CN112318970A - 一种玻璃纤维增强含氟聚合物电路层压板结构 - Google Patents

一种玻璃纤维增强含氟聚合物电路层压板结构 Download PDF

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CN112318970A
CN112318970A CN202011287010.XA CN202011287010A CN112318970A CN 112318970 A CN112318970 A CN 112318970A CN 202011287010 A CN202011287010 A CN 202011287010A CN 112318970 A CN112318970 A CN 112318970A
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冯贝贝
李强
张立欣
王丽婧
赖占平
庞子博
张海涛
李攀
刘正
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CETC 46 Research Institute
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Abstract

本发明公开了一种玻璃纤维增强含氟聚合物电路层压板结构。该结构自上而下顺序包括上导电层、介电材料层和下导电层，所述的介电材料层包括至少为两层的增强层和至少为一层的浸渍层，即至少每两层增强层与一层浸渍层交错叠加，每两层增强层将一层浸渍层夹在中间。本发明提供了一种结合现有材料优异性能的新型结构电路层压板，其具有更优异的尺寸稳定性，电气性能和用于细线电路的光滑表面，其还表现出导电层和介电材料层间较强的粘合性能，本设计结构满足层压板玻璃强度以及能够承受高温环境性能的技术要求。

Description

一种玻璃纤维增强含氟聚合物电路层压板结构
技术领域
本发明涉及微波复合介质基板技术，具体涉及一种玻璃纤维增强含氟聚合物电路层压板结构。
背景技术
随着通信领域的不断发展，电路层压板的需求越来越大，要求也越来越高。传统的电路层压板在加工过程中都会发生尺寸变化，这些变化是电路板在后加工去除金属箔层时的应力释放或蚀刻溶液导致的。因而考虑向聚合物体系中添加增强纤维相，以此来减小加工过程中尺寸变化，提高尺寸稳定性。
常见的玻璃增强的含氟聚合物层压板有三种类型。含氟物以聚四氟乙烯（PTFE），玻璃增强含氟聚合物以介电常数2.00为例，第一种类型是玻璃随机纤维增强的PTFE介电材料具有优异的电气性能和光滑的表面，其介电常数约为2.20-2.33，可生产微波应用中所需的细线电路，但其尺寸稳定性非常差。第二种类型是使用PTFE浸渍玻璃纤维布生产的层压材料，其介电常数约为2.40-2.60，该材料通常具有比第一种类型层压板更好的尺寸稳定性，但损耗因子较高。第三种类型是含氟聚合物材料，即未增强PTFE和PTFE浸渍的玻璃纤维布交叠层的复合材料，其介电常数约为2.17。与第一种类型相比，其介电常数较低，损耗因子低，尺寸稳定性高。但由于存在未增强的PTFE层，层压板与导电箔结合性差且层与层间存在分层现象，导致层压板玻璃强度低，不能够承受高温环境。虽然所有类型的含氟聚合物电路材料都具有某些优点和可取特性，但均存在一定的局限性和缺点。目前除了生产技术问题，还未发现一种玻璃增强的含氟聚合物能够只获得复合材料优良特性而没有其劣势，因而难题仍需探讨。
发明内容
针对现有技术存在的问题，本发明的目的是提供一种玻璃纤维增强含氟聚合物电路层压板结构，该结构由玻璃纤维增强的含氟聚合物与含氟聚合物浸渍的编织纤维布一层或多层相互夹杂组成。
本发明采取的技术方案是：一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述结构自上而下顺序包括上导电层、介电材料层和下导电层，所述的介电材料层包括至少为两层的增强层和至少为一层的浸渍层，即至少每两层增强层与一层浸渍层交错叠加，每两层增强层将一层浸渍层夹在中间，其中增强层由一层或多层玻璃纤维增强的含氟聚合物构成，浸渍层由一层或多层含氟聚合物浸渍的编织纤维布构成。
所述介电材料层包括两层增强层和第一浸渍层，两层增强层分别为第一增强层和第二增强层，所述结构自上而下顺序为上导电层、第一增强层、第一浸渍层、第二增强层，介电材料层和下导电层。
所述介电材料层还包括两层粘结层，分别为上粘接层和下粘接层，所述结构自上而下顺序为上导电层、上粘接层、第一增强层、第一浸渍层、第二增强层下粘接层和下导电层。
所述介电材料层还包括第二浸渍层和第三增强层，所述结构自上而下顺序为上导电层、上粘接层、第一增强层、第一浸渍层、第二增强层、第二浸渍层、第三增强层、下粘接层和下导电层。
所述的介电材料层总厚度在0.003-0.500 inch范围内。
所述增强层介电常数为2.20-2.94，增强层总厚度为0.006-0.055inch，其中玻璃纤维直径为0.3-0.7um，长度小于5000um。
所述浸渍层总厚度占介电材料层总厚度的10-60%。
所述含氟聚合物浸渍的编织纤维布的编织样式编号为1080、108、106、112中任意一种，其中含氟聚合物占纤维布质量的30-85%。
所述粘结层总厚度在0.0005-0.004inch范围内。
所述导电层选用导电箔或电阻箔任意一种。
本发明所产生的有益效果是：本发明提供了一种结合现有材料优异性能的新型结构电路层压板，其具有更优异的尺寸稳定性，电气性能和用于细线电路的光滑表面，其还表现出导电层和介电材料层间较强的粘合性能，本设计结构满足层压板玻璃强度以及能够承受高温环境性能的技术要求。
附图说明
图1是本发明实施例1的电路层压板叠层示意图；
图2是本发明实施例2的电路层压板叠层示意图；
图3是本发明实施例3的电路层压板叠层示意图。
具体实施方式
以下结合实施例和附图对本发明作进一步说明：
实施例1：
如图1所示，自上而下结构顺序为：上导电层2、第一增强层3、第一浸渍层4、第二增强层5、下导电层6；此实施例结构的介电材料层1包括一对增强层，即第一增强层3和第二增强层5，将第一浸渍层4夹在中间。介电材料总厚度为0.009inch，增强层介电常数为2.20，增强层总厚度为0.006inch，即两侧各0.003inch。浸渍层为含氟聚合物浸渍的编织纤维，是涂覆了PTFE的市售机织玻璃织物，即PTFE浸渍玻璃纤维布，浸渍层厚度为0.003inch，采用编号为1080织法。涂覆的PTFE占PTFE浸渍玻璃纤维布质量的76 wt.%，其余为E玻璃纤维。上导电层2使用的是商用Ohmega电阻箔，它由镀在铜箔上的电阻层组成。下导电层的导电箔采用铜箔，其是符合# IPC-CE-150E规格的电沉积箔，厚度约为0.0014inch。将以上各层在温度300℃、压力10 MPa下热压烧结150 min得到的电路层压板进行性能测试，其介电常数为2.215，损耗因子为0.00109，剥离强度为10.98，尺寸稳定性（经向：0.52mm/m；纬向：0.42mm/m）。
实施例2：
如图2所示，自上而下结构顺序为：上导电层2、上粘接层7、第一增强层3、第一浸渍层4、第二增强层5、下粘接层8、下导电层6；此实施例结构的介电材料层1包括上粘接层7、第一增强层3、浸渍层4、第二增强层5和下粘接层8，第一增强层3和第二增强层5将第一浸渍层4夹在中间；上粘接层7和下粘接层8分别紧挨上导电层2和下导电层6。介电材料总厚度为0.020inch，增强层介电常数为2.55，其中玻璃纤维直径为0.5um，长度约为1000um，厚度为0.015inch，即两侧各0.075inch。浸渍层是涂覆了PTFE的市售机织玻璃织物，采用编号为1080织法，厚度为0.003inch。涂覆的PTFE占PTFE浸渍玻璃纤维布的76 wt.%，其余为E玻璃纤维。粘结层是商用0.001inch的PTFE粘合膜，这些膜是100%PTFE（无玻璃或其他增强材料），粘结层厚度为0.002inch（上下两层）。上导电层使用的是商用Ohmega电阻箔，它由镀在铜箔上的电阻层组成。下导电层的导电箔采用铜箔，其是符合# IPC-CE-150E规格的电沉积箔，厚度约为0.0014inch。将以上各层在温度300 ℃、压力10 MPa下热压烧结150 min得到的电路层压板进行性能测试，其介电常数为2.215，损耗因子为0.00104，剥离强度为11.13，尺寸稳定性（经向：0.50mm/m；纬向：0.39mm/m）。
实施例3：
如图3所示，自上而下结构顺序为：上导电层2、上粘接层7、第一增强层3、第一浸渍层4、第二增强层5、第二浸渍层9、第三增强层10、下粘接层8和下导电层6；此实施例结构的介电材料层1包括上粘接层7、第一增强层3、第一浸渍层4、第二增强层5、第二浸渍层9、第三增强层10和下粘接层8，第一增强层3和第二增强层5将第一浸渍层4夹在中间；第二增强层5和第三增强层10将第二浸渍层9夹在中间。介电材料层1的总厚度为0.062inch，增强层介电常数为2.55，增强层总厚度为0.052inch。浸渍层是涂覆了PTFE的市售机织玻璃织物，采用编号为1080织法，总厚度为0.006inch（即两层）。涂覆的PTFE占PTFE浸渍玻璃纤维布的76 wt.%，其余为E玻璃纤维。粘结层是商用0.002inch的PTFE粘合膜，这些膜是100%PTFE（无玻璃或其他增强材料）。粘结层总厚度为0.004inch（上下两层）。上导电层使用的是商用Ohmega电阻箔，它由镀在铜箔上的电阻层组成。下导电层的导电箔采用铜箔，其是符合# IPC-CE-150E规格的电沉积箔，厚度约为0.0014inch。将以上各层在温度300 ℃、压力10 MPa下热压烧结150 min得到的电路层压板进行性能测试，其介电常数为2.012，损耗因子为0.00102，剥离强度为12.34，尺寸稳定性（经向：0.25mm/m；纬向：0.18mm/m）。
本结构根据对电路层压板的不同性能要求进行设计。结合浸渍层的尺寸稳定性和增强层的层间结合强度高和耐高温优势，与导电层结合能够承受较高环境温度和加工温度。本设计结构满足电路层压板玻璃强度以及能够承受高温环境性能的技术要求。

Claims (10)

1.一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述结构自上而下顺序包括上导电层、介电材料层和下导电层，所述的介电材料层包括至少为两层的增强层和至少为一层的浸渍层，即至少每两层增强层与一层浸渍层交错叠加，每两层增强层将一层浸渍层夹在中间，其中增强层由一层或多层玻璃纤维增强的含氟聚合物构成，浸渍层由一层或多层含氟聚合物浸渍的编织纤维布构成。
2.根据权利要求1所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述介电材料层包括两层增强层和第一浸渍层，两层增强层分别为第一增强层和第二增强层，所述结构自上而下顺序为上导电层、第一增强层、第一浸渍层、第二增强层，介电材料层和下导电层。
3.根据权利要求2所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述介电材料层还包括两层粘结层，分别为上粘接层和下粘接层，所述结构自上而下顺序为上导电层、上粘接层、第一增强层、第一浸渍层、第二增强层下粘接层和下导电层。
4.根据权利要求3所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述介电材料层还包括第二浸渍层和第三增强层，所述结构自上而下顺序为上导电层、上粘接层、第一增强层、第一浸渍层、第二增强层、第二浸渍层、第三增强层、下粘接层和下导电层。
5.根据权利要求1至4任一项所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述的介电材料层总厚度在0.003-0.500 inch范围内。
6.根据权利要求1至4任一项所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述增强层介电常数为2.20-2.94，增强层总厚度为0.006-0.055inch，其中玻璃纤维直径为0.3-0.7um，长度小于5000um。
7.根据权利要求1至4任一项所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述浸渍层总厚度占介电材料层总厚度的10-60%。
8.根据权利要求1所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述含氟聚合物浸渍的编织纤维布的编织样式编号为1080、108、106、112中任意一种，其中含氟聚合物占纤维布质量的30-85%。
9.根据权利要求3或权利要求4所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述粘结层总厚度在0.0005-0.004inch范围内。
10.根据权利要求1所述的一种玻璃纤维增强含氟聚合物电路层压板结构，其特征在于，所述导电层选用导电箔或电阻箔任意一种。
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