CN101362303A - Grinding method combining mechanical reciprocation and supersonic vibration - Google Patents
Grinding method combining mechanical reciprocation and supersonic vibration Download PDFInfo
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- CN101362303A CN101362303A CNA2008101965603A CN200810196560A CN101362303A CN 101362303 A CN101362303 A CN 101362303A CN A2008101965603 A CNA2008101965603 A CN A2008101965603A CN 200810196560 A CN200810196560 A CN 200810196560A CN 101362303 A CN101362303 A CN 101362303A
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Abstract
The invention relates to a composite grinding method of mechanical reciprocation and ultrasonic vibration. The superposition method of the mechanical reciprocation vibration and the ultrasonic vibration is adopted in the grinding procedure to drive the identical grinding head to grind the surface of a processed work piece, wherein, the mechanical reciprocation vibration and the ultrasonic vibration are superposed according the following motion parameters: the mechanical reciprocation vibration direction and the ultrasonic vibration direction are coaxially superposed, or the mechanical reciprocation vibration direction and the ultrasonic vibration direction are superposed inside the plane parallel to the surface of the processed work piece with an included angle; the frequency of the mechanical reciprocation vibration is 30 Hz to 300 Hz, and the frequency of the ultrasonic vibration is 20 KHz to 50 KHz; the amplitude of the mechanical reciprocation vibration is 0.1 to 10 mm, and the amplitude of the ultrasonic vibration is 0.02 to 0.05 times of the mechanical reciprocation vibration. The grinding method solves the problem that only the polishing of the work piece with a large area can be realized by the existing mechanical reciprocation grinding polishing, and only the polishing of the surface with a small area such as a corner, a slit, a narrow side, a quirk, and a die cavity with complex shape can be realized by the ultrasonic grinding polishing, and the grinding efficiency is low.
Description
Technical field
The invention belongs to surface of the work polishing processing technique field, be specifically related to the reciprocal and compound Ginding process of ultrasonic vibration of a kind of machinery, this combined method of lapping especially is fit to portable grinder to be used.
Background technology
The develop rapidly of modern industry is had higher requirement to the surface quality of workpiece, and surface quality not only influences the outward appearance of workpiece, also directly influences the serviceability and the life-span of workpiece, and the quality of surface quality is even more important concerning mould.Mould is to carry out a kind of instrument that part is made in the mode of rerunning a movie, and surface roughness has become the important symbol of weighing the mould product quality, has only the roughness of die surface low, could make with the roughness value of its product processed also low.Therefore grinding and polishing has become the important means of some vital part Surface Machining in mould, engineering machinery, Medical Devices and the aerospace industry.
Now, the processing of the shape on mold cavity surface has realized automation basically.In order to remove tool marks or the hardened layer that machining or spark machined stay on the mold cavity surface, after geometry processing, must carry out grinding and polishing processing, in the hope of obtaining desired size, shape, positional precision and surface roughness to the mold cavity surface.Grinding and polishing accounts for the 30%-50% of entire die manufacturing time its process time as one important procedure of die surface processing, and its cost accounts for the 5%-30% of complete manufacturing cost.Grinding and polishing has become the bottleneck in the die manufacture.
The most frequently used Ginding process is the reciprocal grinding and polishing of armstrong's patent at present, secondly is the ultrasonic wave grinding and polishing.The reciprocal grinding and polishing of machinery will be finished the grinding and polishing to a workpiece to be ground, at least will be through 5～12 road grinding steps, the bistrique of a kind of single material of employing is equipped with the abrasive material of single particle diameter in the per pass operation, grind according to rule from coarse to fine, the material that is bistrique is successively from firmly to soft, the particle diameter of abrasive material successively from big to small, after finishing preceding one grinding step, change the more preceding once soft slightly bistrique of a kind of material and be equipped with the slightly little abrasive material of particle diameter and grind, finally reach grinding effect by that analogy.And the reciprocal grinding and polishing of machinery utilizes the universal rotation of its bistrique, can realize the polishing processing special-shaped curved to the bigger mold cavity of area, this method has simply, low cost and other advantages, but because of mechanical double vibrations frequency lower, make that this method working ability is relatively poor, production efficiency is lower, and labour intensity is bigger.
The ultrasonic wave grinding and polishing, as shown in Figure 1, be to utilize supersonic generator 1 to produce certain energy (supersonic frequency electric current of 20～50KHz), through transducer potsherd 2 these supersonic frequency current conversion are become the supersonic frequency mechanical oscillation, and these supersonic frequency mechanical oscillation are amplified by luffing bar 3, pass to again on the bistrique 4 that is fixed on luffing bar 3 ends, make bistrique 4 by certain frequency vibration, impact and rubbing down workpiece surface to be machined, and in the per pass grinding step, adopt different bistrique and abrasive material, to reach grinding effect.The ultrasonic wave grinding and polishing adopts the fixedly dither of bistrique, produce high efficiency grinding function, but because of its bistrique displacement too little (about 1～5 μ m), so its range of application is narrower, can only realize the corner, the slit, narrow limit, the polishing processing that deep trouth and the complex-shaped reciprocal polisher lapper of machineries such as mold cavity surface can not be handled than small size, and when large-area surface of the work ground, then can not guarantee the flatness and the fineness on processing work surface, thereby make that the use occupation rate of Ultrasonic Vibration Lapping polishing in whole polishing field only is 2%～5%, therefore the effect of ultrasonic wave dither can not be fully played, and uses to exist significant limitation.
Therefore how to solve the limitation of existing abrasive polishing method, promptly the reciprocal grinding and polishing of machinery can only be realized the polishing of large tracts of land workpiece, and the ultrasonic wave grinding and polishing can only be realized the polishing than small size of some corners, slit, narrow limit, deep trouth and complex-shaped mold cavity surface, make and the problem that grinding efficiency is low become the present invention's content of research emphatically.
Summary of the invention
The object of the invention provides the reciprocal and ultrasonic vibration combined method of lapping of a kind of machinery, can only realize the polishing of large tracts of land workpiece to solve the reciprocal grinding and polishing of existing machinery, and the ultrasonic wave grinding and polishing can only be realized the polishing than small size of some corners, slit, narrow limit, deep trouth and complex-shaped mold cavity surface, and the low problem of grinding efficiency.
For achieving the above object, the technical solution used in the present invention is: the reciprocal and compound Ginding process of ultrasonic vibration of a kind of machinery, the mode that adopts mechanical double vibrations and ultrasonic vibration to superpose in grinding step drives same bistrique the processing work surface is ground, wherein, mechanical double vibrations and ultrasonic vibration superpose by following kinematic parameter:
(1) direction of motion stack
The machinery vibration-direction is coaxial stack with the ultrasonic vibration direction, and perhaps mechanical vibration-direction and ultrasonic vibration direction are the angle stack in the plane that is parallel to the processing work surface;
(2) frequency stack
The reciprocating frequency of machinery is 30 hertz～300 hertz, and the frequency of ultrasonic vibration is 20 KHzs～50 KHzs;
(3) amplitude stack
The reciprocating amplitude of machinery is 0.1～10 millimeter, and the amplitude of ultrasonic vibration is 0.02～0.05 times that machinery moves back and forth amplitude.
Related content in the technique scheme is explained as follows:
1, in the such scheme, the angle of described mechanical vibration-direction and ultrasonic vibration direction is acute angle, obtuse angle or right angle.And when mechanical vibration-direction is coaxial stack with the ultrasonic vibration direction, its grinding effect the best.
2, in the such scheme, described machinery moves back and forth and the frequency of ultrasonic vibration is respectively 58 hertz～108 hertz and 21 KHzs～39 KHzs.
3, in the such scheme, described " same bistrique " refers to employed bistrique when machinery is reciprocal to be ground, and this bistrique is doing reciprocating linear motion simultaneously, and the grinding tool on its bistrique is around self center rotation.
Operation principle of the present invention is: on the main shaft of the linear reciprocating motion mechanism of hand-ground polishing machine, coaxial stack ultrasonic generator, or ultrasonic generator is on the main shaft that angle is superimposed upon mechanical reciprocating mechanism in the plane that is parallel to the processing work surface, the mode that adopts mechanical double vibrations and ultrasonic vibration to superpose in grinding step drives same bistrique the processing work surface is ground, this bistrique is done the bigger reciprocating motion of amplitude under the drive of mechanical linear reciprocating motion main shaft; Simultaneously, start supersonic generator and send ultrasonic signal, ultrasonic vibration is reached bistrique, impel bistrique, improve the grinding efficiency of mechanical linear reciprocating motion by certain frequency vibration, impact and rubbing down workpiece surface to be machined through ultrasonic transducer; Simultaneously, ultrasonic vibration is superimposed upon the reciprocating motion of carrying out on the bistrique than large amplitude, makes grinding efficiency and quality be further improved.In whole process of lapping, ultrasonic vibration and machinery move back and forth the multiple grinding surface of the work, and integrated ultrasonic vibration is ground and machinery moves back and forth the correlation properties of grinding.Its movement locus is on the spiral feeding mill of bistrique track, stack ultrasonic vibration and mechanical reciprocating straight reciprocating motion track, and grinding precision and Grinding Quality all are greatly improved.
Because the technique scheme utilization, the present invention compared with prior art has following advantage and effect:
1, the present invention adopts the mode of mechanical double vibrations and ultrasonic vibration stack to drive same bistrique in grinding step the processing work surface is ground, overcome machinery in the past back and forth and ultrasonic vibration act on the limitation on bistrique grinding processing work surface separately, can finish efficiently the corner, the slit, narrow limit, the polishing processing that deep trouth and the complex-shaped reciprocal polisher lapper of machineries such as mold cavity surface can not be handled than small size, also can finish polishing processing efficiently, guarantee the flatness and the fineness on processing work surface large tracts of land mold cavity surface.Give full play to ultrasonic vibration and the reciprocal effect of machinery, enlarged its scope of application.
2, the present invention adopts the mode of mechanical double vibrations and ultrasonic vibration stack to drive same bistrique in grinding step the processing work surface is ground, reciprocal and ultrasonic vibration acts on bistrique grinding processing work surface separately to its grinding efficiency with respect to machinery, improve 10～50 times, and improved the grinding and polishing quality and the effect of whole work-piece grinding and polishing face type.
3, the present invention back and forth grinds effective composite ultraphonic ripple grinding technique on the basis at machinery, by the linear reciprocating motion and the ultrasonic vibration of bistrique, improves grinding efficiency and grinding precision.
Description of drawings
Accompanying drawing 1 is a ultrasonic wave grinding and polishing vibration principle schematic diagram;
The hand-ground polishing machine structural representation that accompanying drawing 2 adopts for the embodiment of the invention;
Accompanying drawing 3 is the operation principle schematic diagram of the embodiment of the invention one;
Accompanying drawing 4 is the operation principle schematic diagram of the embodiment of the invention two;
Accompanying drawing 5 is the operation principle schematic diagram of the embodiment of the invention three.
In the above accompanying drawing: 1, supersonic generator; 2, potsherd; 3, luffing bar; 4, bistrique; 5, abrasive material; 6, surface of the work; 7, arrow; 8, arrow; 9, hand-held grinding polishing machine; 10, shock club.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one:
As shown in Figure 3, reciprocal and the ultrasonic vibration combined method of lapping of a kind of machinery, comprise at least two grinding steps, use the bistrique 4 of different hardness and the abrasive material 5 of variable grain diameter between each grinding step, bistrique 4 hardness are pressed the grinding step order from firmly to soft variation, abrasive material 5 particle diameters change from big to small by the grinding step order, in each grinding step, the mode that adopts mechanical double vibrations and ultrasonic vibration to superpose drives same bistrique the processing work surface is ground, as shown in Figure 2, coaxial on the main shaft (not shown) of hand-held grinding polishing machine 9 ultrasonic generator is set, and act on 4 pairs of processing work surfaces 6 of same bistrique simultaneously and grind, bistrique 4 is done the bigger reciprocating motion of amplitude under the drive of mechanical linear reciprocating motion main shaft; Simultaneously, start supersonic generator and send ultrasonic signal, by shock club 10 ultrasonic vibration is reached bistrique 4 through ultrasonic transducer, impel bistrique 4, improve the grinding efficiency of mechanical linear reciprocating motion by certain frequency vibration, impact and rubbing down workpiece to be machined surface 6; Simultaneously, ultrasonic vibration is superimposed upon the reciprocating motion of carrying out on the bistrique 4 than large amplitude, makes grinding efficiency and quality be further improved.
When machinery double vibrations and ultrasonic vibration stack drove, wherein, mechanical vibration-direction was coaxial stack with the ultrasonic vibration direction, and arrow 7 and arrow 8 are represented ultrasonic vibration and mechanical reciprocating direction respectively among Fig. 3; Described mechanical reciprocating frequency is 58 hertz～108 hertz, and with machinery back and forth the frequency of the ultrasonic vibration of stack be 21 KHzs～39 KHz 30KHz ± 20%, simultaneously, the reciprocating amplitude of machinery is 0.1～10mm, and with machinery back and forth the amplitude of the ultrasonic vibration of stack be 0.02～0.05 times of machinery reciprocating motion amplitude; With this be formed on the spiral track that advances of bistrique self stack machinery back and forth and ultrasonic vibration act on the linear reciprocating motion track of bistrique.
Driving same bistrique by the mode that adopts mechanical double vibrations and ultrasonic vibration stack grinds the processing work surface, overcome machinery in the past back and forth and ultrasonic vibration act on the limitation on bistrique grinding processing work surface separately, can finish the polishing processing that to handle corner, slit, narrow limit, deep trouth and the complex-shaped reciprocal polisher lapper of machineries such as mold cavity surface efficiently than small size, also can finish polishing processing efficiently, guarantee the flatness and the fineness on processing work surface large tracts of land mold cavity surface.Give full play to ultrasonic vibration and the reciprocal effect of machinery, enlarged its scope of application.And machinery back and forth with the ultrasonic vibration superposition in same bistrique with machinery reciprocal and ultrasonic vibration superposition behind same bistrique, reciprocal and ultrasonic vibration acts on bistrique grinding processing work surface separately to its grinding efficiency with respect to machinery, improve 10～50 times, and improved the grinding and polishing quality and the effect of whole work-piece grinding and polishing face type.
Embodiment two:
As shown in Figure 4, the reciprocal and ultrasonic vibration combined method of lapping of a kind of machinery is with embodiment one difference: mechanical vibration-direction and ultrasonic vibration direction are the acute angle stack in the plane that is parallel to the processing work surface; Arrow 4 and arrow 5 are represented ultrasonic vibration and mechanical reciprocating direction respectively among Fig. 4; Other are identical with embodiment one, are not described in detail here.In addition, the mode that mechanical vibration-direction and ultrasonic vibration direction superpose in obtuse angle therewith roughly the same, is not described in detail here.
Embodiment three
As shown in Figure 5, reciprocal and the ultrasonic vibration combined method of lapping of a kind of machinery, comprise at least two grinding steps, be with embodiment one difference: mechanical vibration-direction and ultrasonic vibration direction be at right angles stack in the plane that is parallel to the processing work surface; Arrow 4 and arrow 5 are represented ultrasonic vibration and mechanical reciprocating direction respectively among Fig. 5; Other are identical with embodiment one, are not described in detail here.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit essence is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (3)
1, the reciprocal and compound Ginding process of ultrasonic vibration of a kind of machinery, it is characterized in that: the mode that adopts mechanical double vibrations and ultrasonic vibration to superpose in grinding step drives same bistrique the processing work surface is ground, wherein, mechanical double vibrations and ultrasonic vibration superpose by following kinematic parameter:
(1) direction of motion stack
The machinery vibration-direction is coaxial stack with the ultrasonic vibration direction, and perhaps mechanical vibration-direction and ultrasonic vibration direction are the angle stack in the plane that is parallel to the processing work surface;
(2) frequency stack
The reciprocating frequency of machinery is 30 hertz～300 hertz, and the frequency of ultrasonic vibration is 20 KHzs～50 KHzs;
(3) amplitude stack
The reciprocating amplitude of machinery is 0.1～10 millimeter, and the amplitude of ultrasonic vibration is 0.02～0.05 times that machinery moves back and forth amplitude.
2, the reciprocal and compound Ginding process of ultrasonic vibration of machinery according to claim 1, it is characterized in that: the angle of described mechanical vibration-direction and ultrasonic vibration direction is acute angle, obtuse angle or right angle.
3, the reciprocal and compound Ginding process of ultrasonic vibration of machinery according to claim 1, it is characterized in that: described machinery moves back and forth and the frequency of ultrasonic vibration is respectively 58 hertz～108 hertz and 21 KHzs～39 KHzs.
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| CNA2008101965603A CN101362303A (en) | 2008-09-10 | 2008-09-10 | Grinding method combining mechanical reciprocation and supersonic vibration |
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| CNA2008101965603A CN101362303A (en) | 2008-09-10 | 2008-09-10 | Grinding method combining mechanical reciprocation and supersonic vibration |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102493037A (en) * | 2011-11-11 | 2012-06-13 | 淄博兰雁集团有限责任公司 | Spinning machine, spinning method and application of spinning machine |
| CN104476378A (en) * | 2014-12-09 | 2015-04-01 | 苏州科技学院 | Single excitation ultrasonic elliptic vibration polishing device |
| CN105499706A (en) * | 2016-02-16 | 2016-04-20 | 苏州昱耀模具科技有限公司 | Grinding polishing device and grinding polishing method |
| CN106737120A (en) * | 2017-01-15 | 2017-05-31 | 广州东荣轴承设备有限公司 | A kind of fine abrasive superposition high frequency oscillating apparatus |
| CN109174386A (en) * | 2018-08-31 | 2019-01-11 | 茂名市兴煌化工有限公司 | A kind of ultrasonic wave Scroll-tupe grinding machine and the nanoclay preparation system with the grinding machine |
| CN109794816A (en) * | 2017-11-14 | 2019-05-24 | 福特汽车公司 | The axle journal method for fine finishing and axle journal of crankshaft, camshaft |
| CN110421430A (en) * | 2019-08-16 | 2019-11-08 | 东莞市银泰丰光学科技有限公司 | A kind of making apparatus and manufacture craft of glass diffuser plate |
| CN110497535A (en) * | 2019-09-06 | 2019-11-26 | 金华愉悦机械科技有限公司 | A kind of building stone cutting polishing equipment |
| CN113146406A (en) * | 2021-05-19 | 2021-07-23 | 西安航空职业技术学院 | High-precision steel pipe end grinding device for machining |
| CN113714862A (en) * | 2021-08-17 | 2021-11-30 | 南京航空航天大学 | Large-amplitude ultrasonic vibration auxiliary grinding device based on vibration superposition and operation process thereof |
| CN115042021A (en) * | 2022-05-19 | 2022-09-13 | 江苏富乐德石英科技有限公司 | Ultrasonic quartz grinding device and grinding process |
| CN115056109A (en) * | 2022-08-17 | 2022-09-16 | 杭州非古科技有限公司 | Precision grinding device for machining parts of moving vehicle |
| CN115464471A (en) * | 2022-09-15 | 2022-12-13 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| CN116038444A (en) * | 2023-03-27 | 2023-05-02 | 四川托璞勒科技有限公司 | Ultrasonic grinder |
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2008
- 2008-09-10 CN CNA2008101965603A patent/CN101362303A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102493037A (en) * | 2011-11-11 | 2012-06-13 | 淄博兰雁集团有限责任公司 | Spinning machine, spinning method and application of spinning machine |
| CN104476378A (en) * | 2014-12-09 | 2015-04-01 | 苏州科技学院 | Single excitation ultrasonic elliptic vibration polishing device |
| CN105499706A (en) * | 2016-02-16 | 2016-04-20 | 苏州昱耀模具科技有限公司 | Grinding polishing device and grinding polishing method |
| CN106737120B (en) * | 2017-01-15 | 2020-01-07 | 广州东荣轴承设备有限公司 | Super lapping superposes high frequency oscillation device |
| CN106737120A (en) * | 2017-01-15 | 2017-05-31 | 广州东荣轴承设备有限公司 | A kind of fine abrasive superposition high frequency oscillating apparatus |
| CN109794816A (en) * | 2017-11-14 | 2019-05-24 | 福特汽车公司 | The axle journal method for fine finishing and axle journal of crankshaft, camshaft |
| CN109174386A (en) * | 2018-08-31 | 2019-01-11 | 茂名市兴煌化工有限公司 | A kind of ultrasonic wave Scroll-tupe grinding machine and the nanoclay preparation system with the grinding machine |
| CN109174386B (en) * | 2018-08-31 | 2022-04-19 | 林焕 | Ultrasonic vortex type mill and nano clay preparation system with same |
| CN110421430A (en) * | 2019-08-16 | 2019-11-08 | 东莞市银泰丰光学科技有限公司 | A kind of making apparatus and manufacture craft of glass diffuser plate |
| CN110497535A (en) * | 2019-09-06 | 2019-11-26 | 金华愉悦机械科技有限公司 | A kind of building stone cutting polishing equipment |
| CN113146406A (en) * | 2021-05-19 | 2021-07-23 | 西安航空职业技术学院 | High-precision steel pipe end grinding device for machining |
| CN113714862A (en) * | 2021-08-17 | 2021-11-30 | 南京航空航天大学 | Large-amplitude ultrasonic vibration auxiliary grinding device based on vibration superposition and operation process thereof |
| CN115042021A (en) * | 2022-05-19 | 2022-09-13 | 江苏富乐德石英科技有限公司 | Ultrasonic quartz grinding device and grinding process |
| CN115056109A (en) * | 2022-08-17 | 2022-09-16 | 杭州非古科技有限公司 | Precision grinding device for machining parts of moving vehicle |
| CN115464471A (en) * | 2022-09-15 | 2022-12-13 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| CN115464471B (en) * | 2022-09-15 | 2023-08-29 | 湘潭大学 | Ultrasonic auxiliary polishing device capable of self-adapting to irregular complex curved surface |
| CN116038444A (en) * | 2023-03-27 | 2023-05-02 | 四川托璞勒科技有限公司 | Ultrasonic grinder |
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