CN112752630A - 无铅焊料合金 - Google Patents

无铅焊料合金 Download PDF

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Publication number
CN112752630A
CN112752630A CN201980062723.5A CN201980062723A CN112752630A CN 112752630 A CN112752630 A CN 112752630A CN 201980062723 A CN201980062723 A CN 201980062723A CN 112752630 A CN112752630 A CN 112752630A
Authority
CN
China
Prior art keywords
mass
lead
free solder
solder alloy
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980062723.5A
Other languages
English (en)
Chinese (zh)
Inventor
西村哲郎
西村贵利
赤岩彻哉
末永将一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Speria Co ltd
Nihon Superior Sha Co Ltd
Original Assignee
Japan Speria Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Speria Co ltd filed Critical Japan Speria Co ltd
Publication of CN112752630A publication Critical patent/CN112752630A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201980062723.5A 2018-08-10 2019-09-26 无铅焊料合金 Pending CN112752630A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018151991 2018-08-10
JP2018-181045 2018-09-26
JP2018181045A JP7287606B2 (ja) 2018-08-10 2018-09-26 鉛フリーはんだ合金
PCT/JP2019/037903 WO2020067307A1 (ja) 2018-08-10 2019-09-26 鉛フリーはんだ合金

Publications (1)

Publication Number Publication Date
CN112752630A true CN112752630A (zh) 2021-05-04

Family

ID=69620807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062723.5A Pending CN112752630A (zh) 2018-08-10 2019-09-26 无铅焊料合金

Country Status (4)

Country Link
JP (1) JP7287606B2 (pt)
KR (1) KR20210062060A (pt)
CN (1) CN112752630A (pt)
WO (1) WO2020067307A1 (pt)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114055010A (zh) * 2021-11-05 2022-02-18 安徽工业大学 一种含微量Ge的铜基合金钎料、制备方法及其钎焊方法
CN115990726A (zh) * 2021-10-18 2023-04-21 Tdk株式会社 焊料组合物和电子部件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007623B1 (ja) 2021-08-27 2022-01-24 千住金属工業株式会社 はんだ合金及びはんだ継手

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048639A1 (fr) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
CN101288923A (zh) * 2008-02-27 2008-10-22 重庆机电职业技术学院 一种低铜亚共晶Sn-Cu无铅钎料
CN102066042A (zh) * 2008-04-23 2011-05-18 千住金属工业株式会社 无铅焊料
JP2011156558A (ja) * 2010-01-30 2011-08-18 Nihon Superior Co Ltd 鉛フリーはんだ合金
CN103547408A (zh) * 2011-03-28 2014-01-29 千住金属工业株式会社 无铅焊料球
JP2016129908A (ja) * 2014-04-30 2016-07-21 株式会社日本スペリア社 鉛フリーはんだ合金

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69433994T2 (de) 1993-01-19 2005-09-22 Endorecherche Inc., Ste-Foy Therapeutische verwendungen und verabreichungsysteme von dehydroepiandrosteron
CN110900036B (zh) 2012-10-09 2022-10-28 阿尔法组装解决方案公司 高温可靠的无铅并且无锑的锡焊料
JP2017087248A (ja) * 2015-11-08 2017-05-25 株式会社日本スペリア社 はんだペースト組成物
GR1009565B (el) 2016-07-14 2019-08-06 Galenica Α.Ε. Νεα παραγωγα 1,2,4-τριαζολο-[3,4-b]-1,3,4-θειαδιαζολιων
JP6119912B1 (ja) * 2016-09-13 2017-04-26 千住金属工業株式会社 はんだ合金、はんだボールおよびはんだ継手
JPWO2018174162A1 (ja) * 2017-03-23 2019-03-28 株式会社日本スペリア社 はんだ継手
JP2019141881A (ja) * 2018-02-21 2019-08-29 千住金属工業株式会社 鉛フリーはんだ合金

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048639A1 (fr) * 1998-03-26 1999-09-30 Nihon Superior Sha Co., Ltd. Soudure sans plomb
CN101288923A (zh) * 2008-02-27 2008-10-22 重庆机电职业技术学院 一种低铜亚共晶Sn-Cu无铅钎料
CN102066042A (zh) * 2008-04-23 2011-05-18 千住金属工业株式会社 无铅焊料
JP2011156558A (ja) * 2010-01-30 2011-08-18 Nihon Superior Co Ltd 鉛フリーはんだ合金
CN103547408A (zh) * 2011-03-28 2014-01-29 千住金属工业株式会社 无铅焊料球
JP2016129908A (ja) * 2014-04-30 2016-07-21 株式会社日本スペリア社 鉛フリーはんだ合金

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115990726A (zh) * 2021-10-18 2023-04-21 Tdk株式会社 焊料组合物和电子部件
CN114055010A (zh) * 2021-11-05 2022-02-18 安徽工业大学 一种含微量Ge的铜基合金钎料、制备方法及其钎焊方法

Also Published As

Publication number Publication date
WO2020067307A1 (ja) 2020-04-02
KR20210062060A (ko) 2021-05-28
JP7287606B2 (ja) 2023-06-06
JP2020025982A (ja) 2020-02-20

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