CN112725895B - 一种碳化硅单晶体的生长方法 - Google Patents
一种碳化硅单晶体的生长方法 Download PDFInfo
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- CN112725895B CN112725895B CN202110125864.6A CN202110125864A CN112725895B CN 112725895 B CN112725895 B CN 112725895B CN 202110125864 A CN202110125864 A CN 202110125864A CN 112725895 B CN112725895 B CN 112725895B
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- Prior art keywords
- silicon carbide
- silicon
- heat treatment
- single crystal
- carbide single
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 239000013078 crystal Substances 0.000 title claims abstract description 45
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 20
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 14
- 229910052786 argon Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000001069 Raman spectroscopy Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
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Claims (1)
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CN202110125864.6A CN112725895B (zh) | 2021-01-29 | 2021-01-29 | 一种碳化硅单晶体的生长方法 |
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CN202110125864.6A CN112725895B (zh) | 2021-01-29 | 2021-01-29 | 一种碳化硅单晶体的生长方法 |
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CN112725895A CN112725895A (zh) | 2021-04-30 |
CN112725895B true CN112725895B (zh) | 2022-09-30 |
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Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5863325A (en) * | 1995-05-31 | 1999-01-26 | Bridgestone Corporation | Process for producing high purity silicon carbide powder for preparation of a silicon carbide single crystal and single crystal |
JP3934695B2 (ja) * | 1995-05-31 | 2007-06-20 | 株式会社ブリヂストン | 炭化ケイ素単結晶製造用高純度炭化ケイ素粉体の製造方法 |
JP2001158695A (ja) * | 1999-11-29 | 2001-06-12 | Denso Corp | 炭化珪素単結晶の製造方法 |
JP2003221300A (ja) * | 2002-01-29 | 2003-08-05 | Kyocera Corp | 単結晶炭化珪素部材の製造方法 |
WO2009140791A1 (en) * | 2008-05-21 | 2009-11-26 | Dalian Institute Of Chemical Physics, Chinese Academy Of Sciences | Process for producing silicon carbide |
KR102024190B1 (ko) * | 2012-10-18 | 2019-09-23 | 엘지이노텍 주식회사 | 탄화규소 분말의 제조 방법 |
CN105821471B (zh) * | 2016-05-10 | 2018-10-30 | 山东大学 | 一种低应力高纯半绝缘SiC单晶的制备方法 |
CN107190323A (zh) * | 2017-06-06 | 2017-09-22 | 宝鸡文理学院 | 一种生长低缺陷碳化硅单晶的方法 |
CN109234804B (zh) * | 2018-11-02 | 2020-01-14 | 山东天岳先进材料科技有限公司 | 一种碳化硅单晶生长方法 |
CN111748843B (zh) * | 2020-07-09 | 2022-02-22 | 北京北方华创微电子装备有限公司 | 碳化硅单晶生长装置 |
CN112158845A (zh) * | 2020-10-13 | 2021-01-01 | 哈尔滨科友半导体产业装备与技术研究院有限公司 | 一种pvt法中碳化硅粉源的回收方法 |
CN112226815A (zh) * | 2020-11-16 | 2021-01-15 | 哈尔滨科友半导体产业装备与技术研究院有限公司 | 用于pvt法生长碳化硅单晶的碳化硅粉料的预处理方法 |
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Effective date of registration: 20211207 Address after: 100176 935, floor 9, building 2, yard 38, Kechuang Fifth Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Applicant after: Beijing libaosheng Technology Co.,Ltd. Address before: Room 501, 5th floor, 3749 Erhuan East Road, Licheng District, Jinan City, Shandong Province Applicant before: XINCAN semiconductor technology (Shandong) Co.,Ltd. |
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Effective date of registration: 20240418 Address after: 101300 North Wenhuaying Village, Shunyi District, Beijing (No. 1, Shunchuang Second Road) Patentee after: Beijing Changlong Zhixin Semiconductor Co.,Ltd. Country or region after: China Address before: 100176 935, floor 9, building 2, yard 38, Kechuang Fifth Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: Beijing libaosheng Technology Co.,Ltd. Country or region before: China |