CN112309922A

CN112309922A - Intelligent device integrating feeding and binding

Info

Publication number: CN112309922A
Application number: CN202011247628.3A
Authority: CN
Inventors: 喻泷
Original assignee: Shenzhen Semipeak Technology Co ltd
Current assignee: Shenzhen Semipeak Technology Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-02-02

Abstract

The invention discloses an intelligent device integrating feeding and binding, and relates to the technical field of IC binding. The upper end of the workbench is sequentially provided with a glass feeding unit, a glass cleaning unit, an ACF attaching machine, a prepressing binding unit and a pressing binding unit along the left-to-right direction, the upper end of the workbench is also provided with a manipulator assembly capable of moving along the left-to-right direction, the manipulator assembly can adsorb glass to carry, the upper end of the workbench is also provided with an IC feeding bin, an overturning feeding assembly for IC feeding is arranged between the IC feeding bin and the prepressing binding unit, and the workbench is provided with a glass cleaning platform, an attaching platform, a prepressing platform and a pressing platform. The glass plate can be automatically cleaned firstly, the glass plate can be bound with the IC chip after the cleaning process is finished, the IC chip is automatically turned over in the feeding process, the labor intensity of workers is reduced, and the working efficiency is improved.

Description

Intelligent device integrating feeding and binding

Technical Field

The invention relates to the technical field of IC binding, in particular to an intelligent device integrating feeding and binding.

Background

ACF is an abbreviation of Anisotropic Conductive Film (iso Conductive Film), and is characterized in that the electrical conduction direction of the Z-axis and the resistance characteristics of the XY insulating plane have obvious differences. Before bonding the IC to the glass, the ACF needs to be attached to the glass, and then the IC is attached to the glass for bonding.

When the existing IC chip is bound on the glass plate, the glass plate needs to be cleaned first, and then the IC chip is bound on the glass plate. However, the glass plate is often cleaned manually by workers, the IC chip is conveyed to the binding station from the material tray and is also often conveyed manually, the labor intensity of the workers is high, the glass plate is difficult to clean and transfer, and the risk of glass damage is easy to occur.

Therefore, the intelligent equipment integrating loading and binding is urgently needed, the glass plate can be automatically cleaned firstly, the glass plate can be bound with the IC chip after the cleaning process is finished, the IC chip is automatically turned over in the feeding process, the labor intensity is reduced, and the working efficiency is improved.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides intelligent equipment integrating feeding and binding, which can automatically clean a glass plate, can bind with an IC chip after the cleaning process is finished, and can automatically turn over the IC chip in the feeding process, thereby reducing the labor intensity and improving the working efficiency.

The invention specifically adopts the following technical scheme:

the intelligent device integrating feeding and binding into a whole comprises a workbench, wherein a glass feeding unit and a glass cleaning unit are sequentially arranged at the upper end of the workbench along the left-to-right direction, ACF pastes the machine, the unit is bound to the pre-compaction and this pressure is bound the unit, the workstation upper end still is provided with the manipulator subassembly that can remove along left right direction, manipulator subassembly can adsorb glass and carry, the workstation upper end still is provided with feed bin on the IC, it is provided with the upset material loading subassembly that is used for the IC material loading to bind between the unit with the pre-compaction on the IC, be provided with the glass cleaning platform that removes about can between glass material loading unit and the glass cleaning unit, ACF pastes and attaches the machine and bind the unit with the pre-compaction and be provided with attached platform, the unit is bound with this pressure to the pre-compaction and bind the unit below and be provided with pre-compaction platform and this pressure platform respectively, pre-compaction platform and this pressure.

The present invention is further preferred: the glass feeding unit comprises a support frame, a cross sliding table, a vertical sliding rail, a supporting plate and a bracket, wherein the vertical sliding table and a glass feeding disc are arranged on the support frame; the lower extreme of support frame is installed on the workstation, and the cross slip table is installed in the upper end of support frame, and the lower extreme of cross slip table is provided with adsorbs the charging tray, and vertical slide rail setting is in the below of cross slip table, and the bracket passes through vertical slip table and vertical slide rail interconnect, and the layer board is installed in the bracket upper end, and the charging tray setting is in the upper end of layer board on the glass, and the charging tray is located the below of adsorbing the charging tray on the glass.

The present invention is further preferred: the glass cleaning unit comprises a CCD camera and a plasma cleaning machine which are sequentially arranged from left to right, the plasma cleaning machine is provided with a spray head, the lower end of the glass cleaning platform is provided with a transverse shaft sliding seat, the lower end of the transverse shaft sliding seat is provided with a transverse shaft sliding rail, the lower end of the transverse shaft sliding rail is provided with a longitudinal shaft sliding seat, the lower end of the longitudinal shaft sliding seat is provided with a longitudinal shaft sliding rail, and the CCD camera and the spray head are located above the transverse shaft sliding.

The present invention is further preferred: the lower extreme of attached platform is provided with first XY axle slip table.

The present invention is further preferred: the IC loading bin below sets up places the platform, places the upper end of platform and is provided with two IC loading trays side by side, places the platform and installs the DD motor, two IC loading trays are located the both sides of DD motor respectively and with DD motor interconnect, place the lower extreme of platform and be provided with second XY axle slip table.

The present invention is further preferred: the overturning feeding assembly comprises a Y-axis module, a Z-axis module, a positioning sliding seat, a positioning plate, an overturning motor, a synchronous belt and an overturning sucker assembly; y axle module level sets up, the both ends of Y axle module are located the top of charging tray on the IC respectively and are located the top of pre-compaction platform, the lateral wall at Y axle module is installed to the location slide, the lateral wall at the location slide is installed along vertical direction to the Z axle module, locating plate horizontal installation is at the lower extreme of Z axle module, the upset motor sets up on the locating plate, the locating plate upper end still is provided with the fixed plate, upset suction head subassembly rotates and sets up at the fixed plate lower extreme, the groove of stepping down of the upset suction head subassembly upset of being convenient for is seted up to the fixed plate, the one end of upset suction head subassembly and the output shaft of upset motor all overlap and are.

The present invention is further preferred: the overturning suction head assembly comprises an IC rotating shaft, a miniature joint, a suction head body and a fixed block; the IC rotating shaft is of a hollow structure, one end of the IC rotating shaft is of a closed structure, the other end of the IC rotating shaft is communicated with the micro connector, the fixed block is sleeved on the IC rotating shaft and provided with a positioning groove for fixing the suction head body, and the suction head body is provided with a plurality of through holes communicated with the interior of the IC rotating shaft.

The present invention is further preferred: the prepressing platform and the lower end of the flattening platform are provided with guide rails which are vertical to each other in the left-right direction.

The present invention is further preferred: the manipulator subassembly is including the first manipulator that can remove between cleaning platform and attached platform, the second manipulator that can remove between attached platform and pre-compaction platform, the third manipulator that can remove between pre-compaction platform and this pressure body and the fourth manipulator that can remove between this platform and next station of flattening, the workstation upper end is provided with the horizontal guide rail along left right direction level setting, first manipulator, the second manipulator, third manipulator and fourth manipulator lower extreme all are provided with the removal seat of installing on horizontal guide rail.

The present invention is further preferred: the first mechanical arm, the second mechanical arm, the third mechanical arm and the fourth mechanical arm respectively comprise a guide frame, an adsorption head and an adsorption mounting seat; the leading truck sets up along the direction of perpendicular horizontal guide rail, and the leading truck runs through and has seted up the kidney slot, adsorbs the head to install on adsorbing the mount pad, adsorbs the mount pad to run through and sets up the fixed orifices that aligns with the kidney slot, adsorbs mount pad and leading truck pass through bolt assembly interconnect.

The invention has the beneficial effects that:

the invention arranges a glass cleaning unit, an ACF attaching machine, a pre-pressing binding unit and a local pressing binding unit on the upper end of the workbench in sequence along the direction from left to right. Realize the automatic feeding of glass board through glass material loading unit, the cross slip table through glass material loading unit drives the removal of absorption charging tray at the horizontal plane, and absorption charging tray adsorbs the glass board, then removes glass to the glass cleaning unit and washs. Be provided with the manipulator subassembly in the upper end of workstation, cooperation cleaning platform, attached platform, pre-compaction platform and this pressure platform can carry the removal to glass between different stations, do not need artifical manual to move, reduce artifical intensity of labour, improve work efficiency. The in-process that the pre-compaction was bound, the upset material loading subassembly snatchs IC through absorbent mode in with IC material loading tray, then moves on the pre-compaction platform under the effect of Y axle module. Automatic feeding of the IC is achieved, and labor intensity of workers is reduced.

Drawings

In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

FIG. 1 is a perspective assembly view of the present invention;

FIG. 2 is a schematic perspective view of a glass loading unit;

FIG. 3 is a bottom perspective view of FIG. 2;

FIG. 4 is a perspective view of the plasma cleaning machine;

FIG. 5 is a schematic perspective view of the glass cleaning platform;

FIG. 6 is a perspective view of an ACF bonder;

FIG. 7 is a perspective view of the attachment platform;

FIG. 8 is a schematic perspective view of the pre-pressing platform;

FIG. 9 is a perspective view of the platen;

FIG. 10 is a schematic perspective view of the flip-top loading assembly and IC loading bin;

FIG. 11 is a left side schematic view of FIG. 10;

FIG. 12 is another perspective view of FIG. 10;

FIG. 13 is a perspective view of the tip assembly;

figure 14 is a perspective view of the robot assembly;

FIG. 15 is an enlarged view of the structure at A in FIG. 14;

in the attached drawings, 1-a workbench, 2-a glass loading unit, 201-a support frame, 202-a supporting plate, 203-a glass loading tray, 204-a cross sliding table, 205-an adsorption material taking tray, 206-a vertical sliding rail, 207-a vertical sliding table, 208-a bracket, 3-a glass cleaning unit, 301-a plasma cleaning machine, 3011-a spray head, 302-a CCD camera, a 4-ACF attaching machine, 5-a pre-pressing binding unit, 6-a local pressing binding unit, 7-a mechanical arm component, 701-a first mechanical arm, 702-a second mechanical arm, 703-a third mechanical arm, 704-a fourth mechanical arm, 8-a glass cleaning platform, 801-a transverse shaft sliding seat, 802-a transverse shaft sliding rail, 803-a longitudinal shaft sliding seat, 804-a longitudinal shaft sliding rail, 9-an attaching platform, 901-a first XY axis sliding table, 10-a pre-pressing platform, 11-a local pressing platform, 12-an IC feeding bin, 1201-a second XY axis sliding table, 1202-a placing table, 1203-an IC feeding tray, 13-a turning feeding assembly, 1301-a Y axis module, 1302-a Z axis module, 1303-a positioning sliding seat, 1304-a turning motor, 1305-a positioning plate, 1306-a synchronizing wheel, 1307-a synchronizing sleeve, 1308-a turning suction head assembly, 13081-an IC rotating shaft, 13082-a fixing block, 13083-a suction head body, 13084-a micro joint, 14-a horizontal guide rail, 15-a moving seat, 16-a guide frame, 17-an adsorption mounting seat and 18-an adsorption head.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.

Referring to fig. 1, the glass feeding unit 2, the glass cleaning unit 3, the ACF applying machine 4, the pre-pressing binding unit 5, and the home pressing binding unit 6 are sequentially disposed on the upper end of the workbench 1 along a left-to-right direction, and during actual use, a protective cover is disposed on the outer side of the workbench 1, and is removed for observation. As a preferred ACF model is 7831, the pre-pressing binding unit 5 actually places the IC on the glass plate in advance, pre-binds the IC on the glass, and then hot-presses the IC and the glass by the present pressing binding unit 6 to realize ACF curing, and the working principle thereof is currently common. In the prior art, glass cleaning, AFC attaching and IC binding are carried out manually at different stations, and the labor intensity of workers is high. Be provided with manipulator subassembly 7 in the upper end of workstation 1, cooperation cleaning platform, attached platform 9, pre-compaction platform 10 and this platform 11 that flattens can carry the removal to glass between different stations, do not need artifical manual to move, reduce artifical intensity of labour, improve work efficiency.

Referring to fig. 2 and 3, support frame 201 is installed on workstation 1, cross slip table 204 is installed in the upper end of support frame 201, cross slip table 204 includes two transverse guide, two transverse guide are parallel to each other, and unanimous with the direction from a left side to the right, two transverse guide stride and be equipped with longitudinal rail, longitudinal rail can remove along transverse guide's direction, be provided with the absorption material taking disc 205 that can go up and down to remove at longitudinal rail's lower extreme, absorption material taking disc 205 is for adsorbing the formula and getting the material hand, through the mode of vacuum adsorption, hug closely the absorption with glass, thereby play the effect of snatching glass. The adsorption material taking disc 205 can move to the upper part of the glass cleaning platform 8 under the action of the cross sliding table 204, and the glass is placed on the glass cleaning platform 8. It should be further noted that, the lower end of the supporting plate 202 is provided with a bracket 208, the bracket 208 is connected with the vertical slide rail 206 through the vertical sliding table 207, and can move up and down along the vertical slide rail 206, and as for the driving mode, the driving mode can be a telescopic mode through a hydraulic cylinder, or a mode of matching a lead screw transmission with a stepping motor.

Referring to fig. 4 and 5, in fig. 1, the position of the CCD camera 302 is marked, the glass is firstly photographed and positioned by the CCD camera 302 during cleaning, then wiped by alcohol dust-free cloth to remove impurities on the glass, and then plasma cleaning is performed by the nozzle 3011 to further remove impurities such as organic matters on the glass. The lower end of the glass cleaning platform 8 is provided with a transverse shaft sliding seat 801 and a longitudinal shaft sliding seat 803, so that the glass cleaning unit 3 can move, and the glass cleaning unit moves back a certain distance in each moving process and then moves transversely. After the washing finishes, through first manipulator 701, can adsorb the back glass that finishes to wash and snatch, transfer glass to attached platform 9 from glass cleaning platform 8.

Referring to fig. 6-11, the attaching platform 9 can be adjusted in the horizontal plane direction under the action of the first XY axis sliding table 901 at the lower end to ensure that the attaching platform 9 moves at the lower end of the ACF attaching machine 4 under the condition of supporting glass, so as to ensure that the ACF can be attached to the glass. After the ACF attachment is completed, the glass with the ACF attached thereto is placed on the pre-pressing stage 10 by the second manipulator 702. The IC feeding bin 12 and the attaching platform 9 are positioned at two sides, so that the ACF-attached glass moves onto the pre-pressing platform 10, and the feeding of the IC is not influenced.

The placing table 1202 moves to the lower end of the IC loading bin 12 under the action of the second XY shaft sliding table 1201 arranged at the lower end to accept a material tray fully loaded with IC chips, two IC loading trays 1203 are arranged at the upper end of the placing table 1202, the number of IC storage is increased through a double-loading structure, and the problem of overlong waiting time during material changing in the IC loading process is solved. After the IC loading tray 1203 finishes receiving the IC, the IC loading tray 1203 moves to the position below the turnover loading assembly 13; then the turnover motor 1304 is operated to drive the turnover sucker assembly 1308 to turn over 180 degrees and turn the turnover sucker assembly 1308 down through the action of the synchronizing wheel 1306 and the synchronizing sleeve 1307; under the action of the Z-axis module 1302, the tip inverting assembly 1308 moves downward, picks up the IC, and then rises; then the turnover motor 1304 is operated, and the turnover sucker assembly 1308 is turned over 180 degrees to recover the initial state; under the effect of the Y-axis module 1301, the IC moves to the position below the pressing head of the pre-pressing binding unit 5, so that the pressing head can pick up the IC conveniently, and the IC is finally pre-bound with the glass.

Referring to fig. 13, it should be further explained that: the theory of operation of upset suction head subassembly 1308 does, IC pivot 13081's inside is hollow structure, IC pivot 13081's one end is connected with micro-joint 13084, micro-joint 13084 and vacuum tube intercommunication each other, make the vacuum source can pass through in miniature entering into IC pivot 13081, another pot head of IC pivot 13081 is equipped with synchronizing wheel 1306, upset motor 1304 work, make IC pivot 13081 can rotate around self axis, upset suction head subassembly 1308 rotates fixedly through the fixed plate, and set up the groove of stepping down to the upset of upset suction head subassembly 1308 abdicating at the fixed plate lateral wall. The suction head body 13083 is also sleeved with a shaft sleeve, a fixed block 13082 is provided with a communication hole communicated with an IC rotating shaft 13081, the suction head body 13083 is sleeved with the shaft sleeve and then is installed in the communication hole, the shaft sleeve is in transition fit with the IC rotating shaft 13081, the shaft sleeve is in clearance fit with the suction head body 13083, and the suction head is provided with through holes communicated with the interior of the IC rotating shaft 13081, so that the sealing is realized, a vacuum source is conducted into the suction head body 13083, and the suction head body 13083 can suck ICs. More preferably, a spring is further provided at the lower end of the nozzle body 13083 to provide elasticity for the nozzle body 13083 to suck the IC, thereby avoiding collision immediately after waking up.

Referring to fig. 14 and 15, the first robot 701, the second robot 702, the third robot 703, and the fourth robot 704 have the same structure, and 4 robots are provided to improve work efficiency, and only one robot is theoretically sufficient, and the robots are named and distinguished for convenience of description in the present application. First manipulator 701, second manipulator 702, third manipulator 703 and fourth manipulator 704 all can remove along horizontal guide rail 14, now explain with first manipulator 701, leading truck 16 sets up along the direction of perpendicular horizontal guide rail 14, through kidney-shaped groove and bolt assembly complex mode, can adjust the relative position of adsorbing mount pad 17, and the number of self-defined adsorbing mount pad 17 and the distance between the adjacent adsorbing mount pad 17, adsorb head 18 and install on adsorbing mount pad 17, adsorb head 18 and be connected with pneumatic system, can realize vacuum adsorption. The adsorption head 18 can be according to the self-defined quantity of actual demand to can stably absorb glass.

The working process of the invention is as follows: when the glass feeding disc 203 in the glass feeding unit 2 reaches the material taking position, the adsorption material taking disc 205 can take out the glass from the glass feeding disc 203, the glass moves to the upper end of the glass cleaning platform 8 under the action of the cross sliding table 204, the glass is placed on the glass cleaning platform 8, the glass cleaning platform 8 moves to the CCD camera 302 to correct the angle of the glass, and then the glass is cleaned through alcohol dust-free cloth, foreign matters on the ITO of the glass are cleaned, and finally the organic matters on the ITO of the glass are cleaned through Plasma cleaning, so that the feeding cleaning of the glass is completed. Then the first mechanical arm 701 can convey glass to an attaching platform 9 at the lower end of an ACF attaching machine 4, the angle of the glass is corrected through another group of CCDs, the attaching platform 9 conveys the glass to the lower portion of an attaching pressure head, the ACF is attached to the glass through the work of the pressure head, the attaching platform 9 retreats to a detection position, the ACF attaching condition is detected through the CCDs and then retreats to a discharge position, then the second mechanical arm 702 can convey the glass attached with the ACF to a prepressing platform 10 in a prepressing binding unit 5, meanwhile, an IC material tray can be taken out from an IC material loading bin 12 through an overturning feeding assembly 13, the IC angle is corrected by moving to the lower portion of a panoramic camera, the overturning feeding assembly 13 picks up an IC from the IC material tray to overturn, conveys the glass to the lower portion of the prepressing pressure head, the air suction pressure head is aligned on the prepressing CCDs, and then the. The third manipulator 703 carries the glass that will bind in advance to this pressure platform 11 in this pressure binding mechanism, and through CCD correction, this pressure platform 11 sends the glass of taking IC to this pressure head below, and this pressure head work carries out the hot pressing to IC and glass, realizes the ACF solidification. This completes the bonding of the IC and glass.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.

Claims

1. The utility model provides a collect material loading and bind intelligent device as an organic whole, includes the workstation, its characterized in that: the utility model discloses a glass cleaning machine, including workstation upper end, mechanical arm, glass cleaning unit, ACF attaching machine, pre-compaction binding unit, the unit is bound to the pre-compaction and this pressure along direction from left to right is provided with the unit in order, the workstation upper end still is provided with the manipulator subassembly that can remove along left right direction, the manipulator subassembly can adsorb glass and carry, the workstation upper end still is provided with IC and goes up the feed bin, IC goes up the feed bin and binds the upset material loading subassembly that is used for IC material loading between the unit with the pre-compaction, be provided with the glass cleaning platform that can remove about between glass cleaning unit and the glass cleaning unit, ACF attaching machine and pre-compaction binding unit are provided with attached platform between the unit, the unit is bound with this pressure to the pre-compaction binding unit below and is provided with pre-compaction platform and this pressure platform.

2. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the glass feeding unit comprises a support frame, a cross sliding table, a vertical sliding rail, a supporting plate and a bracket, wherein the vertical sliding table and a glass feeding disc are arranged on the support frame; the lower extreme of support frame is installed on the workstation, the cross slip table is installed in the upper end of support frame, the lower extreme of cross slip table is provided with adsorbs the charging tray, vertical slide rail sets up the below at the cross slip table, the bracket passes through vertical slip table and vertical slide rail interconnect, the layer board is installed in the bracket upper end, the charging tray sets up the upper end at the layer board on the glass, the charging tray is located the below of adsorbing the charging tray on the glass.

3. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the glass cleaning unit includes CCD camera and the plasma cleaning machine that sets up in order from a left side to the right side, the plasma cleaning machine is provided with the shower nozzle, the lower extreme of glass cleaning platform is provided with the cross axle slide, the cross axle slide rail is installed to the lower extreme of cross axle slide, the lower extreme of cross axle slide rail is provided with the axis of ordinates slide, the axis of ordinates slide rail is installed to the lower extreme of axis of ordinates slide, CCD camera and shower nozzle are located the top of cross axle slide rail.

4. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the lower end of the attaching platform is provided with a first XY axis sliding table.

5. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the IC loading bin is characterized in that a placing table is arranged below the IC loading bin, two IC loading trays are arranged on the upper end of the placing table side by side, the placing table is provided with a DD motor, the two IC loading trays are respectively located on two sides of the DD motor and are mutually connected with the DD motor, and a second XY-axis sliding table is arranged at the lower end of the placing table.

6. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the overturning and feeding assembly comprises a Y-axis module, a Z-axis module, a positioning slide seat, a positioning plate, an overturning motor, a synchronous belt and an overturning sucker assembly; y axle module level sets up, the both ends of Y axle module are located the top of IC charging tray respectively and are located the top of pre-compaction platform, the lateral wall at Y axle module is installed to the location slide, the lateral wall at the location slide is installed along vertical direction to Z axle module, locating plate horizontal installation is at the lower extreme of Z axle module, the upset motor sets up on the locating plate, the locating plate upper end still is provided with the fixed plate, upset suction head subassembly rotates and sets up at the fixed plate lower extreme, the groove of stepping down of being convenient for upset suction head subassembly upset is seted up to the fixed plate, the one end of upset suction head subassembly and the output shaft of upset motor all overlap and are equipped with the synchronizing wheel, and the synchronizing wheel cover is established on two synchronizing.

7. The intelligent device integrating loading and binding as claimed in claim 6, wherein: the overturning suction head assembly comprises an IC rotating shaft, a miniature joint, a suction head body and a fixed block; the IC rotating shaft is of a hollow structure, one end of the IC rotating shaft is of a closed structure, the other end of the IC rotating shaft is communicated with the miniature connector, the fixed block is sleeved on the IC rotating shaft and provided with a positioning groove for fixing the suction head body, and the suction head body is provided with a plurality of through holes communicated with the interior of the IC rotating shaft.

8. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the prepressing platform and the lower end of the flattening platform are provided with guide rails which are perpendicular to each other in the left-right direction.

9. The intelligent device integrating loading and binding as a whole as claimed in claim 1, wherein: the manipulator subassembly is including the first manipulator that can remove between washing platform and attached platform, the second manipulator that can remove between attached platform and pre-compaction platform, the third manipulator that can remove between pre-compaction platform and this pressure body and the fourth manipulator that can remove between this platform and next station of flattening, the workstation upper end is provided with the horizontal guide that sets up along controlling the direction level, first manipulator, second manipulator, third manipulator and fourth manipulator lower extreme all are provided with the removal seat of installing on horizontal guide.

10. The intelligent device integrating loading and binding as claimed in claim 9, wherein: the first manipulator, the second manipulator, the third manipulator and the fourth manipulator comprise guide frames, adsorption heads and adsorption mounting seats; the leading truck sets up along the direction of perpendicular horizontal guide rail, the leading truck runs through and has seted up the kidney slot, adsorb the head and install on adsorbing the mount pad, adsorb the mount pad and run through and set up the fixed orifices that aligns with the kidney slot, adsorb the mount pad and pass through bolt assembly interconnect with the leading truck.