CN112105219A - 均温板及其制造方法 - Google Patents
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Abstract
一种均温板及其制造方法,该均温板包含一上盖及一下盖。上盖包含一盖板及多个支撑柱。盖板具有一容置槽。这些支撑柱位于容置槽内,并凸出于盖板。毛细结构位于腔室。下盖例如通过焊接的方式与上盖之盖板相接而形成一腔室。此外,这些支撑柱远离盖板之一端焊接于设置于下盖的毛细结构,以提升均温板之结构强度。
Description
技术领域
本发明关于一种均温板及其制造方法,特别是一种具有支撑柱的均温板及其制造方法。
背景技术
均温板的技术原理类似于热管,但在传导方式上有所区别。热管为一维线性热传导,而真空腔均热板中的热量则是在一个二维的面上传导,因此效率更高。具体来说,均温板主要包括一腔体及一毛细结构。腔体内部具有一中空腔室,且中空腔室用以供一工作流体填注。毛细组织布设在中空腔室内。腔体受热部分称为蒸发区。腔体散热的部分称为冷凝区。工作流体在蒸发区吸收热量汽化并迅速扩张至整个腔体。在冷凝区放出热量冷凝成液态。接着,液态工质通过毛细结构返回蒸发区,而形成一冷却循环。
然而,在电子产品往轻、薄、短、小的前提下,发热组件的使用环境是受到相当大的局限,故均温板也朝向薄型化的趋势发展。由于腔体厚度太薄造成强度不足,当工作温度超过90摄氏度以上时,会因为工作流体汽化而发生腔体内部压力上升,导致VC产生膨胀变形,甚至可能发生破裂的情况。因此,在薄型化的均温板中,部分厂商会在均温板的腔体内加装多个支撑柱,这些支撑柱的相对两端分别抵靠于与腔体的相对两侧,以对腔体起支撑作用,进而增强腔体的抗压能力,以及增加均温板的均温效果。
不过由于薄型化的均温板的结构强度较弱,故在将腔体与支撑柱压合的过程中,若压合条件设计不当,则有可能造成腔体破裂的问题。
发明内容
本发明在于提供一种均温板及其制造方法,藉以提升具有支撑柱的均温板的制造质量与均温效果。
本发明之一实施例所揭露的均温板的制造方法包含下列步骤。将一毛细结构定位于一第一盖体。于一第二盖体的一接合面形成一容置槽、一流道及多个支撑柱。将第二盖体盖合于第一盖体。定位第二盖体与第一盖体,以令这些支撑柱与毛细结构保持一间隙。压焊第一盖体与第二盖体,以令第一盖体与第二盖体形成一腔室及连通腔室的一通槽,且这些支撑柱与毛细结构相焊接。
本发明的另一实施例所揭露的均温板包含一上盖、一下盖及一毛细结构。上盖包含一盖板及多个支撑柱。盖板具有一容置槽。这些支撑柱位于容置槽内,并凸出于盖板。下盖与上盖的盖板相接而形成一腔室。毛细结构位于腔室并设置于下盖。其中,这些支撑柱焊接于设置于下盖的毛细结构。
根据上述实施例的均温板及其制造方法,将这些支撑柱与毛细结构相焊接,使得均温板除了可过毛细结构水平向导热,更可藉由这些支撑柱垂直向导热,以提升均温板的均温效果。
此外,通过上述的焊接温度与焊接压力的控制,使得在制造均温板时,除了可以确保这些支撑柱皆得以与毛细结构相焊接,更能够较为精准地控制这些支撑柱的压合量。如此一来,将可避免均温板在压合过程中发生腔体破裂的问题,进而提升均温板的制造质量。
以上关于本发明内容的说明及以下实施方式的说明用以示范与解释本发明的原理,并且提供本发明的专利申请范围更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的均温板的立体示意图。
图2为图1的分解示意图。
图3为图1的剖面示意图。
图4至图13为图1的均温板的制造流程。
其中附图标记为:
均温板20
上盖22
盖板23
容置槽24
支撑柱25
下盖26
毛细结构28
封口结构30
第一盖体100
第二盖体200
接合面210
背面220
容置槽230
流道240
沟槽250
支撑柱260
焊接剂300
充填除气管400
压合结构500
通槽C、C’
间隙G
腔室S
具体实施方式
请参阅图1至图3。图1为根据本发明第一实施例所述的均温板的立体示意图。图2为图1的分解示意图。图3为图1的剖面示意图。
本实施例的均温板20例如为薄形均温片,其总厚度例如0.5毫米以下。均温板20包含一上盖22、一下盖26及一毛细结构28。
上盖22与下盖26的材质例如为无氧铜、含硅合金铜或含铝合金铜板材,且上盖22包含一盖板23及多个支撑柱25。盖板23具有一容置槽24。这些支撑柱25位于容置槽24内,并凸出于盖板23。毛细结构28例如为铜网或铜纤维纸,并位于腔室S内。下盖26例如通过焊接的方式与上盖22的盖板23相接而形成一腔室S。此外,这些支撑柱25远离盖板23的一端焊接于设置于下盖26的毛细结构28,以提升均温板20的结构强度。此外,均温板20的外缘具有一封口结构30,封口结构30用以防止腔室S内的工作流体外泄。封口结构30例如通过电阻焊方式形成。以下将说明均温板20的制造方法。
请参阅图4至图11,图4至图11为图1的均温板的制造流程。
首先,如图4所示,裁切毛细结构28,使毛细结构28的形状匹配后续第二盖体200的容置槽230(请暂参阅图6)的形状。接着,将毛细结构28进行退火工艺。
接着,如图5所示,将毛细结构28定位并焊接于第一盖体100。第一盖体 100例如为平板。
接着,如图6所示,提供一第二盖体200。第二盖体200具有一接合面210、一背面220、一容置槽230、一流道240、一沟槽250及多个支撑柱260。背面 220背对于接合面210。容置槽230、流道240、沟槽250及多个支撑柱260通过例如蚀刻、喷砂或冲压接合面210所形成的结构。容置槽230、流道240、沟槽250及多个支撑柱260可于同一蚀刻、喷砂或冲压工艺形成,或是于不同工艺步骤中形成。沟槽250形成于接合面210,并沿第二盖体200的外缘的轮廓设置。接着,注入焊接剂300于沟槽250。焊接剂300例如为铜膏、锡膏或类似的物质。
接着,如图7所示,将第二盖体200盖合于第一盖体100,并定位第二盖体200与第一盖体100。详细来说,第一盖体100迭设于第二盖体200上的焊接剂300。
接着,如图8与图9所示,通过加压焊接的方式将第一盖体100与第二盖体200的接合面210相接,以及将支撑柱260与毛细结构28相接。第一盖体 100与第二盖体200相接,使得第二盖体200与第一盖体100于容置槽230与流道240处分别共同围绕出腔室S及连通腔室S的一通槽C。支撑柱260与毛细结构28相接,使得这些支撑柱260的相对两端分别直接或接间连接于与第一盖体100与第二盖体200,以对第一盖体100与第二盖体200发挥支撑作用,进而增强第一盖体100与第二盖体200的结合强度。
需注意的是,由于第一盖体100与第二盖体200的厚度很薄,若加压焊接条件设定不当时,则有可能造成第一盖体100与第二盖体200破裂或支撑柱260 与第一盖体100的毛细结构28间的焊接不完全。详细来说,若压焊第一盖体 100与第二盖体200时的压合量过小,则支撑柱260与第一盖体100的毛细结构28间就会产生焊接不完全的状况,使得支撑柱260难以发挥出结构补强的效果,尤其是在腔室S内部因受力较大而向外膨胀的情况。反之,若加压焊接第一盖体100与第二盖体200时的压合量过大,则第一盖体100与第二盖体200则会受到支撑柱260的过度挤压而产生破裂或裂隙。
因此,为了提升压焊质量,则在本实施例中,压焊条件设定如下表:
假设预定压合量为0.03毫米(mm)。压合量是指支撑柱260于加温软化后可被外力压缩的高度值。则可如参数1,将压焊的温度设定于摄氏680度,压力设定于25千克(kg)。或是如参数2,将压焊的温度设定于摄氏700度,压力设定于20千克(kg)。或是如参数3,将压焊的温度设定于摄氏750度,压力设定于18千克(kg)。或是如参数4,将压焊的温度设定于摄氏800度,压力设定于 15千克(kg)。或是如参数5,将压焊的温度设定于摄氏850度,压力设定于10 千克(kg)。
不过上述参数1~5仅为举例说明,并非用以限制本案,在其他实施例中,也可以用参数1的温度设定(摄氏680度)搭配参数3的压力设定(18千克/平方厘米(kg/cm2)),或是搭配参数5的压力设定(10千克/平方厘米(kg/cm2))。又或是可以用,参数5的压力设定(10千克/平方厘米(kg/cm2))搭配参数1的温度设定(摄氏680度)或是参数4的温度设定(摄氏800度)。
此外,上述加压焊接条件以压合量为0.03毫米(mm)举例说明,但并不以此为限,在其他实施例中,亦可依实际产品需求,调整第一盖体100与第二盖体 200的压合量,并随压合量调整加压焊接条件。
上述的压焊条件除了温度与压力之外,亦有恒温时间、续压时间及延时时间。以参数1为例,压焊条件指以摄氏680度的温度条件搭配25千克/平方厘米(kg/cm2)的压力条件,进行扩散/铜膏焊接。并且,焊接需要维持680摄氏度的恒温300秒。接着,进入续压时间,续压时间指压力维持不变但温度逐渐降低至约摄氏300至400度。接着,进入延时时间,延时时间指除温度逐渐降低外,压力亦开始降低。
接着,对第一盖体100与第二盖体200共同围绕的通槽C进行扩管。接着,如图9所示,插入一充填除气管400于扩管后的通槽C’。详细来说,充填除气管400插接于通槽C’的部分经过缩管,例如以车削、挤压等工艺,使充填除气管400插接于通槽C’部分的外直径小于其余部分,以利于将充填除气管400插入通槽C’。充填除气管400插入通槽C’的部分同样需以焊接剂300与第一盖体 100、第二盖体200进行焊接接合。
较佳地,可于完成充填除气管400、第一盖体100与第二盖体200的焊接工艺后进行测漏工艺,以检测充填除气管400与第一盖体100、第二盖体200 的焊接品质。以及,可于完成充填除气管400与第一盖体100、第二盖体200 的焊接工艺后进行退火工艺,以释放焊接应力、改善机械性能。
接着,充填除气管400依序连接除气设备及注水设备,以经过充填除气管 400进行排除气体与工作流体注入作业。
接着,如图10所示,通过冲压的方式压扁充填除气管400远离通槽C’的一端。接着,对充填除气管400的压扁处进行熔接封口,以避免注入腔室内的工作流体外泄并维持腔室S内的低压状态。
接着。如图11所示,例如通过电阻焊接的方式对腔室S与通槽C’的交界处进行封口工艺,以形成一压合结构500。
接着。如图12所示,切割腔室S与通槽C’的交界处,以切除第一盖体100(如图11所示)与第二壳体200(如图11所示)中设置通槽C’的部分。如此一来,将制作出上述的均温板20。即,切除后的第一盖体100为均温板20之下盖26,而切除后的第二盖体200为均温板20的下盖22。
根据上述实施例的均温板及其制造方法,将这些支撑柱与毛细结构相焊接,使得均温板除了可过毛细结构水平向导热,更可藉由这些支撑柱垂直向导热,以提升均温板的均温效果。
此外,通过上述的焊接温度与焊接压力的控制,使得在制造均温板时,除了可以确保这些支撑柱皆得以与毛细结构相焊接,更能够较为精准地控制这些支撑柱的压合量。如此一来,将可避免均温板在压合过程中发生腔体破裂的问题,进而提升均温板的制造质量。
虽然本发明以前述的诸项实施例揭露如上,然其并非用以限定本发明,任何熟习相像技艺者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的专利保护范围须视本说明书所附的权利要求所界定者为准。
Claims (21)
1.一种均温板的制造方法,其特征在于,包含:
将一毛细结构定位于一第一盖体;
于一第二盖体的一接合面形成一容置槽、一流道及多个支撑柱;
将该第二盖体盖合于该第一盖体;
定位该第二盖体与该第一盖体,以令该些支撑柱与该毛细结构保持一间隙;
压焊该第一盖体与该第二盖体,以令该第一盖体与该第二盖体形成一腔室及连通该腔室的一通槽,且该些支撑柱与该毛细结构相焊接。
2.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度介于摄氏680度至850度之间。
3.如权利要求1及2的任一项所述之均温板的制造方法,其中压焊该第一盖体与该第二盖体的压力介于10度至25千克之间。
4.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度介于摄氏680度至750度之间,压焊该第一盖体与该第二盖体的压力介于18度至25千克之间。
5.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度介于摄氏750度至850度之间,压焊该第一盖体与该第二盖体的压力介于10度至18千克之间。
6.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度为摄氏680度,压焊该第一盖体与该第二盖体的压力为25千克。
7.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度为摄氏700度,压焊该第一盖体与该第二盖体的压力为20千克。
8.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度为摄氏750度,压焊该第一盖体与该第二盖体的压力为18千克。
9.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度为摄氏800度,压焊该第一盖体与该第二盖体的压力为15千克。
10.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的温度为摄氏850度,压焊该第一盖体与该第二盖体的压力为10千克。
11.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的的压合量介于0.15至0.45毫米之间。
12.如权利要求1所述的均温板的制造方法,其特征在于,压焊该第一盖体与该第二盖体的的压合量介于0.03毫米之间。
13.如权利要求1所述的均温板的制造方法,其特征在于,在将该毛细结构定位于该第一盖体的步骤前,更包含:
裁切一毛细结构,使该毛细结构的形状匹配于该第二盖体的该容置槽的形状;以及
对该毛细结构进行退火工艺。
14.如权利要求1所述的均温板的制造方法,其特征在于,在压焊该第一盖体与该第二盖体的步骤前,更包含:
于该第二盖体的该接合面形成一沟槽;以及
注入一焊接剂于该沟槽。
15.如权利要求1所述的均温板的制造方法,其特征在于,在压焊该第一盖体与该第二盖体的步骤后,更包含:
对该第一盖体与该第二盖体共同围绕的该通槽进行扩管;以及
插入一充填除气管于扩管后的一通槽。
16.如权利要求15所述的均温板的制造方法,其特征在于,在插入该充填除气管于扩管后的该通槽的步骤后,更包含:
经该充填除气管进行除气与工作流体注入作业。
17.如权利要求16所述的均温板的制造方法,其特征在于,在经该充填除气管进行除气与工作流体注入作业的步骤后,更包含:
压扁该充填除气管远离该通槽的一端;以及
对该充填除气管的压扁处进行熔接封口。
18.如权利要求17所述的均温板的制造方法,其特征在于,在对该充填除气管的压扁处进行熔接封口的步骤后,更包含:
通过压焊的方式对该腔室与该通槽的交界处进行封口工艺,以形成一压合结构。
19.如权利要求18所述的均温板的制造方法,其特征在于,在对该充填除气管的压扁处进行熔接封口的步骤后,更包含:
切割该腔室与该通槽的交界处。
20.如权利要求1所述的均温板的制造方法,其特征在于,通过蚀刻工艺或冲压工艺于该接合面形成该容置槽、该流道及该些支撑柱。
21.一种均温板,其特征在于,包含:
一上盖,包含一盖板及多个支撑柱,该盖板具有一容置槽,该些支撑柱位于该容置槽内,并凸出于该盖板;
一下盖,该下盖与该上盖的盖板相接而形成一腔室;以及
一毛细结构,位于该腔室并设置于该下盖;
其中,该些支撑柱焊接于设置于该下盖的该毛细结构。
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TWI813277B (zh) * | 2022-05-06 | 2023-08-21 | 邁萪科技股份有限公司 | 改良除氣管固定結構的均溫板 |
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US20220243992A1 (en) * | 2021-01-29 | 2022-08-04 | Advanced Semiconductor Engineering, Inc. | Heat transfer element, method for forming the same and semiconductor structure comprising the same |
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