CN112389039A - 一种高强度、高韧性层状复相陶瓷的制备方法 - Google Patents
一种高强度、高韧性层状复相陶瓷的制备方法 Download PDFInfo
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Abstract
本发明公开一种高强度、高韧性层状复相陶瓷的制备方法,包括以下具体步骤:将陶瓷基体粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成基体层陶瓷浆料;将界面层粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成界面浆料;本发明利用流延叠层技术、界面层打孔、温压成型及热压烧结相结合的工艺制备出层状复相陶瓷具有高韧性、高强度。
Description
技术领域
本发明涉及陶瓷制备技术领域,具体讲是一种高强度、高韧性层状复相陶瓷的制备方法。
背景技术
陶瓷材料具有高硬度、高强度、高耐磨性、低热膨胀系数以及优异的化学稳定性,使其广泛应用于装甲防护、石油化工、钢铁冶金、机械电子、航空航天等工业领域。但是常规的陶瓷材料的在冲击过程极易发生碎裂,造成材料的失效,其原因是由于裂纹在陶瓷材料内部极其容易发生扩展。通过向陶瓷材料中引入层状界面层,是提高陶瓷材料韧性及抗冲击性的主要途径之一,层状界面层的引入使得裂纹在陶瓷材料中的扩展路径发生改变,改变为沿着层间扩展,从而裂纹不会贯穿整个坯体,使得材料的韧性提高,抗冲击性能得到改善。
目前层状结构复相陶瓷的制备方法一般都是通过引入界面层的方法制备层状陶瓷,界面层成分与基体层有较大的差异,为了使得层状陶瓷具有较高的韧性,使得裂纹扩展方向沿着界面层方向,通常是界面层与基体的结合强度不会很高,这种结构虽然使得坯体获得了较高的韧性,但是却极大的降低坯体的强度及弹性模量。
公开号为CN 110156486 A高韧性层状防弹陶瓷材料及流延法结合热压烧结法的制备方法,其采用流延法结合热压烧结法制备出层状防弹陶瓷材料,界面层选用BN或石墨等材料,所制备出的材料具有高的韧性,采用BN、石墨材质使得基体层结合强度降低,从而裂纹能沿着基体层扩展,大幅提高了层状陶瓷的韧性,但是也因此使得材料的基体层的强度及弹性模量大幅降低。
公开号为CN 109111231 A一种碳化硼/碳化硅层状复合陶瓷材料的制备方法采用凝胶注模法在模具中交替浇注基体层和分隔层陶瓷浆料的固化后的坯体,然后通过热压烧结技术得到层状结构陶瓷。这种工艺中提到层间都采用碳化硼、碳化硅这种相对较“硬”的材质,这样使得碳化硼层与碳化硅层具有较高的结合强度,这使得其不会对材质的强度有明显的降低,但是这种结构使得裂纹扩展并不会沿着层间出现明显的延伸现象,材料本身韧性并不会有明显的提升。
发明内容
基于以上层状结构复相陶瓷的制备技术中基体强度的维持与层状结构的韧性的提高很难兼顾的问题,本发明提出了一种利用流延叠层技术、界面层打孔、温压成型及热压烧结相结合的工艺制备出一种高韧性、高强度的层状复相陶瓷的方法。
主要内容是先通过流延工艺制备出的层状陶瓷片为单元,薄片成型基于流延成型,但不限于流延,可以是其他方法成型薄片。通过对界面层流延带激光切割或冲压工艺形成一种多孔结构,然后根据材料设计要求进行叠层、低温加热加压成型、然后再进行热压烧结制备出所需的高强度、高韧性的层状复相陶瓷。利用网状结构的界面层结合加热加压成型、热压烧结工艺,使得层状复相陶瓷的基体层与基体层之间不会完全被界面层隔开,而是在多孔结构处形成了基体层与基体层烧结在一起、非孔部位形成基体、界面层相结合的结构,是一种类似“桁架结构”的复相材料,这种结构使得所制备出的复相陶瓷在提高了陶瓷的韧性的同时又保持了基体层的强度,是一种高强度、高韧性、高弹性模量复相陶瓷的制备方法。
本发明的技术解决方案如下:一种高强度、高韧性层状复相陶瓷的制备方法,包括以下具体步骤:
1)将陶瓷基体粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成基体层陶瓷浆料;
2)将界面层粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成界面浆料;
3)分别将陶瓷浆料、界面浆料进行流延成型得到所需厚度的陶瓷流延卷与界面流延卷,然后裁剪成所需的陶瓷流延片、界面层流延片;
4)对界面层流延片进行打孔处理,形成界面层流延片;
5)根据层状复相陶瓷的结构设计,分别将一定层数陶瓷流延片与多孔界面层流延片交替叠层、边角对齐,然后置于具有加热功能的压机模具中,施加一定的压力得到素坯,由于流延片中大量有机物的存在,在一定温度下使得流延片软化,在压力的作用下,流延片在压力的作用下相互靠近,使得层与层之间的间隙降低,界面层打孔位置由于流延片的软化,使得界面层上下的基体在打孔位置紧密结合在一起,初始阶段此位置相比未打孔位置会出现明显凹陷,但是随着加压时间的延长,基体层其他位置的料会在压力的作用下填平打孔所形成的厚度差值,最终压制的素坯表面趋于平整;
6)对素坯进行脱蜡,然后置于热压烧结炉中进行烧结、冷却降温得到层状复相陶瓷。
步骤1)所述的陶瓷基体粉体为碳化硅、碳化硼、氮化硅、氧化铝、氧化锆中的一种或多种混合。
步骤1)和步骤2)所述的烧结助剂为炭黑、金属硅、金属硼、碳化钛、碳化硅、碳化硼、氧化铝、氧化钇、氧化镁等中的一种多种混合。
步骤2)所述的界面层粉体为氮化硼、石墨、氧化铝、氧化锆、氮化硅(基体)中的一种或多种混合,但是界面层粉体所用粉体类型要与陶瓷基体粉体所用粉体类型不同。
步骤1)和步骤2)所述的粘结剂为酚醛树脂、呋喃树脂、环氧树脂、木质素磺酸钠、聚乙烯醇、聚乙烯醇缩丁醛、羟丙基甲基纤维素中的一种或多种。
步骤1)和步骤2)所述的改性剂为石墨烯、碳纤维、碳纳米管、碳化硅纤维、碳化硅晶须中的一种或多种。
步骤1)和步骤2)所述的分散剂为鲱鱼油、蓖麻油、聚乙烯醇、磷酸三乙酯、BYK-160中的一种;所述的塑化剂为邻苯二甲酸二甲酯、邻苯二甲酸二丁酯、邻苯二甲酸二辛酯、甘油、聚乙二醇、环氧大豆油、已二酸二辛酯中的一种或几种;溶剂为去离子水、无水乙醇、正丁醇、正辛醇、丁酮、三氯乙烯、甲苯、二甲苯中的一种或几种;所述的消泡剂为正丁醇、硅油中的一种;
步骤1)中所述陶瓷浆料各组分以重量份计的组成为:陶瓷基体粉体70-100份、烧结助剂0.5~20份,改性剂0.1-20份、分散剂0.1-20份、粘结剂1-18份、溶剂70-700份、增塑剂1-20份、消泡剂0.001-5份。
步骤2)中所述界面浆料各组分以重量份计的组成为:界面层粉体70-100份、烧结助剂0.5~20份、改性剂0.1-20份、分散剂0.1-20份、粘结剂1-18份、溶剂70-700份、增塑剂1-20份、消泡剂0.001-5份。
步骤4)所述的界面层流延片打孔的形状为圆形、方形、菱形、椭圆形中的一种;所述的孔的孔径为0.1~10mm,孔与孔的中心间距为0.2~20mm;孔的面积占整个界面层流延片的20~80%。
步骤3)所述的陶瓷流延片的厚度为0.05~5mm;界面层流延片厚度为0.05~2mm。
步骤5)所述的陶瓷流延片与界面层流延片的层数比为1~100;成型压力为5~200MPa;所述的素坯的最终厚度为1~100mm。
步骤6)所述的热压烧结温度为1400~2200℃、热压压力为2~50MPa。
步骤6)最终层状复相陶瓷的基体层与未打孔界面层具有明显差异,而在界面层原打孔位置则基体层与基层直接结合的结构,从而基体层与界面层之间呈现出基体层直接结合与界面层交替过度的状态,这种界面结构使得坯体不但具有高的韧性,同时基体层的强度也不会降低。
本发明的有益效果是:采用以上步骤制备的层状复相陶瓷结构具有以下优点:a)采用温压及热压工艺使得界面层打孔位置的上下基体层能紧密紧密结合,形成均质结构;b)利用流延片具有大量的有机高分子,在低温加热过程种具有较高的流动性,使得打孔位置因压制形成的凹坑能通过其他位置粉料得以补充;c)采用这种打孔结构使得界面层由之前的连续相变为非连续相;d)这种结构所制备材料使得裂纹扩展沿着界面层未打孔位置进行扩展,但因为界面层打孔位置基体层的连通,使得基体层不会快速沿着界面层扩展开;e)最终这种层状复相陶瓷,根据孔占界面层的面积大小,使得材料在韧性、强度及弹性模量等性能具有可调性,陶瓷能实现高韧性,同时又具有较高的强度及弹性模量。
具体实施方式
下面用具体实施例对本发明做进一步详细说明,但本发明不仅局限于以下具体实施例。
实施例1
(1)将98份的碳化硅粉体、2份的碳化硼、0.5份四甲基氢氧化铵、20份聚乙烯醇、10份的丙三醇、50份的去离子水、0.05份正辛醇混合后加入球磨桶中,同时加入200份的碳化硅球磨介质球磨24h,然后将球磨后的浆料在真空除泡机中进行真空除泡60min制备成基体层陶瓷浆料;
(2)将80份的氮化硼粉体、19份碳化硅粉体、1份碳化硼粉体、0.5份聚丙烯酸铵、20份聚乙烯醇、10份的丙三醇、50份的去离子水、0.05份正辛醇混合后加入球磨桶中,同时加入200份的碳化硅球磨介质球磨24h,然后将球磨后的浆料在真空除泡机中进行真空除泡60min制备成界面层陶瓷浆料;
(3)将基体层陶瓷浆料进行流延成型得到基体陶瓷流延卷,然后将其裁剪成199.5x199.5mm方形流延片,其中流延片层厚0.2mm;将界面层陶瓷浆料进行流延成型得到界面层陶瓷流延卷,然后将其裁剪成199.5x199.5方形流延片,其中界面层流延片厚为0.05mm;
(4)将界面层流延片进行激光切割成所需的均匀分布分孔结构,其中孔的形状为圆形、直径5mm、孔面积为界面层面积的20%;
(5)根据层状复合陶瓷的结构设计,基体层与界面层的层数比为10:1,上下选用基体层;将10片基体层流延与1片界面层流延片逐层叠层,选用50片基体流延片逐层叠层,放置于200x200mm方形模具中,然后在具有加热功能的压机上进行成型,其中加热温度为80℃、成型压力为30MPa,得到所需的层状陶瓷坯体,其厚度为20mm;
(6)将压制好的层状陶瓷素坯在脱蜡炉中真空气氛下缓慢升温到900℃进行脱蜡、冷却得到层状陶瓷素坯;然后将素坯装入热压模具中进行热压烧结,其中烧结温度为1950℃、保温时间为1小时,热压压力为25MPa,冷却脱模得到所需的层状陶瓷制品;
(7)取截面观察,所制备出的层状结构与常规的层状结构有明显的区别,界面层出现不连续的现象,基体层上下呈现连通结构,测量所制备出试样的韧性达到7.8MPa·m1/2、弯曲强度为600MPa、弹性模量400GPa。对比去掉BN界面层基体材料弯曲强度有750MPa、断裂韧性只有4MPa·m1/2、弹性模量440GPa;而连续BN界面层材料的断裂韧性达到8MPa·m1/2、而弯曲强度只有350MPa、弹性模量300GPa。
实施例2
(1)将98份的碳化硅粉体、2份的碳化硼、0.5份四甲基氢氧化铵、20份聚乙烯醇、10份的丙三醇、50份的去离子水、0.05份正辛醇混合后加入球磨桶中,同时加入200份的碳化硅球磨介质球磨24h,然后将球磨后的浆料在真空除泡机中进行真空除泡60min制备成基体层陶瓷浆料;
(2)将80份的氮化硼粉体、19份碳化硅粉体、1份碳化硼粉体、0.5份聚丙烯酸铵、20份聚乙烯醇、10份的丙三醇、50份的去离子水、0.05份正辛醇混合后加入球磨桶中,同时加入200份的碳化硅球磨介质球磨24h,然后将球磨后的浆料在真空除泡机中进行真空除泡60min制备成界面层陶瓷浆料;
(3)将基体层陶瓷浆料进行流延成型得到基体陶瓷流延卷,然后将其裁剪成199.5x199.5mm方形流延片,其中流延片层厚0.2mm;将界面层陶瓷浆料进行流延成型得到界面层陶瓷流延卷,然后将其裁剪成199.5x199.5方形流延片,其中界面层流延片厚为0.05mm;
(4)将界面层流延片进行激光切割成所需的均匀分布分孔结构,其中孔的形状为圆形、直径5mm、孔面积为界面层面积的70%;
(5)根据层状复合陶瓷的结构设计,基体层与界面层的层数比为10:1,上下选用基体层;将10片基体层流延与1片界面层流延片逐层叠层,选用50片基体流延片逐层叠层,放置于200x200mm方形模具中,然后在具有加热功能的压机上进行成型,其中加热温度为80℃、成型压力为30MPa,得到所需的层状陶瓷坯体,其厚度为20mm;
(6)将压制好的层状陶瓷素坯在脱蜡炉中真空气氛下缓慢升温到900℃进行脱蜡、冷却得到层状陶瓷素坯;然后将素坯装入热压模具中进行热压烧结,其中烧结温度为1950℃、保温时间为1小时,热压压力为25MPa,冷却脱模得到所需的层状陶瓷制品;
(7)取截面观察,所制备出的层状结构与常规的层状结构有明显的区别,界面层出现不连续的现象,基体层上下呈现连通结构,测量所制备出试样的韧性达到6 MPa·m1/2、弯曲强度为700MPa、弹性模量420GPa。
以上仅是本发明的特征实施范例,对本发明保护范围不构成任何限制。凡采用同等交换或者等效替换而形成的技术方案,均落在本发明权利保护范围之内。
Claims (10)
1.一种高强度、高韧性层状复相陶瓷的制备方法,其特征在于,包括以下具体步骤:
1)将陶瓷基体粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成基体层陶瓷浆料;
2)将界面层粉体、烧结助剂、改性剂、分散剂、粘结剂、溶剂、增塑剂、消泡剂混合均匀并球磨1~48h,然后将球磨后的浆料在真空除泡机中进行真空除泡10~180min制备成界面浆料;
3)分别将陶瓷浆料、界面浆料进行流延成型得到所需厚度的陶瓷流延卷与界面流延卷,然后裁剪成所需的陶瓷流延片、界面层流延片;
4)对界面层流延片进行打孔处理,形成界面层流延片;
5)根据层状复相陶瓷的结构设计,分别将一定层数陶瓷流延片与多孔界面层流延片交替叠层、边角对齐,然后置于具有加热功能的压机模具中,施加一定的压力得到素坯,由于流延片中大量有机物的存在,在一定温度下使得流延片软化,在压力的作用下,流延片在压力的作用下相互靠近,使得层与层之间的间隙降低,界面层打孔位置由于流延片的软化,使得界面层上下的基体在打孔位置紧密结合在一起,初始阶段此位置相比未打孔位置会出现明显凹陷,但是随着加压时间的延长,基体层其他位置的料会在压力的作用下填平打孔所形成的厚度差值,最终压制的素坯表面趋于平整;
6)对素坯进行脱蜡,然后置于热压烧结炉中进行烧结、冷却降温得到层状复相陶瓷。
2.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)所述的陶瓷基体粉体为碳化硅、碳化硼、氮化硅、氧化铝、氧化锆中的一种或多种混合。
3.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)和步骤2)所述的烧结助剂为炭黑、金属硅、金属硼、碳化钛、碳化硅、碳化硼、氧化铝、氧化钇、氧化镁等中的一种多种混合。
4.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤2)所述的界面层粉体为氮化硼、石墨、氧化铝、氧化锆、氮化硅(基体)中的一种或多种混合,界面层粉体与陶瓷基体粉体所用粉体类型不同。
5.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)和步骤2)所述的粘结剂为酚醛树脂、呋喃树脂、环氧树脂、木质素磺酸钠、聚乙烯醇、聚乙烯醇缩丁醛、羟丙基甲基纤维素中的一种或多种。
6.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)和步骤2)所述的改性剂为石墨烯、碳纤维、碳纳米管、碳化硅纤维、碳化硅晶须中的一种或多种。
7.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)和步骤2)所述的分散剂为鲱鱼油、蓖麻油、聚乙烯醇、磷酸三乙酯、BYK-160中的一种;所述的塑化剂为邻苯二甲酸二甲酯、邻苯二甲酸二丁酯、邻苯二甲酸二辛酯、甘油、聚乙二醇、环氧大豆油、已二酸二辛酯中的一种或几种;所述溶剂为去离子水、无水乙醇、正丁醇、正辛醇、丁酮、三氯乙烯、甲苯、二甲苯中的一种或几种;所述的消泡剂为正丁醇、硅油中的一种。
8.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤1)中所述陶瓷浆料各组分以重量份计的组成为:陶瓷基体粉体70-100份、烧结助剂0.5~20份,改性剂0.1-20份、分散剂0.1-20份、粘结剂1-18份、溶剂70-700份、增塑剂1-20份、消泡剂0.001-5份。
9.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤2)中所述界面浆料各组分以重量份计的组成为:界面层粉体70-100份、烧结助剂0.5~20份、改性剂0.1-20份、分散剂0.1-20份、粘结剂1-18份、溶剂70-700份、增塑剂1-20份、消泡剂0.001-5份。
10.根据权利要求1所述的高强度、高韧性层状复相陶瓷的制备方法,其特征在于,步骤3)所述的陶瓷流延片的厚度为0.05~5mm;界面层流延片厚度为0.05~2mm;步骤5)所述的陶瓷流延片与界面层流延片的层数比为1~100;成型压力为5~200MPa;所述的素坯的最终厚度为1~100mm;步骤6)所述的热压烧结温度为1400~2200℃、热压压力为2~50MPa。
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