JP2957571B1 - Wire for saw wire - Google Patents

Abstract

[PROBLEMS] Even when used under a condition where a load on a wire is increased, the diameter of a free circle does not become extremely small or becomes small after use, and the wire is straight in a saw machine. To provide a wire for a saw wire capable of maintaining a posture. SOLUTION: This saw wire is used for cutting and slicing a hard material such as silicon, quartz, and ceramic, and has a diameter of 0.06 to 0.32 mmφ and an internal stress of 0 μm from the wire surface to a depth of 15 μm. ± 40kg /
It is set in the range of mm ² (+ side is tensile stress, − side is compressive stress).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire for a saw wire used in a saw machine, and is used for cutting and slicing hard materials such as silicon, quartz and ceramic.

[0002]

2. Description of the Related Art Saw wire is required to make the slice surface smooth and to make the slice thickness uniform.
A saw wire is required to have a high-precision wire diameter tolerance and to maintain a straight posture in a saw machine. In this regard, conventional saw wires include a type that slices with a wire while flowing an abrasive mixed solution, a type that slices with a wire to which abrasive particles such as diamond are fixed in advance, and others. And usually the diameter is 0.06-0.32mmφ
In, for example, through a loose abrasive under a tension of 1 to 6 kg,
Slicing hard materials such as silicon, quartz and ceramic. Usually, high carbon steel wire is used from the viewpoint of high tensile strength and abrasion resistance.Because high precision wire diameter tolerance is required, and from the drawability side, copper Steel wires plated with brass, zinc and its alloys are often used.

[0003] In recent years, from the economical point of view, saw wire 1 has been reduced by reducing the supply of new wire and reusing used wires.
There is a demand for increasing the slice amount per book. A saw wire used under such a situation where the load on the wire is increased may have a small free circle diameter or a small wave shape depending on the case. Saw wires with extremely small free circle diameters, especially sawtooth-shaped saw wires, have the problem of being unable to maintain a perfect straight posture even under a constant wire tension in the saw machine, resulting in reduced slice plane accuracy. is there. It has been found that such a decrease in the free circle diameter and the generation of small waves that reduce the slice surface accuracy are mainly caused by uneven wear of the wire and internal stress on the wire surface. That is, as shown in FIG.
Normally, it was confirmed that since the wire surface is under tensile stress, if the wire is partially worn, the wire is curved with the wear side outward.

[0004]

The problem to be solved is that even when the wire is used under a condition where the load on the wire is increased, the diameter of the free circle becomes extremely small or becomes small after use. It is an object of the present invention to provide a saw wire that can maintain a straight posture in a saw machine without any problem.

[0005]

In order to achieve the above-mentioned object, the present invention quantifies the internal stress and limits the range, so that even if the load on the wire in practical use becomes large, the slice plane is reduced. This completes a wire for a saw wire that does not reduce accuracy. Specifically, the diameter of the wire is 0.06 to 0.32 mmφ, and the internal stress from the wire surface to a depth of 15 μm is 0 ± 40 kg /.
It is characterized in that it is set in the range of mm ² (the tensile stress is on the + side and the compressive stress is on the − side).

[0006] The diameter of the wire in the present invention is 0.0
It is 6 to 0.32 mmφ, but is intended for the wire size that is usually used. The depth for obtaining the internal stress was set to a depth of 15 μm from the wire surface because the maximum wear on one side of the used wire in actual use was 15 μm.
This is because it was confirmed that Further, the range of the internal stress value is based on the fact that it was confirmed that no small wave was generated on the used line in actual use. In this range, it was confirmed that the free circle diameter of the used wire was clearly larger than that of the conventional example.

The internal stress was quantified by a layer removing method. That is, one surface of the wire was removed by etching to a predetermined thickness (see FIG. 3), and a change in the curvature of the wire before and after the etching (see FIG. 2) was measured. At this time, since the bending moment M ₁ of the etched portion with respect to the neutral axis and the bending moment M ₁ ′ calculated from the change in the curvature of the wire before and after etching are equal, the stress σ ₁ of the etched portion was calculated.

(Equation 1) This internal stress can be obtained by setting an appropriate lubricant, a die schedule, a type and a shape of a die in a final drawing step at the time of manufacturing. For example, during wet lubrication of an emulsion type, each area reduction rate is 1
The dice set at 5 to 20% are passed through about 20 sheets.
At this time, the length of the bearing of the die should be 30 to 60 of its diameter.
%, And a reduction angle of 8 to 12 °. Furthermore, it can be obtained by subjecting the wire after the final drawing to appropriate heat treatment or mechanical repetitive bending.
For example, holding the wire at a temperature of about 500 ° C.,
There is a method of repeatedly bending using a straightening roller of 12 mmφ.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a wire for saw wire according to the present invention will be described. The wire has a diameter of 0.06
応 力 0.32 mmφ, and the internal stress from the wire surface to a depth of 15 μm is set in the range of 0 ± 40 kg / mm ² .

<Specific Example 1> Diameter size: 0.18 mmφ Internal stress (average value): 35 kg / mm ² Free circle diameter: 240 mmφ <Specific Example 2> Diameter size: 0.18 mmφ Internal stress (average value): 32 kg / mm ² free circle diameter: 180mmφ <example 3> diameters: 0.18Mmfai internal stress (mean): 30kg / mm ² free circle diameter: 370mmφ <example 4> diameters: 0.18Mmfai internal stress (mean ): 25kg / mm ² free circle diameter: 600mmφ <example 5> diameters: 0.18Mmfai internal stress (mean): 23kg / mm ² free circle diameter: 1000Mmfai

[0010]

[Table 1]

According to Table 1 above, specific examples 1 to 5 of the present invention are shown.
The wires of Comparative Examples 1 to 5 and the wires of the comparative examples 1 to 5 show the wire shapes after the actual use of the wires.
In the wire of No. 5, the internal stress on the wire surface is small, and it can be seen that the linear shape of the wire used, such as the free circle diameter and small wave, is significantly improved.

[0012]

A. Effects of the Invention According to claim 1, 1
Since the internal stress up to a depth of 5 μm is set in the range of 0 ± 40 kg / mm ² , the diameter of the free circle becomes extremely small after use even when used under the condition that the load on the wire is increased, In addition, a straight posture can be maintained in the saw machine without causing a small wave. Further, since the internal stress on the surface is small, the elastic deformation region in the load-elongation curve becomes large. From this aspect as well, it has a characteristic that it does not easily form a habit with respect to bending stress caused by contact with a workpiece.

[Brief description of the drawings]

FIG. 1 is an internal stress distribution diagram of a wire cross section.

FIG. 2 is a schematic diagram showing a change in wire shape before and after etching.

FIG. 3 is a cross-sectional view showing a cross-sectional shape of a wire after etching.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-70747 (JP, A) JP-A-5-104521 (JP, A) JP-A-5-200667 (JP, A) JP-A-5-200667 23965 (JP, A) JP-A-62-251061 (JP, A) JP-B-6-96222 (JP, B2) (58) Fields investigated (Int. Cl. ⁶ , DB name) B24B 27/06 B28D 5 / 04

Claims (1)

(57) [Claims] 1. A saw wire used for cutting and slicing a hard material such as silicon, quartz, ceramic, etc., having a diameter of 0.06 to 0.32 mmφ and an internal stress from the wire surface to a depth of 15 μm. 0 ± 40kg /
A wire for a saw wire, wherein the wire is set to a range of mm ² (tensile stress on the + side, compressive stress on the − side).