CN116086663B - Preparation method of force sensor - Google Patents
Preparation method of force sensor Download PDFInfo
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- CN116086663B CN116086663B CN202310105336.3A CN202310105336A CN116086663B CN 116086663 B CN116086663 B CN 116086663B CN 202310105336 A CN202310105336 A CN 202310105336A CN 116086663 B CN116086663 B CN 116086663B
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- temporary matrix
- metal strain
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- 239000011159 matrix material Substances 0.000 claims description 39
- 239000011888 foil Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 30
- 239000002313 adhesive film Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- 238000001259 photo etching Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000004381 surface treatment Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
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- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 3
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- 238000001035 drying Methods 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
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- 238000012360 testing method Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 238000000105 evaporative light scattering detection Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000005488 sandblasting Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
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- 230000008901 benefit Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention provides a preparation method of a force sensor, which is applied to the technical field of force sensor preparation and comprises a preparation process of a metal strain frame and a preparation process of the force sensor, wherein the metal strain frame comprises a bonding pad and grid-shaped resistors, at least two grid-shaped resistors are arranged, the two grid-shaped resistors are connected through the bonding pad, and the grid-shaped resistors are used for forming a Wheatstone bridge structure; the force sensor includes a metal terminal having the same shape as the metal strain frame. The preparation method enables the force sensor to be suitable for a high-temperature environment, and is beneficial to improving the reliability of detection of the force sensor in the high-temperature environment.
Description
Technical Field
The invention belongs to the technical field of force sensor preparation, and particularly relates to a preparation method of a force sensor.
Background
A force sensor is a device that converts the magnitude of a force into an associated electrical signal. Force is a direct cause of the change in movement of the substance. The force sensor can detect mechanical quantities such as tension, pulling force, pressure, weight, torque, internal stress, strain and the like. Specific devices include metal strain gages, pressure sensors and the like, and the metal strain gages, the pressure sensors and the like become indispensable core components in power equipment, engineering machinery, various working machines and industrial automation systems.
The force sensor mainly comprises three parts, including a force sensitive element, a conversion element and a circuit part, wherein the force sensitive element is an elastomer, and common materials include aluminum alloy, alloy steel and stainless steel; the most common of the conversion elements is a resistive strain gage.
The existing force sensor is difficult to monitor force in a high-temperature environment, and has reliability problems. For example, the invention patent of publication No. CN110553769A, a novel strain type pressure-torsion two-dimensional force sensor is provided with a torsion strain beam and a T-shaped beam which are longitudinally arranged between three flanges, and the structure has the advantages of strong eccentric load resistance and side load resistance and can improve dynamic and static application performance. However, the strain gauge is attached to the metal strain structure by means of bonding, on one hand, the bonding glue can cause creep effect, so that the creep performance of the force sensor component is poor; on the other hand, in the use process of the sensor, when the temperature is repeatedly changed, the glue has failure risk, so that the reliability of the force sensor is affected. In addition, the thermal expansion coefficients between the strain gauge, the glue, the metal substrate are different, which may lead to deterioration of the temperature characteristics of the force sensor.
And as disclosed in the patent of publication No. CN111780900A, the strain force transducer is provided with two elastic main beams, each of which is provided with one strain gauge, the two strain gauges are mutually vertical and are in inverse parallel connection, and the strain force transducer has the function of thermal expansion and cold contraction compensation when the temperature changes, and has strong scene adaptability and strong temperature stability. However, the scheme only compensates the signal of the force sensor in a certain temperature range, for example-40-150 ℃, so that the accuracy of the force sensor is improved, but the problem that the force sensor is difficult to apply in a high-temperature environment cannot be effectively solved.
Disclosure of Invention
In view of the above problems in the prior art, an object of the present invention is to provide a method for manufacturing a force sensor, which enables the force sensor to be suitable for a high temperature environment, and is beneficial to improving the reliability of the detection of the force sensor in the high temperature environment.
The preparation method of the force sensor comprises a preparation process of a metal strain frame and a preparation process of the force sensor, wherein the metal strain frame comprises a bonding pad and grid-shaped resistors, at least two grid-shaped resistors are arranged, the two grid-shaped resistors are connected through the bonding pad, and the grid-shaped resistors are used for forming a Wheatstone bridge structure; the force sensor comprises a metal terminal, wherein the shape of the metal terminal is the same as that of the metal strain frame;
the preparation process of the metal strain frame comprises the following steps:
s11, placing the metal foil on a workbench, generating a temporary matrix on the metal foil and forming a temporary matrix adhesive film;
s12, coating photoresist above the metal foil, forming a photoetching pattern after photoetching development, and etching the metal by using an etching solution to form a metal strain frame;
s13, adjusting resistance by a mechanical grinding, laser resistance adjustment or chemical resistance adjustment method to adjust the resistance of the metal strain frame to be within a threshold range;
s14, dissolving or decomposing the temporary matrix by a physical or chemical method to automatically peel the metal strain frame from the temporary matrix adhesive film;
the preparation process of the force sensor comprises the following steps:
s21, carrying out surface treatment on the metal terminal;
s22, printing a material on the metal terminal subjected to surface treatment, printing glass slurry on the upper end surface of the metal terminal, and sintering for the first time to form a flat glass layer;
s23, attaching a metal strain frame to the upper side of the glass layer;
s24, placing the metal terminal attached with the metal strain frame in a tunnel furnace for secondary sintering, wherein the temperature of the secondary sintering is higher than the softening temperature of the glass material;
s25, detecting the quality of the sintered metal terminal;
s26, welding a metal lead wire to a grid resistor on the metal strain frame for inputting and outputting signals;
and S27, dispensing protective glue at the welding position above the metal strain frame.
Generating a temporary matrix for forming a metal strain frame, wherein the generation process of the temporary matrix comprises the following steps: and (3) coating the precursor solution of the temporary matrix on the upper surface of the metal foil in a dispensing, spin coating or spray coating mode, and curing the temporary matrix by high-temperature or ultraviolet irradiation to form a flat temporary matrix adhesive film.
The thickness of the metal foil is 10-30 mu m, and the material of the metal foil is nichrome, kama alloy or Ivin alloy.
The forming process of the metal strain frame specifically comprises the following steps:
turning over the combination of the metal foil and the temporary matrix adhesive film on a workbench, so that one surface of the metal foil faces upwards and one surface of the temporary matrix adhesive film faces downwards;
coating photoresist on the surface of the metal foil;
photoetching through a mask plate and a photoetching machine, and after development, covering a metal foil with a photoresist part to form a photoetching pattern;
etching the metal by using an etching solution, and etching the part which is not covered by the photoresist to form a metal strain frame;
and (5) washing off the photoresist, and retaining the metal strain frame and the temporary matrix adhesive film.
In order to ensure the accuracy of the force sensor measurement, the specific process of resistance adjustment comprises the following steps: and uniformly spraying resistance adjusting solution on the metal strain frame and the temporary matrix adhesive film, connecting the voltage to the two ends of the metal strain frame to be adjusted, detecting the resistance value of the metal strain frame in real time until the resistance value reaches a threshold value range, and stopping adjusting the resistance.
The surface treatment of the metal terminal comprises the steps of carrying out sand blasting on the surface of the metal terminal to form a sand blasted surface, and then carrying out ultrasonic cleaning and drying on the metal terminal after sand blasting, wherein the sand blasting material is zirconia or corundum, and the surface roughness of the metal terminal after sand blasting is 3-10 mu m.
The quality detection process comprises the following steps: adopting AOI detection equipment to automatically detect and judge the sintering position and quality of the metal strain frame; the quality detection process further comprises the steps of testing the resistance value of each grid-shaped resistor on the metal strain frame and judging whether the metal strain frame fails or not.
The beneficial effects of the invention are as follows: according to the preparation method of the force sensor, the metal foil and the temporary matrix are mutually matched to form the metal strain frame, so that the force sensor is convenient to use in producing force sensors in various forms, and meanwhile, the produced metal strain frame has the advantage of high temperature resistance by virtue of the advantages of high resistivity, low resistance temperature coefficient, high temperature resistance and high resistance strain coefficient of the metal foil, and is beneficial to improving the high temperature resistance performance of the force sensor, so that the force sensor is suitable for high temperature environments. In addition, through the force sensor that twice sintering formed, make metal strain frame can fuse with glass thick liquids, can make metal strain frame be fixed in glass top after the sintering is accomplished, avoid adopting the mode of adhesion to fix metal strain frame, can effectively avoid high temperature environment to cause the damage to force sensor's structure.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of the structure of a force sensor of the present invention;
FIG. 2 is a schematic structural view of a metallic strain frame of the present invention;
FIG. 3 is a flow chart of the preparation of a metal strain frame of the present invention;
FIG. 4 is a flow chart of the force sensor preparation of the present invention.
Marked in the figure as: 1. a metal terminal; 2. a sand blasted surface; 3. a glass paste; 4. a metal strain frame; 401. a bonding pad; 402. a grid-like resistor; 5. a metal lead; 6. and (5) protecting glue.
Detailed Description
Example 1
As shown in fig. 1, a method for manufacturing a force sensor includes a process for manufacturing a metal strain frame 4 and a process for manufacturing a force sensor, where the metal strain frame 4 includes a bonding pad 401 and a grid resistor 402, at least two grid resistors 402 are provided, the two grid resistors 402 are connected through the bonding pad 401, the grid resistors 402 are used to form a wheatstone bridge structure, the wheatstone bridge needs 4 resistors, and the number of the grid resistors 402 on a single metal strain frame 4 is usually 2 or 4.
The force sensor comprises a metal terminal 1, the shape of the metal terminal 1 is the same as that of a metal strain frame 4, and the shape of the metal strain frame can be determined according to the actual requirements of application scenes and comprises various shapes such as triangle, rectangle, circle, circular ring, special shape and the like.
In this embodiment, a rectangular metal strain frame 4 having 2 grid resistors 402 is used as an example.
The preparation process of the metal strain frame 4 comprises the following steps:
s11, placing the metal foil on a workbench, generating a temporary matrix on the metal foil and forming a temporary matrix adhesive film; the temporary matrix generation process comprises the following steps: and (3) coating the precursor solution of the temporary matrix on the upper surface of the metal foil in a dispensing, spin coating or spray coating mode, and curing the temporary matrix by high-temperature or ultraviolet irradiation to form a flat temporary matrix adhesive film.
The temporary matrix is made of thermosetting materials such as polyester, polyimide, epoxy resin and the like or photosensitive materials such as photoresist and the like.
The thickness of the metal foil is 10-30 mu m, the material of the metal foil is nichrome, kama alloy or I Wen Gejin, and the metal foil has the advantages of high resistivity, low resistance temperature coefficient, high resistance temperature and low resistance strain coefficient in the temperature range of-40-300 ℃.
S12, coating photoresist above the metal foil, forming a photoetching pattern after photoetching development, and etching the metal by using an etching solution to form a metal strain frame 4; the forming process of the metal strain frame 4 specifically includes:
turning over the combination of the metal foil and the temporary matrix adhesive film on a workbench, so that one surface of the metal foil faces upwards and one surface of the temporary matrix adhesive film faces downwards;
coating photoresist on the surface of the metal foil;
photoetching through a mask plate and a photoetching machine, and after development, covering a metal foil with a photoresist part to form a photoetching pattern;
etching the metal with an etching solution, and etching the part uncovered by the photoresist to form a metal strain frame 4;
the photoresist is washed away leaving the metal strain frame 4 and temporary matrix film.
S13, adjusting resistance by a mechanical grinding, laser resistance adjustment or chemical resistance adjustment method to adjust the resistance of the metal strain frame 4 to be within a threshold range; the specific process for adjusting resistance by a chemical group adjustment method comprises the following steps: and uniformly spraying resistance adjusting solution on the metal strain frame 4 and the temporary matrix adhesive film, connecting the voltage to the two ends of the metal strain frame 4 to be subjected to resistance adjustment, detecting the resistance value of the metal strain frame 4 in real time until the resistance value reaches a threshold value range, and stopping resistance adjustment.
S14, dissolving or decomposing the temporary matrix by a physical or chemical method, so that the metal strain frame 4 is automatically peeled from the temporary matrix adhesive film.
The preparation process of the force sensor comprises the following steps:
s21, carrying out surface treatment on the metal terminal 1; the surface treatment of the metal terminal includes blasting the surface of the metal terminal 1 to form a blasted surface 2, and then ultrasonic cleaning and drying the blasted metal terminal 1. Wherein the sand blasting material is zirconia or corundum, the surface roughness of the metal terminal 1 after sand blasting is 3-10 mu m, and the solvent for ultrasonic cleaning is deionized water for washing off residues after sand blasting;
s22, printing materials on the metal terminal 1 subjected to surface treatment, printing the glass paste 3 on the upper end face of the metal terminal 1, and sintering for the first time to form a flat glass layer, wherein the temperature of the first time sintering is 500-600 ℃, the temperature is used for removing volatile components such as adhesive and the like in the glass paste 3, and the thickness of the glass is 50-100 mu m. The reason for selecting the glass paste 3 is that: the thermal expansion coefficient of the glass paste 3 is matched with that of the metal strain frame 4, the creep effect is almost not existed, the stress can be transmitted almost without damage, and the glass paste has the characteristic of high temperature resistance.
S23, attaching the metal strain frame 4 to the upper side of the glass layer, so that the metal strain frame 4 is positioned in a proper strain area;
s24, placing the metal terminal 1 attached with the metal strain frame 4 in a tunnel furnace for secondary sintering, wherein the temperature of the secondary sintering is higher than the softening temperature of the glass material, so that the metal strain frame 4 can sink in the glass liquid due to the action of gravity and cannot sink in the softened glass liquid due to the existence of surface tension in the sintering process; further, nitrogen needs to be filled in the sintering process to prevent the metal strain frame 4 from being oxidized.
S25, detecting the quality of the sintered metal terminal 1; the quality detection process comprises the following steps: adopting AOI detection equipment to automatically detect and judge the sintering position and quality of the metal strain frame 4; the quality inspection process also includes testing the resistance of each grid resistor 402 on the metal strain frame 4 and determining whether the metal strain frame 4 is malfunctioning.
S26, welding the metal lead 5 to the grid resistor 402 on the metal strain frame 4 for inputting and outputting signals;
and S27, a protective adhesive 6 is coated at a welding position above the metal strain frame 4, wherein the protective adhesive 6 can be soft adhesive such as silica gel and has certain strength, but almost no extra stress is generated, and the signal output and the long-term use stability of the force sensor can not be influenced.
The foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The preparation method of the force sensor is characterized by comprising a preparation process of a metal strain frame and a preparation process of the force sensor, wherein the metal strain frame comprises bonding pads and grid-shaped resistors, at least two grid-shaped resistors are arranged, the two grid-shaped resistors are connected through the bonding pads, and the grid-shaped resistors are used for forming a Wheatstone bridge structure; the force sensor comprises a metal terminal, wherein the shape of the metal terminal is the same as that of the metal strain frame;
the preparation process of the metal strain frame comprises the following steps:
s11, placing the metal foil on a workbench, generating a temporary matrix on the metal foil and forming a temporary matrix adhesive film;
s12, coating photoresist above the metal foil, forming a photoetching pattern after photoetching development, and etching the metal by using an etching solution to form a metal strain frame;
s13, adjusting resistance by a mechanical grinding, laser resistance adjustment or chemical resistance adjustment method to adjust the resistance of the metal strain frame to be within a threshold range;
s14, dissolving or decomposing the temporary matrix by a physical or chemical method to automatically peel the metal strain frame from the temporary matrix adhesive film;
the preparation process of the force sensor comprises the following steps:
s21, carrying out surface treatment on the metal terminal;
s22, printing a material on the metal terminal subjected to surface treatment, printing glass slurry on the upper end surface of the metal terminal, and sintering for the first time to form a flat glass layer;
s23, attaching a metal strain frame to the upper side of the glass layer;
s24, placing the metal terminal attached with the metal strain frame in a tunnel furnace for secondary sintering, wherein the temperature of the secondary sintering is higher than the softening temperature of the glass material;
s25, detecting the quality of the sintered metal terminal;
s26, welding a metal lead wire to a grid resistor on the metal strain frame for inputting and outputting signals;
and S27, dispensing protective glue at the welding position above the metal strain frame.
2. The method of manufacturing a force sensor of claim 1, wherein the temporary matrix generation process comprises: and (3) coating the precursor solution of the temporary matrix on the upper surface of the metal foil in a dispensing, spin coating or spray coating mode, and curing the temporary matrix by high-temperature or ultraviolet irradiation to form a flat temporary matrix adhesive film.
3. The method of manufacturing a force sensor according to claim 1, wherein the thickness of the metal foil is 10-30 μm, and the material of the metal foil is nichrome, kama alloy or iver alloy.
4. The method of manufacturing a force sensor of claim 1, wherein the forming of the metallic strain frame specifically comprises:
turning over the combination of the metal foil and the temporary matrix adhesive film on a workbench, so that one surface of the metal foil faces upwards and one surface of the temporary matrix adhesive film faces downwards;
coating photoresist on the surface of the metal foil;
photoetching through a mask plate and a photoetching machine, and after development, covering a metal foil with a photoresist part to form a photoetching pattern;
etching the metal by using an etching solution, and etching the part which is not covered by the photoresist to form a metal strain frame;
and (5) washing off the photoresist, and retaining the metal strain frame and the temporary matrix adhesive film.
5. The method for manufacturing a force sensor according to claim 1, wherein the specific process of resistance adjustment comprises: and uniformly spraying resistance adjusting solution on the metal strain frame and the temporary matrix adhesive film, connecting the voltage to the two ends of the metal strain frame to be adjusted, detecting the resistance value of the metal strain frame in real time until the resistance value reaches a threshold value range, and stopping adjusting the resistance.
6. The method for manufacturing a force sensor according to claim 1, wherein the surface treatment of the metal terminal includes blasting the surface of the metal terminal to form a blasted surface, and then ultrasonic cleaning and drying the blasted metal terminal, wherein the blasted material is zirconia or corundum, and the surface roughness of the blasted metal terminal is 3-10 μm.
7. The method of manufacturing a force sensor of claim 1, wherein the mass detection process comprises: adopting AOI detection equipment to automatically detect and judge the sintering position and quality of the metal strain frame; the quality detection process further comprises the steps of testing the resistance value of each grid-shaped resistor on the metal strain frame and judging whether the metal strain frame fails or not.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310105336.3A CN116086663B (en) | 2023-02-13 | 2023-02-13 | Preparation method of force sensor |
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| CN202310105336.3A CN116086663B (en) | 2023-02-13 | 2023-02-13 | Preparation method of force sensor |
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| CN103615967A (en) * | 2013-11-30 | 2014-03-05 | 中航电测仪器股份有限公司 | High-temperature foil strain gauge and method for manufacturing high-temperature foil strain gauge |
| CN108328561A (en) * | 2018-01-10 | 2018-07-27 | 上海交通大学 | Glassy metal micron foil resistance strain and preparation method thereof |
| CN109059747A (en) * | 2018-07-04 | 2018-12-21 | 北京科技大学 | A kind of temporary frame work wire grid formula high temperature strain gauge and its manufacture and use method |
| CN114414123A (en) * | 2022-01-24 | 2022-04-29 | 上海交通大学 | Strain sensor chip on special-shaped metal substrate and in-situ preparation method thereof |
| CN114812374A (en) * | 2022-03-31 | 2022-07-29 | 厦门大学 | TiB 2 -SiCN ceramic high-temperature thin film strain gauge and preparation method thereof |
| CN217403649U (en) * | 2022-05-23 | 2022-09-09 | 无锡胜脉电子有限公司 | Ceramic resistance strain gauge with higher output span |
| CN115096377A (en) * | 2022-08-25 | 2022-09-23 | 无锡胜脉电子有限公司 | Temperature and pressure sensor and assembly process of temperature sensing assembly thereof |
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