CN111805776A - 带基台的刀具 - Google Patents

带基台的刀具 Download PDF

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Publication number
CN111805776A
CN111805776A CN202010264474.2A CN202010264474A CN111805776A CN 111805776 A CN111805776 A CN 111805776A CN 202010264474 A CN202010264474 A CN 202010264474A CN 111805776 A CN111805776 A CN 111805776A
Authority
CN
China
Prior art keywords
base
cutter
tool
opening
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010264474.2A
Other languages
English (en)
Chinese (zh)
Inventor
田口良二
深泽隆
椛泽孝行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN111805776A publication Critical patent/CN111805776A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202010264474.2A 2019-04-11 2020-04-07 带基台的刀具 Pending CN111805776A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-075445 2019-04-11
JP2019075445A JP7383332B2 (ja) 2019-04-11 2019-04-11 基台付きブレード

Publications (1)

Publication Number Publication Date
CN111805776A true CN111805776A (zh) 2020-10-23

Family

ID=72613695

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010264474.2A Pending CN111805776A (zh) 2019-04-11 2020-04-07 带基台的刀具

Country Status (7)

Country Link
US (1) US11712783B2 (ja)
JP (1) JP7383332B2 (ja)
KR (1) KR20200120505A (ja)
CN (1) CN111805776A (ja)
DE (1) DE102020204556A1 (ja)
SG (1) SG10202002645QA (ja)
TW (1) TWI827831B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235764U (ja) * 1985-08-22 1987-03-03
CN106182476A (zh) * 2015-06-01 2016-12-07 株式会社迪思科 带基台的刀片
WO2018183724A1 (en) * 2017-03-31 2018-10-04 Saint-Gobain Abrasives, Inc. Grinding wheel assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002178268A (ja) 2000-12-14 2002-06-25 Nippon Plastic Seito Kk 皮膜固定抵抗器のトリミング用研削砥石とその支持具
JP4763389B2 (ja) 2005-09-05 2011-08-31 株式会社ディスコ 切削工具
JP5690581B2 (ja) 2010-12-27 2015-03-25 株式会社ディスコ 切削ブレード
DE102013204922A1 (de) 2013-03-20 2014-09-25 Hilti Aktiengesellschaft Vibrationsminimierung bei Diamanttrennscheiben
JP6069122B2 (ja) * 2013-07-22 2017-02-01 株式会社ディスコ 切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235764U (ja) * 1985-08-22 1987-03-03
CN106182476A (zh) * 2015-06-01 2016-12-07 株式会社迪思科 带基台的刀片
WO2018183724A1 (en) * 2017-03-31 2018-10-04 Saint-Gobain Abrasives, Inc. Grinding wheel assembly

Also Published As

Publication number Publication date
KR20200120505A (ko) 2020-10-21
JP2020171992A (ja) 2020-10-22
SG10202002645QA (en) 2020-11-27
US20200324391A1 (en) 2020-10-15
DE102020204556A1 (de) 2020-10-15
TW202037459A (zh) 2020-10-16
US11712783B2 (en) 2023-08-01
JP7383332B2 (ja) 2023-11-20
TWI827831B (zh) 2024-01-01

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