CN112481594A - 一种用于手机盖板的彩色不导电真空电镀膜及其制备方法 - Google Patents

一种用于手机盖板的彩色不导电真空电镀膜及其制备方法 Download PDF

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CN112481594A
CN112481594A CN202011427455.3A CN202011427455A CN112481594A CN 112481594 A CN112481594 A CN 112481594A CN 202011427455 A CN202011427455 A CN 202011427455A CN 112481594 A CN112481594 A CN 112481594A
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oxide
nitride
oxynitride
titanium
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李刚
马立云
沈洪雪
金克武
姚婷婷
王天齐
陈诚
钟汝梅
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Triumph Science & Technology Co ltd
CNBM Bengbu Design and Research Institute for Glass Industry Co Ltd
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Abstract

本发明公开一种用于手机盖板的彩色不导电真空电镀膜及其制备方法,包括玻璃基板,玻璃基板顶面由下至上依次层叠有底漆层、缓冲层、NCVM层、彩色层与面漆层;所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;所述彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层;该电镀膜能够实现多种颜色的外观,并且膜系结合力强,抗老化、耐腐蚀。

Description

一种用于手机盖板的彩色不导电真空电镀膜及其制备方法
技术领域
本发明涉及功能玻璃技术领域,具体是一种用于手机盖板的彩色不导电真空电镀膜及其制备方法。
背景技术
近年来,手机消费已成为人们物质生活不可缺少的一部份。市场上所出现的高光、高亮的金属外壳及表面金属电镀外观的产品普遍得到消费者的青睐。但是随着无线充电逐渐普及和5G时代等新型传输方式的到来,手机上将搭载更多种类的天线,尤其是5G时代通信采用频段更高的毫米波技术,天线设计也更加复杂,金属机壳难以应对手机天线设计问题。这主要是因为金属的导电性,通讯设备在收讯或发讯时,产生的电磁场被导电的金属所囤积,从而影响通讯设备的RF性能以及ESD性能。
基于此,不导电真空电镀技术(NCVM)被广泛应用于手机及多种电子产品的表面。NCVM 是采用镀膜金属及绝缘化合物等薄膜,利用各项不连续之特性,得到最终外观有金属质感且不影响无线通讯传输之效果,其主要工艺流程为基材—底漆喷涂base coating —NCVM—(中漆喷涂)middle coating—面漆喷涂Top coating。其中底漆、中漆与面漆一般采用UV涂料,而中漆层视具体情况决定是否采用,主要起着色或改善性能的作用。
已有的NCVM工艺,大多都是用锡(Sn)靶或铟(In)靶作为NCVM工艺的主要靶材,其主要是利用Sn、In本身具有的低导电性的优势,但是其所呈现的金属光泽偏暖色系,金属光泽的颜色可选择性不多。为解决NCVM工艺得到的手机盖板颜色单调的问题,目前主流的彩色盖板制作途径是在中涂或面涂UV涂料中添加色浆。但加色浆后,涂层附着力会变差,因色浆会与UV紫外光起作用,色浆浓度越高,UV涂料对UV能量吸收越差,深层固化也较差,所以容易出现彩色中漆或面漆层和底漆层之间掉漆的现象。还有一种彩色盖板制作方法是在NCVM过程中充入气体,使气体与金属材料反应获得颜色,但受单层膜光学干涉规则的限制,很多颜色是无法获得的,所以这种方法制作的手机盖板颜色种类也很有限。
此外,由于UV涂层主要成分是有机物,易受氧气及水汽的侵蚀,导致不导电金属膜层的老化,从而造成NCVM层与UV涂层的结合力下降等问题。
发明内容
本发明的目的在于提供一种用于手机盖板的彩色不导电真空电镀膜及其制备方法,该电镀膜能够实现多种颜色的外观,并且膜系结合力强,抗老化、耐腐蚀。
本发明解决其技术问题所采用的技术方案是:
一种用于手机盖板的彩色不导电真空电镀膜,包括玻璃基板,玻璃基板顶面由下至上依次层叠有底漆层、缓冲层、NCVM层、彩色层与面漆层;
所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;所述彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层。
进一步的,所述缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛。
进一步的,所述第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁。
本发明还提供一种用于手机盖板的彩色不导电真空电镀膜的制备方法,包括以下步骤:
S1、清洗玻璃基板,去除玻璃基板表面的污垢;
S2、在玻璃基板顶面喷涂底漆层;
S3、采用等离子体对底漆层进行轰击,然后通过磁控溅射工艺在底漆层表面沉积缓冲层,所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;
S4、采用等离子体对缓冲层进行轰击,然后通过NCVM工艺在下介质层表面镀制NCVM层;NCVM层采用铟、锡、锌、钛、锆或是以上金属的合金;
S5、采用磁控溅射工艺在NCVM层表面沉积彩色层,彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层;
第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁;
S6、在彩色层表面喷涂面漆层,得到上述方案的彩色不导电真空电镀膜。
本发明的有益效果是,引入彩色层,通过第一折射膜层与第二折射膜层的层叠结构,并利用膜系材料的组成和膜层厚度的调整,使反射光产生干涉的波长不同,并同NCVM层相结合,从而获得各种颜色的不导电真空电镀膜;彩色层和缓冲层是致密的无机薄膜,可以防止NCVM层被氧气及水汽的侵蚀,从而起到保护NCVM层的作用;由于不采用色浆,同时通过用等离子体对底漆层进行轰击,并在底漆层表面沉积缓冲层,改善了膜层的平整度和表面张力,从而在镀制NCVM层时,增加了NCVM层与其它膜层的结合,保证了NCVM层的附着力。
附图说明
下面结合附图和实施例对本发明进一步说明:
图1是本发明的结构示意图;
图2是本发明彩色层的放大结构示意图。
具体实施方式
如图1所示,本发明提供一种用于手机盖板的彩色不导电真空电镀膜,包括玻璃基板1,玻璃基板1顶面由下至上依次层叠有底漆层2、缓冲层3、NCVM层4、彩色层5与面漆层6。
缓冲层3为单晶硅层、氮化物层、氮氧化物层或氧化物层;缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛。
结合图2所示,彩色层5是由第一折射膜层51与第二折射膜层52交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层。
当彩色层的层数为2层时,由下至上的层叠顺序为第一折射膜层/第二折射膜层,或者第二折射膜层/第一折射膜层;
当彩色层的层数为3层时,由下至上的层叠顺序为第一折射膜层/第二折射膜层/第一折射膜层,或者第二折射膜层/第一折射膜层/第二折射膜层;
当彩色层的层数为4层时,由下至上的层叠顺序为第一折射膜层/第二折射膜层/第一折射膜层/第二折射膜层,或者第二折射膜层/第一折射膜层/第二折射膜层/第一折射膜层。
第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁。
NCVM层采用铟、锡、锌、钛、锆或是以上金属的合金。
本发明还提供一种用于手机盖板的彩色不导电真空电镀膜的制备方法,包括以下步骤:
S1、清洗玻璃基板,去除玻璃基板表面的污垢;
S2、在玻璃基板顶面喷涂底漆层;
S3、采用等离子体对底漆层进行轰击,然后通过磁控溅射工艺在底漆层表面沉积缓冲层,所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;
S4、采用等离子体对缓冲层进行轰击,然后通过NCVM工艺在下介质层表面镀制NCVM层;NCVM层采用铟、锡、锌、钛、锆或是以上金属的合金;
S5、采用磁控溅射工艺在NCVM层表面沉积彩色层,彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层;
第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁;
S6、在彩色层表面喷涂面漆层,得到上述方案的彩色不导电真空电镀膜。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制;任何熟悉本领域的技术人员,在不脱离本发明技术方案范围情况下,都可利用上述揭示的方法和技术内容对本发明技术方案做出许多可能的变动和修饰,或修改为等同变化的等效实施例。因此,凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所做的任何简单修改、等同替换、等效变化及修饰,均仍属于本发明技术方案保护的范围内。

Claims (4)

1.一种用于手机盖板的彩色不导电真空电镀膜,其特征在于,包括玻璃基板,玻璃基板顶面由下至上依次层叠有底漆层、缓冲层、NCVM层、彩色层与面漆层;
所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;所述彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层。
2.根据权利要求1所述的一种用于手机盖板的彩色不导电真空电镀膜,其特征在于,所述缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛。
3.根据权利要求1所述的一种用于手机盖板的彩色不导电真空电镀膜,其特征在于,所述第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁。
4.一种用于手机盖板的彩色不导电真空电镀膜的制备方法,其特征在于,包括以下步骤:
S1、清洗玻璃基板,去除玻璃基板表面的污垢;
S2、在玻璃基板顶面喷涂底漆层;
S3、采用等离子体对底漆层进行轰击,然后通过磁控溅射工艺在底漆层表面沉积缓冲层,所述缓冲层为单晶硅层、氮化物层、氮氧化物层或氧化物层;缓冲层的氮化物为氮化碳、氮化硅、氮化钛或氮化铝,缓冲层的氮氧化物为氮氧化硅或氮氧化钛,所述缓冲层的氧化物为氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;
S4、采用等离子体对缓冲层进行轰击,然后通过NCVM工艺在下介质层表面镀制NCVM层;NCVM层采用铟、锡、锌、钛、锆或是以上金属的合金;
S5、采用磁控溅射工艺在NCVM层表面沉积彩色层,彩色层是由第一折射膜层与第二折射膜层交替层叠构成的复合膜层,彩色层的层数为2~4层;第一折射膜层的折射率大于第二折射膜层;
第一折射膜层采用氮化碳、氮化硅、氮化钛、氮化铝、氮氧化硅、氮氧化钛、氧化锆、氧化铝、氧化铌、氧化钽或氧化钛;第二折射膜层采用氮氧化硅、氧化硅或氟化镁;
S6、在彩色层表面喷涂面漆层,得到权利要求1所述的彩色不导电真空电镀膜。
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