CN112368336A - 树脂组合物、其固化膜 - Google Patents

树脂组合物、其固化膜 Download PDF

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Publication number
CN112368336A
CN112368336A CN201980040304.1A CN201980040304A CN112368336A CN 112368336 A CN112368336 A CN 112368336A CN 201980040304 A CN201980040304 A CN 201980040304A CN 112368336 A CN112368336 A CN 112368336A
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group
polysiloxane
resin composition
carbon atoms
mass
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CN201980040304.1A
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Chinese (zh)
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日比野利保
的羽良典
诹访充史
藤井真实
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Toray Industries Inc
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Toray Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201980040304.1A 2018-08-31 2019-08-22 树脂组合物、其固化膜 Pending CN112368336A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-162721 2018-08-31
JP2018162721 2018-08-31
PCT/JP2019/032782 WO2020045214A1 (ja) 2018-08-31 2019-08-22 樹脂組成物、その硬化膜

Publications (1)

Publication Number Publication Date
CN112368336A true CN112368336A (zh) 2021-02-12

Family

ID=69644341

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980040304.1A Pending CN112368336A (zh) 2018-08-31 2019-08-22 树脂组合物、其固化膜

Country Status (5)

Country Link
JP (1) JP7327163B2 (ja)
KR (1) KR20210052431A (ja)
CN (1) CN112368336A (ja)
TW (1) TW202020024A (ja)
WO (1) WO2020045214A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220155319A (ko) * 2020-03-16 2022-11-22 샌트랄 글래스 컴퍼니 리미티드 조성물, 조성물 전구체의 용액, 조성물의 제조 방법, 다층막을 가지는 기판, 및 패턴을 가지는 기판의 제조 방법
WO2022131278A1 (ja) * 2020-12-15 2022-06-23 セントラル硝子株式会社 光学部材用の塗布液、重合体、硬化膜、感光性塗布液、パターン硬化膜、光学部材、固体撮像素子、表示装置、ポリシロキサン化合物、塗布液に用いる安定化剤、硬化膜の製造方法、パターン硬化膜の製造方法、及び重合体の製造方法
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法
CN116107163A (zh) * 2022-12-28 2023-05-12 上海玟昕科技有限公司 一种含纳米粒子的正性光刻胶组合物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101546127A (zh) * 2008-03-24 2009-09-30 Jsr株式会社 感射线性树脂组合物以及层间绝缘膜和微透镜的制造方法
CN101595424A (zh) * 2007-02-01 2009-12-02 东京应化工业株式会社 液晶显示元件用平坦化绝缘膜形成用组合物以及液晶显示元件用平坦化绝缘膜的制造方法
CN102472964A (zh) * 2009-09-29 2012-05-23 东丽株式会社 正型感光性树脂组合物、使用其的固化膜及光学设备
CN102870047A (zh) * 2010-04-28 2013-01-09 Jsr株式会社 正型感射线性组合物、显示元件用层间绝缘膜及其形成方法
TW201439109A (zh) * 2013-01-21 2014-10-16 Central Glass Co Ltd 含六氟異丙醇基之矽化合物及其製造方法、以及其聚合而成之高分子化合物
CN105122137A (zh) * 2013-03-28 2015-12-02 东丽株式会社 感光性树脂组合物、保护膜或绝缘膜、触摸面板及其制造方法
CN105706000A (zh) * 2013-11-01 2016-06-22 中央硝子株式会社 正型感光性树脂组合物、使用了它的膜的制造方法以及电子部件

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JP4488215B2 (ja) 2004-08-19 2010-06-23 信越化学工業株式会社 レジスト組成物並びにこれを用いたパターン形成方法
JP5560518B2 (ja) 2005-09-28 2014-07-30 東レ株式会社 熱硬化性樹脂組成物
JP5648518B2 (ja) 2011-02-10 2015-01-07 Jsr株式会社 ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
JP6201280B2 (ja) 2011-03-30 2017-09-27 東レ株式会社 シロキサン系樹脂組成物の製造方法、それを用いた硬化膜、光学物品および固体撮像素子の製造方法
JP5830978B2 (ja) 2011-07-04 2015-12-09 東レ株式会社 シロキサン系樹脂組成物およびその製造方法、それを硬化してなる硬化膜ならびにそれを有する光学物品および固体撮像素子
CN110095941B (zh) 2011-12-26 2023-02-17 东丽株式会社 感光性树脂组合物和半导体元件的制造方法
JP6318634B2 (ja) 2013-02-14 2018-05-09 東レ株式会社 感光性シロキサン組成物、硬化膜及び素子
JP2015017195A (ja) 2013-07-11 2015-01-29 日産化学工業株式会社 固体撮像素子用リフロー型高屈折率膜形成組成物
JP6358416B2 (ja) 2013-07-11 2018-07-18 日産化学工業株式会社 アルコキシシリル基を含有する固体撮像素子用高屈折率膜形成組成物
CN111801621A (zh) * 2018-02-28 2020-10-20 中央硝子株式会社 含硅层形成组合物和使用其制造带图案的基板的方法

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CN101595424A (zh) * 2007-02-01 2009-12-02 东京应化工业株式会社 液晶显示元件用平坦化绝缘膜形成用组合物以及液晶显示元件用平坦化绝缘膜的制造方法
CN101546127A (zh) * 2008-03-24 2009-09-30 Jsr株式会社 感射线性树脂组合物以及层间绝缘膜和微透镜的制造方法
CN102472964A (zh) * 2009-09-29 2012-05-23 东丽株式会社 正型感光性树脂组合物、使用其的固化膜及光学设备
CN102870047A (zh) * 2010-04-28 2013-01-09 Jsr株式会社 正型感射线性组合物、显示元件用层间绝缘膜及其形成方法
TW201439109A (zh) * 2013-01-21 2014-10-16 Central Glass Co Ltd 含六氟異丙醇基之矽化合物及其製造方法、以及其聚合而成之高分子化合物
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CN105706000A (zh) * 2013-11-01 2016-06-22 中央硝子株式会社 正型感光性树脂组合物、使用了它的膜的制造方法以及电子部件

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JP7327163B2 (ja) 2023-08-16
TW202020024A (zh) 2020-06-01
JPWO2020045214A1 (ja) 2021-08-10
KR20210052431A (ko) 2021-05-10
WO2020045214A1 (ja) 2020-03-05

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