JP2012139743A - Saw wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a saw wire having superior cutting speed in the wire used in a wire saw for cutting a hard material such as hard grass, semiconductors, cemented carbides.SOLUTION: The saw wire 1 has two dimensional tendency configured such that a wave form tendency comprising a pair of top parts 2, 3 protruding in opposite directions each other continues on the single flat plane.

Description

  The present invention relates to a wire used in a wire saw for cutting a hard material such as hard glass, a semiconductor, and a cemented carbide, and more particularly to a saw wire having a two-dimensional corrugation.

Conventionally, wire saws have been used for slicing hard materials such as hard glass, semiconductors, and cemented carbides (see, for example, Patent Document 1). FIG. 7 schematically shows a wire saw.
The wire saw 100 has at least two guide rollers 101 each having a guide groove, and the saw wire 102 is wound around the guide roller 101 along the guide groove. When cutting the workpiece, tension is applied to the saw wire 102 by the guide roller 101, and the saw wire 102 is supplied with cutting oil containing abrasive grains such as diamond abrasive grains and alumina abrasive grains between the saw wire 102 and the workpiece. Relatively move the workpiece closer. At this time, the saw wire 102 slides on the surface to be cut of the workpiece while entraining the abrasive grains contained in the cutting oil, and the saw wire 102 and the abrasive particles are pressed against the surface to be cut of the workpiece to cut the workpiece.

Japanese Patent Laid-Open No. 4-57666

By the way, the present inventors have studied various shapes of the saw wire in order to further improve the cutting speed of the wire saw.
First, with a linear saw wire that is not clinged to the saw wire, it is difficult for the abrasive grains to be entangled, and the saw wire cannot strongly press the abrasive grains against the workpiece, so that the cutting speed cannot be improved. For this reason, Patent Document 1 proposes a saw wire having a three-dimensional habit. However, the wire having such a three-dimensional warp protrudes in a direction other than the surface to be cut of the workpiece in addition to the top of the wire protruding in the direction of the surface to be cut of the workpiece. For this reason, the present inventors have found that there is room for improvement in the cutting speed because the top of the habit cannot be brought into intensive contact with the surface to be cut of the workpiece.

  Then, an object of this invention is to provide the saw wire excellent in cutting speed.

In order to solve the above problems, according to the saw wire according to the present invention,
A two-dimensionally sawed wire is provided.

In the saw wire,
The saw wire is attached to the corrugation,
It is preferable that the wire diameter d of the saw wire and the wave height h of the waveform satisfy 0.20 ≦ h / d ≦ 0.35.

In the saw wire,
The saw wire is attached to the corrugation,
It is preferable that the wire diameter d of the saw wire and the pitch p of the waveform satisfy 10 ≦ p / d ≦ 14.

In the saw wire,
The saw wire is preferably subjected to a toughening treatment before being attached.

In the saw wire,
It is preferable that the saw wire is subjected to low-temperature heat treatment before being attached.

  According to the saw wire according to the present invention, since the top of the two-dimensionally saw wire can press the abrasive grains intensively against the surface to be cut of the workpiece, the saw wire has an excellent cutting speed. Can be provided.

It is a side view which shows the saw wire which concerns on this embodiment. It is a sectional side view which shows a mode that a workpiece | work is cut | disconnected using the two-dimensionally attached saw wire which concerns on this embodiment. It is a sectional side view which shows a mode that a workpiece | work is cut | disconnected using the three-dimensionally saw wire which concerns on a comparative example. It is a top view which shows a mode that a workpiece | work is cut | disconnected using the saw wire attached to the two-dimensional waveform which concerns on this embodiment. It is a top view which shows a mode that the workpiece | work W is cut | disconnected using the three-dimensional saw wire which concerns on the comparative example. It is explanatory drawing of the manufacturing method of the saw wire attached to the two-dimensional waveform which concerns on this embodiment. It is a schematic diagram of a wire saw.

Hereinafter, an example of an embodiment of a saw wire according to the present invention will be described with reference to the drawings.
FIG. 1 is a side view showing a saw wire 1 according to this embodiment. As shown in FIG. 1, in the saw wire 1 according to the present embodiment, a wavy habit composed of a pair of top portions 2 and 3 protruding in opposite directions is continuous on a single plane (in the direction of the paper in FIG. 1). As you can see, it is tied in two dimensions.

  In the following description, the wire diameter of the saw wire 1 is d, the wave height of the corrugation (the height between the adjacent top portions 2 and 3) is h, and the interval (pitch) between the adjacent top portions 2 and 3 is p. / 2, A plane on which a corrugated comb is formed (a plane including the protruding direction of the top of the comb) is defined as a combing surface. In addition, although an example of a sine wave waveform is illustrated in FIG. 1, it is needless to say that other waveform shapes such as a triangular wave may be used.

<Cutting speed>
Referring to FIGS. 2 and 3 below, the saw wire 1 according to the present embodiment is superior in cutting speed to the three-dimensional saw wire 11 according to the comparative example. Will be explained. FIG. 2 is a side sectional view showing a state in which the workpiece W is cut using the saw wire 1 that is two-dimensionally attached according to the present embodiment, and FIG. 3 is a three-dimensionally attached saw according to a comparative example. 3 is a side cross-sectional view showing a state in which a workpiece W is cut using a wire 11. FIG.

  The saw wire 1 attached to the two-dimensional corrugation according to the present embodiment is hung on the guide roller in a state of being accommodated in the guide groove of the guide roller so that the cutting direction coincides with the attachment surface of the saw wire 1. Then, cutting processing is performed. Therefore, in the saw wire 1 attached to the two-dimensional waveform shown in FIG. 2, the interval between the top portions 2 and 2 protruding to the cut surface w1 side of the workpiece W is p.

  On the other hand, the saw wire 11 in the three-dimensional zigzag shape according to the comparative example shown in FIG. 3 is formed with the same curvature as the saw wire 1 in the two-dimensional manner shown in FIG. The wave height is h and the interval between the adjacent top portions 12 to 15 is p / 2. Moreover, the adjacent top parts 12-15 are twisted so that it may rotate 90 degree | times to radial direction, and are attached | subjected three-dimensionally. In such a three-dimensionally sewn saw wire 11, there are always three top portions 13, 14, 15 between the top portions 12 protruding in the direction of the surface to be cut w 1 of the workpiece W. The distance between the top portions 12 and 12 projecting in the direction of the cut surface w1 is 2p.

  When cutting the workpiece W using these saw wires 1 and 11, abrasive grains positioned in the vicinity of the tops 2 and 12 where the distance between the work surface w1 of the workpiece W and the saw wires 1 and 11 is narrowed. g is pressed against the surface to be cut w1 of the workpiece W by the top portions 2 and 12, and the surface to be cut w1 is ground. Therefore, when many top parts 2 and 12 protrude on the work surface w1 side of the workpiece W, many abrasive grains g are pressed against the work surface w1 and the cutting speed is improved.

  As apparent from comparison between FIGS. 2 and 3, the interval between the tops 2 protruding to the cut surface w <b> 1 of the saw wire 1 that is two-dimensionally attached according to this embodiment is three-dimensionally attached. Many apexes 2 protrude toward the surface to be cut w1 of the workpiece W, which is narrower than the interval between the saw wires 11. Therefore, since more abrasive grains g are pressed against the surface to be cut w1, the saw wire 1 that is two-dimensionally bonded is excellent in cutting speed.

  In addition, although the example in which the adjacent top portions 12, 13, 14, and 15 are rotated by 90 degrees with each other in the three-dimensional saw wire shown in FIG. Since the interval between the top portions 12 protruding toward the surface to be cut w1 is large, the saw wire 1 that is two-dimensionally attached has more top portions protruding toward the surface to be cut w1 of the workpiece W, and has an excellent cutting speed. Yes.

  In addition, in the spiral three-dimensionally saw wire different from the above-described comparative example, the number of the top portions 12 protruding to the surface to be cut w1 per unit length is two-dimensionally attached. Since it is less than the saw wire 1, the saw wire 1 that is two-dimensionally attached has a higher cutting speed.

<Cutting allowance>
Furthermore, using FIGS. 4 and 5, the two-dimensionally sawed wire 1 according to the present embodiment has a smaller cutting margin than the three-dimensionally sawed wire 11 and can effectively use the workpiece W. In addition, it will be described that the dimensional accuracy of the processed surface w2 is good.

  4 is a top view showing a state in which the workpiece W is cut using the saw wire 1 attached to the two-dimensional waveform according to the present embodiment, and FIG. 5 is a three-dimensional view shown in FIG. 3 according to the comparative example. It is a top view which shows a mode that the workpiece | work W is cut | disconnected using the saw wire 11 which was crushed.

  As shown in FIG. 4, when cutting the workpiece W using the two-dimensionally saw wire 1 according to the present embodiment, the brazing surface of the saw wire 1 matches the cutting direction (in other words, The wrinkled surface is perpendicular to the surface to be cut w1 of the workpiece W). Therefore, the top portion 2 protruding to one side faces the surface to be cut w1 and presses the abrasive grains g against the surface to be cut w1, and the top portion 3 protruding to the other side faces the opposite side to the surface to be cut w1 and applies abrasive particles to the workpiece. Since it does not press, only the to-be-cut surface w1 of the workpiece | work W is ground.

  On the other hand, as shown in FIG. 5, when the workpiece W is cut using the three-dimensionally saw wire 11 shown in FIG. 3 according to the comparative example, the top of the habit is the surface to be cut w1 of the workpiece W. In addition, there are top portions 13 and 15 that protrude toward the machining surface w2 perpendicular to the surface to be cut w1 of the workpiece W. Therefore, since the top portions 13 and 15 projecting to the processing surface w2 side of the workpiece W press the abrasive grains g against the processing surface w2 to perform grinding, the cutting allowance C increases as the processing surface w2 is ground. This cutting allowance C becomes more prominent as the hose height h of the saw wire 11 increases.

  Thus, since the saw wire 1 that is two-dimensionally pressed presses the abrasive grains g intensively against the surface to be cut w1, the three-dimensionally saw wire 11 that presses the abrasive grains g also onto the processing surface w2. The cutting allowance C at the time of cutting is smaller than that, and the cutting allowance formed on the workpiece W can be made approximately the same as the wire diameter of the saw wire 1.

  Further, since the pressing force is applied to the surface to be cut w1 of the saw wires 1 and 11 by the guide roller, the saw wire 11 crushed three-dimensionally as shown in FIG. The top portions 13 and 15 protruding to the side do not always press the abrasive grains g in the direction facing the processing surface w2 of the workpiece W. At this time, the abrasive grains g may be separated from between the saw wire 11 and the processing surface w2, and the abrasive grains g cannot be uniformly pressed against the processing surface w2. As a result, the processed surface w2 is not uniformly ground, and the dimensional accuracy of the processed surface w2 may deteriorate.

  However, according to the two-dimensionally sewn wire 1 according to the present embodiment as shown in FIG. 4, both of the top portions 2 and 3 protruding in opposite directions are on the machining surface w2 of the workpiece W with the abrasive grains g2. Is not positively pressed, the accuracy of the processed surface w2 is unlikely to deteriorate.

<Manufacturing method>
Next, a method for manufacturing the saw wire 1 attached to the above-described two-dimensional waveform will be described. First, as shown in FIG. 6, a pair of squeezing rollers 20 provided with a plurality of squeezing pins 21 having a predetermined interval l on the outer peripheral surface is prepared, and the pair of squeezing rollers 20 is provided with a distance L between the centers. The saw wire 1 that is two-dimensionally kneaded is obtained by placing the metal pre-processing wire 30 such as a piano wire between the pair of kneading rollers 20. The tacking pitch p can be adjusted by changing the distance l between the tacking pins 21, and the tacking height h can be adjusted by changing the distance L between the centers of the pair of tacking rollers 20. it can.

  In addition, since the pre-processing wire 30 before passing through the kneading roller 20 is usually wound and stored, pre-processing is performed in order to improve the straightness of the pre-processing wire 30 before passing through the kneading roller 20. It is preferable to apply. As shown in FIG. 6, the pretreatment includes a toughening process in which a plurality of straight rollers 40 are arranged in a zigzag shape on the upstream side of the kneading roller 20 and the pre-processing wire 30 is passed between the plurality of straight rollers 40. It is done. The straightness can be improved by repeatedly applying a bending stress and a tensile stress to the wire 30 before processing.

  In addition to the toughening process, the pre-processing wire 30 may be subjected to a low temperature heat treatment for performing a heat treatment at a relatively low temperature, such as passing through a furnace set at 250 to 350 ° C. for 3 to 10 seconds. The straightness of the unprocessed wire 30 can be improved by removing the residual strain remaining in the unprocessed wire 30 by low-temperature heat treatment.

  Further, both the toughening treatment and the low temperature heat treatment may be performed on the wire 30 before processing. As described above, after the straightness of the pre-processing wire 30 is improved, by passing the pre-processing wire 30 through the kneading roller 20, a plurality of formed two-dimensional combs can easily be accommodated within a single kneading surface. . How much the two-dimensional habit is within a single hauling surface can be measured by the variation in the wave height h when the hauled wire 1 is projected onto the horizontal plane.

  Table 1 shows that the wire height h is 0.06 mm and the pitch p is 3.0 mm using a piano wire before wire diameter d of 0.25 mm. It is a measure of how much variation and, as a result, the above-mentioned machined surface dimensional accuracy is affected. In addition, the processing surface dimensional accuracy was set to hard glass using diamond abrasive grains having a wire feed speed of 80 m / min, a guide roller moving speed of 0.6 m / min, and a particle diameter of 10 to 20 μm as cutting conditions. Was measured as the surface roughness of the processed surface. Moreover, the processing surface dimensional accuracy in Table 1 was shown as a relative evaluation when the processing surface dimensional accuracy when cutting using a wire saw produced without pretreatment was 1. The lower the numerical value of the processed surface dimensional accuracy, the smoother the processed surface.

  Samples B and D are obtained by applying a toughening process in which the unprocessed wire 30 is passed through five straight rollers and then attaching the pre-processing wire 30 with the setting roller 20. Samples C and D are obtained by placing the pre-processing wire 30 in a 300 ° C. furnace for 5 seconds and subjecting it to low temperature heat treatment, followed by the squeezing roller 20.

  As can be seen from Table 1, since the pre-treatment reduces the variation in wave height, the dimensional accuracy of the processed surface is improved. The higher the degree of the two-dimensional corrugation being within a single tacking surface (the smaller the variation in Table 1), the more the abrasive grains can be pressed against the surface to be cut of the workpiece. The cutting allowance can be reduced. Moreover, since the frequency with which the abrasive grains cut the processed surface of the workpiece is reduced, the dimensional accuracy of the processed surface is also improved. Therefore, it is preferable to perform at least one of a toughening process or a low-temperature heat treatment on the unprocessed wire before it is kneaded.

<Example>
Next, as shown in Table 2, using a piano wire, sample Nos. With different types of wrinkles, wire diameter d, wavy height h, and wrinkle pitch p are different. 1 to 11 saw wires were prepared and measured for breaking strength, tensile strength, and yield point.

  Table 3 shows the sample No. in Table 2. About 1-11, the maximum cutting speed, the processing surface dimensional accuracy, and the cutting allowance were measured, and the result was put together. Note that the maximum cutting speed, machining surface dimensional accuracy, and cutting allowance in Table 3 are the sample numbers. It is a relative evaluation when each numerical value of 1 is 1. The lower the cutting allowance is, the smaller the cutting allowance is, indicating that the workpiece machining efficiency is good.

The maximum cutting speed is the sample number. Using a wire saw of 1 to 11, a wire feed speed of 80 m / min as a cutting condition, diamond abrasive grains having a particle diameter of 10 to 20 μm, hard glass is set on the workpiece, and the moving speed of the guide roller is gradually increased. The workpiece was cut while continuing, and the moving speed of the guide roller when the saw wire broke was measured as the maximum cutting speed. The larger the maximum cutting speed value in the table, the faster the workpiece can be cut.
Sample No. Using a wire saw of 1 to 11, a wire feed speed of 80 m / min, a moving speed of the guide roller of 0.6 m / min, and diamond abrasive grains having a particle size of 10 to 20 μm, and setting hard glass as a workpiece The machining surface dimensional accuracy and cutting allowance when the workpiece was cut were measured.

Sample No. 1 to 8 are examples according to the present embodiment.
First, with respect to the breaking strength, tensile strength, and yield point, sample No. 2 with a two-dimensional corrugation was attached. Sample Nos. 1 to 8 with a three-dimensional habit are attached. The value is better than 9,10. This is considered to be because the mechanical strength is lowered because the wire is twisted when attaching the three-dimensional habit. Therefore, since the saw wire that is two-dimensionally attached can be stretched between the guide rollers by applying a large tension, the dimensional accuracy of the work surface is improved without the saw wire being bent at the time of cutting.

  As for the maximum cutting speed, the saw wire that is two-dimensionally crushed as described above has a three-dimensional structure because the apex of the protrusion protruding in the direction of the work surface of the workpiece presses the abrasive grains intensively against the work surface. It was confirmed that the workpiece could be cut at a higher cutting speed than the saw wire (sample No. 9, 10) that was crushed or the saw wire without sample (sample No. 11).

  As for the machining surface dimensional accuracy and cutting allowance, when cutting using a saw wire that is two-dimensionally welded as described above, the top of the crack does not positively press the abrasive grains against the machining surface of the workpiece. Therefore, it was confirmed that the machined surface dimensional accuracy and the cutting allowance were superior to the case of cutting using a saw wire that was three-dimensionally cut.

  Note that the sample No. 1-8, sample no. As in 2 to 7, it is preferable that the wire diameter d and the wave height h of the saw wire are set so as to satisfy 0.20 ≦ h / d ≦ 0.35. If the wave height h is too low with respect to the wire diameter d, the distance between the workpiece in which the abrasive grains are held and the saw wire is not sufficiently defined, and it becomes difficult to entrain the abrasive grains, so that many abrasive grains are removed. It cannot be pressed against the surface to be cut. On the other hand, if the wave height h is too high with respect to the wire diameter d, the formed wrinkles are less likely to fit within a single wrinkled surface, and the machining surface accuracy may be degraded.

  In addition, the sample No. according to this embodiment. 1-8, sample no. It is preferable that the wire diameter d and the pitch p of the saw wire are set so as to satisfy 10 ≦ p / d ≦ 14 as in 1 to 3, 5, 7, and 8. If the value of p / d is low and the pitch p is too small with respect to the wire diameter d, the space at the adjacent apex where the abrasive grains are held becomes narrow, and many abrasive grains cannot be pressed against the workpiece surface to be cut. . On the other hand, if the pitch p is too large with respect to the wire diameter d, the number of tops pressing the abrasive grains against the workpiece decreases, and an improvement in cutting speed cannot be expected.

  From the above factors, the wire diameter d and the wave height h of the saw wire satisfy 0.20 ≦ h / d ≦ 0.35, and the wire diameter d and the pitch p of the saw wire satisfy 10 ≦ p / d ≦ 14. Sampling sample No. It can be confirmed that 2, 3, 5 and 7 show particularly good values in all the items of dimensional accuracy of the machining surface, cutting allowance, and maximum cutting speed.

1: saw wire (saw wire), 2, 3: top part, 20: kneading roller, 30: wire before processing, 40 straight roller, W: work, w1: cutting surface, w2: processing surface, g: abrasive grains, h: wave height, p: pitch, d: wire diameter, C: cutting allowance

Claims (5)

  Two-dimensional saw wire. The saw wire is attached to the corrugation,
2. The saw wire according to claim 1, wherein a wire diameter d of the saw wire and a wave height h of the waveform satisfy 0.20 ≦ h / d ≦ 0.35. The saw wire is attached to the corrugation,
3. The saw wire according to claim 1, wherein a wire diameter d of the saw wire and a pitch p of the waveform satisfy 10 ≦ p / d ≦ 14.   The saw wire according to any one of claims 1 to 3, wherein the saw wire is subjected to a toughening process before being attached.   The saw wire according to any one of claims 1 to 4, wherein the saw wire is subjected to a low-temperature heat treatment before being attached.

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