CN112397436A - Wafer rotating device - Google Patents
Wafer rotating device Download PDFInfo
- Publication number
- CN112397436A CN112397436A CN202011374182.0A CN202011374182A CN112397436A CN 112397436 A CN112397436 A CN 112397436A CN 202011374182 A CN202011374182 A CN 202011374182A CN 112397436 A CN112397436 A CN 112397436A
- Authority
- CN
- China
- Prior art keywords
- wafer
- holes
- ring
- diameter
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 5
- 230000007704 transition Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 2
- 238000005086 pumping Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 4
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000003116 impacting effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 22
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
The invention discloses a wafer rotating device, wherein a wafer is arranged in a wafer frame to form a combined structure to be rotationally cleaned, and the device comprises: the driving mechanism provides a rotating shaft; the bottom center of the supporting disc is fixedly connected to the rotating shaft, the top of the supporting disc supports the combined structure, and the top is provided with an outer ring with the height lower than that of the center ring. The vacuum adsorption type cleaning device has the beneficial effects that the vacuum adsorption type cleaning device is applied, so that liquid backflow and splashing caused by liquid impacting a clamp during cleaning are avoided; the supporting surface at the top of the supporting disc is arranged, so that the cleaning solvent is better guided to exit under the dead weight; the cleaning efficiency is improved, and the damage of cleaning to the surface of the wafer is reduced.
Description
Technical Field
The invention belongs to the field of wafer production, and particularly relates to a wafer rotating device.
Background
Because the wafer is thin, it is necessary to use a wafer frame as a peripheral reinforcing mechanism during the processing of the wafer. In a process of cleaning by spraying a solvent on the surface of a wafer, the wafer is placed in a wafer frame, the wafer frame is fixed by a jig, and the jig is rotated at a high speed around a self-axis. The clamp is arranged on the outer edge of the wafer frame and has a partial structure higher than the wafer, so that when the solvent is emitted and touches the clamp, the liquid flows back and splashes, the cleaning efficiency is reduced on one hand, and the surface of the wafer is damaged at the other hand.
Disclosure of Invention
In some embodiments of the invention, a better liquid cleaning flow channel can be realized by a vacuumized adsorption mode and a slightly convex supporting surface.
In order to achieve the purpose, the invention adopts the following technical scheme:
a wafer rotation apparatus, the wafers being arranged in a wafer frame to form a composite structure to be rotationally cleaned, the apparatus comprising: the driving mechanism provides a rotating shaft; the bottom center of the supporting disc is fixedly connected to the rotating shaft, the top of the supporting disc supports the combined structure, and the top is provided with an outer ring with the height lower than that of the center ring.
Preferably, an inclined transition ring is arranged between the central ring and the outer ring.
Preferably, the transition ring is at an angle of less than 30 ° to the horizontal.
Preferably, an air chamber is arranged in the supporting disc, a plurality of through holes are formed in the top of the supporting disc, the through holes are communicated with the air chamber, and the air chamber is communicated with an external vacuumizing structure.
Preferably, the rotation shaft is hollow, and one end of the rotation shaft is communicated with the air chamber, and the other end of the rotation shaft is communicated with the vacuum-pumping structure.
Preferably, a plurality of circular first holes are uniformly distributed on the center ring.
Preferably, a plurality of arc-shaped second holes are uniformly distributed on the outer ring.
Preferably, the second bore comprises a first diameter bore and a second diameter bore, the first diameter being greater than the second diameter.
Preferably, adjacent first diameter holes and second diameter holes partially overlap angularly.
Compared with the prior art, the invention has the beneficial effects that: the application of a vacuum adsorption mode avoids liquid backflow and splashing caused by liquid impacting the clamp during cleaning; the supporting surface at the top of the supporting disc is arranged, so that the cleaning solvent can be better guided to exit under the dead weight; the cleaning efficiency is improved, and the damage of cleaning to the surface of the wafer is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view taken along line a-a in fig. 1.
FIG. 3 is a schematic cross-sectional view of a support plate as a main body.
Fig. 4 is a schematic oblique side plan view of the support plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
As shown in fig. 1-4, the present embodiment provides a wafer rotating apparatus, wherein a wafer is disposed in a wafer frame to form a combined structure to be rotationally cleaned, the apparatus comprising: the driving mechanism provides a rotating shaft 2; the bottom center fixed connection of supporting disk 1 is on axis of rotation 2, and the top of supporting disk 1 supports integrated configuration, and the top is provided with the outer loop 5 that highly is less than centre ring 4. The outer ring supports the outer wafer frame and the center ring supports the middle wafer.
An inclined transition ring 6 is arranged between the centre ring 4 and the outer ring 5.
The transition ring 6 is at an angle of less than 30 deg. to the horizontal.
Be provided with the air cavity in the supporting disk 1, the top is provided with a plurality of through-holes, through-hole and air cavity intercommunication, air cavity and outside evacuation structure 3 intercommunication.
The rotation shaft 2 is hollow, one end of the rotation shaft is communicated with the air cavity, and the other end of the rotation shaft is communicated with the vacuumizing structure 3.
A plurality of circular first holes 9 are uniformly distributed on the center ring 4.
A plurality of arc-shaped second holes are uniformly distributed on the outer ring 5.
The second holes include a first diameter hole 7 and a second diameter hole 8.
Adjacent first diameter holes 7 and second diameter holes 8 partially overlap in angle.
Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.
Claims (9)
1. A wafer rotation apparatus, wherein a wafer is disposed in a wafer frame to form a composite structure to be rotationally cleaned, the apparatus comprising:
the driving mechanism provides a rotating shaft;
the bottom center of the supporting disc is fixedly connected to the rotating shaft, the top of the supporting disc supports the combined structure, and the top is provided with an outer ring with the height lower than that of the center ring.
2. The wafer rotation apparatus of claim 1, wherein an inclined transition ring is disposed between the center ring and the outer ring.
3. The wafer rotation apparatus of claim 2, wherein the transition ring is at an angle of less than 30 ° to the horizontal.
4. The wafer rotation apparatus of claim 1, wherein an air chamber is disposed within the support plate, the top portion is provided with a plurality of through holes, the through holes are in communication with the air chamber, and the air chamber is in communication with an external vacuum pumping structure.
5. The wafer rotating apparatus according to claim 4, wherein the rotation shaft is hollow inside, and one end thereof is communicated with the air chamber and the other end thereof is communicated with the vacuum structure.
6. The wafer rotating apparatus according to claim 3, wherein the center ring has a plurality of circular first holes uniformly distributed therein.
7. The wafer rotating apparatus as claimed in claim 6, wherein the outer ring has a plurality of arc-shaped second holes uniformly distributed thereon.
8. The wafer rotation apparatus of claim 7, wherein the second hole comprises a first diameter hole and a second diameter hole, the first diameter being larger than the second diameter.
9. The wafer rotation apparatus of claim 8, wherein adjacent first diameter holes and second diameter holes partially overlap angularly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011374182.0A CN112397436A (en) | 2020-11-30 | 2020-11-30 | Wafer rotating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011374182.0A CN112397436A (en) | 2020-11-30 | 2020-11-30 | Wafer rotating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112397436A true CN112397436A (en) | 2021-02-23 |
Family
ID=74605584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011374182.0A Pending CN112397436A (en) | 2020-11-30 | 2020-11-30 | Wafer rotating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112397436A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871182A (en) * | 2022-05-27 | 2022-08-09 | 宁波润华全芯微电子设备有限公司 | Wafer cleaning device for liquid protection |
| CN115106339A (en) * | 2022-06-20 | 2022-09-27 | 苏州富强科技有限公司 | Wafer cleaning mechanism |
| CN117594514A (en) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195931A (en) * | 1998-12-24 | 2000-07-14 | Ntt Advanced Technology Corp | Wafer chuck and tilt angle measuring method |
| JP2003142384A (en) * | 2001-11-06 | 2003-05-16 | Tokyo Electron Ltd | Liquid treatment device and method therefor |
| CN101556904A (en) * | 2008-04-10 | 2009-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas distributor and semiconductor processing equipment applying same |
| JP2014237200A (en) * | 2013-06-10 | 2014-12-18 | 株式会社ディスコ | Chuck table and grinding/polishing device |
| CN104658947A (en) * | 2014-12-31 | 2015-05-27 | 上海新阳半导体材料股份有限公司 | Wafer cleaning device |
| CN105478391A (en) * | 2015-12-31 | 2016-04-13 | 上海新阳半导体材料股份有限公司 | Wafer cleaning apparatus |
| CN208315516U (en) * | 2018-06-25 | 2019-01-01 | 德淮半导体有限公司 | Wafer cleaning device |
-
2020
- 2020-11-30 CN CN202011374182.0A patent/CN112397436A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195931A (en) * | 1998-12-24 | 2000-07-14 | Ntt Advanced Technology Corp | Wafer chuck and tilt angle measuring method |
| JP2003142384A (en) * | 2001-11-06 | 2003-05-16 | Tokyo Electron Ltd | Liquid treatment device and method therefor |
| CN101556904A (en) * | 2008-04-10 | 2009-10-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas distributor and semiconductor processing equipment applying same |
| JP2014237200A (en) * | 2013-06-10 | 2014-12-18 | 株式会社ディスコ | Chuck table and grinding/polishing device |
| CN104658947A (en) * | 2014-12-31 | 2015-05-27 | 上海新阳半导体材料股份有限公司 | Wafer cleaning device |
| CN105478391A (en) * | 2015-12-31 | 2016-04-13 | 上海新阳半导体材料股份有限公司 | Wafer cleaning apparatus |
| CN208315516U (en) * | 2018-06-25 | 2019-01-01 | 德淮半导体有限公司 | Wafer cleaning device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871182A (en) * | 2022-05-27 | 2022-08-09 | 宁波润华全芯微电子设备有限公司 | Wafer cleaning device for liquid protection |
| CN114871182B (en) * | 2022-05-27 | 2023-08-04 | 宁波润华全芯微电子设备有限公司 | Wafer cleaning device for liquid protection |
| CN115106339A (en) * | 2022-06-20 | 2022-09-27 | 苏州富强科技有限公司 | Wafer cleaning mechanism |
| CN117594514A (en) * | 2024-01-18 | 2024-02-23 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
| CN117594514B (en) * | 2024-01-18 | 2024-04-30 | 天津中科晶禾电子科技有限责任公司 | Wafer clamp, wafer clamping method and wafer cleaning equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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