CN112567296B - 使用二衍射级成像的离轴照明覆盖测量 - Google Patents
使用二衍射级成像的离轴照明覆盖测量 Download PDFInfo
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- CN112567296B CN112567296B CN201880096229.6A CN201880096229A CN112567296B CN 112567296 B CN112567296 B CN 112567296B CN 201880096229 A CN201880096229 A CN 201880096229A CN 112567296 B CN112567296 B CN 112567296B
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- 238000005259 measurement Methods 0.000 title claims abstract description 179
- 238000005286 illumination Methods 0.000 title claims abstract description 88
- 238000003384 imaging method Methods 0.000 title description 13
- 238000000034 method Methods 0.000 claims abstract description 67
- 238000012545 processing Methods 0.000 claims description 15
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- 230000008569 process Effects 0.000 abstract description 5
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- 238000010586 diagram Methods 0.000 description 15
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- 230000002441 reversible effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/36—Systems for automatic generation of focusing signals using image sharpness techniques, e.g. image processing techniques for generating autofocus signals
- G02B7/38—Systems for automatic generation of focusing signals using image sharpness techniques, e.g. image processing techniques for generating autofocus signals measured at different points on the optical axis, e.g. focussing on two or more planes and comparing image data
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Data Mining & Analysis (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862723944P | 2018-08-28 | 2018-08-28 | |
| US62/723,944 | 2018-08-28 | ||
| PCT/US2018/065579 WO2020046408A1 (fr) | 2018-08-28 | 2018-12-14 | Mesure de superposition d'éclairage hors axe à l'aide d'une imagerie à deux ordres diffractés |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112567296A CN112567296A (zh) | 2021-03-26 |
| CN112567296B true CN112567296B (zh) | 2024-03-08 |
Family
ID=69645312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880096229.6A Active CN112567296B (zh) | 2018-08-28 | 2018-12-14 | 使用二衍射级成像的离轴照明覆盖测量 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11281111B2 (fr) |
| EP (1) | EP3811154A4 (fr) |
| JP (2) | JP7344954B2 (fr) |
| KR (2) | KR20210038983A (fr) |
| CN (1) | CN112567296B (fr) |
| SG (1) | SG11202100991PA (fr) |
| TW (1) | TWI791866B (fr) |
| WO (1) | WO2020046408A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11604149B2 (en) | 2020-04-23 | 2023-03-14 | Kla Corporation | Metrology methods and optical schemes for measurement of misregistration by using hatched target designs |
| US11164307B1 (en) | 2020-07-21 | 2021-11-02 | Kla Corporation | Misregistration metrology by using fringe Moiré and optical Moiré effects |
| US11300405B2 (en) * | 2020-08-03 | 2022-04-12 | Kla Corporation | Grey-mode scanning scatterometry overlay metrology |
| US11796925B2 (en) | 2022-01-03 | 2023-10-24 | Kla Corporation | Scanning overlay metrology using overlay targets having multiple spatial frequencies |
| US20230314344A1 (en) * | 2022-03-30 | 2023-10-05 | Kla Corporation | System and method for isolation of specific fourier pupil frequency in overlay metrology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532320A (ja) * | 2005-03-01 | 2008-08-14 | ケーエルエー−テンカー テクノロジィース コーポレイション | ２つの回折次数による画像化に基づいたターゲット取得およびオーバレイ測定 |
| WO2017044283A1 (fr) * | 2015-09-09 | 2017-03-16 | Kla-Tencor Corporation | Nouvelles approches de superposition par diffusométrie (scol) de premier ordre reposant sur l'introduction de champs électromagnétiques auxiliaires |
| JP2017537352A (ja) * | 2014-11-26 | 2017-12-14 | エーエスエムエル ネザーランズ ビー．ブイ． | 計測方法、コンピュータ製品およびシステム |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891872B2 (ja) | 2002-04-04 | 2007-03-14 | 株式会社ミツトヨ | 微小周期構造評価装置及び微小周期構造評価方法 |
| US7342659B2 (en) * | 2005-01-21 | 2008-03-11 | Carl Zeiss Meditec, Inc. | Cross-dispersed spectrometer in a spectral domain optical coherence tomography system |
| US7528941B2 (en) * | 2006-06-01 | 2009-05-05 | Kla-Tencor Technolgies Corporation | Order selected overlay metrology |
| NL1036459A1 (nl) * | 2008-02-13 | 2009-08-14 | Asml Netherlands Bv | Method and apparatus for angular-resolved spectroscopic lithography characterization. |
| US8300233B2 (en) * | 2010-03-30 | 2012-10-30 | Zygo Corporation | Interferometric encoder systems |
| KR101492205B1 (ko) * | 2010-11-12 | 2015-02-10 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템, 및 디바이스 제조 방법 |
| US9007584B2 (en) | 2010-12-27 | 2015-04-14 | Nanometrics Incorporated | Simultaneous measurement of multiple overlay errors using diffraction based overlay |
| US8867041B2 (en) * | 2011-01-18 | 2014-10-21 | Jordan Valley Semiconductor Ltd | Optical vacuum ultra-violet wavelength nanoimprint metrology |
| US9223227B2 (en) * | 2011-02-11 | 2015-12-29 | Asml Netherlands B.V. | Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method |
| US9201313B2 (en) * | 2011-11-09 | 2015-12-01 | Zygo Corporation | Compact encoder head for interferometric encoder system |
| US8456641B1 (en) | 2011-11-23 | 2013-06-04 | Kla-Tencor Corporation | Optical system |
| TWI516746B (zh) | 2012-04-20 | 2016-01-11 | 賽格股份有限公司 | 在干涉編碼系統中執行非諧循環錯誤補償的方法、裝置及計算機程式產品，以及微影系統 |
| EP3126893A4 (fr) * | 2014-03-31 | 2017-10-04 | Kla-Tencor Corporation | Mesures de mise au point par métrologie de diffusiomètrie |
| KR102665579B1 (ko) | 2015-05-19 | 2024-05-10 | 케이엘에이 코포레이션 | 오버레이 측정을 위한 지형 위상 제어 |
| US10101676B2 (en) | 2015-09-23 | 2018-10-16 | KLA—Tencor Corporation | Spectroscopic beam profile overlay metrology |
| EP3467591A4 (fr) * | 2016-05-31 | 2020-02-12 | Nikon Corporation | Appareil de détection de marque, procédé de détection de marque, appareil de mesure, appareil d'exposition, procédé d'exposition et procédé de fabrication de dispositif |
| JP6716779B2 (ja) * | 2016-07-21 | 2020-07-01 | エーエスエムエル ネザーランズ ビー．ブイ． | ターゲットの測定方法、基板、計測装置およびリソグラフィ装置 |
| US10048132B2 (en) * | 2016-07-28 | 2018-08-14 | Kla-Tencor Corporation | Simultaneous capturing of overlay signals from multiple targets |
| CN113946105A (zh) * | 2017-02-22 | 2022-01-18 | Asml荷兰有限公司 | 计算量测法 |
| US10677588B2 (en) * | 2018-04-09 | 2020-06-09 | Kla-Tencor Corporation | Localized telecentricity and focus optimization for overlay metrology |
-
2018
- 2018-12-14 KR KR1020217008813A patent/KR20210038983A/ko not_active Application Discontinuation
- 2018-12-14 EP EP18931575.7A patent/EP3811154A4/fr active Pending
- 2018-12-14 JP JP2021508303A patent/JP7344954B2/ja active Active
- 2018-12-14 WO PCT/US2018/065579 patent/WO2020046408A1/fr unknown
- 2018-12-14 KR KR1020247018480A patent/KR20240096661A/ko unknown
- 2018-12-14 CN CN201880096229.6A patent/CN112567296B/zh active Active
- 2018-12-14 US US16/317,603 patent/US11281111B2/en active Active
- 2018-12-14 SG SG11202100991PA patent/SG11202100991PA/en unknown
-
2019
- 2019-07-09 TW TW108124045A patent/TWI791866B/zh active
-
2023
- 2023-09-04 JP JP2023142824A patent/JP2023165738A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532320A (ja) * | 2005-03-01 | 2008-08-14 | ケーエルエー−テンカー テクノロジィース コーポレイション | ２つの回折次数による画像化に基づいたターゲット取得およびオーバレイ測定 |
| JP2017537352A (ja) * | 2014-11-26 | 2017-12-14 | エーエスエムエル ネザーランズ ビー．ブイ． | 計測方法、コンピュータ製品およびシステム |
| WO2017044283A1 (fr) * | 2015-09-09 | 2017-03-16 | Kla-Tencor Corporation | Nouvelles approches de superposition par diffusométrie (scol) de premier ordre reposant sur l'introduction de champs électromagnétiques auxiliaires |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202022348A (zh) | 2020-06-16 |
| JP7344954B2 (ja) | 2023-09-14 |
| US11281111B2 (en) | 2022-03-22 |
| KR20240096661A (ko) | 2024-06-26 |
| EP3811154A4 (fr) | 2022-04-06 |
| EP3811154A1 (fr) | 2021-04-28 |
| CN112567296A (zh) | 2021-03-26 |
| WO2020046408A1 (fr) | 2020-03-05 |
| TWI791866B (zh) | 2023-02-11 |
| US20200132446A1 (en) | 2020-04-30 |
| JP2021535595A (ja) | 2021-12-16 |
| KR20210038983A (ko) | 2021-04-08 |
| SG11202100991PA (en) | 2021-03-30 |
| JP2023165738A (ja) | 2023-11-17 |
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