CN112788945A - 安装条件估计装置、学习装置、安装条件估计方法 - Google Patents

安装条件估计装置、学习装置、安装条件估计方法 Download PDF

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Publication number
CN112788945A
CN112788945A CN202011200266.2A CN202011200266A CN112788945A CN 112788945 A CN112788945 A CN 112788945A CN 202011200266 A CN202011200266 A CN 202011200266A CN 112788945 A CN112788945 A CN 112788945A
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China
Prior art keywords
component
mounting
component information
mounting condition
learning
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Pending
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CN202011200266.2A
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English (en)
Chinese (zh)
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岩田维里
清水太一
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN112788945A publication Critical patent/CN112788945A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202011200266.2A 2019-11-05 2020-10-30 安装条件估计装置、学习装置、安装条件估计方法 Pending CN112788945A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019200840A JP7382575B2 (ja) 2019-11-05 2019-11-05 実装条件推定装置、学習装置、実装条件推定方法、およびプログラム
JP2019-200840 2019-11-05

Publications (1)

Publication Number Publication Date
CN112788945A true CN112788945A (zh) 2021-05-11

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CN (1) CN112788945A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022264835A1 (ja) * 2021-06-16 2022-12-22 パナソニックＩｐマネジメント株式会社 部品データ管理方法および部品データ管理装置ならびに部品データ管理プログラム
JPWO2023286135A1 (ja) * 2021-07-12 2023-01-19

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738294A (ja) * 1993-07-26 1995-02-07 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003273595A (ja) * 2002-03-15 2003-09-26 Matsushita Electric Ind Co Ltd 部品実装情報作成装置、方法、プログラム、および記録媒体
CN102612313A (zh) * 2011-01-24 2012-07-25 株式会社日立高新技术仪器 算出部件安装装置的设定的运算装置和部件安装装置
WO2015122272A1 (ja) * 2014-02-14 2015-08-20 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム
JP2018107315A (ja) * 2016-12-27 2018-07-05 ファナック株式会社 プリント板組立作業のための機械学習装置、制御装置、産業機械、組立システム及び機械学習方法
US20180314918A1 (en) * 2015-11-09 2018-11-01 Fuji Corporation Lead tip position image recognition method and lead tip position image recognition system
US20190009407A1 (en) * 2017-07-07 2019-01-10 Fanuc Corporation Component supply device and machine learning device
KR20190009083A (ko) * 2017-07-18 2019-01-28 주식회사 루멘스 발광다이오드 모듈 제조 장치 및 방법
EP3528072A1 (en) * 2016-10-12 2019-08-21 Omron Corporation Operation state monitoring device, and learning data generation device, method, and program

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738294A (ja) * 1993-07-26 1995-02-07 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003273595A (ja) * 2002-03-15 2003-09-26 Matsushita Electric Ind Co Ltd 部品実装情報作成装置、方法、プログラム、および記録媒体
CN102612313A (zh) * 2011-01-24 2012-07-25 株式会社日立高新技术仪器 算出部件安装装置的设定的运算装置和部件安装装置
WO2015122272A1 (ja) * 2014-02-14 2015-08-20 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム
US20180314918A1 (en) * 2015-11-09 2018-11-01 Fuji Corporation Lead tip position image recognition method and lead tip position image recognition system
EP3528072A1 (en) * 2016-10-12 2019-08-21 Omron Corporation Operation state monitoring device, and learning data generation device, method, and program
JP2018107315A (ja) * 2016-12-27 2018-07-05 ファナック株式会社 プリント板組立作業のための機械学習装置、制御装置、産業機械、組立システム及び機械学習方法
US20190009407A1 (en) * 2017-07-07 2019-01-10 Fanuc Corporation Component supply device and machine learning device
KR20190009083A (ko) * 2017-07-18 2019-01-28 주식회사 루멘스 발광다이오드 모듈 제조 장치 및 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
廖梓龙;钟守炎;: "基于机器视觉大数据分析的表面贴装缺陷检测", 机电工程技术, no. 08, 31 December 2016 (2016-12-31) *

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JP7382575B2 (ja) 2023-11-17
JP2021077675A (ja) 2021-05-20

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