JP5734702B2 - Wire tool - Google Patents

Description

  The present invention relates to a wire tool used when slicing an ingot such as solar cell silicon, semiconductor silicon, magnetic material, sapphire, or SiC.

  Wire tools are roughly classified into resin wire tools and electrodeposition wire tools. As shown in FIG. 4A, in the resin wire tool 40, the abrasive grains 41 are fixed to the outer peripheral surface of the wire 43 through the synthetic resin layer 42. As shown in FIG. The abrasive grains 51 are fixed to the outer peripheral surface of the wire 53 through the plating layer 52.

  Since the outer peripheral surface of the wire 43 is covered with the synthetic resin layer 42, the resin wire tool 40 has high flexibility, hardly breaks due to twisting, and has stable machining performance. Further, as shown in FIG. 4B, the abrasive grains 41 of the resin wire tool 40 that performs the cutting while proceeding in the direction of the arrow 40a are indicated by the arrows 41h and 41v due to the drag received from the workpiece 44 during the cutting. Since it can be displaced slightly in the direction, it is excellent in that the processed surface of the workpiece 44 has good surface roughness and high processing accuracy, but the abrasive holding power is weak and the processing efficiency is low.

  On the other hand, the electrodeposition wire tool 50 has a strong abrasive grain holding force because the abrasive grains 51 are firmly fixed to the plating layer 52, and as shown in FIG. Even if the abrasive grains 51 of the electrodeposited wire tool 50 to be processed receive a drag force from the workpiece 44 during the cutting process, the abrasive grains 51 are not easily displaced minutely, and there is an advantage that the machining efficiency is high.

  In the cutting of a single crystal ingot, it is required that the surface roughness is good and the processing accuracy is high, and in the cutting of a polycrystalline ingot, high processing performance is required. In view of this, a wire tool in which abrasive grains are fixed to a wire outer peripheral surface by a plating layer and a resin layer has been proposed (for example, see Patent Document 1).

JP 2004-50301 A

  The wire saw described in Patent Document 1 was developed for the purpose of combining the advantages of an electrodeposition wire tool and a resin wire tool, but the superabrasive grains are substantially fixed to the outer peripheral surface of the wire by the electrodeposition layer. Therefore, the surface roughness of the processed surface is not good. Moreover, since the abrasive grains are covered with the resin layer, the protruding amount of the abrasive grains may be reduced, and the processing efficiency may be deteriorated.

  The problem to be solved by the present invention is to provide a wire tool having high machining efficiency and good surface roughness.

The wire tool of the present invention includes a backup granular material fixed by a plating layer covering an outer peripheral surface of a wire, and abrasive grains fixed by a resin layer covering the plating layer, and the abrasive grains are wire-advancing. A buffer resin layer that is in contact with the granular material located in a direction opposite to the direction and does not include abrasive grains is provided between the plating layer and the abrasive grains .

  With such a configuration, the granular material is firmly fixed by the plating layer covering the outer peripheral surface of the wire, and the abrasive force is fixed by the resin layer covering the plating layer, so that the drag received from the workpiece during the cutting process The fine displacement of the abrasive grains in the direction opposite to the wire traveling direction caused by the above is backed up by the granular material fixed by the plating layer, so that the cutting force does not decrease and high processing efficiency is exhibited. Further, since the fine displacement of the abrasive grains in the direction approaching the wire axis caused by the drag received from the workpiece is appropriately maintained by the resin layer, the surface roughness of the processed surface is also improved.

  Moreover, it can also be set as the structure which mixed the filler of the inorganic material or the metal material in the said resin layer.

  With such a configuration, since the filler exists in the resin layer, the load applied to the abrasive grains fixed by the resin layer can be dispersed in the filler during the cutting process, and is brought into the processing surface by the wire tool. Since cutting fluid also increases, it is effective in improving the surface roughness of the machined surface.

Furthermore, a wire tool of the present invention, Ru Tei provided buffer resin layer containing no abrasive grain between the abrasive grains and the plating layer.

  With such a configuration, the buffer resin layer can increase the minute displacement in the direction in which the abrasive grains fixed on the resin layer approach the wire axis caused by the drag received from the workpiece. Effective for improving surface roughness.

  On the other hand, the clearance gap between the said granular material adjacent to the longitudinal direction of the said wire and the said abrasive grain can be made smaller than the outer diameter of the said abrasive grain.

  With such a configuration, it is possible to suppress minute displacement of the abrasive grains in the wire traveling direction caused by the drag that the abrasive grains receive from the workpiece during cutting, which is effective in improving machining efficiency. .

  Further, the number of abrasive grains fixed by the resin layer can be made larger than the number of granules fixed by the plating layer.

  With such a configuration, cutting with abrasive grains fixed by the resin layer is mainly performed, which is effective in improving the surface roughness of the processed surface.

  Furthermore, the particle size of the abrasive grains fixed by the resin layer can be made smaller than the particle size of the granular material fixed by the plating layer.

  With such a configuration, the tips of the abrasive grains fixed by the resin layer can be aligned, which is effective in improving the surface roughness of the processed surface.

  According to the present invention, it is possible to provide a wire tool having high machining efficiency and good surface roughness.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially omitted cross-sectional view illustrating a wire tool that is a first embodiment of the present invention. It is a partially-omission sectional drawing which shows the wire tool which is 2nd embodiment of this invention. It is a partially abbreviated sectional view showing a wire tool which is a third embodiment of the present invention. It is a partially omitted sectional view showing a conventional resin wire tool. It is a partially omitted sectional view showing a conventional electrodeposition wire tool.

  Based on FIG. 1, the wire tool 10 which is 1st embodiment of this invention is demonstrated. As shown in FIG. 1, the wire tool 10 includes a backup granule 13 fixed with a plating layer 12 covering the outer peripheral surface of the wire 11, and abrasive grains 15 fixed with a synthetic resin layer 14 covering the plating layer 12. And. Between the plating layer 12 and the abrasive grains 15, a buffer resin layer 16 that does not include the abrasive grains 15 is provided.

  A gap 17 between the granular material 13 adjacent to the longitudinal direction of the wire 11 and the abrasive grain 15 is set to be smaller than the outer diameter of the abrasive grain 15. In particular, in this embodiment, the granular body 13 and the abrasive grain 15 are in contact with each other. Therefore, the gap 17 is almost equal to zero. The wire 11 is a piano wire, the plating layer 12 is formed of nickel plating, the synthetic resin layer 14 is formed of a thermosetting resin, and the granular body 13 and the abrasive grains 15 are diamond grains, but are not limited thereto. is not.

  As shown in FIG. 1, when the workpiece 18 is cut while moving the wire tool 10 in the direction of the arrow X, the abrasive grains 15 receive a drag force in the direction opposite to the arrow X from the workpiece 18. The granular material 13 is firmly fixed by the plating layer 12 covering the outer peripheral surface of the wire 11, the abrasive grains 15 are fixed by the synthetic resin layer 14 covering the plating layer 12, and each abrasive grain 15 has a wire traveling direction (arrow). Since it is in a state of being in contact with the granular material 13 located in the direction opposite to the direction of the line X), it is difficult for minute displacement of each abrasive grain 15 in the direction opposite to the wire traveling direction.

  That is, during the cutting process, the minute displacement of the abrasive grains 15 in the direction opposite to the wire traveling direction (arrow X direction) caused by the drag received by the abrasive grains 15 from the workpiece 18 is the granularity fixed by the plating layer 12. By being backed up by the body 13, it is suppressed to the minimum, so that the cutting force does not decrease, and the wire tool 10 exhibits high machining efficiency.

  On the other hand, during the cutting process, the minute displacement of the abrasive grains 15 in the direction approaching the axis of the wire 11 (in the direction of the arrow Y) generated by the drag received by the abrasive grains 15 from the workpiece 18 is appropriately maintained by the synthetic resin layer 14. Therefore, the surface roughness of the processed surface of the workpiece 18 is good.

  Further, in the wire tool 10, by providing the buffer resin layer 16 that does not include the abrasive grains 15 between the plating layer 12 and the abrasive grains 15, the abrasive grains 15 fixed by the synthetic resin layer 14 can be processed. The minute displacement in the direction approaching the axis of the wire 11 (arrow Y direction) generated by the drag received from 18 can be increased by the buffer resin layer 16, so that the surface roughness of the processed surface of the workpiece 18 is improved. It is valid.

  Further, as described above, the gap 17 between the granular material 13 adjacent to the longitudinal direction of the wire 11 and the abrasive grains 15 is made smaller (almost zero) than the outer diameter of the abrasive grains 15, so Since the fine displacement of the abrasive grains 15 in the direction opposite to the traveling direction (arrow X direction) of the wire 11 caused by the drag force that the grains 15 receive from the workpiece 18 is suppressed, it is effective in improving the processing efficiency.

  In the wire tool 10, the number of the granular bodies 13 fixed by the plating layer 12 and the number of the abrasive grains 15 fixed by the synthetic resin layer 14 are substantially the same, but the present invention is not limited to this. The number of the abrasive grains 15 fixed by the synthetic resin layer 14 can be made larger than the number of the granular bodies 13 fixed by. If the number of the abrasive grains 15 is larger than the number of the granular bodies 13, since the cutting with the abrasive grains 15 fixed by the synthetic resin layer 14 is mainly performed during the cutting process, the surface roughness of the processed surface of the workpiece is increased. It is effective in improving the degree.

  Next, the wire tool 20 which is 2nd embodiment of this invention is demonstrated based on FIG. As shown in FIG. 2, the wire tool 20 includes a backup granule 23 fixed by a plating layer 22 covering the outer peripheral surface of the wire 21, and abrasive grains 25 fixed by a synthetic resin layer 24 covering the plating layer 22. The filler 26 is mixed in the synthetic resin layer 24.

  A gap 27 between the granular material 23 adjacent to the longitudinal direction of the wire 21 and the abrasive 25 is smaller than the outer diameter of the abrasive 15 and is set to almost zero. The wire 21 is a piano wire, the plating layer 22 is formed of nickel plating, the synthetic resin layer 24 is formed of a thermosetting resin, the granular material 23 and the abrasive grains 25 are diamond grains, and the filler 26 is silica ( Silicon oxide), but is not limited thereto.

  As shown in FIG. 2, when cutting the workpiece 28 while moving the wire tool 20 in the direction of the arrow X, the abrasive grains 25 are separated from the workpiece 28 as in the case of the wire tool 10 shown in FIG. 1. Although subjected to a drag in the direction opposite to the arrow X, the granular material 23 is firmly fixed by the plating layer 22 covering the outer peripheral surface of the wire 21, and the abrasive grains 25 are fixed by the synthetic resin layer 24 covering the plating layer 22, And since each abrasive grain 25 exists in the state which contacted the granular material 23 located in the opposite direction to a wire advancing direction (arrow X direction), each abrasive grain 25 is a direction opposite to a wire advancing direction (arrow X direction). Difficult to move slightly. For this reason, the wire tool 20 exhibits high machining efficiency without causing a reduction in cutting force.

  On the other hand, during the cutting process, the minute displacement of the abrasive grains 25 in the direction approaching the axis of the wire 21 (arrow Y direction) generated by the drag received by the abrasive grains 25 from the workpiece 28 is appropriately maintained by the synthetic resin layer 24. Therefore, the surface roughness of the processed surface of the workpiece 28 is good.

Further, in the wire tool 20, the filler 26 is mixed in the synthetic resin layer 24, whereby the load applied to the abrasive grains 25 fixed by the synthetic resin layer 24 can be dispersed in a large number of fillers 26 during the cutting process. Not only can the cutting fluid brought into the machining surface by the wire tool 20 increase, but the surface roughness of the machining surface is improved. In addition to the silica (silicon oxide), the filler 26 may be made of an inorganic material such as SiC, Al ₂ O ₃ , diamond, cBN, glass, or a metal material.

  Next, the wire tool 30 which is 3rd embodiment of this invention is demonstrated based on FIG. As shown in FIG. 3, the wire tool 30 includes a backup granule 33 fixed by a plating layer 32 covering the outer peripheral surface of the wire 31 and an abrasive grain 35 fixed by a synthetic resin layer 34 covering the plating layer 32. The particle size of the abrasive grains 35 fixed by the synthetic resin layer 34 is smaller than the particle size of the granular material 33 fixed by the plating layer 32.

  A gap 37 between the granular material 33 adjacent to the longitudinal direction of the wire 31 and the abrasive grain 35 is smaller than the outer diameter of the abrasive grain 35 and is set to almost zero. The wire 31 is a piano wire, the plating layer 32 is formed of nickel plating, the synthetic resin layer 34 is formed of a thermosetting resin, and the granular material 33 and the abrasive grains 35 are diamond. However, the present invention is not limited to these. Absent.

  As shown in FIG. 3, when the workpiece 38 is cut while moving the wire tool 30 in the direction of the arrow X, the abrasive grains 35 are the same as in the case of the wire tools 10 and 20 shown in FIGS. 1 and 2. While receiving a drag in the direction opposite to the arrow X from the workpiece 38, the granular material 33 is firmly fixed by the plating layer 32 covering the outer peripheral surface of the wire 31, and the abrasive grains are formed by the synthetic resin layer 34 covering the plating layer 32. Since each of the abrasive grains 35 is in contact with the granular material 33 positioned in the opposite direction to the wire traveling direction (arrow X direction), each abrasive grain 35 is in the wire traveling direction (arrow X). It is difficult to make a slight displacement in the opposite direction. For this reason, the wire tool 30 exhibits high machining efficiency without causing a reduction in cutting force.

  On the other hand, during the cutting process, the minute displacement of the abrasive grains 35 in the direction approaching the axis of the wire 31 (the arrow Y direction) generated by the drag received by the abrasive grains 35 from the workpiece 38 is appropriately maintained by the synthetic resin layer 34. Therefore, the surface roughness of the processed surface of the workpiece 38 is good.

  Further, in the wire tool 30, by reducing the particle size of the abrasive grains 35 fixed by the synthetic resin layer 34 from the particle size of the granular material 33 fixed by the plating layer 32, as shown in FIG. Since the tips of the abrasive grains 35 fixed by the synthetic resin layer 34 can be aligned, it is effective for improving the surface roughness of the processed surface of the workpiece 38.

  In the wire tools 10, 20, 30 described above, the gaps 17, 27, 37 between the granules 13, 23, 33 adjacent to the longitudinal direction of the wires 11, 21, 31 and the abrasive grains 15, 25, 35 are The gaps 17, 27, and 37 can be changed within a range of values that are larger than zero and smaller than the outer diameter of the abrasive grains 15, 25, and 35. Is possible.

  By changing the gaps 17, 27, and 37 within the above range, the direction of the wire traveling direction (X direction) that the abrasive grains 15, 25, and 35 receive from the workpieces 18, 28, and 38 during the cutting process is changed. Since the minute displacement amount can be adjusted, the cutting performance and the surface accuracy of the workpieces 18, 28, 38 can be adjusted.

  The wire tool of the present invention can be widely used in the industrial field of slicing an ingot such as solar cell silicon, semiconductor silicon, magnetic material, sapphire, or SiC.

10, 20, 30 Wire tool 11, 21, 31 Wire 12, 22, 32 Plating layer 13, 23, 33 Granular body 14, 24, 34 Synthetic resin layer 15, 25, 35 Abrasive grain 16 Buffer resin layer 17, 27, 37 Clearance 18, 28, 38 Workpiece 26 Filler X, Y Arrow line

Claims (5)

A backup granular material fixed by a plating layer covering the outer peripheral surface of the wire; and abrasive grains fixed by a resin layer covering the plating layer, the abrasive particles being positioned in a direction opposite to the wire traveling direction. A wire tool comprising a buffer resin layer that is in contact with the granular material and does not include abrasive grains between the plating layer and the abrasive grains .   The wire tool according to claim 1, wherein a filler of an inorganic material or a metal material is mixed in the resin layer. The wire tool according to claim 1 or 2, wherein a gap between the granular material adjacent to the longitudinal direction of the wire and the abrasive is smaller than an outer diameter of the abrasive. The wire tool according to any one of claims 1 to 3 , wherein the number of abrasive grains fixed by the resin layer is larger than the number of granular bodies fixed by the plating layer. The wire tool according to any one of claims 1 to 4 , wherein the particle size of the abrasive grains fixed by the resin layer is smaller than the particle size of the granular material fixed by the plating layer.

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