CN112739012A - Method for manufacturing Mini LED board - Google Patents
Method for manufacturing Mini LED board Download PDFInfo
- Publication number
- CN112739012A CN112739012A CN202011371772.8A CN202011371772A CN112739012A CN 112739012 A CN112739012 A CN 112739012A CN 202011371772 A CN202011371772 A CN 202011371772A CN 112739012 A CN112739012 A CN 112739012A
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- CN
- China
- Prior art keywords
- substrate
- manufacturing
- silver film
- mini led
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 34
- 229910052709 silver Inorganic materials 0.000 claims description 34
- 239000004332 silver Substances 0.000 claims description 34
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 238000002310 reflectometry Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000012805 post-processing Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000002048 anodisation reaction Methods 0.000 claims 1
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000011049 pearl Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a Mini LED board.
Description
Technical Field
The invention belongs to the technical field of LED lamp panels, and particularly relates to a manufacturing method of a Mini LED panel.
Background
Mini LED technique is also known as time millimeter emitting diode, indicate dozens of LED lamp pearls with traditional LCD display screen side backlight, the change is thousands, tens of thousands or even more straight following formula backlight lamp pearls, through the intensive distribution of large amount of lamp pearls, regional dimming in the small circle has been realized, thereby can realize higher luminance homogeneity and color contrast in the less mixed light distance, can play very big promotion effect to the backlight performance of current LCD display device, the performance of ultra-thin, high color rendering and power saving of terminal product has been realized.
The existing double-sided Mini LED board is generally manufactured by adopting white solder mask ink on the light source surface of an outer layer circuit to meet the requirement of high reflectivity, and the reflectivity is reduced after SMT, so that the requirement of customers cannot be met.
Disclosure of Invention
In order to solve the problems, the invention discloses a method for manufacturing a Mini LED board, which is characterized in that a secondary anodic oxidation method is adopted to prepare a porous alumina film which is orderly arranged and has a regular shape, a silver film is deposited on the surface of the porous alumina film to replace the ink of the original process, and the high reflectivity after reflow soldering is kept.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for manufacturing a Mini LED board is characterized by comprising the following steps:
step S1, preparing a double-sided copper-clad plate as a substrate, drilling the double-sided copper-clad plate, penetrating through the two layers of copper foils, plating copper in the hole wall of the drilled hole to connect the two layers of copper foils, and filling solder resist ink in the drilled hole;
step S2, preparing a porous alumina film, depositing a layer of Ag particles with the particle size of 0.5um on the alumina film by utilizing magnetron sputtering to obtain a silver film, and cutting the silver film according to the outline size of the substrate;
step S3, respectively manufacturing a front circuit and a back circuit on two sides of a double-sided copper-clad plate, and arranging circuit pads on the circuits;
step S4, punching a T-shaped hole on the substrate according to the preset contour position;
step S5, connecting and attaching the silver film and the substrate in a mode of aligning PIN nails and T holes, removing the release film covered on the silver film before attaching, contacting the non-conductive thermosetting adhesive surface of the silver film with the LED surface of the substrate, and attaching the silver film and the substrate through a false attaching machine;
step S6, bonding the silver film and the substrate together in a hot pressing mode to obtain a laminated plate;
step S7, the laminated substrate is put into an oven for baking treatment, so that the non-conductive thermosetting adhesive is further cured, and the layering and deviation of the post-processing procedure are prevented;
step S8, manufacturing a fine circuit by adopting photoetching;
step S8, after the components are assembled on the substrate, the reflectivity of the substrate is confirmed by a reflectivity tester;
and step S9, finishing the manufacture of the Mini LED board.
Further, the porous alumina film obtained in the step S2 is prepared into a regularly arranged and regular-shaped porous alumina film by a secondary anodic oxidation method.
Further, the step S2 is cutting by a numerical control laser board cutting machine.
Further, the double-sided copper-clad plate of the step S1 is subjected to reflow soldering treatment by vacuum vapor condensation soldering.
Further, the baking temperature of the step S7 is 120-130 ℃, and the baking time is 4 hours.
Further, the thickness of the silver film was 5 μm.
The invention has the beneficial effects
The invention discloses a method for manufacturing a Mini LED (light-emitting diode) board, which is characterized in that a porous alumina film which is regularly arranged and has a regular shape is prepared by adopting a secondary anodic oxidation method, a silver film is deposited on the surface of the porous alumina film to replace the ink of the original process, and the high reflectivity after reflow soldering is kept.
Description of the content
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the contents needed in the description of the embodiments or the prior art, and it is obvious that the contents in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other contents based on these contents without creative efforts.
Detailed Description
The embodiments of the present invention will be described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout, and which are described below by reference to the accompanying drawings, are exemplary only, are used for the purpose of illustrating the invention, and are not to be construed as limiting the invention, and therefore, the description is set forth merely for the purpose of illustration, and therefore, the practice of the inventive concepts herein is not limited solely to the exemplary embodiments and illustrations within the contexts described herein, which are not limiting in any way.
Example 1
A manufacturing method of a Mini LED board comprises the following steps:
step S1, preparing a double-sided copper-clad plate as a substrate, drilling the double-sided copper-clad plate, penetrating through the two layers of copper foils, plating copper in the hole wall of the drilled hole to connect the two layers of copper foils, and filling solder resist ink in the drilled hole;
step S2, preparing a porous alumina film, depositing a layer of Ag particles with the particle size of 0.5um on the alumina film by utilizing magnetron sputtering to obtain a silver film, and cutting the silver film according to the outline size of the substrate;
step S3, respectively manufacturing a front circuit and a back circuit on two sides of a double-sided copper-clad plate, and arranging circuit pads on the circuits;
step S4, punching a T-shaped hole on the substrate according to the preset contour position;
step S5, connecting and attaching the silver film and the substrate in a mode of aligning PIN nails and T holes, removing the release film covered on the silver film before attaching, contacting the non-conductive thermosetting adhesive surface of the silver film with the LED surface of the substrate, and attaching the silver film and the substrate through a false attaching machine;
step S6, bonding the silver film and the substrate together in a hot pressing mode to obtain a laminated plate;
step S7, the laminated substrate is put into an oven for baking treatment, so that the non-conductive thermosetting adhesive is further cured, and the layering and deviation of the post-processing procedure are prevented;
step S8, manufacturing a fine circuit by adopting photoetching;
step S8, after the components are assembled on the substrate, the reflectivity of the substrate is confirmed by a reflectivity tester;
and step S9, finishing the manufacture of the Mini LED board.
And the porous alumina film obtained in the step S2 is prepared into the porous alumina film which is orderly arranged and has a regular shape by adopting a secondary anodic oxidation method.
And step S2, cutting by a numerical control laser plate dividing machine.
And the double-sided copper-clad plate of the step S1 is subjected to reflow soldering treatment through vacuum steam condensation soldering.
The baking temperature of the step S7 is 120 ℃, and the baking time is 4 hours.
The thickness of the silver film was 5 μm.
Example 2
A manufacturing method of a Mini LED board comprises the following steps:
step S1, preparing a double-sided copper-clad plate as a substrate, drilling the double-sided copper-clad plate, penetrating through the two layers of copper foils, plating copper in the hole wall of the drilled hole to connect the two layers of copper foils, and filling solder resist ink in the drilled hole;
step S2, preparing a porous alumina film, depositing a layer of Ag particles with the particle size of 0.5um on the alumina film by utilizing magnetron sputtering to obtain a silver film, and cutting the silver film according to the outline size of the substrate;
step S3, respectively manufacturing a front circuit and a back circuit on two sides of a double-sided copper-clad plate, and arranging circuit pads on the circuits;
step S4, punching a T-shaped hole on the substrate according to the preset contour position;
step S5, connecting and attaching the silver film and the substrate in a mode of aligning PIN nails and T holes, removing the release film covered on the silver film before attaching, contacting the non-conductive thermosetting adhesive surface of the silver film with the LED surface of the substrate, and attaching the silver film and the substrate through a false attaching machine;
step S6, bonding the silver film and the substrate together in a hot pressing mode to obtain a laminated plate;
step S7, the laminated substrate is put into an oven for baking treatment, so that the non-conductive thermosetting adhesive is further cured, and the layering and deviation of the post-processing procedure are prevented;
step S8, manufacturing a fine circuit by adopting photoetching;
step S8, after the components are assembled on the substrate, the reflectivity of the substrate is confirmed by a reflectivity tester;
and step S9, finishing the manufacture of the Mini LED board.
And the porous alumina film obtained in the step S2 is prepared into the porous alumina film which is orderly arranged and has a regular shape by adopting a secondary anodic oxidation method.
And step S2, cutting by a numerical control laser plate dividing machine.
And the double-sided copper-clad plate of the step S1 is subjected to reflow soldering treatment through vacuum steam condensation soldering.
The baking temperature of the step S7 is 130 ℃, and the baking time is 4 hours.
The thickness of the silver film was 5 μm.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (6)
1. A method for manufacturing a Mini LED board is characterized by comprising the following steps:
step S1, preparing a double-sided copper-clad plate as a substrate, drilling the double-sided copper-clad plate, penetrating through the two layers of copper foils, plating copper in the hole wall of the drilled hole to connect the two layers of copper foils, and filling solder resist ink in the drilled hole;
step S2, preparing a porous alumina film, depositing a layer of Ag particles with the particle size of 0.5um on the alumina film by utilizing magnetron sputtering to obtain a silver film, and cutting the silver film according to the outline size of the substrate;
step S3, respectively manufacturing a front circuit and a back circuit on two sides of a double-sided copper-clad plate, and arranging circuit pads on the circuits;
step S4, punching a T-shaped hole on the substrate according to the preset contour position;
step S5, connecting and attaching the silver film and the substrate in a mode of aligning PIN nails and T holes, removing the release film covered on the silver film before attaching, contacting the non-conductive thermosetting adhesive surface of the silver film with the LED surface of the substrate, and attaching the silver film and the substrate through a false attaching machine;
step S6, bonding the silver film and the substrate together in a hot pressing mode to obtain a laminated plate;
step S7, the laminated substrate is put into an oven for baking treatment, so that the non-conductive thermosetting adhesive is further cured, and the layering and deviation of the post-processing procedure are prevented;
step S8, manufacturing a fine circuit by adopting photoetching;
step S8, after the components are assembled on the substrate, the reflectivity of the substrate is confirmed by a reflectivity tester;
and step S9, finishing the manufacture of the Mini LED board.
2. The method for manufacturing a Mini LED panel according to claim 1, wherein the porous alumina film of step S2 is prepared by a secondary anodization method to form a regularly arranged and regular porous alumina film.
3. The method for manufacturing a Mini LED board according to claim 1, wherein the step S2 is performed by cutting with a numerical control laser board cutting machine.
4. The method for manufacturing a Mini LED board according to claim 1, wherein the double-sided copper-clad plate of step S1 is reflowed by vacuum vapor condensation soldering.
5. The method for manufacturing a Mini LED board according to claim 1, wherein the baking temperature of step S7 is 120-130 ℃ and the baking time is 4 hours.
6. The method for manufacturing a Mini LED panel according to claim 1, wherein the silver film has a thickness of 5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011371772.8A CN112739012A (en) | 2020-11-30 | 2020-11-30 | Method for manufacturing Mini LED board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011371772.8A CN112739012A (en) | 2020-11-30 | 2020-11-30 | Method for manufacturing Mini LED board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739012A true CN112739012A (en) | 2021-04-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011371772.8A Pending CN112739012A (en) | 2020-11-30 | 2020-11-30 | Method for manufacturing Mini LED board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112739012A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183176A1 (en) * | 2003-01-30 | 2004-09-23 | Fuji Photo Film Co., Ltd. | Sensor chip, process for producing the same, and sensor using the same |
| CN106480484A (en) * | 2016-10-12 | 2017-03-08 | 中山大学 | A kind of preparation of reflective image device and application process |
| CN110267460A (en) * | 2019-07-08 | 2019-09-20 | 深圳市景旺电子股份有限公司 | A kind of production method and Mini LED board of Mini LED board |
| CN111341766A (en) * | 2020-02-27 | 2020-06-26 | 惠州中京电子科技有限公司 | Method for manufacturing mini LED mainboard |
| CN111901968A (en) * | 2020-07-29 | 2020-11-06 | 厦门爱谱生电子科技有限公司 | Micro LED flexible circuit board manufacturing method |
-
2020
- 2020-11-30 CN CN202011371772.8A patent/CN112739012A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183176A1 (en) * | 2003-01-30 | 2004-09-23 | Fuji Photo Film Co., Ltd. | Sensor chip, process for producing the same, and sensor using the same |
| CN106480484A (en) * | 2016-10-12 | 2017-03-08 | 中山大学 | A kind of preparation of reflective image device and application process |
| CN110267460A (en) * | 2019-07-08 | 2019-09-20 | 深圳市景旺电子股份有限公司 | A kind of production method and Mini LED board of Mini LED board |
| CN111341766A (en) * | 2020-02-27 | 2020-06-26 | 惠州中京电子科技有限公司 | Method for manufacturing mini LED mainboard |
| CN111901968A (en) * | 2020-07-29 | 2020-11-06 | 厦门爱谱生电子科技有限公司 | Micro LED flexible circuit board manufacturing method |
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Application publication date: 20210430 |
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| RJ01 | Rejection of invention patent application after publication |