CN112629402B - Preparation method and template for strain gauge coated with welding spot - Google Patents

Preparation method and template for strain gauge coated with welding spot Download PDF

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Publication number
CN112629402B
CN112629402B CN202011640015.6A CN202011640015A CN112629402B CN 112629402 B CN112629402 B CN 112629402B CN 202011640015 A CN202011640015 A CN 202011640015A CN 112629402 B CN112629402 B CN 112629402B
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strain gauge
welding spot
photoetching
graph
substrate
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CN112629402A (en
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何志俊
刘长俊
潘成福
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Xiamen Lct Measurement And Control Co ltd
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Xiamen Lct Measurement And Control Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/024Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

The invention relates to a preparation method of a strain gauge coated by a welding spot and a template thereof, wherein the method comprises the following steps: s1, preparing a substrate composite layer: heating the metal foil coated with the substrate slurry, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array; s2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot; s3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines; s4, welding spot coating: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film; s5, cutting off the connecting wire; s6, setting a sensitive grid protective layer; and S7, cutting and forming.

Description

Preparation method and template for strain gauge coated with welding spot
Technical Field
The invention relates to the field of strain gauge preparation, in particular to a strain gauge preparation method for coating a welding spot and a preparation template thereof.
Background
The strain gauge is a sensor with resistance changing along with acting force; it converts physical quantities such as force, pressure, tension, weight, etc. into changes in resistance, thereby measuring the physical quantities. When an external force is applied to the fixed object, stress and strain are generated. The reaction force (to the external force) generated inside the object is the stress, and the displacement and deformation generated is the strain. Strain gauges are one of the most important sensors in electrical measurement technology for the measurement of mechanical quantities. As its name implies, strain gauges are used primarily for strain measurement. As a generic term, "strain" includes both tensile and compressive strain, distinguished by a positive or negative sign. Thus, a strain gauge can measure both expansion and contraction.
The strain gauge requires tin on the solder joints during the manufacturing process to connect to other circuits. However, the sensitive grid of the strain gauge is mainly made of special materials such as illion or gamma, and the materials contain aluminum, and the welding spot is small, so that the soldering difficulty is higher. Meanwhile, a corrosive soldering flux needs to be added, and uncontrollable factors exist in the reliability and stability of a soldering point.
The invention aims to provide a strain gauge preparation method for coating a welding spot and a preparation template thereof aiming at the problems in the prior art.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a preparation method of a strain gauge with a plated film at a welding spot and a template for preparing the strain gauge, which can effectively solve the problems in the prior art.
The technical scheme of the invention is as follows:
a preparation method of a strain gauge coated with a welding spot comprises the following steps:
s1, preparing a substrate composite layer: heating the metal foil coated with the substrate slurry, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array;
s2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot;
s3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting wires;
s4, welding spot coating: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film;
s5, cutting the connecting wire: cutting the connecting line by laser;
s6, setting a sensitive grid protective layer: arranging a sensitive grid protective layer on one surface of the strain gauge graph corresponding to the sensitive grid to obtain a strain gauge array;
s7, cutting and forming: and cutting the strain gauge array by laser to obtain the single strain gauge.
Further, the step S1 is preceded by:
s0, preparing a strain gauge template: the strain gauge template comprises strain gauge photoetching areas arranged in an array, conductive band photoetching areas and connecting line photoetching areas for connecting the strain gauge photoetching areas and the conductive band photoetching areas.
Further, step S2 is specifically:
covering the substrate composite layer with the strain gauge templates, and obtaining strain gauge patterns in each strain gauge region through the matching of a photoetching process and the strain gauge templates.
Further, step S3 is specifically:
covering the substrate composite layer with the strain gauge templates, and matching the photoetching technology with the strain gauge templates to obtain connecting wires for respectively short-connecting each strain gauge graph and conductive strips for connecting all the connecting wires.
Further, in step S4, the plating the film on the solder joints by the electroplating process specifically includes:
and electrifying the conductive belt through an electroplating lead so as to electrify all the strain gauge graphs and further coat films on all welding points.
Further, in step S4, the plating film is one of gold plating and tin plating.
Further, the thickness of the tin plating is 5 to 100 micrometers, and the thickness of the gold plating is 0.5 to 1 micrometer.
Further, between step S5 and step S6, the method further includes:
s5.1, resistance adjustment: and adjusting the resistance value of the sensitive grid of each strain gauge graph to a required range.
Further, the air conditioner is provided with a fan,
in step S1, the composite layer further includes strain gauge monitoring areas;
in step S2, after the metal foil is subjected to photolithography by a photolithography process, a monitoring strain gauge pattern is further obtained in a plurality of strain gauge monitoring areas;
in step S3, the connecting line does not short the monitoring strain gauge pattern.
The preparation template comprises the photoetching areas of the strain gauges arranged in an array, the photoetching area of the conductive belt and the photoetching area of a connecting line for connecting the photoetching areas of the strain gauges and the photoetching area of the conductive belt.
Accordingly, the present invention provides the following effects and/or advantages:
the strain gauge with the plated film on the welding spot is obtained by short-circuiting all the strain gauge graphs through the connecting line, plating the film on the welding spot through isolating the sensitive grid and an electroplating process, and finally cutting off the connecting line, setting the sensitive grid protective layer, cutting and forming and the like. The strain gauge is coated with a film, and no soldering flux is needed in the process of connecting with other circuits.
The invention uniformly short-circuits all strain gauge graphs through the connecting wires, thereby plating films on the welding spots of the strain gauge graphs, ensuring the consistency of the plated films on all the welding spots, ensuring the same coverage degree of the plated films, and ensuring that the detection head of the resistance trimming instrument only needs to be contacted with the welding spots in the subsequent resistance trimming process.
According to the invention, the strain gauge template is prepared, the strain gauge photoetching area, the conductive strip photoetching area and the connecting line photoetching area for connecting the strain gauge photoetching area and the conductive strip photoetching area are arranged on the template, so that a shielded template is provided for a subsequent photoetching process, and a strain gauge graph which is short-circuited can be obtained by one-time photoetching, and the work efficiency is high and the consistency is high.
It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
FIG. 2 is a diagram illustrating a structure of a strain gauge template according to an embodiment.
Fig. 3 is an enlarged view of a portion a of fig. 2.
Detailed Description
To facilitate understanding of those skilled in the art, the structure of the present invention will now be described in further detail by way of examples in conjunction with the accompanying drawings:
referring to fig. 1, a method for manufacturing a strain gauge coated with a solder joint comprises the following steps:
s0, preparing a strain gauge template: the strain gauge template comprises strain gauge photoetching areas 1, conductive strip photoetching areas 2 and connecting line photoetching areas 3, wherein the strain gauge photoetching areas 1 are distributed in an array manner, and the connecting line photoetching areas 3 are connected with the conductive strip photoetching areas 2;
in this embodiment, referring to fig. 2-3, the conductive strip photo-etching area is located at the periphery of the strain gauge photo-etching area and extends to each strain gauge photo-etching area, wherein the width of the conductive strip photo-etching area is much larger than that of the connection line photo-etching area, and the connection line photo-etching area connects each strain gauge photo-etching area and the conductive strip photo-etching area;
s1, preparing a substrate composite layer: heating the metal foil coated with the substrate, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array;
in this embodiment, a single side of the metal foil is coated with a substrate slurry, the substrate slurry adopted in this embodiment is a polyimide slurry, the metal foil is israen or cama, and other materials may be adopted in other embodiments, which is not limited herein; and heating to a certain temperature by an oven, so that the substrate slurry is solidified and is attached to the metal foil, and the metal foil is exposed on one surface of the substrate slurry to obtain a substrate composite layer. And strain gauge regions arranged in an array are planned on the substrate composite layer.
S2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot; the method specifically comprises the following steps: covering the substrate composite layer with the strain gauge templates, and obtaining strain gauge patterns in each strain gauge region through the matching of a photoetching process and the strain gauge templates.
S3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines; the method specifically comprises the following steps: and through the matching of the photoetching process and the strain gauge template, connecting lines which are respectively short-circuited with each strain gauge pattern and conductive strips which are connected with all the connecting lines are obtained.
In this embodiment, in steps S2 to S3, the substrate composite layer is covered with the strain gauge template, and the entire surface of each substrate composite layer is coated with photoresist by matching a photolithography process with the strain gauge template, and after exposure with the strain gauge template, the part not covered by the strain gauge template is washed away during development, and then etched to obtain a strain gauge pattern of a metal foil material having the same shape as the strain gauge template, and a composite layer to which the strain gauge pattern is attached, and at the same time, the strain gauge pattern has a connection line which short-circuits the connection line and the conductive strip of each strain gauge pattern.
S4, coating a welding spot: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film;
in this embodiment, the sensitive grid is attached by an adhesive tape to isolate the sensitive grid, the conductive band is electrified by an electroplating lead to electrify all the strain gauge patterns, and then all the welding spots are plated with a film, wherein the plated film is one of gold plating or tin plating, if the puppet is tin, the thickness of the tin plating is 5-100 micrometers, and if the plated film is gold, the thickness of the gold plating is 0.5-1 micrometer. Specifically, in this embodiment, the thickness of the tin is 5 micrometers, 50 micrometers, or 100 micrometers, and the thickness of the gold is 0.5 micrometers, 0.8 micrometers, or 1 micrometer, and may be other thicknesses in other embodiments.
S5, cutting the connecting wire: cutting the connecting line by laser;
s5.1, resistance adjustment: adjusting the resistance value of the sensitive grid of each strain gauge graph to a required range;
in this embodiment, the adhesive tape needs to be removed before the resistance value is adjusted. The resistance value of the strain gauge is adjusted in the prior art, the resistance of the strain gauge can be adjusted by means of polishing the sensitive grid and the like, so that the resistance value of the sensitive grid of each strain gauge graph is adjusted to a required range, a specific resistance value adjusting method is not limited, and meanwhile, the resistance value adjusting method is not specifically described.
S6, setting a sensitive grid protective layer: arranging a sensitive grid protective layer on one surface of the strain gauge graph corresponding to the sensitive grid to obtain a strain gauge array; in this embodiment, a cover layer slurry is further coated on one surface of the strain gauge pattern corresponding to the sensitive grid, and the strain gauge pattern is sent into a heating chamber to be heated and cured to obtain a sensitive grid protective layer, so that the complete strain gauge comprising the substrate, the sensitive grid and the cover layer is obtained. The method for disposing the sensitive gate protection layer is the prior art and is not specifically described herein.
S7, cutting and forming: and cutting the strain gauge array by laser to obtain the single strain gauge.
Further, referring to fig. 2-3, this embodiment provides strain gauge monitoring lithography areas on the strain gauge reticle,
in step S1, further obtaining a plurality of strain gauge monitoring areas on the composite layer through a photoetching process;
in step S2, after the metal foil is subjected to photolithography by a photolithography process, a monitoring strain gauge pattern is further obtained in a plurality of strain gauge monitoring areas;
in step S3, the connecting line does not short the monitoring strain gauge pattern.
In the photoetching process, because all the strain gauge graphs are in short circuit through the connecting lines, the resistance value of the strain gauge graphs cannot be obtained, and the corrosion degree of the strain gauge graphs on the corrosion process cannot be accurately controlled in the photoetching process. The embodiment connects the monitoring strain gauge graph through the resistance measuring instrument, so that the resistance value of the monitoring strain gauge graph is monitored, and the parameters of the corrosion time and the like of the corrosion process of the monitoring strain gauge graph are accurately controlled.
Further, the strain gauge monitoring lithographic zones may be located at the periphery, corners or center of the strain gauge reticle.
Example two
The preparation template comprises strain gauge photoetching areas arranged in an array, conductive belt photoetching areas and connecting wire photoetching areas for connecting the strain gauge photoetching areas and the conductive belt photoetching areas.
Further, the preparation of the template strain gauge monitors the photoetching area.
The working principle of the template preparation and the function and use thereof are described in detail in the first embodiment, and are not specifically described herein.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.

Claims (6)

1. A preparation method of a strain gauge coated with a welding spot is characterized by comprising the following steps: comprises the following steps:
s0, preparing a strain gauge template: the strain gauge template comprises strain gauge photoetching areas arranged in an array, conductive band photoetching areas and connecting line photoetching areas for connecting the strain gauge photoetching areas and the conductive band photoetching areas;
s1, preparing a substrate composite layer: heating the metal foil coated with the substrate slurry, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array;
s2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot; the method specifically comprises the following steps:
covering the substrate composite layer with the strain gauge template, and matching the photoetching process with the strain gauge template to obtain a strain gauge graph in each strain gauge area;
s3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines; s3 specifically includes:
covering the substrate composite layer with the strain gauge templates, and matching the photoetching process with the strain gauge templates to obtain connecting wires respectively short-circuited with each strain gauge graph and conductive strips connected with all the connecting wires;
s4, coating a welding spot: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film;
s5, cutting the connecting wire: cutting off the connecting line by laser;
s6, setting a sensitive grid protective layer: arranging a sensitive grid protective layer on one surface of the strain gauge graph corresponding to the sensitive grid to obtain a strain gauge array;
s7, cutting and forming: and cutting the strain gauge array by laser to obtain the single strain gauge.
2. The method for preparing the strain gauge coated on the welding spot according to claim 1, wherein the method comprises the following steps: in step S4, the plating a film on the solder joint by an electroplating process specifically includes:
and electrifying the conductive belt through the electroplating lead wire so as to electrify all the strain gauge patterns and further coat films on all welding spots.
3. The method for preparing the strain gauge coated on the welding spot according to any one of claims 1-2, wherein the method comprises the following steps: in step S4, the plating film is one of gold plating and tin plating.
4. The method for preparing the strain gauge coated on the welding spot according to claim 3, wherein the method comprises the following steps: the thickness of the tin plating is 5-100 microns, and the thickness of the gold plating is 0.5-1 micron.
5. The method for preparing the strain gauge coated on the welding spot according to claim 1, wherein the method comprises the following steps: between step S5 and step S6, the method further includes:
s5.1, resistance adjustment: and adjusting the resistance value of the sensitive grid of each strain gauge graph to a required range.
6. The method for preparing the strain gauge coated on the welding spot according to claim 1, wherein the method comprises the following steps:
in step S1, the composite layer further includes strain gauge monitoring regions;
in step S2, after the metal foil is photo-etched by a photo-etching process, further obtaining a graph of a monitoring strain gauge in a plurality of monitoring areas of the strain gauge;
in step S3, the connecting line does not short the monitoring strain gauge pattern.
CN202011640015.6A 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot Active CN112629402B (en)

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CN202011640015.6A CN112629402B (en) 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot

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