CN111868194A - 粘合剂、粘合带以及固定电子设备部件或车载部件的方法 - Google Patents

粘合剂、粘合带以及固定电子设备部件或车载部件的方法 Download PDF

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Publication number
CN111868194A
CN111868194A CN201980018852.4A CN201980018852A CN111868194A CN 111868194 A CN111868194 A CN 111868194A CN 201980018852 A CN201980018852 A CN 201980018852A CN 111868194 A CN111868194 A CN 111868194A
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China
Prior art keywords
meth
adhesive
monomer
acrylate
weight
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CN201980018852.4A
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English (en)
Chinese (zh)
Inventor
足立绚
内田德之
土居智
岩井勇树
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of CN111868194A publication Critical patent/CN111868194A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN201980018852.4A 2018-06-19 2019-05-30 粘合剂、粘合带以及固定电子设备部件或车载部件的方法 Pending CN111868194A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-116222 2018-06-19
JP2018116222 2018-06-19
PCT/JP2019/021534 WO2019244595A1 (ja) 2018-06-19 2019-05-30 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Publications (1)

Publication Number Publication Date
CN111868194A true CN111868194A (zh) 2020-10-30

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CN201980018852.4A Pending CN111868194A (zh) 2018-06-19 2019-05-30 粘合剂、粘合带以及固定电子设备部件或车载部件的方法

Country Status (6)

Country Link
US (1) US20210395575A1 (https=)
JP (2) JP7797093B2 (https=)
KR (2) KR20210022521A (https=)
CN (1) CN111868194A (https=)
TW (1) TWI862497B (https=)
WO (1) WO2019244595A1 (https=)

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CN114829533A (zh) * 2019-12-18 2022-07-29 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法
CN115803408A (zh) * 2021-03-22 2023-03-14 积水化学工业株式会社 粘合带、电子设备部件或车载设备部件的固定方法以及电子设备或车载设备的制造方法
CN119421937A (zh) * 2022-07-04 2025-02-11 日东电工株式会社 粘合片

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JP7386609B2 (ja) * 2018-12-27 2023-11-27 日東電工株式会社 粘着剤組成物
DE202019100588U1 (de) * 2019-01-31 2019-02-07 Certoplast Technische Klebebänder Gmbh Klebeband, insbesondere Wickelband
CN114729249B (zh) * 2019-12-18 2023-03-07 积水化学工业株式会社 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法、以及电子设备部件或车载部件的制造方法
JP7784837B2 (ja) * 2020-07-09 2025-12-12 積水化学工業株式会社 粘着テープ
KR20230096916A (ko) * 2020-10-28 2023-06-30 세키스이가가쿠 고교가부시키가이샤 점착 테이프
JP7599985B2 (ja) * 2021-02-12 2024-12-16 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート
WO2022210579A1 (ja) * 2021-03-29 2022-10-06 三菱ケミカル株式会社 粘着剤組成物、およびそれを用いてなる粘着剤、粘着シート、ならびに積層体
JP7826127B2 (ja) * 2021-06-23 2026-03-09 積水化学工業株式会社 粘着テープ
JP2023003414A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電子機器及び車載部材
WO2022270567A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
KR20240023019A (ko) * 2021-06-23 2024-02-20 세키스이가가쿠 고교가부시키가이샤 점착 테이프
JP2023003416A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電化製品、車載部材及び固定方法
JP7723510B2 (ja) * 2021-06-23 2025-08-14 積水化学工業株式会社 粘着テープ
WO2022270565A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ
TW202311481A (zh) * 2021-08-30 2023-03-16 日商三菱化學股份有限公司 黏著片材、積層片材及可撓性圖像顯示裝置
JP7807217B2 (ja) * 2021-11-29 2026-01-27 日本カーバイド工業株式会社 粘着剤組成物及び粘着テープ
JP7321329B1 (ja) * 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7308342B1 (ja) * 2022-09-13 2023-07-13 日東電工株式会社 粘着シート
JP2024094179A (ja) * 2022-12-27 2024-07-09 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤組成物及びそれを用いた粘着シート
CN120813663A (zh) * 2023-03-14 2025-10-17 综研化学株式会社 粘合剂组合物以及粘合剂层的制造方法
JP7387216B1 (ja) 2023-07-11 2023-11-28 サイデン化学株式会社 再剥離用粘着剤組成物及び粘着シート
DE102023118445A1 (de) 2023-07-12 2025-01-16 Tesa Se Elektrisch leitfähiges Klebeband mit hohem biogenem Kohlenstoffanteil
JP7622796B1 (ja) 2023-10-27 2025-01-28 ａｒｔｉｅｎｃｅ株式会社 粘着剤組成物および粘着シート

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Publication number Priority date Publication date Assignee Title
CN114829533A (zh) * 2019-12-18 2022-07-29 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法
CN114829533B (zh) * 2019-12-18 2024-11-22 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法
CN115803408A (zh) * 2021-03-22 2023-03-14 积水化学工业株式会社 粘合带、电子设备部件或车载设备部件的固定方法以及电子设备或车载设备的制造方法
CN115803408B (zh) * 2021-03-22 2023-07-14 积水化学工业株式会社 粘合带、电子设备部件或车载设备部件的固定方法以及电子设备或车载设备的制造方法
CN119421937A (zh) * 2022-07-04 2025-02-11 日东电工株式会社 粘合片

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KR20210022521A (ko) 2021-03-03
WO2019244595A1 (ja) 2019-12-26
JP7797093B2 (ja) 2026-01-13
JPWO2019244595A1 (ja) 2021-05-13
US20210395575A1 (en) 2021-12-23
TW202000836A (zh) 2020-01-01
KR20240134397A (ko) 2024-09-09
TWI862497B (zh) 2024-11-21
JP2024166298A (ja) 2024-11-28

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