CN111850526A - 一种表面金属涂层原位修复方法 - Google Patents
一种表面金属涂层原位修复方法 Download PDFInfo
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- 239000011248 coating agent Substances 0.000 title claims abstract description 82
- 238000000576 coating method Methods 0.000 title claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 72
- 239000002184 metal Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000011065 in-situ storage Methods 0.000 title claims abstract description 15
- -1 catechol amine compound Chemical class 0.000 claims abstract description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 16
- 239000002105 nanoparticle Substances 0.000 claims abstract description 12
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 claims description 20
- 239000008367 deionised water Substances 0.000 claims description 18
- 229910021641 deionized water Inorganic materials 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 17
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 16
- 239000000725 suspension Substances 0.000 claims description 16
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 10
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 235000010493 xanthan gum Nutrition 0.000 claims description 9
- 229920001285 xanthan gum Polymers 0.000 claims description 9
- 239000000230 xanthan gum Substances 0.000 claims description 9
- 229940082509 xanthan gum Drugs 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 8
- 229960003638 dopamine Drugs 0.000 claims description 7
- CTENFNNZBMHDDG-UHFFFAOYSA-N Dopamine hydrochloride Chemical compound Cl.NCCC1=CC=C(O)C(O)=C1 CTENFNNZBMHDDG-UHFFFAOYSA-N 0.000 claims description 6
- 239000007853 buffer solution Substances 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Chemical compound OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 claims description 6
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 claims description 5
- 244000137852 Petrea volubilis Species 0.000 claims description 5
- 229930003268 Vitamin C Natural products 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 5
- 235000019154 vitamin C Nutrition 0.000 claims description 5
- 239000011718 vitamin C Substances 0.000 claims description 5
- IKGDKYQNRJGWMZ-RGMNGODLSA-N (2s)-2-amino-3-(3,4-dihydroxyphenyl)propanoic acid;hydrobromide Chemical compound Br.OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 IKGDKYQNRJGWMZ-RGMNGODLSA-N 0.000 claims description 3
- SNZIFNXFAFKRKT-NSHDSACASA-N (2s)-2-azaniumyl-3-[4-[(2-methylpropan-2-yl)oxy]phenyl]propanoate Chemical compound CC(C)(C)OC1=CC=C(C[C@H]([NH3+])C([O-])=O)C=C1 SNZIFNXFAFKRKT-NSHDSACASA-N 0.000 claims description 3
- AMCDZTCOQXPOAZ-UHFFFAOYSA-N 1-hydroxy-2,3-dihydroindol-2-ol Chemical compound C1=CC=C2N(O)C(O)CC2=C1 AMCDZTCOQXPOAZ-UHFFFAOYSA-N 0.000 claims description 3
- IAGPESOLVJAEAG-BQBZGAKWSA-N 2-S-cysteinyl-DOPA Chemical compound OC(=O)[C@@H](N)CSC1=C(C[C@H](N)C(O)=O)C=CC(O)=C1O IAGPESOLVJAEAG-BQBZGAKWSA-N 0.000 claims description 3
- IAGPESOLVJAEAG-UHFFFAOYSA-N 2-S-cysteinyldopa Natural products OC(=O)C(N)CSC1=C(CC(N)C(O)=O)C=CC(O)=C1O IAGPESOLVJAEAG-UHFFFAOYSA-N 0.000 claims description 3
- QKNYBSVHEMOAJP-UHFFFAOYSA-N 2-amino-2-(hydroxymethyl)propane-1,3-diol;hydron;chloride Chemical compound Cl.OCC(N)(CO)CO QKNYBSVHEMOAJP-UHFFFAOYSA-N 0.000 claims description 3
- WTDRDQBEARUVNC-UHFFFAOYSA-N L-Dopa Natural products OC(=O)C(N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-UHFFFAOYSA-N 0.000 claims description 3
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims description 3
- 235000004279 alanine Nutrition 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 229960001149 dopamine hydrochloride Drugs 0.000 claims description 3
- SBBWEQLNKVHYCX-UHFFFAOYSA-N ethyl 2-amino-3-(4-hydroxyphenyl)propanoate Chemical compound CCOC(=O)C(N)CC1=CC=C(O)C=C1 SBBWEQLNKVHYCX-UHFFFAOYSA-N 0.000 claims description 3
- 229960004502 levodopa Drugs 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
- SFLSHLFXELFNJZ-UHFFFAOYSA-N noradrenaline Chemical compound NCC(O)C1=CC=C(O)C(O)=C1 SFLSHLFXELFNJZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000523 polyvinylpolypyrrolidone Polymers 0.000 claims description 3
- 235000013809 polyvinylpolypyrrolidone Nutrition 0.000 claims description 3
- 239000001253 polyvinylpolypyrrolidone Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000005067 remediation Methods 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 150000003943 catecholamines Chemical class 0.000 abstract description 2
- 238000006722 reduction reaction Methods 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910001961 silver nitrate Inorganic materials 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- DVVXXHVHGGWWPE-UHFFFAOYSA-N 2-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=CC=C1C(O)=O DVVXXHVHGGWWPE-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
本发明公开了一种表面金属涂层原位修复方法,属于电子器件及表面修复领域。本发明首先在清理后的残损部位涂刷一层粘性邻苯二酚胺类化合物溶液,经过化合物的聚合反应会在基体材料上形成一层邻苯二酚胺类聚合物。然后,在此聚合物上再涂抹一层钯纳米颗粒,用以催化后续的金属还原反应,最后得到新的一层金属涂层。本方法基于表面处理和快速无电沉积等技术,可以根据具体应用需求,灵活选择修补材料,以实现快速修复电子元器件的目的。本方法具有操作简单、适应性强、参数可控、成功率高、重复性好等特点,容易实施,为包括天线阵列在被的电子器件金属表面修复提供了新的思路和实施方案,具有良好的应用前景。
Description
技术领域
本发明属于电子器件表面修复技术领域,特别是指一种表面金属涂层原位修复方法。
背景技术
天线被广泛应用在商用飞机、军用飞机、卫星,无人机以及地面上的电子终端中。然而,目前的天线,特别是航空航天中使用的RF天线,在重量方面还需要进一步减轻,天线的设计也有继续优化的空间。3D打印天线在这种背景下应运而生。其将先进的3D打印技术应用于制造微波/毫米波天线器件,极大地提高了微波/毫米波天线器件的生产效率并降低其生产成本,从而从根本上减低未来高速通讯链路等领域的基础建设和使用成本。
目前,在3D打印领域中,金属粉末打印虽然能够满足天线器件导电性的需求,但是无法保证其打印精度。与之相比,不导电的紫外光固化树脂打印更容易满足天线器件对成型精度的要求。因此,常见的方法是先用紫外光固化树脂打印的方法制备天线器件,然后再通过表面处理方式,例如磁控溅射、无电沉积、浸粘等方法在立体天线器件上生长一层金属镀层,实现器件的导电化。然而,这样的加工方式常常会出现天线器件表面金属涂层剥落、破损或者划伤等问题。因此需要对破损涂层位置进行修复,用以保证天线器件的信号传输功能。
目前,还没有一种可靠、有效的立体表面局部修补的方法。公开号为CN103898468的中国专利提供了一种零件表面金属镀层缺陷的修复方法,该方法在真空环境下采用磁控溅射技术,使用和表面涂层相同或者相近的材料对缺陷或者损伤进行修补。该方法实施难度大,对设备和材料要求高,尤其对于在使用环境下的立体天线器件,不能实现原位修补。公开号为CN101108447A的中国专利提供了一种基于激光快速成型机的零件表面修补方法,该方法应用激光快速成型机完备的前处理和控制加工系统,在真空或者惰性气体气氛下对工模具和零件损伤进行局部修复。同样,该方法实施难度大,不适用于高分子材料基体零件。
发明内容
本发明的目的在于克服现有技术的不足,提供一种表面金属涂层原位修复方法,该方法简单高效,能实现天线器件等立体部件的表面金属涂层修复。
为了实现上述目的,本发明采用的技术方案为:
一种表面金属涂层原位修复方法,包括如下步骤:
步骤1:对金属涂层破损部位进行清洁处理,然后晾干;
步骤2:配制含有邻苯二酚的胺类聚合物的粘性溶液;
步骤3:配制含有钯离子的纳米颗粒悬浮液;
步骤4:配制对应于破损部位处原金属涂层的金属无电沉积溶液;
步骤5:在做好清洁处理后的金属涂层破损部位处涂敷步骤2中配制的粘性溶液,放置一段时间后,将粘性溶液擦拭掉,用去离子水对金属涂层破损部位进行擦拭清洗,晾干;
步骤6:在步骤5处理后的金属涂层破损部位处涂敷步骤3中配制的悬浮液;
步骤7:擦拭、清洗步骤6中所涂敷的悬浮溶液;
步骤8:在金属涂层破损部位处反复涂敷步骤4中配制的金属无电沉积溶液,直至新的金属颗粒长出,形成新的金属涂层。
进一步的,所述步骤1中清洁处理的方式为,用砂纸打磨金属涂层破损部位,然后用有机溶液进行清洗。
进一步的,所述有机溶液为甲醇或乙醇。
进一步的,所述步骤2中粘性溶液的配制方式为,将邻苯二酚胺类化合物溶解于pH为8.5的Tris-HCl缓冲液中,并向缓冲液中加入硫酸铜和双氧水以加速聚合反应,然后用黄原胶进行粘度调整。
进一步的,所述邻苯二酚胺类化合物为含有二羟基苯基功能团的有机单分子类化合物。
进一步的,配制好的粘性溶液中各组分的占比为:邻苯二酚胺类化合物占溶液成分的0.2 – 0.5 wt%,硫酸铜占溶液成分的 0.1 wt%,双氧水占溶液成分的 0.03 wt%,黄原胶占溶液成分的0.1-0.3 wt%。
进一步的,所述邻苯二酚胺类化合物为以下一种或者多种:
多巴胺、盐酸多巴胺、3,4-二羟基-β-苯乙胺盐酸、L-3-(3,4-二羟基苯)丙氨酸、2-(3,4-二羟基苯基)乙胺、3-羟酪胺氢溴酸、L-酪氨酸乙酯盐酸盐、O-叔丁基-L-酪氨酸、DL-酪氨酸、3,4-二羟苯丙氨酸、二羟苯丙氨酸多巴、2-S-半胱氨酰多巴、二羟基二氢吲哚、3,4-三羟基-N-甲基苯乙胺或者1-(3,4-二羟苯基)-2-氨基乙醇。
进一步的,用涂敷工具蘸取粘性溶液并涂敷在金属涂层破损部位处,常温放置290~320秒后将其擦拭掉,然后用去离子水对金属涂层破损部位进行擦拭清洗,晾干。
进一步的,将氯化铵、氯化钯、聚乙烯聚吡咯烷酮、维生素C加入去离子水中并充分搅拌,得到含有钯离子的纳米颗粒悬浮液。
本发明采用上述技术方案的有益效果在于:
1、本发明利用邻苯二酚的胺类化合物聚合后所产生聚合物的易于螯合金属离子的特性,通过掺和黄原胶调整溶液粘度,使该层聚合物一方面可以在材料基体上形成强粘结层,另一方面可以吸附可用于催化无电沉积的金属催化剂离子,继而促使后续无电沉积反应,最终实现金属涂层的局部修复。
2、本发明基于表面处理和快速无电沉积等技术,可以根据具体应用需求,灵活选择修补材料,以实现快速修复电子元器件的目的。
3、本发明理论上不受天线器件的形状限制,可以修补任意种类天线器件,且具有操作简单、适应性强、参数可控、成功率高、重复性好等特点,易于实施,为包括天线阵列在内的电子器件金属表面修复提供了新的思路和实施方案,具有良好的应用前景。
总之,本发明简单高效,成本低廉,易于实施,适用于任意形状的天线器件,可用于多种表面金属材料的修复,能够快速恢复器件的导电和信号传输性能,具有较强的实用性。
具体实施方式
下面结合具体实施例对本发明作进一步的详细说明,但本发明不限于以下实施例。
一种表面金属涂层原位修复方法,包括如下步骤:
步骤1:对金属涂层破损部位进行清洁处理,然后晾干;
步骤2:配制含有邻苯二酚的胺类聚合物的粘性溶液;
步骤3:配制含有钯离子的纳米颗粒悬浮液;
步骤4:配制对应于破损部位处原金属涂层的金属无电沉积溶液;
步骤5:在做好清洁处理后的金属涂层破损部位处涂敷步骤2中配制的粘性溶液,放置一段时间后,将粘性溶液擦拭掉,用去离子水对金属涂层破损部位进行擦拭清洗,晾干;
步骤6:在步骤5处理后的金属涂层破损部位处涂敷步骤3中配制的悬浮液;
步骤7:擦拭、清洗步骤6中所涂敷的悬浮溶液;
步骤8:在金属涂层破损部位处反复涂敷步骤4中配制的金属无电沉积溶液,直至新的金属颗粒长出,形成新的金属涂层。
进一步的,所述步骤1中清洁处理的方式为,用砂纸打磨金属涂层破损部位,然后用有机溶液进行清洗。
进一步的,所述有机溶液为甲醇或乙醇。
进一步的,所述步骤2中粘性溶液的配制方式为,将邻苯二酚胺类化合物溶解于pH为8.5的Tris-HCl缓冲液中,并向缓冲液中加入硫酸铜和双氧水以加速聚合反应,然后用黄原胶进行粘度调整。
进一步的,所述邻苯二酚胺类化合物为含有二羟基苯基功能团的有机单分子类化合物。
进一步的,配制好的粘性溶液中各组分的占比为:邻苯二酚胺类化合物占溶液成分的0.2 – 0.5 wt%,硫酸铜占溶液成分的 0.1 wt%,双氧水占溶液成分的 0.03 wt%,黄原胶占溶液成分的0.1-0.3 wt%。
进一步的,所述邻苯二酚胺类化合物为以下一种或者多种:
多巴胺、盐酸多巴胺、3,4-二羟基-β-苯乙胺盐酸、L-3-(3,4-二羟基苯)丙氨酸、2-(3,4-二羟基苯基)乙胺、3-羟酪胺氢溴酸、L-酪氨酸乙酯盐酸盐、O-叔丁基-L-酪氨酸、DL-酪氨酸、3,4-二羟苯丙氨酸、二羟苯丙氨酸多巴、2-S-半胱氨酰多巴、二羟基二氢吲哚、3,4-三羟基-N-甲基苯乙胺或者1-(3,4-二羟苯基)-2-氨基乙醇。
进一步的,用涂敷工具蘸取粘性溶液并涂敷在金属涂层破损部位处,常温放置290~320秒后将其擦拭掉,然后用去离子水对金属涂层破损部位进行擦拭清洗,晾干。
进一步的,将氯化铵、氯化钯、聚乙烯聚吡咯烷酮、维生素C加入去离子水中并充分搅拌,得到含有钯离子的纳米颗粒悬浮液。
以下为更具体的实施例:
实施例1:针对以聚丙烯酸为基体的立体天线器件,表面金属涂层为铜,局部铜层出现破损,影响其信号传输性能。修复方式如下:
用砂纸轻轻打磨破损位置,用酒精擦拭清洗,晾干;
粘性邻苯二酚胺类化合物溶液由2g/L的多巴胺、1g/L的硫酸铜、300μL/L的过氧化氢混合含有2g/L的黄原胶的Tris8.5得到;
钯纳米颗粒悬浮液由中氯化铵(9g/L)、氯化钯(3g/L)、PVP(9.4g/L)、维生素C(6g/L)混合去离子水后充分搅拌得到;
铜的无电沉积溶液由A、B两溶液混合得到。其中A溶液由30g/L的乙二胺四乙酸、15g/L的CuCl2和12g/L的硼酸的水溶液组成。B溶液为12g/L的二甲基氨基苯甲酸水溶液,作为辅助金属螯合剂。在使用前将A和B两种溶液混合。
用刷子在涂层破损位置轻轻涂敷一层多巴胺粘性Tris 溶液,静置300s;
用无纺布沾水轻轻擦拭掉上述粘性溶液,然后去离子水冲洗,晾干;
用刷子在涂层破损部位轻轻涂敷一层钯纳米颗粒悬浮液,静置30s;
用去离子水冲洗破损位置;
用刷子蘸取铜无电沉积溶液,反复涂敷残损位置,经150s后重新得到一层铜导电层,清水冲洗。
实施例 2:针对以聚丙烯酸为基体的立体天线器件,表面金属涂层为银,局部银层出现破损,影响其信号传输性能。修复方式如下:
用砂纸轻轻打磨破损位置,用酒精擦拭清洗,晾干;
粘性邻苯二酚胺类化合物溶液由2g/L的多巴胺、1g/L的硫酸铜、300μL/L的过氧化氢混合含有2g/L的黄原胶的Tris8.5得到;
钯纳米颗粒悬浮液由中氯化铵(9g/L)、氯化钯(3g/L)、PVP(9.4g/L)、维生素C(6g/L)混合去离子水后充分搅拌得到;
银的无电沉积溶液由2g/L的硝酸银、0.2g/L的EDTA二钠和1mL/L的甲醛混合去离子水组成。在配制过程中,首先将硝酸银和EDTA二钠分别溶于去离子水中。然后在将硝酸银溶液与EDTA二钠溶液边搅拌边混合。在此溶液中逐滴加入25wt%的氨水,直至溶液由浑浊重新变清澈。然后按比例混入甲醛,添加去离子水标定到1L;
用刷子在涂层破损位置轻轻涂敷一层多巴胺粘性Tris 溶液,静置300s;
用无纺布沾水轻轻擦拭掉上述粘性溶液,然后去离子水冲洗,晾干;
用刷子在涂层破损部位轻轻涂敷一层钯纳米颗粒悬浮液,静置30s;
用去离子水冲洗破损位置;
用刷子蘸取银无电沉积溶液,反复涂敷残损位置,经150s后重新得到一层铜导电层,清水冲洗。
总之,本发明首先在清理后的残损部位涂刷一层粘性邻苯二酚胺类化合物溶液,经过化合物的聚合反应会在基体材料上形成一层邻苯二酚胺类聚合物。然后,在此聚合物上再涂抹一层钯纳米颗粒,用以催化后续的金属还原反应,最后得到新的一层金属涂层。
本发明针对3D打印轻量化天线器件常见的表面金属涂层破损、剥落或者刮痕等问题,提出了一种高效、快速、低成本的表面修复方法,能够迅速恢复天线器件阵列信号传输性能要求。本方法基于表面处理和快速无电沉积等技术,可以根据具体应用需求,灵活选择修补材料,以实现快速修复电子元器件的目的。本方法理论上不受天线器件的形状限制,可以修补任意种类天线器件,具有操作简单、适应性强、参数可控、成功率高、重复性好等特点,容易实施,为包括天线阵列在被的电子器件金属表面修复提供了新的思路和实施方案,具有良好的应用前景。
Claims (9)
1.一种表面金属涂层原位修复方法,其特征在于,包括如下步骤:
步骤1:对金属涂层破损部位进行清洁处理,然后晾干;
步骤2:配制含有邻苯二酚的胺类聚合物的粘性溶液;
步骤3:配制含有钯离子的纳米颗粒悬浮液;
步骤4:配制对应于破损部位处原金属涂层的金属无电沉积溶液;
步骤5:在做好清洁处理后的金属涂层破损部位处涂敷步骤2中配制的粘性溶液,放置一段时间后,将粘性溶液擦拭掉,用去离子水对金属涂层破损部位进行擦拭清洗,晾干;
步骤6:在步骤5处理后的金属涂层破损部位处涂敷步骤3中配制的悬浮液;
步骤7:擦拭、清洗步骤6中所涂敷的悬浮溶液;
步骤8:在金属涂层破损部位处反复涂敷步骤4中配制的金属无电沉积溶液,直至新的金属颗粒长出,形成新的金属涂层。
2.根据权利要求1所述的一种表面金属涂层原位修复方法,其特征在于,所述步骤1中清洁处理的方式为,用砂纸打磨金属涂层破损部位,然后用有机溶液进行清洗。
3.根据权利要求2所述的一种表面金属涂层原位修复方法,其特征在于,所述有机溶液为甲醇或乙醇。
4.根据权利要求1所述的一种表面金属涂层原位修复方法,其特征在于,所述步骤2中粘性溶液的配制方式为,将邻苯二酚胺类化合物溶解于pH为8.5的Tris-HCl缓冲液中,并向缓冲液中加入硫酸铜和双氧水以加速聚合反应,然后用黄原胶进行粘度调整。
5.根据权利要求4所述的一种表面金属涂层原位修复方法,其特征在于,所述邻苯二酚胺类化合物为含有二羟基苯基功能团的有机单分子类化合物。
6.根据权利要求4所述的一种表面金属涂层原位修复方法,其特征在于,配制好的粘性溶液中各组分的占比为:邻苯二酚胺类化合物占溶液成分的0.2 – 0.5 wt%,硫酸铜占溶液成分的 0.1 wt%,双氧水占溶液成分的 0.03 wt%,黄原胶占溶液成分的0.1-0.3 wt%。
7.根据权利要求4所述的一种表面金属涂层原位修复方法,其特征在于,所述邻苯二酚胺类化合物为以下一种或者多种:
多巴胺、盐酸多巴胺、3,4-二羟基-β-苯乙胺盐酸、L-3-(3,4-二羟基苯)丙氨酸、2-(3,4-二羟基苯基)乙胺、3-羟酪胺氢溴酸、L-酪氨酸乙酯盐酸盐、O-叔丁基-L-酪氨酸、DL-酪氨酸、3,4-二羟苯丙氨酸、二羟苯丙氨酸多巴、2-S-半胱氨酰多巴、二羟基二氢吲哚、3,4-三羟基-N-甲基苯乙胺或者1-(3,4-二羟苯基)-2-氨基乙醇。
8.根据权利要求1所述的一种表面金属涂层原位修复方法,其特征在于,所述步骤5的具体方式为,用涂敷工具蘸取粘性溶液并涂敷在金属涂层破损部位处,常温放置290~320秒后将其擦拭掉,然后用去离子水对金属涂层破损部位进行擦拭清洗,晾干。
9.根据权利要求1所述的一种表面金属涂层原位修复方法,其特征在于,所述步骤3的具体方式为,将氯化铵、氯化钯、聚乙烯聚吡咯烷酮、维生素C加入去离子水中并充分搅拌,得到含有钯离子的纳米颗粒悬浮液。
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