CN111816630B - 一种散热结构及功率模块 - Google Patents
一种散热结构及功率模块 Download PDFInfo
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- CN111816630B CN111816630B CN202010613862.7A CN202010613862A CN111816630B CN 111816630 B CN111816630 B CN 111816630B CN 202010613862 A CN202010613862 A CN 202010613862A CN 111816630 B CN111816630 B CN 111816630B
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- heat
- power unit
- heat dissipation
- power
- radiator
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- 230000005855 radiation Effects 0.000 title claims description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 206
- 238000005192 partition Methods 0.000 claims description 9
- 238000009423 ventilation Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910021389 graphene Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010613862.7A CN111816630B (zh) | 2020-06-30 | 2020-06-30 | 一种散热结构及功率模块 |
PCT/CN2020/129299 WO2022000940A1 (zh) | 2020-06-30 | 2020-11-17 | 一种散热结构及功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010613862.7A CN111816630B (zh) | 2020-06-30 | 2020-06-30 | 一种散热结构及功率模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111816630A CN111816630A (zh) | 2020-10-23 |
CN111816630B true CN111816630B (zh) | 2022-07-05 |
Family
ID=72856402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010613862.7A Active CN111816630B (zh) | 2020-06-30 | 2020-06-30 | 一种散热结构及功率模块 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN111816630B (zh) |
WO (1) | WO2022000940A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111816630B (zh) * | 2020-06-30 | 2022-07-05 | 科华恒盛股份有限公司 | 一种散热结构及功率模块 |
CN114430652B (zh) * | 2022-02-12 | 2024-08-16 | 合肥工业大学 | 一种基于热成像技术的电子器件散热装置 |
CN114867287B (zh) * | 2022-02-25 | 2023-11-24 | 太仓陶氏电气有限公司 | 一种上下间距调节型散热器及其工作方法 |
CN114838339B (zh) * | 2022-04-29 | 2024-01-23 | 佛山电器照明股份有限公司 | 一种散热装置、散热装置的设计方法及集鱼灯 |
CN115033064B (zh) * | 2022-06-30 | 2024-06-07 | 西安易朴通讯技术有限公司 | 一种导风结构、gpu组件及服务器 |
CN116709725B (zh) * | 2023-04-19 | 2024-02-06 | 东莞市万亨达热传科技有限公司 | 高密度复合散热器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09280758A (ja) * | 1996-04-17 | 1997-10-31 | Fujikura Ltd | ヒートパイプ式熱交換器 |
JP2005276918A (ja) * | 2004-03-23 | 2005-10-06 | Furukawa Electric Co Ltd:The | 冷却装置 |
EP2887787A3 (en) * | 2013-12-13 | 2015-08-19 | Hitachi, Ltd. | Cooling structure for heating element and power converter |
CN204466125U (zh) * | 2014-10-09 | 2015-07-08 | 帝斯曼知识产权资产管理有限公司 | 一种集成散热器连接排模块 |
TW201628484A (zh) * | 2015-01-23 | 2016-08-01 | Tai Sol Electronics Co Ltd | 使用制冷晶片的散熱系統 |
CN205911298U (zh) * | 2015-12-10 | 2017-01-25 | 绵阳雅晶科技有限公司 | 一种晶体管散热装置 |
CN105934139B (zh) * | 2016-06-16 | 2018-05-22 | 广东合一新材料研究院有限公司 | 大功率器件的工质接触式冷却系统及其工作方法 |
CN107819172B (zh) * | 2017-10-25 | 2024-07-02 | 珠海格力电器股份有限公司 | 一种电池筒组件、电池组件及车 |
CN209297181U (zh) * | 2019-02-02 | 2019-08-23 | 德威(苏州)新能源有限公司 | 一种高效液态循环温控装置 |
JP7186645B2 (ja) * | 2019-03-20 | 2022-12-09 | 株式会社東芝 | 半導体装置 |
CN210042701U (zh) * | 2019-05-17 | 2020-02-07 | 台达电子企业管理(上海)有限公司 | 散热结构及具有该散热结构的功率变换器 |
CN110519967B (zh) * | 2019-08-22 | 2021-01-01 | 科华恒盛股份有限公司 | 功率模块 |
CN111816630B (zh) * | 2020-06-30 | 2022-07-05 | 科华恒盛股份有限公司 | 一种散热结构及功率模块 |
-
2020
- 2020-06-30 CN CN202010613862.7A patent/CN111816630B/zh active Active
- 2020-11-17 WO PCT/CN2020/129299 patent/WO2022000940A1/zh active Application Filing
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Publication number | Publication date |
---|---|
CN111816630A (zh) | 2020-10-23 |
WO2022000940A1 (zh) | 2022-01-06 |
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Address after: 361000 Ma Long Road 457, Torch Garden, Xiamen Torch High-tech Zone, Xiamen City, Fujian Province Patentee after: Kehua Data Co.,Ltd. Patentee after: ZHANGZHOU KEHUA TECHNOLOGY Co.,Ltd. Address before: 361000 Ma Long Road 457, Torch Garden, Xiamen Torch High-tech Zone, Xiamen City, Fujian Province Patentee before: XIAMEN KEHUAHENGSHENG LIMITED BY SHARE Ltd. Patentee before: ZHANGZHOU KEHUA TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
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Effective date of registration: 20231207 Address after: Room 208-38, Hengye Building, No. 100 Xiangxing Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Xiamen Kehua shuneng Technology Co.,Ltd. Address before: 361000 Ma Long Road 457, Torch Garden, Xiamen Torch High-tech Zone, Xiamen City, Fujian Province Patentee before: Kehua Data Co.,Ltd. Patentee before: ZHANGZHOU KEHUA TECHNOLOGY Co.,Ltd. |