 0.08mm.The diameter g in guide pin insertion holes such as hole 214 is 0.7mm, and between guide pin insertion holes 214 and 216 centers is 4.6mm apart from d, and the overall diameter i of through hole such as hole 214a rim section is 1mm, and pilot pin is gone into pin P 1Diameter be 0.7mm.
Will be the time, at pilot pin P such as the optical element of optical fiber and microlens array 210 couplings 1And P 2Insert under the state of guide pin insertion holes 214 and 216 described pilot pin P 1And P 2Insert in two pilot pin insertion grooves (hole) of this optical element, and when needed they are fixed together.Sheet metal such as plate 222 relative positioning layers are about 1 μ m as 218 positioning error.Even this error is added to pilot pin such as P 1Overall diameter sum of errors pin insertion hole such as the scale error of hole 222a in, also lens such as lens L relatively 1The center with 2 μ m or littler precision fixedly pilot pin such as pin P 1
As pilot pin such as pin P 1Insert and when extracting guide pin insertion holes such as hole 214 pilot pin such as P 1Contact with metal level such as layer 226.Can prevent the through hole such as the hole 214a open end generation splitting of quartz base plate 212.Metal level such as layer 226 stop such as the sheet metal of plate 226 and the rim section of substrate 212 another first type surface one side such as metal levels of layer 226 212 1 first type surface one sides of substrate, thereby can avoid metal level such as layer 226, at pilot pin such as P 1Insert or be moved when extracting guide pin insertion holes.Because guide pin insertion holes such as hole 122a are increasing with through hole opposite metal plates one side direction outside dimension, be easy to the hole is formed in the guide pin insertion holes of pin insertion such as hole 222a, guarantee to fixedly secure between pin and the hole, and with in the guide pin insertion holes of pilot pin insertion such as hole 214.
Below, an example of fabricating method of microlens array is described with reference to Figure 65 to 75.In Figure 65 to 75, with the same reference numerals/symbolic representation of components identical shown in Figure 63 and 64.
In the step shown in Figure 65, go up formation resist layer 230 at a first type surface (upper surface) of for example quartzy transparency carrier of making 212, this resist layer has the position alignment mark and forms pattern 230a.
In the step shown in Figure 66, by forming Cr layer, overlay pattern 230a and resist layer 230 on the upper surface that sputters at substrate 212.The thickness of Cr layer can be 300nm.After forming the Cr layer, remove (peeling off) resist layer 230 and top Cr layer, on the upper surface of substrate 212, form and pattern 230a corresponding C r position alignment mark 232.
In the step shown in Figure 67, on the upper surface of substrate 212, form and four corresponding corrosion-resisting pattern R of lens by photoetching 1To R 4Use location alignment mark 2 32 carries out described photoetching process as a reference.
In the step shown in Figure 68, corrosion-resisting pattern R 1To R 4Experience hot soft heat and handle, make it to have protruding spherical shape.Form the protective seam 234 that covers position alignment mark 232, be with as apton.This protective seam prevents that position alignment mark 232 is moved in the etching process shown in Figure 69.
In the step shown in Figure 69, by dry ecthing, corrosion-resisting pattern R 1To R 4The protruding spherical lens pattern transfer to the upper surface of substrate 212, form protruding spherical lens L 1To L 4Employed etching gas can be for fluorine containing etchant gas, as CHF in the described dry etch process 3, CF 4And C 3F 8, perhaps described fluoro-gas with such as Ar, O 2And H 2Mixed gas.Forming lens L 1To L 4Afterwards, remove protective seam 234, outside position alignment mark 232 is exposed to.
In the step shown in Figure 70, on substrate 212 upper surfaces, comprising lens L by photoetching 1To L 4The lens arra both sides form the location pattern of making by for example resin 218 and 220.Use location alignment mark 232 carries out described photoetching process as a reference.Form location pattern 218 and 220, make it to have the pattern shown in Figure 76.Form location pattern 218 and 220 with sub-micrometer precision, and relative lens such as lens L 1Has good positional precision.
In the step shown in Figure 71, use the accurate upper surface that is drilled in substrate 212 in the middle section of location pattern 218 and 220, to form half through hole 214A and 216A.If the formation through hole then might form cracking in the open end edge location of through hole when accurate brill runs through substrate 212.For this reason, form half through hole.The size of half through hole such as hole 214A (diameter) is pilot pin such as pin P relatively 1Has certain surplus.If pilot pin such as P 1Diameter be 0.7mm, then the size of half through hole can be 0.8mm.
In the step shown in Figure 72, grind the lower surface of substrate 212, arrive the significant depth of half through hole 214A and 216A, half through hole 214A and 216A are become through hole 214a and 216a.
In the step shown in Figure 73, annular metal sheet 222 and 224 is installed among the endoporus 218a and 220a of location pattern 218 and 220.Figure 76 is installed to the top view of the sheet metal 222 among the pattern 218 endoporus 218a of location for expression.The sheet metal 224 that is installed among the pattern 220 endoporus 220a of location has the view identical with Figure 76.Sheet metal 222 and 224 has pin insertion hole 222a and 224a, can form this pin insertion hole 222a and 224a accurately by the described film formation process in back.
Electroplated electrode plate 240 has the size and dimension of covered substrate 212 upper surfaces, and has the first and second downward outshots that can be assembled in location pattern 218 and 220 endoporus.Electroplated electrode plate 240 has the second patchhole 240b that passes its first patchhole 240a that also passes through second outshot and pass it and pass through first outshot from electroplated electrode plate upper surface from electroplated electrode plate upper surface.For example the nonmetal hole of being made by pottery forms among pin 242 and 244 insertion first and second pin insertion hole 240a and the 240b.The hole forms pin 242 and 244 and has wheel rim 242a and 244a.
The first and second downward outshots are assembled in the location pattern 218 and 220 (being arranged on sheet metal 222 and 224), electroplated electrode 240 is layered on the upper surface of substrate 212, and afterwards the hole is formed pin 242 and 244 and insert among pin insertion hole 240a and the 240b and among pin insertion hole 222a and the 224a, stretch out from another surface of substrate 212 via through hole 214a and 216a.Because wheel rim 242a and 244a, the hole forms pin 242 and 244 and abuts against on the upper surface of electroplated electrode plate 240.Electroplate mask material and be filled between the perimeter and substrate 212 of electroplated electrode plate 240 downward outshots, electroplate mask layer 246 thereby form.Also will be filled into the space between hole formation pin 242 and the pin insertion hole 240a inwall such as the plating mask material of resin, and in the space between hole formation pin 244 and the pin insertion hole 240b.
In the step shown in Figure 74, under the described plating armed state of reference Figure 73, electric current flow on the electroplated electrode plate 240, for example by using sheet metal 222 and 224 as electroplating kind of a plate, carry out the plating of Ni-Fe alloy, thereby form Ni-Fe alloying metal layer 226 and 228.Metal level 226 and 228 covers the inwall of through hole 214a and 216a, and covers through hole 214a and 216a in the open end edge zone of substrate 212 another surperficial sides (formation wheel rim).
In the step shown in Figure 75, the hole is formed pin 242 extract pin insertion hole 240a and 222a and metal level 226, the hole forms pin 244 and extracts pin insertion hole 240b and 224a and metal level 228.With an organic solvent remove plating mask material and plating mask layer 246 among pin insertion hole 240a and the 240b, separate the upper surface of electroplated electrode plate 240 and substrate 212 such as resin.Thereby can manufacture microlens array 210, this microlens array 210 has lens L on a first type surface of substrate 212 1To L 4, location pattern 218 and 220 and sheet metal 222 and 224, and with metal level 226 and 216 in pin insertion hole 222a and the continuous guide pin insertion holes 214 and 216 of 224a.
Because location pattern 218 and 220 is made by negative resist, therefore can not remove by organic solvent.Residual down location pattern 218 and 220 makes it can be used as and is arranged on substrate 212 upper surfaces and (is used to form lens L 1To L 4The surface) on the sept of optical devices (laser diode, photodiode etc.).
An example of Figure 77 to 79 expression sheet metal formation method.
In the step shown in Figure 77, by sputtering at by forming Cr layer 213 and Cu layer 215 on the first type surface of for example quartzy substrate of making 211 continuously.The thickness of Cr layer 213 and Cu layer 215 can be respectively 30nm and 300nm.Cr layer 213 is used to improve the secure adhesion of Cu layer 215, and Cu layer 215 is as electroplating kind of a layer.
Then, on the Cu layer, form resist layer 217 by photoetching.Forming resist layer 217 is in order to make the pin insertion hole 222a shown in Figure 79 increase its opening size gradually on top.Resist layer 217 has the circular flat pattern, and size (diameter) size of being a bit larger tham pin insertion hole 222a.After this, on the Cu layer, form resist layer 221, on resist layer 217, form corrosion-resisting pattern 221a by photoetching.That resist layer 221 has is corresponding with sheet metal 222 outer shape shown in Fig. 76, and around the circular hole 221A of corrosion-resisting pattern 217.Form corrosion-resisting pattern 221a, so that form the pin insertion hole 222a shown in Figure 76 and 79, and the circular flat pattern is identical substantially with pin insertion hole 222a with size (diameter).
In the step shown in Figure 78, by use resist layer 217 and 221 and corrosion-resisting pattern 221a as mask, implement the selection of Ni-Fe alloy and electroplate, on Cu layer 215, form the sheet metal 222 that the Ni-Fe alloy is made.Owing to there is resist layer 217, the electroplating velocity in the corrosion-resisting pattern 221a fringe region is slower, thereby the size of the pin insertion hole 222a of sheet metal 222 increases gradually on top.
In the step shown in Figure 79, remove resist layer 221, corrosion-resisting pattern 221a and resist layer 217 by chemical substance or additive method.Remove Cu layer 215 by etching, separating metal plate 222 and substrate 211.Thereby can obtain to have the sheet metal 222 of pin insertion hole 222a.Also can form the sheet metal 222 shown in Figure 73 with the sub-micrometer precision that is similar to sheet metal 222.By in the step shown in Figure 77, forming Cu layer 215, can reuse substrate 211 with Cu layer 213.
Another example of Figure 80 to 93 expression microlens array formation method.In the step shown in Figure 80, by upward forming position alignment mark 232 at a first type surface (upper surface) by for example quartzy transparency carrier of making 212 with the described identical mode of reference Figure 65 to 66.
Then, on the upper surface of substrate 212, form corrosion-resisting pattern R by photoetching 11To R 14And location against corrosion pattern 218 and 220.Use location alignment mark 232 is carried out described photoetching process as reference.Resist layer R 11To R 14Corresponding to four lens.Location pattern 218 has the planar annular pattern shown in Figure 76.The width m of alignment layers 218 can be 100 μ m, and the diameter a of its endoporus 218a can be 0.8mm.Form alignment layers 220 by the mode identical with alignment layers 218.
In the step shown in Figure 81, corrosion-resisting pattern R 11To R 24And location pattern 218 and the hot soft heat processing of 220 experience, make corrosion-resisting pattern have protruding spherical shape, and make location pattern broad ways have semicircle cross-sectional view.
In the step shown in Figure 82, on the upper surface of substrate 212, form protective seam 234 as the Kapton band, cover position alignment mark 232.This protective seam prevents that position alignment mark 232 is moved in the etching process shown in Figure 83.
In the step shown in Figure 83, by carrying out dry ecthing, with corrosion-resisting pattern R with the described identical mode of reference Figure 69 11To R 14The protruding spherical lens design transfer to the upper surface of substrate 212, form protruding spherical lens L 1To L 4By described etching process, also the circular pattern of alignment layers 218 and 220 is transferred to the upper surface of substrate 212, form circular orientation projection 258 and 260.Locator protrusions 258 and 260 has and location pattern 218 and 220 identical xsects shown in Figure 82, and its xsect of broad ways is semicircle.After dry etch process, remove protective seam 234, outside position alignment mark 232 is exposed to.
In the step shown in Figure 84, use the accurate DR of boring in the endoporus of circular orientation projection 258 and 260, to form half through hole 214A and 216A.The diameter of half through hole 214A and 216A is approximately equal to the diameter of bore (for example 0.8mm) of locator protrusions 258 and 260.
In the step shown in Figure 85, grind the lower surface of substrate 212, until the significant depth of half through hole 214A and 216A, half through hole 214A and 216A are become through hole 214a and 216a.Because the endoporus of through hole 214a and 216a and positioning convex 258 and 260 forms continuously, they can have the shape that increases gradually in the upper opening size in substrate 212 upper surfaces one side.By the process shown in Figure 85, can obtain on upper surface, to have lens L 1To L 4And locator protrusions 258 and 260, and from the upper surface to the lower surface, connect the through hole 214a of substrate 212 and the substrate 212 of 216a.
In the step shown in Figure 86, preparation is by for example quartzy mounting plate of making 262.On the upper surface of mounting plate 262, form shown in Figure 94 by the Cr layer 264a that stacks gradually from the bottom resist/Cu/Cr lamination 264 that Cu layer 264b and resist layer 264c constitute.Form Cu layer 264a and Cu layer 264b in the described identical mode of reference Figure 77 by sputter, thickness is respectively 30nm and 300nm.By applying formation thickness is the resist layer 264c of 2 μ m.By using resist layer 264c, the lower surface bonds of substrate shown in Figure 85 212 is arrived the upper surface of mounting plate 262 as adhesive linkage.Express this confined state among Figure 87.
In the step shown in Figure 87, coating resist layer 266 covers position alignment mark 232, lens L on the upper surface of substrate 212 1To L 4And through hole 214a and 216a.
In the step shown in Figure 88, exposure and development resist layer 266 make it patterning, and the formation resist pattern patrols 266a and 266b in through hole 214a and 216a.Corrosion-resisting pattern 266a and 266b are used to form the guide pin insertion holes 214 and 216 shown in Figure 92, and size (diameter) is less than through hole 214a and 216a.In developing process, shown in Figure 94, resist layer 264 is etched into around the annular of corrosion-resisting pattern 266a.Also form similar etching annular around corrosion-resisting pattern 266b.
In the step shown in Figure 89, on the upper surface of substrate 212, form resist layer 268, resist layer 268 covers position alignment mark 232, lens L 1To L 4, through hole 214a and 216a and corrosion-resisting pattern 266a and 266b.
In the step shown in Figure 90, exposure and development resist layer 268 make it patterning, and form corrosion-resisting pattern 268a and 268b (on corrosion-resisting pattern 266a and 266b) in through hole 214a and 216b.Corrosion-resisting pattern 268b is used to form an opening 214p of guide pin insertion holes shown in Figure 94 214, and size (diameter) is slightly smaller than corrosion-resisting pattern 266a, thereby opening 214p increases gradually in upper dimension (diameter).This situation for corrosion-resisting pattern 268b also is suitable for.Resist layer 266a is similar to forming shown in Figure 94, in developing process, resist layer 264c is etched into around the annular of corrosion-resisting pattern 266a.Also form the resist layer 264c that is etched into annular around corrosion-resisting pattern 266b.
By the developing process shown in Figure 88 and 90, below corrosion-resisting pattern 266a, there is the isolated part 264co of resist layer 264c.Because the excircle of the resist layer 264c below the corrosion-resisting pattern 266a is by subsidiary etching, the size of corrosion-resisting pattern 264co (diameter) Q is slightly smaller than corrosion-resisting pattern 266a.Because the inner periphery of resist layer 264c is by subsidiary etching below the corrosion-resisting pattern 266a, the size (diameter) of resist layer 264c endoporus is greater than through hole 214a.The size Q of corrosion-resisting pattern 264co is for example 0.7mm.The size of corrosion-resisting pattern 268 (diameter) P is a bit larger tham the size Q (P＞Q) of corrosion-resisting pattern 264co.Temperature conditions during according to bonding resist layer 64c might neither attach the excircle of etching corrosion-resisting pattern 264co, also the inner periphery of not etching resist layer 264c.In this case, shown in Figure 90, through hole 214a is vertical with the 216b lower shape.The etching state of corrosion-resisting pattern 266b bottom is identical with the state of above-mentioned corrosion-resisting pattern 266a.
In the step shown in Figure 91, by using substrate 212 and corrosion-resisting pattern 266a, 266b, 268a and 268b carry out for example selection of Ni-Fe alloy and electroplate as mask, form the metal level 272 and 274 that the Ni-Fe alloy is made in through hole 214a and 216a.Express the plating state of through hole 214a among Figure 94.Form metal level 272, cover the inwall of through hole 214a, and have the corresponding guide pin insertion holes 14 of overall diameter of size (diameter) and corrosion-resisting pattern 266a.
On the surface of substrate 212, form the inner circumference area (zone that opening size increases gradually) that covers locator protrusions 258, and have the metal level 272 of the corresponding opening 214p of overall diameter of size (diameter) and corrosion-resisting pattern 268a.When forming the inner circumference area of metal level 272 covering locator protrusionss 258, owing to have corrosion-resisting pattern 266a around corrosion-resisting pattern 268a, the plating growth course is slower, thereby the opening size of metal level 272 (diameter) increases gradually on top.
On another surface of substrate 212, form metal level 272 and cover the edge of opening zone (formation wheel rim) of through hole 214a, and have and the corresponding opening 214q of the overall diameter of corrosion-resisting pattern 264co.Opening 214q forms another opening of guide pin insertion holes 214.The plating state of corrosion-resisting pattern 266b and 268b near zone is with identical with the described plating state of 268b with reference to corrosion-resisting pattern 266a.
In the step shown in Figure 92, remove corrosion-resisting pattern 268a by chemical substance or additive method, 268b, 266a and 266b form the metal level 272 and 274 with guide pin insertion holes 214 and 216.At this moment, equally also remove the resist layer 64co shown in Figure 94.
In the step shown in Figure 93, etching is also removed the Cu layer 246b shown in Figure 94, separating base plate 212 and mounting plate 262.Remove the resist layer 264c shown in Figure 94 by chemical substance or additive method.As shown in Figure 93, has lens L thereby can produce on a first type surface of substrate 212 1To L 4, locator protrusions 258 and 260, and guide pin insertion holes 214 that is formed among substrate 212 through hole 214a and the 216a and limits by metal level 272 and 274 and 216 microlens array.
With identical shown in Figure 63 and 64, by pilot pin being inserted in guide pin insertion holes 214 and 216, the microlens array that step shown in Figure 93 obtains can be coupled with another optical devices.Owing to use film formation process, can form the size and the position of guide pin insertion holes 214 accurately with opening 214p and 214q.
When pilot pin inserts and extracts guide pin insertion holes such as pin 214, pilot pin and for example metal layer contacting of layer 272.Thereby can prevent the open end generation splitting of the through hole such as the hole 214a of quartz base plate 212.Metal level such as layer 226 ends at the wheel rim place that is layered on the one side locator protrusions 258 of 212 1 surfaces of substrate, and ends at the wheel rim place that is layered on substrate 212 another surperficial side through hole open end edge zones.Metal level such as layer 272 in the time of can preventing the pilot pin insertion or extract guide pin insertion holes is moved.Because the size of opening 214p increases gradually on top, and opening size is a bit larger tham opening 214p, is easy to pilot pin is inserted in guide pin insertion holes such as the hole 214.
Figure 95 represents a kind of modification of microlens array plating area.With components identical shown in Figure 94 with identical Reference numeral and symbolic representation, and omit its detailed description.
The difference of plating area shown in plating area shown in Figure 95 and Figure 94 is, is not to form locator protrusions 258 on a surface of substrate 212, and is formed on the opening 212a of the through hole 214a that the upper opening size increases gradually.
Form opening 212a by following manner.After the etching process shown in Figure 83, in the step shown in Figure 84, use resist layer and position alignment mark 232 to determine the hole site by photoetching as a reference.Use the accurate DR of boring to form half through hole at place, determined hole site.After forming resist layer, the openend bight of half through hole that exposes, the openend bight of using this resist layer to remove described half through hole as mask by etching obtains opening 212a.Following step is with identical with reference to the described step of Figure 85 to 93.In the step shown in Figure 85, be not to form half through hole, and can use resist layer to form half through hole by the selectivity dry ecthing as mask with accurate boring.Use location alignment mark 232 forms this resist layer by photoetching as a reference.
After forming the metal level 272 that covers plating area opening 212a shown in Figure 95, owing to there is corrosion-resisting pattern 266a near corrosion-resisting pattern 268a, the opening size of metal level 272 (diameter) increases gradually on top, thereby the plating growth is slower.The operation of the guide pin insertion holes 214 shown in Figure 95 in the plating area and effect and identical with effect with reference to the 214 described operations of guide pin insertion holes in the plating area shown in Figure 94.
Figure 96 represents contact probe according to another embodiment of the present invention, and Figure 97 represents the xsect of making along the line B-B ' shown in Figure 96.Contact probe is used for checking and assessing LSI etc.
Contact probe 280 has the trapezoidal probe substrate 282 that aluminium is for example made.Substrate 282 has guide pin insertion holes 284 and 286.On a first type surface of substrate 282, form the alignment layers of making by for example resist 288 and 290 near the long limit in two parallel edges.Shown in Figure 97,, form the through hole 284a that runs through substrate 282 from a first type surface to another first type surface at the middle section of alignment layers 88.Middle section at alignment layers 290 also forms the similar through hole (not shown) with through hole 284a.
On a first type surface of substrate 282, annular metal sheet 292 and 294 is assemblied in the endoporus of alignment layers 288 and 290.Shown in Figure 97, metal level 296 covers the inwall of through hole 284a, and limits guide pin insertion holes 284.Similar to the inwall of through hole 284a, metal level 298 covers the inwall of the through hole that forms in alignment layers 290 middle sections, and limits guide pin insertion holes 286.On first type surface one side of substrate 282, metal level 296 and 298 and sheet metal 292 and 294 form continuously.Metal level 296 covers the fringe region (metal level formation wheel rim) of the opening of through hole 284a substrate 282 another first type surface one sides, and metal level 298 also covers the fringe region (metal level formation wheel rim) of the opening of through hole 284a substrate 282 another first type surface one sides.
On another surface of substrate 282, form ten contact plugs 300 that stretch out from two parallel short sides, one side, and formation and the integrated wiring layer of contact plug.For example, each contact plug and each lead are made by the Ni-Fe alloy.
Being exemplified below of the size of contact probe 280.The length M on long limit is 20mm in 282 liang of parallel edges of substrate, and the length N on the limit between two parallel edges is 15mm, and thickness q is 1mm.The thickness t of alignment layers such as layer 288 is 80 μ m, and the spacing p between the adjacent contact pin 300 (distance between the adjacent contact pin center) is 40 μ m.
By using, can accurately determine the guide pin insertion holes 284 of contact probe 280 and 286 size and position with reference to the described step of Figure 68 to 69.Perhaps, can be by using size and the position of accurately determining guide pin insertion holes 284 and 286 with reference to the described step of Figure 84 to 85.
By pilot pin is inserted in the guide pin insertion holes hole and the guide pin insertion holes of feeler arm in, contact probe 280 can be installed on the feeler arm.Guide pin insertion holes 284 and 286 operations that can realize and effect are with identical with effect with 216 described operations with reference to guide pin insertion holes 214.Especially effectively, can prevent to insert pilot pin or extract pilot pin so that the guide pin insertion holes 284 that causes when changing contact probe 280 and the splitting of 286 openends.
Figure 98 is the decomposition diagram of electrophoresis analyzer according to another embodiment of the present invention.The protein that electrophoresis analyzer is used at a high speed, minute quantity is analyzed on high resolution ground, nucleic acid etc.
Electrophoresis analyzer 310 has photodetector 312, cylindrical lens 320, electrophoretic microchip 340 and cylindrical lens 370.Photodetector 312 has the photovoltaic cell arrays 314 and some terminals 316 that link to each other with photovoltaic cell arrays 314 at the place, side of shell 312A that is arranged in the shell 312A.
Cylindrical lens 320 has the lens 312 that are formed on rectangular lens substrate (transparency carrier) 320A.Forming guide pin insertion holes 324 and 326 near two bights by substrate 320A on the diagonal line.Guide pin insertion holes 324 is identical with the guide pin insertion holes 314 and 316 shown in Figure 64 with 326 cross-sectional structure.The alignment layers that Reference numeral 328 and 330 expressions are made by for example resist.Reference numeral 332 and 334 expressions are installed in the sheet metal in alignment layers 328 and 330 endoporus.The metal level of Reference numeral 336 and two through-hole walls of 338 expression covered substrate 320A.Similar to the metal level 226 shown in Figure 64, metal level 336 and 338 and first type surface of substrate 320A on sheet metal 332 and 334 form and the edge of opening zone of two through holes on another first type surface of covered substrate 320A continuously.
Microchip 340 has chip substrate (transparency carrier) 340A that is made of two transparent panels that are layered on another.The surface of first transparent panel be formed with one become mildewed stria 342 and with continuous undercoat stria 344a and the 344b of the stria 142 of becoming mildewed.Second transparency carrier has the end with capillary channel 342, the end of capillary channel 344a, liquid storage hole 346a, 346b, 346c and 346d that the end of capillary channel 344b and the other end of capillary channel 342 communicate.Second transparent panel is layered on first transparent panel, and by keeping communicating to be fixed to first substrate between described groove and the hole.
Rectangular dies substrate 340A has guide pin insertion holes 348 and 350 in guide pin insertion holes 324 and 326 corresponding positions with lens substrate 320A.Guide pin insertion holes 348 is identical with the guide pin insertion holes 214 and 216 shown in Figure 64 with 350 cross-sectional structure.The alignment layers that Reference numeral 352 and 354 representatives are made by for example resist.Reference numeral 356 and 358 representatives are installed in the sheet metal in alignment layers 352 and 354 endoporus.Reference numeral 360 and 362 is represented the metal level of two through-hole walls of covered substrate 340A.Similar to the metal level 226 shown in Figure 64, metal level 360 and 362 and first type surface of substrate 340A on sheet metal 356 and 358 connect, and cover the edge of opening zone of two through holes on another first type surface of substrate 340A.
Cylindrical lens 370 has the lens 372 that are formed on rectangular lens substrate (transparency carrier) 370A.Form guide pin insertion holes 374 and 376 in guide pin insertion holes 348 and 350 corresponding positions with chip substrate 340A.Guide pin insertion holes 374 is identical with the pin insertion hole 214 and 216 shown in Figure 64 with 376 cross-sectional structure.The alignment layers that Reference numeral 378 and 380 representatives are made by for example resist.Reference numeral 382 and 384 representatives are installed in the sheet metal in alignment layers 378 and 380 endoporus.Reference numeral 386 and 388 is represented the metal level of two through-hole walls of covered substrate 370A.Identical with the metal level 126 shown in Figure 64, metal level 386 and 388 and first type surface of substrate 370A on sheet metal 382 and 384 continuous, and cover the edge of opening zone of two through holes on another first type surface of substrate 370A.
Being exemplified below of the size of microchip 340.The length L of substrate 340 is 60mm, and width W is 30mm, and the diameter and the degree of depth in liquid storage hole such as hole 346 are 1mm, and the width of capillary channel and the degree of depth are respectively 50 μ m and 10 μ m, and the interior diameter in guide pin insertion holes such as hole 348 is 1mm.The interior diameter in the hole 374 of the interior diameter in the hole 348 of guide pin insertion holes such as substrate 320A and guide pin insertion holes such as substrate 370A is 1mm.
Can accurately form cylindrical lens 320 and 370 and the guide pin insertion holes 324,326,348,350,374 and 376 of microchip 340 by the step shown in Figure 70 and 79.Perhaps, can accurately form guide pin insertion holes 324,326,348,350,374 and 376 size and position by the step shown in Figure 84 to 95.
When assembling electrophoresis analyzer 310, the first pilot pin (not shown) is inserted guide pin insertion holes 324, sept S 1Hole S 11, guide pin insertion holes 348, sept S 3Hole S 31In guide pin insertion holes 374, and the second pilot pin (not shown) is inserted guide pin insertion holes 326, sept S 2Hole S 21, guide pin insertion holes 350 and sept S 4Hole S 41In.Under this insertion state, cylindrical lens 320 and microchip 340 are arranged close to each other, and sept S 1And S 2Be arranged between them, and microchip 340 is arranged close to each other with cylindrical lens 370, and sept S 3And S 4Be arranged between them.Under this position alignment and adjacent states, with cylindrical lens 320, microchip 340 and cylindrical lens 370 are fixed together by the stationary installation (not shown).Afterwards, with cylindrical lens 320, photodetector 312 couplings of the fixation kit of microchip 340 and cylindrical lens 370 and lens 320 1 sides.
If the width of capillary channel such as groove 342 is about 50 μ m, then requiring the position alignment precision of each cylindrical lens such as lens 320 relative microchips 340 is a few μ m or littler.By as mentioned above pilot pin is inserted guide pin insertion holes 324,348 and 374 and guide pin insertion holes 326,350 and 376 in, aim at desired location, then can realize each lens such as lens 320 relative chip more than 340 μ m or littler position alignment precision.
When using electrophoresis analyzer 310, wherein any one flows into capillary channel 342 to electrophoresis liquid from liquid storage hole 346a to 346d, among 344a and the 344b.After wherein any one supplies with sample by liquid storage hole 346b and 346c, electrode is inserted among liquid storage hole 346b and the 346c, apply the high pressure of the schedule time, sample is disperseed in capillary channel 344a and 344b.Afterwards, electrode is inserted among liquid storage hole 346a and the 346b, apply electrophoretic voltage, make sample in capillary channel 342, electrophoresis take place.
In this state, parallel ultraviolet line UV is incided on the capillary channel 342 through cylindrical lens 370, and the light through groove 342 is incided on the photovoltaic cell arrays 314 through cylindrical lens 320.Photovoltaic cell arrays 314 detects the absorption of ultraviolet light, and detects target component.After this analysis, cylindrical lens 320 and 370 and the assembly of microchip 340 and photodetector disconnect, and pull down stationary installation.Then, from guide pin insertion holes 324,348 and 374 and guide pin insertion holes 326,350 and 376 extract pilot pin, this assembly is resolved into element, as lens 320 and 370 and chip 340, and clean.Guide pin insertion holes 324,326,348,350,374 with 376 operation and effect can be identical with foregoing pilot pin 214 and 216.Especially effectively, can prevent that the different pin insertion hole open end office that pilot pin causes when inserting or extracting from splitting taking place.
In conjunction with most preferred embodiment the present invention has been described.But the invention is not restricted to top embodiment.Those skilled in the art obviously can make other multiple modification, improvement, combination etc.

Claims (33)

1. microlens array comprises:
One transparency carrier is formed with a plurality of lens on a first type surface of described substrate; With
With the coupling of described substrate, setting element with a plurality of guide pin insertion holes.
2. microlens array according to claim 1, wherein said substrate and described setting element have a kind of assembly structure that allows described substrate and described setting element to be fixed together and to be mounted or to dismantle.
3. microlens array according to claim 2, wherein said assembly structure have a pin and a pin accommodation hole that is used to hold described pin.
4. microlens array according to claim 3, wherein said pin accommodation hole is taper in pin guide openings one side.
5. microlens array according to claim 1, wherein said a plurality of guide pin insertion holes are towards the equal increased in size gradually of first type surface direction of described substrate.
6. microlens array according to claim 1 wherein also comprises:
One has the fiber array of location pilot pin guide hole; With
Insert the pilot pin of described guide pin insertion holes and described pilot pin guide hole.
7. microlens array according to claim 1, wherein:
Described a plurality of lens are arranged to delegation, and the line that makes the described a plurality of lens centers of connection is the straight line on the described first type surface;
Another first type surface of described substrate is formed with the inclined-plane, is used to guide the light that is incident on described a plurality of lens, and reflexes to the direction different with the array direction of described a plurality of lens from this; And
Described a plurality of guide pin insertion holes is formed on the lens arra both sides that comprise described a plurality of lens, the center of described a plurality of guide pin insertion holes is arranged on departs from a certain amount of position of described straight line, and the amount of each lens center of optical axis deviation that described amount and described inclined-plane cause is corresponding.
8. microlens array comprises:
One transparency carrier is formed with a plurality of lens on a first type surface of described substrate; With
One coupling plate that is made of metal, have the lamination area that is layered on the described first type surface and extend continuously and be not layered in non-lamination area on the described first type surface from described lamination area, described lamination area has and the corresponding transparent window of described a plurality of lens, and described non-lamination area has a plurality of guide pin insertion holes.
9. microlens array according to claim 8, wherein said coupling plate is fixed to described substrate.
10. microlens array according to claim 9, wherein said a plurality of guide pin insertion holes are towards the equal increased in size gradually of described coupling plate and described substrate opposed major surfaces one side.
11. microlens array according to claim 9, wherein:
Described a plurality of lens are arranged to delegation, and the line that makes the described a plurality of lens centers of connection is the straight line on the described first type surface;
Another first type surface of described substrate is formed with the inclined-plane, is used to guide the light that is incident on described a plurality of lens, and reflexes to the direction different with the array direction of described a plurality of lens from this; And
Described a plurality of guide pin insertion holes is formed on the lens arra both sides that comprise described a plurality of lens, the center of described a plurality of guide pin insertion holes is arranged on described straight line departs from a certain amount of position, and the amount of each lens center of optical axis deviation that described amount and described inclined-plane cause is corresponding.
12. microlens array according to claim 9 wherein also comprises:
One has the fiber array of location pilot pin bullport; With
Be used to be inserted into the pilot pin of described guide pin insertion holes and described pilot pin bullport.
13. a microlens array comprises:
One has the transparency carrier of a plurality of lens and a plurality of metal rigging pilotages, and described lens and rigging pilotage are respectively formed on the first type surface of described substrate; With
One coupling plate that is made of metal, has the lamination area that is layered on the described first type surface, with extend continuously from described lamination area and be not layered in non-lamination area on the described first type surface, described lamination area have with the corresponding transparent window of described a plurality of lens and with the corresponding a plurality of pilot holes of described a plurality of rigging pilotages, described non-stacked a plurality of guide pin insertion holes that have, and by described a plurality of rigging pilotages are installed in the described pilot hole, described lamination area is layered on the described first type surface, and described coupling plate is installed on the described substrate.
14. microlens array according to claim 13, wherein said a plurality of being assemblied in towards the described coupling plate first type surface of described substrate one side direction increased in size gradually.
15. microlens array according to claim 13, wherein said a plurality of guide pin insertion holes are towards the equal increased in size gradually of the first type surface direction of the described coupling plate of described substrate one side.
16. the device with guide pin insertion holes comprises:
The one nonmetal substrate of making and having the through hole of the guide pin insertion holes of being used to form; With
One covers the metal level of each described through-hole wall, forms the guide pin insertion holes of size less than described clear size of opening.
17. the device with guide pin insertion holes according to claim 16, wherein:
One has size is arranged on two first type surfaces of described substrate on one of them less than the sheet metal of the pin insertion hole of described clear size of opening, described sheet metal covers the fringe region of an openend of described through hole, and the position of described pin insertion hole and described through-hole alignment; With
Described metal level and described sheet metal form continuously, and cover described through hole another edge of opening zone on another first type surface of described substrate.
18. the device with guide pin insertion holes according to claim 16 wherein forms described metal level the fringe region that covers the opening of described through hole on two first type surfaces of described substrate.
19. the manufacture method of a microlens array comprises step:
(a) transparency carrier of preparation is formed with a plurality of lens on a first type surface of described substrate;
(b) form plating kind of a film on this first type surface of described substrate, described plating kind film is around described a plurality of lens;
(c) on described plating kind film, form metal coupling plate by selecting to electroplate, and described coupling plate has and the corresponding transparent window of described a plurality of lens and a plurality of guide pin insertion holes; And
(d) remove the described substrate that is layered on described a plurality of guide pin insertion holes, thereby open described a plurality of guide pin insertion holes in described substrate one side.
20. fabricating method of microlens array according to claim 19, wherein said step (c) limits in the opening of mask in the plating area that comprises plating area qualification guide pillar, plating on described plating kind film, described plating area limits guide pillar separates with described plating kind film, and diameter is identical with the diameter of pilot pin.
21. not limiting under the guide pillar in described plating area and limit guide pillar around the plating area, fabricating method of microlens array according to claim 20, wherein said step (b) form described plating kind film.
22. fabricating method of microlens array according to claim 20, wherein after forming described plating kind film, described step (b) limits under the guide pillar and limits guide pillar around described plating area and forms thin corrosion-resisting pattern in described plating area.
23. the manufacture method of a microlens array comprises step:
Prepare a transparency carrier, on a first type surface of described substrate, have a plurality of lens;
By forming a plurality of grooves on the first type surface selecting to be etched in described substrate; And
Grind another first type surface of the described B.B.P of described a plurality of grooves, described a plurality of grooves are become a plurality of guide pin insertion holes.
24. fabricating method of microlens array according to claim 23, it is characterized in that, also be included in and form after described a plurality of grooves, before grinding another first type surface of described substrate, by select etching make each opening of described a plurality of groove on top the step of increased in size gradually.
25. the manufacture method of a microlens array comprises step:
(a) preparation one transparency carrier and a coupling plate, described transparency carrier has the rigging pilotage that a plurality of lens and a plurality of plated metal are made, described lens and rigging pilotage are respectively formed on the first type surface of described substrate, and described coupling plate is made by plated metal, and has a lamination area that is layered on the described first type surface, with extend continuously from described lamination area and be not layered in non-lamination area on the described first type surface, described lamination area has and the corresponding transparent window of described a plurality of lens, with with the corresponding a plurality of pilot holes of described a plurality of rigging pilotages, described non-lamination area has a plurality of guide pin insertion holes; And
(b), described lamination area is layered on the described first type surface, and described coupling plate is installed on the described substrate by described a plurality of rigging pilotages are installed in described a plurality of pilot hole.
26. fabricating method of microlens array as claimed in claim 25, wherein said step (a) form on a virtual substrate and electroplate kind of film and the plating area limits mask, and on described plating kind film plating.
27. fabricating method of microlens array according to claim 26, wherein said step (a) is comprising that plating area that the plating area limits guide pillar limits in the opening of mask plating on described plating kind film, described plating area limits guide pillar separates with described plating kind film, and diameter is identical with the diameter of a pilot pin.
28. not limiting under the guide pillar and limit guide pillar around described plating area in described plating area, fabricating method of microlens array according to claim 27, wherein said step (a) do not form described plating kind film.
29. fabricating method of microlens array according to claim 27, wherein after forming described plating kind film, described step (b) limits under the guide pillar and limits guide pillar around described plating area and forms thin corrosion-resisting pattern in described plating area.
30. the manufacture method with device of guide pin insertion holes comprises:
Preparation one is by the nonmetal substrate of making and having the through hole that is used to constitute guide pin insertion holes;
To have size and be arranged on two first type surfaces of described substrate on one of them less than the sheet metal of the pin insertion hole of described through hole, described sheet metal covers the fringe region of an opening of described through hole, and the position of described pin insertion hole and described through-hole alignment, and nonmetal hole of making is set forms pin, the hole is formed pin be arranged to when described hole forms the described pin insertion hole of the described sheet metal of pin insertion, described hole forms pin and extends by described through hole another first type surface in two first type surfaces of described substrate;
Use described sheet metal as electroplating kind of a film, carry out the metal plating process, form the metal level that described through-hole wall was made and covered to plated metal, described plated metal is set by the way, and formation pin in hole is set by the way; And
Unload described hole formation pin from the described pin insertion hole of described sheet metal and described metal level, formation has size forms the guide pin insertion holes of pin size corresponding to described hole described metal level.
31. the manufacture method with device of guide pin insertion holes according to claim 30, the described pin insertion hole of described sheet metal used in the step of described sheet metal wherein is set, towards described sheet metal and described through hole one side facing surfaces direction increased in size gradually.
32. the manufacture method with device of guide pin insertion holes comprises:
On a first type surface of mounting plate, form and electroplate kind of a layer;
Will be by adhesive linkage by the nonmetal substrate of through hole and the described plating kind layer bonding of making and having the guide pin insertion holes of being used to form, and described substrate is fixed on the described mounting plate;
Formation is less than each described clear size of opening and than the thick resist layer of thickness between two first type surfaces of substrate described in the described through hole, make described substrate be fixed to described mounting plate, and use described resist layer to remove the described adhesive linkage that centers on described resist layer selectively as mask, the part of described plating kind layer exposed become pattern around described resist layer and the described adhesive linkage part below the remaining described resist layer;
As mask, plating on described plating kind layer forms the metal level of being made and covered described through-hole wall by plated metal by the described adhesive linkage part below described resist layer, described resist layer, described adhesive linkage and described substrate;
By removing described resist layer and described adhesive linkage part, form described metal level with guide pin insertion holes;
Remove described plating kind layer, separate described mounting plate and the described substrate with described metal level, described metal level has guide pin insertion holes.
33. the manufacture method with device of guide pin insertion holes according to claim 32, wherein described substrate is being fixed to described substrate used in the described step of described mounting plate, be fixed to the first type surface direction of the relative example of described mounting plate one side with described substrate, each equal increased in size gradually in the described through hole at described substrate.
CNA2003101045707A 2002-10-04 2003-10-04 Lenticular array and manufacturing method thereof Pending CN1497282A (en)

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CN103675958A (en) * 2012-09-04 2014-03-26 菱光科技股份有限公司 Lens array module and production method thereof
CN109807720A (en) * 2019-03-27 2019-05-28 哈尔滨工业大学 A kind of model accepted way of doing sth processing method of microlens array optical element
CN109807720B (en) * 2019-03-27 2021-09-17 哈尔滨工业大学 Generating type processing method of micro-lens array optical element
CN110398792A (en) * 2019-07-22 2019-11-01 北京理工大学 A kind of microlens array grinding device and method

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