TWI691372B - Sawing wire - Google Patents

Sawing wire Download PDF

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TWI691372B
TWI691372B TW108121451A TW108121451A TWI691372B TW I691372 B TWI691372 B TW I691372B TW 108121451 A TW108121451 A TW 108121451A TW 108121451 A TW108121451 A TW 108121451A TW I691372 B TWI691372 B TW I691372B
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wave component
wave
wavelength
saw
component
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TW108121451A
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TW202012081A (en
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藤原伸彦
飛田政志
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日商特線工業股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本發明之鋸線2具有波狀之鋸齒。該鋸齒具有第一波成分4、第二波成分6及第三波成分8複合而成之形狀。第一波成分4之波長WL1與第二波成分6之波長WL2不同。第二波成分6之波長WL2與第三波成分8之波長WL3不同。第三波成分8之波長WL3與第一波成分4之波長WL1不同。第一波成分4之波高WH1與第二波成分6之波高WH2不同。第二波成分6之波高WH2與第三波成分8之波高WH3不同。第三波成分8之波高WH3與第一波成分4之波高WH1不同。The saw wire 2 of the present invention has wavy saw teeth. The sawtooth has a shape in which the first wave component 4, the second wave component 6, and the third wave component 8 are combined. The wavelength WL1 of the first wave component 4 is different from the wavelength WL2 of the second wave component 6. The wavelength WL2 of the second wave component 6 is different from the wavelength WL3 of the third wave component 8. The wavelength WL3 of the third wave component 8 is different from the wavelength WL1 of the first wave component 4. The wave height WH1 of the first wave component 4 is different from the wave height WH2 of the second wave component 6. The wave height WH2 of the second wave component 6 is different from the wave height WH3 of the third wave component 8. The wave height WH3 of the third wave component 8 is different from the wave height WH1 of the first wave component 4.

Description

鋸線Sawing wire

本發明係關於一種鋸線。詳細而言，本發明係關於一種鋸線之鋸齒加工之改良。The invention relates to a saw wire. In detail, the present invention relates to an improvement of sawtooth processing of saw wires.

對半導體晶錠進行切片時使用鋸線。藉由切片而獲得晶圓。使用固定研磨粒式之鋸線及游離研磨粒式之鋸線。固定研磨粒式之鋸線之切削效率優異。但是，利用固定研磨粒式之鋸線獲得之切削面之尺寸精度較差。就晶圓之性能之觀點而言，有利的是游離研磨粒式之鋸線。Use a saw wire when slicing a semiconductor ingot. Wafers are obtained by slicing. Use fixed abrasive grain saw wire and free abrasive grain saw wire. The cutting efficiency of the fixed abrasive grain saw wire is excellent. However, the dimensional accuracy of the cutting surface obtained with a fixed abrasive grain saw wire is poor. From the standpoint of wafer performance, it is advantageous to have free abrasive grain saw wires.

對於游離研磨粒式之鋸線，在切片之前對該鋸線吹送漿料。該漿料包含研磨粒。藉由鋸線之行進，研磨粒被帶入至晶錠與鋸線之間。藉由該研磨粒之移動而對晶錠進行切削，從而達成切片。可帶入大量研磨粒之鋸線之切削效率優異。可帶入大量研磨粒之鋸線亦可有助於切削面之尺寸精度。For saw wires with free abrasive grains, slurry is blown on the saw wire before slicing. The slurry contains abrasive particles. By the movement of the saw wire, the abrasive grains are brought between the ingot and the saw wire. By moving the abrasive grains, the ingot is cut to achieve slicing. The saw wire that can bring in a large amount of abrasive grains has excellent cutting efficiency. The saw wire that can bring in a large amount of abrasive grains can also contribute to the dimensional accuracy of the cutting surface.

日本特開2004-276207公報中揭示有經鋸齒加工之鋸線。該鋸齒具有波形狀。波具有山與谷。研磨粒補充至谷，通過晶錠之內部而前進。該鋸線可帶入大量研磨粒。Japanese Patent Laid-Open No. 2004-276207 discloses a saw wire processed by saw teeth. The sawtooth has a wave shape. Waves have mountains and valleys. The abrasive grains are replenished to the valley and advance through the inside of the crystal ingot. The saw wire can carry a large amount of abrasive particles.

於日本特表2008-519698公報中揭示有同樣之經鋸齒加工之鋸線。該鋸線具有2個波。一波之振動方向與另一波之振動方向不同。 [先前技術文獻] [專利文獻] The same saw wire processed by saw teeth is disclosed in Japanese Special Publication 2008-519698. This saw wire has 2 waves. The vibration direction of one wave is different from the vibration direction of another wave. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2004-276207公報 [專利文獻2]日本特表2008-519698公報 [Patent Literature 1] Japanese Patent Laid-Open No. 2004-276207 [Patent Document 2] Japanese Special Publication 2008-519698

[發明所欲解決之課題][Problems to be solved by the invention]

有因用於切削加工而於鋸線產生偏磨耗之情況。 偏磨耗會降低切削面之尺寸精度。本發明之目的在於提供一種鋸線，其不易產生偏磨耗，因此可獲得品質優異之切削面。 [解決課題之技術手段] There are cases where partial wear occurs on the saw wire due to cutting. Partial wear will reduce the dimensional accuracy of the cutting surface. An object of the present invention is to provide a saw wire that is less prone to uneven wear, so that a cutting surface with excellent quality can be obtained. [Technical means to solve the problem]

本發明之鋸線具有波狀之鋸齒。該鋸齒具有第一波成分、第二波成分及第三波成分複合而成之形狀。The saw wire of the present invention has corrugated saw teeth. The saw tooth has a shape in which a first wave component, a second wave component, and a third wave component are combined.

較佳為第一波成分之波長WL1與第二波成分之波長WL2不同。較佳為第二波成分之波長WL2與第三波成分之波長WL3不同。較佳為第三波成分之波長WL3與第一波成分之波長WL1不同。Preferably, the wavelength WL1 of the first wave component and the wavelength WL2 of the second wave component are different. Preferably, the wavelength WL2 of the second wave component is different from the wavelength WL3 of the third wave component. Preferably, the wavelength WL3 of the third wave component is different from the wavelength WL1 of the first wave component.

較佳為第一波成分之波高WH1與第二波成分之波高WH2不同。較佳為第二波成分之波高WH2與第三波成分之波高WH3不同。較佳為第三波成分之波高WH3與第一波成分之波高WH1不同。Preferably, the wave height WH1 of the first wave component is different from the wave height WH2 of the second wave component. Preferably, the wave height WH2 of the second wave component is different from the wave height WH3 of the third wave component. Preferably, the wave height WH3 of the third wave component is different from the wave height WH1 of the first wave component.

較佳為第一波成分之振動方向與第二波成分之振動方向不同。較佳為第二波成分之振動方向與第三波成分之振動方向不同。較佳為第三波成分之振動方向與第一波成分之振動方向不同。Preferably, the vibration direction of the first wave component is different from the vibration direction of the second wave component. Preferably, the vibration direction of the second wave component is different from the vibration direction of the third wave component. Preferably, the vibration direction of the third wave component is different from the vibration direction of the first wave component.

較佳為第一波成分之波長WL1及波高WH1、第二波成分之波長WL2及波高WH2、第三波成分之波長WL3及波高WH3、以及線徑Di滿足下述數式。 1.1*Di≦WL1≦50*Di 1.2*Di≦WL2≦100*Di 2000*Di≦WL3≦6000*Di 1.05*Di≦WH1≦5*Di 1.1*Di≦WH2≦10*Di 2*Di≦WH3≦1000*Di [發明之效果] Preferably, the wavelength WL1 and wave height WH1 of the first wave component, the wavelength WL2 and wave height WH2 of the second wave component, the wavelength WL3 and wave height WH3 of the third wave component, and the line diameter Di satisfy the following formula. 1.1*Di≦WL1≦50*Di 1.2*Di≦WL2≦100*Di 2000*Di≦WL3≦6000*Di 1.05*Di≦WH1≦5*Di 1.1*Di≦WH2≦10*Di 2*Di≦WH3≦1000*Di [Effect of invention]

本發明之鋸線之鋸齒具有3種以上之波成分。該鋸線可均勻地帶入研磨粒。該鋸線不易產生偏磨耗。藉由該鋸線，可獲得尺寸精度良好之切削面。The saw tooth of the saw wire of the present invention has more than three kinds of wave components. The saw wire can be uniformly introduced into abrasive grains. The saw wire is not prone to partial wear. With this saw wire, a cutting surface with good dimensional accuracy can be obtained.

以下，一面適宜地參照圖式，一面基於較佳之實施形態詳細地說明本發明。Hereinafter, the present invention will be described in detail based on preferred embodiments while referring to the drawings as appropriate.

圖1及2中表示鋸線2。該等圖式中，X方向為水平方向，Y方向為鉛直方向，Z方向為水平方向。X方向亦為該鋸線2之長度方向。該鋸線2安裝於鋸床（saw machine），向圖1之左側行進。The saw wire 2 is shown in FIGS. 1 and 2. In these drawings, the X direction is the horizontal direction, the Y direction is the vertical direction, and the Z direction is the horizontal direction. The X direction is also the length direction of the saw wire 2. The saw wire 2 is mounted on a saw machine and travels to the left in FIG. 1.

該鋸線2具有波狀之鋸齒。該鋸齒具有圖2中示意性地表示之第一波成分4、第二波成分6及第三波成分8複合而成之形狀。鋸齒亦可具有4種以上之波成分複合而成之形狀。The saw wire 2 has wavy saw teeth. The sawtooth has a shape in which the first wave component 4, the second wave component 6, and the third wave component 8 shown schematically in FIG. 2 are combined. The saw tooth can also have a shape composed of more than 4 kinds of wave components.

圖3中示意性地表示第一波成分4。圖3表示自圖2之箭頭A1之方向觀察之第一波成分4。第一波成分4於相對於箭頭A1垂直之平面振動。第一波成分4於其他平面不振動。第一波成分4係二維之波。第一波成分4以固定波長振動。如圖2明確所示，第一波成分4之波之振動方向為Y方向。The first wave component 4 is schematically shown in FIG. 3. FIG. 3 shows the first wave component 4 viewed from the direction of arrow A1 in FIG. 2. The first wave component 4 vibrates in a plane perpendicular to the arrow A1. The first wave component 4 does not vibrate in other planes. The first wave component 4 is a two-dimensional wave. The first wave component 4 vibrates at a fixed wavelength. As clearly shown in FIG. 2, the vibration direction of the wave of the first wave component 4 is the Y direction.

如圖3所示，第一波成分4具有多個山10及多個谷12。該等山10及谷12沿著X方向交替地配置。鋸線2於第一波成分4之谷12中補充研磨粒，帶入至切削面。圖3中，箭頭WL1表示第一波成分4之波長，箭頭WH1表示第一波成分4之波高。As shown in FIG. 3, the first wave component 4 has multiple mountains 10 and multiple valleys 12. The mountains 10 and valleys 12 are alternately arranged along the X direction. The saw wire 2 is supplemented with abrasive grains in the valley 12 of the first wave component 4 and brought into the cutting surface. In FIG. 3, the arrow WL1 indicates the wavelength of the first wave component 4, and the arrow WH1 indicates the wave height of the first wave component 4.

圖4中示意性地表示第二波成分6。圖4表示自圖2之箭頭A2之方向觀察之第二波成分6。第二波成分6於相對於箭頭A2垂直之平面振動。第二波成分6於其他平面不振動。第二波成分6係二維之波。第二波成分6以固定波長振動。如圖2明確所示，第二波成分6之振動方向相對於Y方向傾斜。第二波成分6之振動方向與第一波成分4之振動方向不同。本實施形態中，第二波成分6之振動方向相對於第一波成分4之振動方向的角度θ 1-2為60°（參照圖2）。 The second wave component 6 is schematically shown in FIG. 4. FIG. 4 shows the second wave component 6 viewed from the direction of arrow A2 in FIG. 2. The second wave component 6 vibrates in a plane perpendicular to the arrow A2. The second wave component 6 does not vibrate in other planes. The second wave component 6 is a two-dimensional wave. The second wave component 6 vibrates at a fixed wavelength. As clearly shown in FIG. 2, the vibration direction of the second wave component 6 is inclined with respect to the Y direction. The vibration direction of the second wave component 6 is different from the vibration direction of the first wave component 4. In this embodiment, the angle θ 1-2 of the vibration direction of the second wave component 6 relative to the vibration direction of the first wave component 4 is 60° (see FIG. 2 ).

如圖4所示，第二波成分6具有多個山14及多個谷16。該等山14及谷16沿著X方向交替地配置。鋸線2於第二波成分6之谷16補充研磨粒，帶入至切削面。圖4中，箭頭WL2表示第二波成分6之波長，箭頭WH2表示第二波成分6之波高。As shown in FIG. 4, the second wave component 6 has multiple mountains 14 and multiple valleys 16. The mountains 14 and valleys 16 are alternately arranged along the X direction. The saw wire 2 is supplemented with abrasive grains in the valley 16 of the second wave component 6 and brought into the cutting surface. In FIG. 4, the arrow WL2 indicates the wavelength of the second wave component 6 and the arrow WH2 indicates the wave height of the second wave component 6.

圖5中示意性地表示第三波成分8。圖5表示自圖2之箭頭A3之方向觀察之第三波成分8。第三波成分8於相對於箭頭A3垂直之平面振動。第三波成分8於其他平面不振動。第三波成分8係二維之波。第三波成分8以固定波長振動。如圖2明確所示，第三波成分8之振動方向相對於Y方向傾斜。第三波成分8之振動方向與第一波成分4之振動方向不同。本實施形態中，第三波成分8之振動方向相對於第一波成分4之振動方向的角度θ 1-3為120°（參照圖2）。第三波成分8之振動方向與第二波成分6之振動方向亦不同。本實施形態中，第三波成分8之振動方向相對於第二波成分6之振動方向的角度θ 2-3為60°（參照圖2）。 The third wave component 8 is schematically shown in FIG. 5. FIG. 5 shows the third wave component 8 viewed from the direction of arrow A3 in FIG. 2. The third wave component 8 vibrates in a plane perpendicular to the arrow A3. The third wave component 8 does not vibrate in other planes. The third wave component 8 is a two-dimensional wave. The third wave component 8 vibrates at a fixed wavelength. As clearly shown in FIG. 2, the vibration direction of the third wave component 8 is inclined with respect to the Y direction. The vibration direction of the third wave component 8 is different from the vibration direction of the first wave component 4. In this embodiment, the angle θ 1-3 of the vibration direction of the third wave component 8 relative to the vibration direction of the first wave component 4 is 120° (see FIG. 2 ). The vibration direction of the third wave component 8 is also different from the vibration direction of the second wave component 6. In this embodiment, the angle θ 2-3 of the vibration direction of the third wave component 8 relative to the vibration direction of the second wave component 6 is 60° (see FIG. 2 ).

如圖5所示，第三波成分8具有多個山18及多個谷20。該等山18及谷20沿著X方向交替地配置。鋸線2於第三波成分8之谷20中補充研磨粒，帶入至切削面。圖5中，箭頭WL3表示第三波成分8之波長，箭頭WH3表示第三波成分8之波高。As shown in FIG. 5, the third wave component 8 has multiple mountains 18 and multiple valleys 20. The mountains 18 and valleys 20 are alternately arranged along the X direction. The saw wire 2 is supplemented with abrasive grains in the valley 20 of the third wave component 8 and brought into the cutting surface. In FIG. 5, the arrow WL3 indicates the wavelength of the third wave component 8 and the arrow WH3 indicates the wave height of the third wave component 8.

如上所述，第一波成分4、第二波成分6及第三波成分8係二維之波。藉由使第一波成分4、第二波成分6及第三波成分8複合而形成三維之波。該鋸線2之鋸齒具有三維形狀。該鋸線2中，沿著其長度方向，第一波成分4之振動、第二波成分6之振動及第三波成分8之振動同時地進行。As described above, the first wave component 4, the second wave component 6, and the third wave component 8 are two-dimensional waves. A three-dimensional wave is formed by combining the first wave component 4, the second wave component 6, and the third wave component 8. The saw teeth of the saw wire 2 have a three-dimensional shape. In the saw wire 2, the vibration of the first wave component 4, the vibration of the second wave component 6, and the vibration of the third wave component 8 are performed simultaneously along the longitudinal direction thereof.

該鋸線2藉由第一波成分4之谷12、第二波成分6之谷16及第三波成分8之谷20而帶入研磨粒。該鋸線2均勻地帶入研磨粒。該鋸線2中，不易產生偏磨耗。藉由該鋸線2，可獲得尺寸精度優異之切削面。藉由該鋸線2，可獲得粗糙度較小之切削面。The saw wire 2 is brought into the abrasive grains by the valley 12 of the first wave component 4, the valley 16 of the second wave component 6 and the valley 20 of the third wave component 8. The saw wire 2 is uniformly introduced into abrasive grains. In this saw wire 2, uneven wear is not likely to occur. With this saw wire 2, a cutting surface excellent in dimensional accuracy can be obtained. By the saw wire 2, a cutting surface with a small roughness can be obtained.

該鋸線2中，第一波成分4之振動方向與第二波成分6之振動方向不同，第二波成分6之振動方向與第三波成分8之振動方向不同，第三波成分8之振動方向與第一波成分4之振動方向不同。該鋸線2具有振動方向不同之3種波成分複合而成之鋸齒。該鋸線2中，均勻地帶入研磨粒。In the saw wire 2, the vibration direction of the first wave component 4 is different from the vibration direction of the second wave component 6, the vibration direction of the second wave component 6 is different from the vibration direction of the third wave component 8, and the third wave component 8 The vibration direction is different from the vibration direction of the first wave component 4. The saw wire 2 has saw teeth composed of three kinds of wave components with different vibration directions. In this saw wire 2, abrasive grains are uniformly introduced.

第一波成分4之振動方向與第二波成分6之振動方向之間的角度較佳為20°以上且160°以下，尤佳為30°以上且150°以下。第二波成分6之振動方向與第三波成分8之振動方向之間的角度較佳為20°以上且160°以下，尤佳為30°以上且150°以下。第三波成分8之振動方向與第一波成分4之振動方向之間的角度較佳為20°以上且160°以下，尤佳為30°以上且150°以下。The angle between the vibration direction of the first wave component 4 and the vibration direction of the second wave component 6 is preferably 20° or more and 160° or less, and particularly preferably 30° or more and 150° or less. The angle between the vibration direction of the second wave component 6 and the vibration direction of the third wave component 8 is preferably 20° or more and 160° or less, and particularly preferably 30° or more and 150° or less. The angle between the vibration direction of the third wave component 8 and the vibration direction of the first wave component 4 is preferably 20° or more and 160° or less, and particularly preferably 30° or more and 150° or less.

如圖3及4之對比明確所示，第二波成分6之波長WL2大於第一波成分4之波長WL1。如圖4及5之對比明確所示，第三波成分8之波長WL3大於第二波成分6之波長WL2。波長之大小關係亦可不同。例如，第一波成分4之波長WL1亦可大於第二波成分6之波長WL2。第一波成分4之波長WL1亦可與第二波成分6之波長WL2相同。As clearly shown in the comparison of FIGS. 3 and 4, the wavelength WL2 of the second wave component 6 is greater than the wavelength WL1 of the first wave component 4. As clearly shown in the comparison of FIGS. 4 and 5, the wavelength WL3 of the third wave component 8 is greater than the wavelength WL2 of the second wave component 6. The relationship between the size of the wavelength can also be different. For example, the wavelength WL1 of the first wave component 4 may also be greater than the wavelength WL2 of the second wave component 6. The wavelength WL1 of the first wave component 4 may also be the same as the wavelength WL2 of the second wave component 6.

如圖3及4之對比明確所示，第一波成分4之波高WH1大於第二波成分6之波高WH2。如圖3及5之對比明確所示，第三波成分8之波高WH3大於第一波成分4之波高WH1。波高之大小關係亦可不同。例如，第一波成分4之波高WH1亦可小於第二波成分6之波高WH2。第一波成分4之波高WH1亦可與第二波成分6之波高WH2相同。As clearly shown in the comparison of FIGS. 3 and 4, the wave height WH1 of the first wave component 4 is greater than the wave height WH2 of the second wave component 6. As clearly shown in the comparison of FIGS. 3 and 5, the wave height WH3 of the third wave component 8 is greater than the wave height WH1 of the first wave component 4. The relationship between wave height and size can also be different. For example, the wave height WH1 of the first wave component 4 may also be smaller than the wave height WH2 of the second wave component 6. The wave height WH1 of the first wave component 4 may also be the same as the wave height WH2 of the second wave component 6.

該鋸線2中，第一波成分4之波長WL1與第二波成分6之波長WL2不同，第二波成分6之波長WL2與第三波成分8之波長WL3不同，第三波成分8之波長WL3與第一波成分4之波長WL1不同。該鋸線2具有波長不同之3種波成分複合而成之鋸齒。該鋸線2中，均勻地帶入研磨粒。In the saw wire 2, the wavelength WL1 of the first wave component 4 is different from the wavelength WL2 of the second wave component 6, the wavelength WL2 of the second wave component 6 is different from the wavelength WL3 of the third wave component 8, and the wavelength of the third wave component 8 is The wavelength WL3 is different from the wavelength WL1 of the first wave component 4. The saw wire 2 has saw teeth composed of three wave components with different wavelengths. In this saw wire 2, abrasive grains are uniformly introduced.

如上所述，第一波成分4之波長WL1亦可與第二波成分6之波長WL2相同。該情形時，藉由第三波成分8之波長WL3與波長WL1及波長WL2不同，亦可達成研磨粒之均勻之帶入。第一波成分4之波長WL1、第二波成分6之波長WL2及第三波成分8之波長WL3亦可相同。As described above, the wavelength WL1 of the first wave component 4 may be the same as the wavelength WL2 of the second wave component 6. In this case, even if the wavelength WL3 of the third wave component 8 is different from the wavelength WL1 and the wavelength WL2, uniform introduction of abrasive grains can be achieved. The wavelength WL1 of the first wave component 4, the wavelength WL2 of the second wave component 6 and the wavelength WL3 of the third wave component 8 may also be the same.

該鋸線2中，第一波成分4之波高WH1與第二波成分6之波高WH2不同，第二波成分6之波高WH2與第三波成分8之波高WH3不同，第三波成分8之波高WH3與第一波成分4之波高WH1不同。該鋸線2具有波高不同之3種波成分複合而成之鋸齒。該鋸線2中，均勻地帶入研磨粒。In the saw wire 2, the wave height WH1 of the first wave component 4 is different from the wave height WH2 of the second wave component 6, the wave height WH2 of the second wave component 6 is different from the wave height WH3 of the third wave component 8, and the wave height of the third wave component 8 is The wave height WH3 is different from the wave height WH1 of the first wave component 4. The saw wire 2 has saw teeth composed of three kinds of wave components with different wave heights. In this saw wire 2, abrasive grains are uniformly introduced.

如上所述，第一波成分4之波高WH1亦可與第二波成分6之波高WH2相同。該情形時，藉由第三波成分8之波高WH3與波高WH1及波高WH2不同，亦可達成研磨粒之均勻之帶入。第一波成分4之波高WH1、第二波成分6之波高WH2及第三波成分8之波高WH3亦可相同。As described above, the wave height WH1 of the first wave component 4 may be the same as the wave height WH2 of the second wave component 6. In this case, even if the wave height WH3 of the third wave component 8 is different from the wave height WH1 and the wave height WH2, uniform introduction of abrasive grains can be achieved. The wave height WH1 of the first wave component 4, the wave height WH2 of the second wave component 6 and the wave height WH3 of the third wave component 8 may also be the same.

較佳為第一波成分4之波長WL1滿足下述之數式。 1.1*Di≦WL1≦50*Di 該數式中，Di表示線徑（參照圖2）。換言之，第一波成分4之波長WL1為線徑Di之1.1倍以上且50倍以下。較佳為波長WL1為線徑Di之3倍以上且40倍以下。 The wavelength WL1 of the first wave component 4 preferably satisfies the following formula. 1.1*Di≦WL1≦50*Di In this equation, Di represents the wire diameter (see FIG. 2). In other words, the wavelength WL1 of the first wave component 4 is 1.1 times or more and 50 times or less the wire diameter Di. Preferably, the wavelength WL1 is 3 times or more and 40 times or less the wire diameter Di.

較佳為第二波成分6之波長WL2滿足下述之數式。 1.2*Di≦WL2≦100*Di 換言之，第二波成分6之波長WL2為線徑Di之1.2倍以上且100倍以下。較佳為波長WL2為線徑Di之3.5倍以上且50倍以下。 Preferably, the wavelength WL2 of the second wave component 6 satisfies the following formula. 1.2*Di≦WL2≦100*Di In other words, the wavelength WL2 of the second wave component 6 is 1.2 times or more and 100 times or less the wire diameter Di. The wavelength WL2 is preferably 3.5 times or more and 50 times or less the wire diameter Di.

較佳為第三波成分8之波長WL3滿足下述之數式。 2000*Di≦WL3≦6000*Di 換言之，第三波成分8之波長WL3為線徑Di之2000倍以上且6000倍以下。較佳為波長WL3為線徑Di之2200倍以上且5000倍以下。 The wavelength WL3 of the third wave component 8 preferably satisfies the following formula. 2000*Di≦WL3≦6000*Di In other words, the wavelength WL3 of the third wave component 8 is 2000 times or more and 6000 times or less the wire diameter Di. Preferably, the wavelength WL3 is 2200 times or more and 5000 times or less the wire diameter Di.

波長WL1與波長WL2之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。波長WL2與波長WL3之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。波長WL3與波長WL1之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。The ratio of the absolute value of the difference between the wavelength WL1 and the wavelength WL2 relative to the wire diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wavelength WL2 and the wavelength WL3 to the wire diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wavelength WL3 and the wavelength WL1 relative to the wire diameter Di is preferably 3% or more, and particularly preferably 5% or more.

波長WL3相對於波長WL1之比（WL3/WL1）較佳為250以上，尤佳為650以上。比（WL3/WL1）較佳為2500以下。波長WL3相對於波長WL2之比（WL3/WL2）較佳為200以上，尤佳為520以上。比（WL3/WL2）較佳為2000以下。The ratio of the wavelength WL3 to the wavelength WL1 (WL3/WL1) is preferably 250 or more, and particularly preferably 650 or more. The ratio (WL3/WL1) is preferably 2500 or less. The ratio of the wavelength WL3 to the wavelength WL2 (WL3/WL2) is preferably 200 or more, and particularly preferably 520 or more. The ratio (WL3/WL2) is preferably 2000 or less.

較佳為第一波成分4之波高WH1滿足下述之數式。 1.05*Di≦WH1≦5*Di 該數式中，Di表示線徑（參照圖2）。換言之，第一波成分4之波高WH1為線徑Di之1.05倍以上且5倍以下。較佳為波高WH1為線徑Di之1.1倍以上且3倍以下。 It is preferable that the wave height WH1 of the first wave component 4 satisfies the following formula. 1.05*Di≦WH1≦5*Di In this equation, Di represents the wire diameter (see FIG. 2). In other words, the wave height WH1 of the first wave component 4 is 1.05 times or more and 5 times or less the wire diameter Di. Preferably, the wave height WH1 is 1.1 times or more and 3 times or less the wire diameter Di.

較佳為第二波成分6之波高WH2滿足下述之數式。 1.1*Di≦WH2≦10*Di 換言之，第二波成分6之波高WH2為線徑Di之1.1倍以上且10倍以下。較佳為波高WH2為線徑Di之1.2倍以上且5倍以下。 Preferably, the wave height WH2 of the second wave component 6 satisfies the following formula. 1.1*Di≦WH2≦10*Di In other words, the wave height WH2 of the second wave component 6 is 1.1 times or more and 10 times or less the wire diameter Di. The wave height WH2 is preferably 1.2 times or more and 5 times or less the wire diameter Di.

較佳為第三波成分8之波高WH3滿足下述之數式。 2*Di≦WH3≦1000*Di 換言之，第三波成分8之波高WH3為線徑Di之2倍以上且1000倍以下。較佳為波高WH3為線徑Di之50倍以上且800倍以下。 It is preferable that the wave height WH3 of the third wave component 8 satisfies the following formula. 2*Di≦WH3≦1000*Di In other words, the wave height WH3 of the third wave component 8 is 2 times or more and 1000 times or less the wire diameter Di. Preferably, the wave height WH3 is 50 times or more and 800 times or less the wire diameter Di.

波高WH1與波高WH2之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。波高WH2與波高WH3之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。波高WH3與波高WH1之差之絕對值相對於線徑Di之比率較佳為3%以上，尤佳為5%以上。The ratio of the absolute value of the difference between the wave height WH1 and the wave height WH2 relative to the wire diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wave height WH2 and the wave height WH3 relative to the wire diameter Di is preferably 3% or more, and particularly preferably 5% or more. The ratio of the absolute value of the difference between the wave height WH3 and the wave height WH1 relative to the wire diameter Di is preferably 3% or more, particularly preferably 5% or more.

線徑Di較佳為0.05mm以上且0.40mm以下，尤佳為0.10mm以上且0.20mm以下。The wire diameter Di is preferably 0.05 mm or more and 0.40 mm or less, and particularly preferably 0.10 mm or more and 0.20 mm or less.

鋸線2之材質為金屬。典型之金屬為碳鋼。較佳為於由碳鋼所構成之主要部分之表面實施有鍍黃銅之鋸線2。The material of the saw wire 2 is metal. The typical metal is carbon steel. It is preferable to implement the brass-plated saw wire 2 on the surface of the main part composed of carbon steel.

用於該鋸線2之鋸齒加工裝置具有第一鋸齒加工部、第二鋸齒加工部及第三鋸齒加工部。圖6中表示第一鋸齒加工部30。該第一鋸齒加工部30具有由第一齒輪32及第二齒輪34所構成之齒輪對36。藉由使母線38通過齒輪對36而產生塑性變形。藉由該塑性變形於母線38鋸齒加工第一波成分4。The sawtooth processing device used for the saw wire 2 has a first sawtooth processing portion, a second sawtooth processing portion, and a third sawtooth processing portion. FIG. 6 shows the first saw-tooth processing part 30. The first saw-tooth machining part 30 has a gear pair 36 composed of a first gear 32 and a second gear 34. By passing the bus bar 38 through the gear pair 36, plastic deformation occurs. By the plastic deformation, the first wave component 4 is processed in the serration of the bus bar 38.

雖未圖示，但第二鋸齒加工部亦具有齒輪對。自第一鋸齒加工部30排出之母線38通過第二鋸齒加工部之齒輪對。藉由該通過而產生塑性變形，於母線38鋸齒加工第二波成分6。藉由具有相對於第一鋸齒加工部30之齒輪對之軸傾斜之軸的齒輪對，可形成振動方向與第一波成分4不同之第二波成分6。Although not shown, the second saw-tooth processing part also has a gear pair. The bus bar 38 discharged from the first saw-tooth processing portion 30 passes through the gear pair of the second saw-tooth processing portion. The plastic deformation is generated by the passage, and the second wave component 6 is saw-toothed on the bus bar 38. By having a gear pair having an axis inclined with respect to the axis of the gear pair of the first sawtooth processing portion 30, a second wave component 6 having a vibration direction different from the first wave component 4 can be formed.

雖未圖示，但第三鋸齒加工部亦具有齒輪對。自第二鋸齒加工部排出之母線38通過第三鋸齒加工部之齒輪對。藉由該通過而產生塑性變形，於母線38鋸齒加工第三波成分8。藉由具有相對於第一鋸齒加工部30之齒輪對之軸傾斜之軸的齒輪對，可形成振動方向與第一波成分4不同之第三波成分8。藉由具有相對於第二鋸齒加工部之齒輪對之軸傾斜之軸的齒輪對，可形成振動方向與第二波成分6不同之第三波成分8。Although not shown, the third saw-tooth processing part also has a gear pair. The bus bar 38 discharged from the second saw-tooth machining section passes through the gear pair of the third saw-tooth machining section. The plastic deformation is generated by this passage, and the third wave component 8 is saw-toothed on the bus bar 38. By having a gear pair having an axis inclined with respect to the axis of the gear pair of the first sawtooth processing portion 30, a third wave component 8 having a vibration direction different from the first wave component 4 can be formed. By the gear pair having an axis inclined with respect to the axis of the gear pair of the second saw-tooth processing portion, a third wave component 8 having a vibration direction different from the second wave component 6 can be formed.

圖7係示意性地表示本發明之另一實施形態之鋸線22的右側視圖。該鋸線22具有波狀之鋸齒。該鋸齒具有圖7中示意性地表示之第一波成分24、第二波成分26及第三波成分28複合而成之形狀。第一波成分24之振動方向為Y方向。第二波成分26之振動方向相對於Y方向傾斜90°。第三波成分28之振動方向相對於Y方向傾斜120°。除第二波成分26之振動方向以外，該鋸線22之構造與圖1-5所示之鋸線22之構造相同。7 is a right side view schematically showing a saw wire 22 according to another embodiment of the present invention. The saw wire 22 has wavy saw teeth. This saw tooth has a shape in which the first wave component 24, the second wave component 26, and the third wave component 28 schematically shown in FIG. 7 are combined. The vibration direction of the first wave component 24 is the Y direction. The vibration direction of the second wave component 26 is inclined by 90° with respect to the Y direction. The vibration direction of the third wave component 28 is inclined by 120° with respect to the Y direction. Except for the vibration direction of the second wave component 26, the structure of the saw wire 22 is the same as the structure of the saw wire 22 shown in FIGS. 1-5.

該鋸線22藉由第一波成分24之谷、第二波成分26之谷及第三波成分28之谷帶入研磨粒。該鋸線22均勻地帶入研磨粒。該鋸線22中，不易產生偏磨耗。藉由該鋸線22，可獲得尺寸精度優異之切削面。藉由該鋸線22，可獲得粗糙度較小之切削面。 [實施例] The saw wire 22 is brought into the abrasive grains by the valley of the first wave component 24, the valley of the second wave component 26, and the valley of the third wave component 28. The saw wire 22 is uniformly introduced into abrasive grains. In the saw wire 22, uneven wear is unlikely to occur. With the saw wire 22, a cutting surface excellent in dimensional accuracy can be obtained. By the saw wire 22, a cutting surface with a small roughness can be obtained. [Example]

以下，藉由實施例明確表示本發明之效果，但不應基於該實施例之記載而對本發明進行限定性之解釋。Hereinafter, the effects of the present invention will be clearly shown by examples, but the present invention should not be limitedly interpreted based on the description of the examples.

[實施例1] 製作了圖1-5所示之鋸線。該鋸線之規格示於下述之表1。該鋸線係由實施有鍍黃銅之碳鋼所構成。 [Example 1] The saw wire shown in Figure 1-5 was produced. The specifications of the saw wire are shown in Table 1 below. The saw wire is made of brass-plated carbon steel.

[實施例2-9] 將規格設為如下述之表1及2所示，除此以外，以與實施例1相同之方式獲得實施例2-9之鋸線。 [Example 2-9] The specifications were set as shown in Tables 1 and 2 below, except that the saw wires of Examples 2-9 were obtained in the same manner as Example 1.

[比較例1] 製作了具有第一波成分及第二波成分之鋸線。該鋸線不具有第三波成分。 [Comparative Example 1] A saw wire having a first wave component and a second wave component was produced. This saw wire does not have a third wave component.

[比較例2] 準備習知之鋸線。該鋸線不具有波之形狀。 [Comparative Example 2] Prepare the conventional saw wire. The saw wire does not have a wave shape.

[試驗1] 將各鋸線安裝於鋸床。於該鋸線之表面塗佈包含研磨粒之漿料。使該鋸線以0.6 mm/min之速度行進，將玻璃板進行切片。觀察所獲得之切削面之粗糙度及波度而進行評價。該結果作為指數示於下述之表1-3。數值越大，評價越優異。 [Experiment 1] Install each saw wire on the sawing machine. A slurry containing abrasive particles is coated on the surface of the saw wire. The saw wire was allowed to travel at a speed of 0.6 mm/min to slice the glass plate. The roughness and waviness of the obtained cutting surface were observed and evaluated. This result is shown as an index in the following Table 1-3. The larger the value, the better the evaluation.

[試驗2] 將該鋸線之行進速度設為0.8 mm/min，除此以外，以與實驗1相同之方式，評價切削面之粗糙度及波度。該結果作為指數示於下述之表1-3。數值越大，評價越優異。 [Experiment 2] Except that the travel speed of the saw wire was set to 0.8 mm/min, the roughness and waviness of the cutting surface were evaluated in the same manner as in Experiment 1. This result is shown as an index in the following Table 1-3. The larger the value, the better the evaluation.

[表1] 表1 評價結果

Figure 108121451-A0305-0001
[Table 1] Table 1 Evaluation results
Figure 108121451-A0305-0001

[表2] 表2 評價結果

Figure 108121451-A0305-0002
[Table 2] Table 2 Evaluation results
Figure 108121451-A0305-0002

[表3] 表3 評價結果

Figure 108121451-A0305-0003
[Table 3] Table 3 Evaluation results
Figure 108121451-A0305-0003

如表1-3所示，各實施例之鋸線中，獲得與比較例1及2之鋸線相比優異之評價。根據該評價結果，本發明之優越性明確。 [產業上之可利用性] As shown in Tables 1-3, among the saw wires of the examples, excellent evaluations were obtained compared to the saw wires of Comparative Examples 1 and 2. Based on this evaluation result, the superiority of the present invention is clear. [Industry availability]

本發明之鋸線可用於各種物品之切斷。The saw wire of the invention can be used for cutting various articles.

2、22：鋸線 4、24：第一波成分 6、26：第二波成分 8、28：第三波成分 10、14、18：山 12、16、20：谷 30：第一鋸齒加工部 32：第一齒輪 34：第二齒輪 36：齒輪對 38：母線 A1、A2、A3：箭頭 Di：線徑 WH1、WH2、WH3：波高 WL1、WL2、WL3：波長 2. 22: Saw wire 4.24: The first wave of components 6.26: Second wave component 8, 28: Third wave component 10, 14, 18: Mountain 12, 16, 20: Valley 30: The first sawtooth processing department 32: The first gear 34: Second gear 36: Gear pair 38: Busbar A1, A2, A3: arrow Di: wire diameter WH1, WH2, WH3: wave height WL1, WL2, WL3: wavelength

圖1係表示本發明之一實施形態之鋸線之一部分的前視圖。 圖2係示意性地表示圖1之鋸線的放大右側視圖。 圖3係表示圖1之鋸線之鋸齒之第一波線段的示意圖。 圖4係表示圖1之鋸線之鋸齒之第二波線段的示意圖。 圖5係表示圖1之鋸線之鋸齒之第三波線段的示意圖。 圖6係表示用於圖1之鋸線的鋸齒加工裝置之一部分的示意圖。 圖7係示意性地表示本發明之另一實施形態之鋸線的右側視圖。 Fig. 1 is a front view showing a part of a saw wire according to an embodiment of the present invention. Fig. 2 is an enlarged right side view schematically showing the saw wire of Fig. 1. FIG. 3 is a schematic diagram showing the first wave segment of the sawtooth of the saw wire of FIG. 1. FIG. 4 is a schematic diagram showing the second wave segment of the sawtooth of the saw wire of FIG. 1. FIG. 5 is a schematic diagram showing the third wave segment of the sawtooth of the saw wire of FIG. 1. 6 is a schematic view showing a part of a saw tooth processing device used for the saw wire of FIG. 1. 7 is a right side view schematically showing a saw wire according to another embodiment of the present invention.

2：鋸線 4：第一波成分 6：第二波成分 8：第三波成分 A1、A2、A3：箭頭 Di：線徑 WH1、WH2、WH3：波高 2: sawing wire 4: The first wave of components 6: Second wave component 8: Third wave component A1, A2, A3: arrow Di: wire diameter WH1, WH2, WH3: wave height

Claims (4)

一種鋸線，其具有波狀之鋸齒，且上述鋸齒具有第一波成分、第二波成分及第三波成分複合而成之形狀；其中上述第一波成分之振動方向與上述第二波成分之振動方向不同，上述第二波成分之振動方向與上述第三波成分之振動方向不同，上述第三波成分之振動方向與上述第一波成分之振動方向不同。 A saw wire having wave-shaped saw teeth, and the saw teeth have a shape composed of a first wave component, a second wave component and a third wave component; wherein the vibration direction of the first wave component and the second wave component The vibration direction is different, the vibration direction of the second wave component is different from the vibration direction of the third wave component, and the vibration direction of the third wave component is different from the vibration direction of the first wave component. 如請求項1所述之鋸線，其中上述第一波成分之波長WL1與上述第二波成分之波長WL2不同，上述第二波成分之波長WL2與上述第三波成分之波長WL3不同，上述第三波成分之波長WL3與上述第一波成分之波長WL1不同。 The saw wire according to claim 1, wherein the wavelength WL1 of the first wave component is different from the wavelength WL2 of the second wave component, and the wavelength WL2 of the second wave component is different from the wavelength WL3 of the third wave component, The wavelength WL3 of the third wave component is different from the wavelength WL1 of the first wave component. 如請求項1或2所述之鋸線，其中上述第一波成分之波高WH1與上述第二波成分之波高WH2不同，上述第二波成分之波高WH2與上述第三波成分之波高WH3不同，上述第三波成分之波高WH3與上述第一波成分之波高WH1不同。 The saw wire according to claim 1 or 2, wherein the wave height WH1 of the first wave component is different from the wave height WH2 of the second wave component, and the wave height WH2 of the second wave component is different from the wave height WH3 of the third wave component The wave height WH3 of the third wave component is different from the wave height WH1 of the first wave component. 如請求項1或2所述之鋸線，其中上述第一波成分之波長WL1及波高WH1、上述第二波成分之波長WL2及波高WH2、上述第三波成分之波長WL3及波高WH3、以及線徑Di滿足下述數式，1.1*Di≦WL1≦50*Di 1.2*Di≦WL2≦100*Di 2000*Di≦WL3≦6000*Di 1.05*Di≦WH1≦5*Di 1.1*Di≦WH2≦10*Di 2*Di≦WH3≦1000*Di。 The saw wire according to claim 1 or 2, wherein the wavelength WL1 and wave height WH1 of the first wave component, the wavelength WL2 and wave height WH2 of the second wave component, the wavelength WL3 and wave height WH3 of the third wave component, and The wire diameter Di satisfies the following formula, 1.1*Di≦WL1≦50*Di 1.2*Di≦WL2≦100*Di 2000*Di≦WL3≦6000*Di 1.05*Di≦WH1≦5*Di 1.1*Di≦WH2 ≦10*Di 2*Di≦WH3≦1000*Di.
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