CN112739495B - Saw wire - Google Patents

Saw wire Download PDF

Info

Publication number
CN112739495B
CN112739495B CN201980062322.XA CN201980062322A CN112739495B CN 112739495 B CN112739495 B CN 112739495B CN 201980062322 A CN201980062322 A CN 201980062322A CN 112739495 B CN112739495 B CN 112739495B
Authority
CN
China
Prior art keywords
wave component
wave
wavelength
component
saw wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980062322.XA
Other languages
Chinese (zh)
Other versions
CN112739495A (en
Inventor
藤原伸彦
飞田政志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokusen Kogyo Co Ltd
Original Assignee
Tokusen Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokusen Kogyo Co Ltd filed Critical Tokusen Kogyo Co Ltd
Publication of CN112739495A publication Critical patent/CN112739495A/en
Application granted granted Critical
Publication of CN112739495B publication Critical patent/CN112739495B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The saw wire (2) of the invention has wavy folds. The fold has a shape formed by compounding a first wave component (4), a second wave component (6) and a third wave component (8). The wavelength WL1 of the first wave component (4) is different from the wavelength WL2 of the second wave component (6). The wavelength WL2 of the second wave component (6) is different from the wavelength WL3 of the third wave component (8). The wavelength WL3 of the third wave component (8) is different from the wavelength WL1 of the first wave component (4). The wave height WH1 of the first wave component (4) is different from the wave height WH2 of the second wave component (6). The wave height WH2 of the second wave component (6) is different from the wave height WH3 of the third wave component (8). The wave height WH3 of the third wave component (8) is different from the wave height WH1 of the first wave component (4).

Description

Saw wire
Technical Field
The present invention relates to saw wires. In particular, the present invention relates to improvements in crease imparting to saw wire.
Background
The dicing of semiconductor ingots uses saw lines. The wafer is obtained by dicing. A fixed abrasive type saw wire and a free abrasive type saw wire are used. The fixed abrasive grain type saw wire is excellent in cutting efficiency. However, the dimensional accuracy of the cut surface obtained by the fixed abrasive grain type saw wire is poor. The free abrasive wire is advantageous from a wafer performance standpoint.
For a wire with loose abrasive particles, a slurry is sprayed onto the wire prior to cutting. The slurry includes abrasive particles. As a result of the travel of the saw wire, abrasive particles are introduced between the ingot and the saw wire. The ingot is cut by the movement of the abrasive grains, thereby cutting. The saw wire into which a large amount of abrasive grains can be introduced is excellent in cutting efficiency. Saw wires that can incorporate a large number of abrasive particles also contribute to the dimensional accuracy of the cutting face.
Japanese patent application laid-open No. 2004-276207 discloses a saw wire to which a crease is applied. The crease has a wave shape. The wave has peaks and valleys. The abrasive particles are replenished into the valleys and travel inside the ingot. The saw wire may incorporate a plurality of abrasive particles.
Japanese patent application laid-open No. 2008-519698 discloses a saw wire to which the same crease is applied. The saw wire has two waves. The direction of vibration of one wave is different from the direction of vibration of the other wave.
Patent document 1: japanese patent laid-open No. 2004-276207
Patent document 2: japanese patent publication No. 2008-519698
When used in cutting, uneven wear is generated in the saw wire. Uneven wear reduces the dimensional accuracy of the cutting face.
Disclosure of Invention
The purpose of the present invention is to provide a saw wire which is less likely to cause uneven wear and which can provide a cutting surface of excellent quality.
The saw wire according to the present invention has wavy folds. The fold has a shape formed by compounding the first wave component, the second wave component, and the third wave component.
Preferably, the wavelength WL1 of the first wave component is different from the wavelength WL2 of the second wave component. Preferably, the wavelength WL2 of the second wave component is different from the wavelength WL3 of the third wave component. Preferably, the wavelength WL3 of the third wave component is different from the wavelength WL1 of the first wave component.
Preferably, the wave height WH1 of the first wave component is different from the wave height WH2 of the second wave component. Preferably, the wave height WH2 of the second wave component is different from the wave height WH3 of the third wave component. Preferably, the wave height WH3 of the third wave component is different from the wave height WH1 of the first wave component.
Preferably, the direction of vibration of the first wave component is different from the direction of vibration of the second wave component. Preferably, the direction of vibration of the second wave component is different from the direction of vibration of the third wave component. Preferably, the direction of vibration of the third wave component is different from the direction of vibration of the first wave component.
Preferably, the wavelengths WL1 and the wave heights WH1 of the first wave component, the wavelengths WL2 and the wave heights WH2 of the second wave component, the wavelengths WL3 and the wave heights WH3 of the third wave component, and the line diameter Di satisfy the following equation.
1.1＊Di≤WL1≤50＊Di，
1.2＊Di≤WL2≤100＊Di，
2000＊Di≤WL3≤6000＊Di，
1.05＊Di≤WH1≤5＊Di，
1.1＊Di≤WH2≤10＊Di，
2＊Di≤WH3≤1000＊Di。
The crease of the saw wire according to the present invention has three or more wave components. In the saw wire, abrasive grains are uniformly introduced. In this saw wire, uneven wear is less likely to occur. By this saw wire, a cut surface with excellent dimensional accuracy can be obtained.
Drawings
Fig. 1 is a front view showing a part of a saw wire according to an embodiment of the present invention.
Fig. 2 is an enlarged right side view schematically showing the saw wire of fig. 1.
Fig. 3 is a schematic diagram showing a first wave component of a crease of the saw wire of fig. 1.
Fig. 4 is a schematic diagram showing a second wave component of the crease of the saw line of fig. 1.
Fig. 5 is a schematic diagram showing a third wave component of the crease of the saw line of fig. 1.
Fig. 6 is a schematic view showing a part of a crease applying device for the saw wire of fig. 1.
Fig. 7 is a right side view schematically showing a saw wire according to another embodiment of the present invention.
Detailed Description
Hereinafter, the present invention will be described in detail based on preferred embodiments with reference to the accompanying drawings as appropriate.
In fig. 1 and 2 a saw wire 2 is shown. In these drawings, the X direction is the horizontal direction, the Y direction is the vertical direction, and the Z direction is the horizontal direction. The X direction is also the length direction of the saw wire 2. The Saw wire 2 is mounted on a sawing Machine (Saw Machine) and travels toward the left in fig. 1.
The saw wire 2 has wavy folds. The crease has a shape schematically shown in fig. 2, which is formed by combining the first wave component 4, the second wave component 6, and the third wave component 8. The folds may have a shape formed by combining 4 or more wave components.
The first wave component 4 is schematically shown in fig. 3. Fig. 3 shows a first wave component 4 as seen from the direction of arrow A1 in fig. 2. The first wave component 4 vibrates in a plane perpendicular to the arrow A1. The first wave component 4 does not vibrate in other planes. The first wave component 4 is a two-dimensional wave. The first wave component 4 vibrates at a constant wavelength. As can be seen from fig. 2, the vibration direction of the waves of the first wave component 4 is the Y direction.
As shown in fig. 3, the first wave component 4 has a plurality of wave crests 10 and a plurality of wave troughs 12. These peaks 10 and valleys 12 are alternately arranged in the X direction. The saw wire 2 is supplemented with abrasive particles in the valleys 12 of the first wave component 4 and is introduced towards the cutting face. In fig. 3, arrow WL1 represents the wavelength of the first wave component 4, and arrow WH1 represents the wave height of the first wave component 4.
The second wave component 6 is schematically shown in fig. 4. Fig. 4 shows the second wave component 6 as seen from the direction of arrow A2 of fig. 2. The second wave component 6 vibrates in a plane perpendicular to the arrow A2. The second wave component 6 does not vibrate in other planes. The second wave component 6 is a two-dimensional wave. The second wave component 6 vibrates at a constant wavelength. As can be seen from fig. 2, the vibration direction of the second wave component 6 is inclined with respect to the Y direction. The direction of vibration of the second wave component 6 is different from the direction of vibration of the first wave component 4. In the present embodiment, the angle θ of the vibration direction of the second wave component 6 with respect to the vibration direction of the first wave component 4 1-2 60 ° (see fig. 2).
As shown in fig. 4, the second wave component 6 has a plurality of wave crests 14 and a plurality of wave troughs 16. These peaks 14 and valleys 16 are alternately arranged in the X direction. The saw wire 2 is supplemented with abrasive particles in the valleys 16 of the second wave component 6 and is introduced towards the cutting face. In fig. 4, arrow WL2 represents the wavelength of the second wave component 6, and arrow WH2 represents the wave height of the second wave component 6.
Fig. 5 schematically shows a third wave component 8. Fig. 5 shows a third wave component 8, seen from the direction of arrow A3 in fig. 2. The third wave component 8 vibrates in a plane perpendicular to the arrow A3. The third wave component 8 does not vibrate in other planes. The third wave component 8 is a two-dimensional wave. The third wave component 8 vibrates at a constant wavelength. As can be seen from fig. 2, the vibration direction of the third wave component 8 is inclined with respect to the Y direction. The direction of vibration of the third wave component 8 is different from the direction of vibration of the first wave component 4. In the present embodiment, the angle θ of the vibration direction of the third wave component 8 with respect to the vibration direction of the first wave component 4 1-3 120 ° (see fig. 2). The direction of vibration of the third wave component 8 is also different from the direction of vibration of the second wave component 6. In the present embodiment, the angle θ of the vibration direction of the third wave component 8 with respect to the vibration direction of the second wave component 6 2-3 60 ° (see fig. 2).
As shown in fig. 5, the third wave component 8 has a plurality of wave crests 18 and a plurality of wave troughs 20. These peaks 18 and valleys 20 are alternately arranged in the X-direction. The saw wire 2 is supplemented with abrasive particles in the valleys 20 of the third wave component 8 and is introduced towards the cutting face. In fig. 5, arrow WL3 represents the wavelength of the third wave component 8, and arrow WH3 represents the wave height of the third wave component 8.
The first wave component 4, the second wave component 6, and the third wave component 8 are two-dimensional waves as described above. The first wave component 4, the second wave component 6, and the third wave component 8 are combined to form a three-dimensional wave. The crease of the saw wire 2 has a three-dimensional shape. In the saw wire 2, vibrations of the first wave component 4, vibrations of the second wave component 6, and vibrations of the third wave component 8 are simultaneously performed along the longitudinal direction thereof.
The sawing wire 2 introduces abrasive particles through the valleys 12 of the first wave component 4, the valleys 16 of the second wave component 6 and the valleys 20 of the third wave component 8. The saw wire 2 uniformly introduces abrasive particles. Uneven wear is less likely to occur in the saw wire 2. By the saw wire 2, a cut surface excellent in dimensional accuracy can be obtained. By means of the saw wire 2, a cutting surface with a small roughness can be obtained.
In the saw wire 2, the direction of vibration of the first wave component 4 is different from the direction of vibration of the second wave component 6, the direction of vibration of the second wave component 6 is different from the direction of vibration of the third wave component 8, and the direction of vibration of the third wave component 8 is different from the direction of vibration of the first wave component 4. The saw wire 2 has a crease formed by compounding 3 wave components having different vibration directions. In the saw wire 2, abrasive grains are uniformly introduced.
The angle between the vibration direction of the first wave component 4 and the vibration direction of the second wave component 6 is preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less. The angle between the vibration direction of the second wave component 6 and the vibration direction of the third wave component 8 is preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less. The angle between the vibration direction of the third wave component 8 and the vibration direction of the first wave component 4 is preferably 20 ° or more and 160 ° or less, and particularly preferably 30 ° or more and 150 ° or less.
As can be seen from a comparison of fig. 3 and 4, the wavelength WL2 of the second wave component 6 is greater than the wavelength WL1 of the first wave component 4. As can be seen from a comparison of fig. 4 and 5, the wavelength WL3 of the third wave component 8 is greater than the wavelength WL2 of the second wave component 6. The magnitude relation of the wavelengths may also be different. For example, the wavelength WL1 of the first wave component 4 may be larger than the wavelength WL2 of the second wave component 6. The wavelength WL1 of the first wave component 4 may be the same as the wavelength WL2 of the second wave component 6.
As can be seen from a comparison of fig. 3 and 4, the wave height WH1 of the first wave component 4 is greater than the wave height WH2 of the second wave component 6. As can be seen from a comparison of fig. 3 and 5, the wave height WH3 of the third wave component 8 is greater than the wave height WH1 of the first wave component 4. The magnitude relation of wave heights may also be different. For example, the wave height WH1 of the first wave component 4 may be smaller than the wave height WH2 of the second wave component 6. The wave height WH1 of the first wave component 4 may be the same as the wave height WH2 of the second wave component 6.
In the saw wire 2, the wavelength WL1 of the first wave component 4 is different from the wavelength WL2 of the second wave component 6, the wavelength WL2 of the second wave component 6 is different from the wavelength WL3 of the third wave component 8, and the wavelength WL3 of the third wave component 8 is different from the wavelength WL1 of the first wave component 4. The saw wire 2 has a fold formed by compounding 3 wave components having different wavelengths. In the saw wire 2, abrasive grains are uniformly introduced.
As described above, the wavelength WL1 of the first wave component 4 may be the same as the wavelength WL2 of the second wave component 6. Even in this case, since the wavelength WL3 of the third wave component 8 is different from the wavelengths WL1 and WL2, uniform introduction of abrasive grains can be achieved. The wavelength WL1 of the first wave component 4 may be the same as the wavelength WL2 of the second wave component 6 and the wavelength WL3 of the third wave component 8.
In the saw wire 2, the wave height WH1 of the first wave component 4 is different from the wave height WH2 of the second wave component 6, the wave height WH2 of the second wave component 6 is different from the wave height WH3 of the third wave component 8, and the wave height WH3 of the third wave component 8 is different from the wave height WH1 of the first wave component 4. The saw wire 2 has a crease formed by compounding 3 wave components having different wave heights. In the saw wire 2, abrasive grains are uniformly introduced.
As described above, the wave height WH1 of the first wave component 4 may be the same as the wave height WH2 of the second wave component 6. Even in this case, since the wave height WH3 of the third wave component 8 is different from the wave heights WH1 and WH2, uniform introduction of abrasive grains can be achieved. The wave heights WH1, WH2, and WH3 of the first, second, and third wave components 4, 6 may be the same.
Preferably, the wavelength WL1 of the first wave component 4 satisfies the following equation.
1.1＊Di≤WL1≤50＊Di
In this equation, di represents the wire diameter (see fig. 2). In other words, the wavelength WL1 of the first wave component 4 is 1.1 to 50 times the line diameter Di. Preferably, the wavelength WL1 is 3 to 40 times the line diameter Di.
Preferably, the wavelength WL2 of the second wave component 6 satisfies the following equation.
1.2＊Di≤WL2≤100＊Di
In other words, the wavelength WL2 of the second wave component 6 is 1.2 times or more and 100 times or less of the line diameter Di. Preferably, the wavelength WL2 is 3.5 to 50 times the line diameter Di.
Preferably, the wavelength WL3 of the third wave component 8 satisfies the following equation.
2000＊Di≤WL3≤6000＊Di
In other words, the wavelength WL3 of the third wave component 8 is 2000 times or more and 6000 times or less of the line diameter Di. Preferably, the wavelength WL3 is 2200 to 5000 times the line diameter Di.
The ratio of the absolute value of the difference between the wavelengths WL1 and WL2 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wavelengths WL2 and WL3 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wavelength WL3 and the wavelength WL1 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more.
The ratio WL3/WL1 of the wavelength WL3 to the wavelength WL1 is preferably 250 or more, particularly preferably 650 or more. The ratio WL3/WL1 is preferably 2500 or less. The ratio WL3/WL2 of the wavelength WL3 to the wavelength WL2 is preferably 200 or more, particularly preferably 520 or more. The ratio WL3/WL2 is preferably 2000 or less.
Preferably, the wave height WH1 of the first wave component 4 satisfies the following expression.
1.05＊Di≤WH1≤5＊Di
In this equation, di represents the wire diameter (see fig. 2). In other words, the wave height WH1 of the first wave component 4 is 1.05 times or more and 5 times or less of the line diameter Di. Preferably, the wave height WH1 is 1.1 to 3 times the line diameter Di.
Preferably, the wave height WH2 of the second wave component 6 satisfies the following equation.
1.1＊Di≤WH2≤10＊Di
In other words, the wave height WH2 of the second wave component 6 is 1.1 times or more and 10 times or less of the line diameter Di. Preferably, the wave height WH2 is 1.2 times or more and 5 times or less the line diameter Di.
Preferably, the wave height WH3 of the third wave component 8 satisfies the following expression.
2＊Di≤WH3≤1000＊Di
In other words, the wave height WH3 of the third wave component 8 is 2 times or more and 1000 times or less of the line diameter Di. Preferably, the wave height WH3 is 50 times to 800 times the line diameter Di.
The ratio of the absolute value of the difference between the wave height WH1 and the wave height WH2 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wave height WH2 and the wave height WH3 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wave height WH3 and the wave height WH1 to the line diameter Di is preferably 3% or more, and particularly preferably 5% or more.
The wire diameter Di is preferably from 0.05mm to 0.40mm, particularly preferably from 0.10mm to 0.20 mm.
The saw wire 2 is made of metal. A typical metal is carbon steel. The saw wire 2 is preferably brass plated on the surface of the main part consisting of carbon steel.
The crease applying device for the saw wire 2 includes a first crease applying portion, a second crease applying portion, and a third crease applying portion. Fig. 6 shows the first fold imparting portion 30. The first fold imparting unit 30 has a gear pair 36 composed of a first gear 32 and a second gear 34. The bus bar 38 passes through the gear pair 36, thereby generating plastic deformation. By this plastic deformation, the busbar 38 is provided with a crease of the first wave component 4.
Although not shown, the second fold imparting portion also has a gear pair. The bus bar 38 discharged from the first fold imparting portion 30 passes through the gear pair of the second fold imparting portion. Plastic deformation occurs due to the passage, and a crease of the second wave component 6 is given to the bus bar 38. The second wave component 6 having a vibration direction different from that of the first wave component 4 can be formed by the gear pair having an axis inclined with respect to the axis of the gear pair of the first fold imparting unit 30.
Although not shown, the third fold-imparting portion also has a gear pair. The bus bar 38 discharged from the second fold imparting portion passes through the gear pair of the third fold imparting portion. Plastic deformation occurs due to this passage, and a crease of the third wave component 8 is imparted to the bus bar 38. The third wave component 8 having a vibration direction different from that of the first wave component 4 can be formed by the gear pair having an axis inclined with respect to the axis of the gear pair of the first fold imparting unit 30. The third wave component 8 having a vibration direction different from that of the second wave component 6 can be formed by a gear pair having an axis inclined with respect to the axis of the gear pair of the second fold imparting portion.
Fig. 7 is a right side view schematically showing a saw wire 22 according to another embodiment of the present invention. The saw wire 22 has wavy folds. The crease has a shape schematically shown in fig. 7, which is formed by combining the first wave component 24, the second wave component 26, and the third wave component 28. The vibration direction of the first wave component 24 is the Y direction. The vibration direction of the second wave component 26 is inclined by 90 ° with respect to the Y direction. The vibration direction of the third wave component 28 is inclined by 120 ° with respect to the Y direction. The construction of the saw wire 22 is the same as the construction of the saw wire 22 shown in fig. 1 to 5, except for the direction of vibration of the second wave component 26.
The saw wire 22 introduces abrasive particles through the valleys of the first wave component 24, the valleys of the second wave component 26, and the valleys of the third wave component 28. The saw wire 22 uniformly incorporates abrasive particles. In the saw wire 22, uneven wear is less likely to occur. By the saw wire 22, a cut surface excellent in dimensional accuracy can be obtained. A cutting surface with a small roughness is obtained by the saw wire 22.
Examples
The effects of the present invention will be clarified by examples below, but the present invention should not be construed as being limited by the description of the examples.
Example 1
The saw wire shown in fig. 1 to 5 was manufactured. The specifications of the saw wire are shown in table 1 below. The saw wire is constructed of brass plated carbon steel.
Examples 2 to 9
The saw wires of examples 2 to 9 were obtained in the same manner as in example 1, except that the specifications were set as shown in tables 1 and 2 below.
Comparative example 1
A saw wire having a first wave component and a second wave component is produced. The saw wire does not have a third wave component.
Comparative example 2
A conventional saw wire was prepared. The saw wire does not have a wave shape.
[ test 1]
Each saw wire is mounted to the sawing machine. A slurry containing abrasive grains is applied to the surface of the saw wire. The saw wire was run at a speed of 0.6mm/min to cut the glass sheet. The roughness and waviness of the obtained cut surface were observed and evaluated. The results are shown in tables 1 to 3 below as indexes. The larger the number, the more excellent the evaluation.
[ test 2]
The roughness and waviness of the cut surface were evaluated in the same manner as in experiment 1 except that the traveling speed of the saw wire was set to 0.8 mm/min. The results are shown in tables 1 to 3 below as indexes. The larger the number, the more excellent the evaluation.
TABLE 1
Table 1 evaluation results
TABLE 2
Table 2 evaluation results
TABLE 3
Table 3 evaluation results
As shown in tables 1 to 3, the saw wire of each example was evaluated to be superior to the saw wires of comparative examples 1 and 2. From the evaluation results, the superiority of the present invention was apparent.
Industrial applicability
The saw wire according to the present invention can be used for cutting various articles.
Description of the reference numerals
2. Sawing wire; 4. first wave component; 6. second wave component; 8. third wave component; 10. peak, 18; 12. trough 16, 20; first fold imparting means; first gear; second gear; gear pair; busbar.

Claims (4)

1. A saw wire having wavy folds, wherein,
the crease has a shape formed by compounding a first wave component, a second wave component and a third wave component,
the first wave component has a plurality of wave crests and a plurality of wave troughs,
the second wave component has a plurality of wave crests and a plurality of wave troughs,
the third wave component has a plurality of wave crests and a plurality of wave troughs,
the ratio WL3/WL1 of the wavelength WL3 of the third wave component to the wavelength WL1 of the first wave component is 650 or more and 1950 or less, the ratio WL3/WL2 of the wavelength WL3 of the third wave component to the wavelength WL2 of the second wave component is 520 or more and 1560 or less,
the direction of vibration of the first wave component is different from the direction of vibration of the second wave component,
the direction of vibration of the second wave component is different from the direction of vibration of the third wave component,
the third wave component has a vibration direction different from that of the first wave component.
2. The saw wire according to claim 1, wherein,
the wavelength WL1 of the first wave component is different from the wavelength WL2 of the second wave component,
the wavelength WL2 of the second wave component is different from the wavelength WL3 of the third wave component,
the wavelength WL3 of the third wave component is different from the wavelength WL1 of the first wave component.
3. Saw wire according to claim 1 or 2, wherein,
the wave height WH1 of the first wave component is different from the wave height WH2 of the second wave component,
the wave height WH2 of the second wave component is different from the wave height WH3 of the third wave component,
the wave height WH3 of the third wave component is different from the wave height WH1 of the first wave component.
4. Saw wire according to claim 1 or 2, wherein,
the wavelength WL1 and the wave height WH1 of the first wave component, the wavelength WL2 and the wave height WH2 of the second wave component, the wavelength WL3 and the wave height WH3 of the third wave component, and the line diameter Di satisfy the following equation:
1.1＊Di≤WL1≤50＊Di，
1.2＊Di≤WL2≤100＊Di，
2000＊Di≤WL3≤6000＊Di，
1.05＊Di≤WH1≤5＊Di，
1.1＊Di≤WH2≤10＊Di，
2＊Di≤WH3≤1000＊Di。
CN201980062322.XA 2018-09-25 2019-06-13 Saw wire Active CN112739495B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018178318 2018-09-25
JP2018-178318 2018-09-25
JP2018199763A JP6534768B1 (en) 2018-09-25 2018-10-24 Saw wire
JP2018-199763 2018-10-24
PCT/JP2019/023484 WO2020066151A1 (en) 2018-09-25 2019-06-13 Saw wire

Publications (2)

Publication Number Publication Date
CN112739495A CN112739495A (en) 2021-04-30
CN112739495B true CN112739495B (en) 2024-01-19

Family

ID=67023789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062322.XA Active CN112739495B (en) 2018-09-25 2019-06-13 Saw wire

Country Status (5)

Country Link
JP (1) JP6534768B1 (en)
KR (1) KR102603483B1 (en)
CN (1) CN112739495B (en)
TW (1) TWI691372B (en)
WO (1) WO2020066151A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6534768B1 (en) * 2018-09-25 2019-06-26 トクセン工業株式会社 Saw wire
CN116000697B (en) * 2023-02-09 2023-09-29 江苏省艾格森数控设备制造有限公司 Oil groove lifting structure for machine tool

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102310489A (en) * 2011-08-09 2012-01-11 镇江耐丝新型材料有限公司 Cutting wire with composite structure, and manufacturing method and manufacturing equipment thereof
CN203752345U (en) * 2014-02-26 2014-08-06 邢台钢铁线材精制有限责任公司 Double-deformation sawtooth-shaped cutting steel wire
CN108145874A (en) * 2017-12-28 2018-06-12 镇江耐丝新型材料有限公司 A kind of cutting steel wire with trapezoidal waveform and preparation method thereof
TWI691372B (en) * 2018-09-25 2020-04-21 日商特線工業股份有限公司 Sawing wire

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276207A (en) * 2003-03-18 2004-10-07 Kanai Hiroaki Saw wire for multi-wire saw
LU91126B1 (en) * 2004-12-23 2006-06-26 Trefilarbed Bettembourg S A Monofilament metal saw wire
KR101934152B1 (en) * 2012-09-07 2018-12-31 베카에르트 빈장 스틸 코드 코., 엘티디. A shaped sawing wire with subsurface tensile residual stresses
CN103963181B (en) * 2014-05-09 2016-08-17 江苏宝钢精密钢丝有限公司 The high intensity cutting steel wire of a kind of composite deformation and manufacture method thereof
JP2016150393A (en) * 2015-02-16 2016-08-22 ジャパンファインスチール株式会社 Saw wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102310489A (en) * 2011-08-09 2012-01-11 镇江耐丝新型材料有限公司 Cutting wire with composite structure, and manufacturing method and manufacturing equipment thereof
CN203752345U (en) * 2014-02-26 2014-08-06 邢台钢铁线材精制有限责任公司 Double-deformation sawtooth-shaped cutting steel wire
CN108145874A (en) * 2017-12-28 2018-06-12 镇江耐丝新型材料有限公司 A kind of cutting steel wire with trapezoidal waveform and preparation method thereof
TWI691372B (en) * 2018-09-25 2020-04-21 日商特線工業股份有限公司 Sawing wire

Also Published As

Publication number Publication date
TW202012081A (en) 2020-04-01
KR102603483B1 (en) 2023-11-16
JP2020049644A (en) 2020-04-02
CN112739495A (en) 2021-04-30
KR20210039493A (en) 2021-04-09
WO2020066151A1 (en) 2020-04-02
TWI691372B (en) 2020-04-21
JP6534768B1 (en) 2019-06-26

Similar Documents

Publication Publication Date Title
CN112739495B (en) Saw wire
KR20080007179A (en) Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using the sawing strip
CN204867639U (en) Saw blade
CN102490088A (en) Three-dimensional spiral line grinding method through ultrasonic vibration
Huang et al. Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire
CN103507173B (en) Cut the method for multiple wafer from cylindrical workpiece simultaneously
JPWO2012060173A1 (en) Cutting insert, cutting tool, and method of manufacturing a cut product using the same
CN112839771B (en) Saw wire
Shimada et al. Statistical approach optimizing slant feed grinding
JP6966182B2 (en) Abrasive band saw blade
CN206839199U (en) It is a kind of that to be used for all kinds of copper products cylindrical with the polycrystal diamond cutter of interior hole machined
JP6689941B1 (en) Saw wire
JP6045960B2 (en) Band saw
Tawakoli et al. Ultrasonic-assisted cylindrical grinding of alumina-zirconia ceramics
SHIMADA et al. 3383 Statistical Approach Optimizing Slant Feed Grinding
Li et al. Effect of machining parameters on surface roughness in vibration-assisted grinding
JP2021091088A (en) Abrasive band saw blade and abrasive band saw blade manufacturing method
Huang et al. Experimental study regarding the surface roughness of circular crystal wafers sliced by a multi-wire saw with reciprocating and rocking functions
Cao et al. Simulation investigation ultrasonically assisted grinding of SiC ceramics with single diamond abrasive grain
JP5444778B2 (en) Broaching tool and processing method using broaching tool
JP5734702B2 (en) Wire tool
JP2018001408A (en) Band saw blade
Cao et al. A021 Experimental investigation of material removal mechanism in ultrasonic assisted grinding of SiC ceramics using a single diamond tool
JP2004195608A (en) Plectrum type saw blade
JPH0769655A (en) Method for polishing metal mold

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant