JP2020171992A - 基台付きブレード - Google Patents
基台付きブレード Download PDFInfo
- Publication number
- JP2020171992A JP2020171992A JP2019075445A JP2019075445A JP2020171992A JP 2020171992 A JP2020171992 A JP 2020171992A JP 2019075445 A JP2019075445 A JP 2019075445A JP 2019075445 A JP2019075445 A JP 2019075445A JP 2020171992 A JP2020171992 A JP 2020171992A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- base
- convex portion
- opening
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 238000005520 cutting process Methods 0.000 description 28
- 239000000758 substrate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
4 基台
4a 第1面
4b 第2面
4c 外周縁
4d 開口部
4e 凸部
4f 外周縁
4g 第1凸部
4h 第2凸部
4i 第1先端面
4j 第2先端面
6 ブレード
6a 第1面
6b 第2面
6c 外周縁
6d 開口部
20 切削装置
22 基台
24 カバー
24a 前面
26 切削ユニット
28 チャックテーブル
30 カセットエレベータ
32 カセット
34 モニタ
40 回転軸(スピンドル)
42 スピンドルハウジング
44 ブレードマウント
46 フランジ部(固定フランジ)
46a 表面
46b 凸部
46c 先端面
48 支持軸
48a ねじ部
50 固定ナット
50a 開口部
11 被加工物
Claims (1)
- 回転軸に装着される基台付きブレードであって、
環状の基台と、該基台の第1面側に固定され中央に開口部が形成された環状のブレードと、を有し、
該基台は、該第1面から突出し外周縁の形状が該開口部の形状に対応する凸部を有し、
該基台と該ブレードとは、該凸部が該開口部に挿入されることによって位置合わせがなされた状態で、接着剤を介して結合されることを特徴とする基台付きブレード。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019075445A JP7383332B2 (ja) | 2019-04-11 | 2019-04-11 | 基台付きブレード |
SG10202002645QA SG10202002645QA (en) | 2019-04-11 | 2020-03-23 | Hubbed blade |
KR1020200035702A KR20200120505A (ko) | 2019-04-11 | 2020-03-24 | 기대 부착 블레이드 |
US16/833,990 US11712783B2 (en) | 2019-04-11 | 2020-03-30 | Hubbed blade |
TW109111329A TWI827831B (zh) | 2019-04-11 | 2020-04-01 | 附基台刀片 |
CN202010264474.2A CN111805776A (zh) | 2019-04-11 | 2020-04-07 | 带基台的刀具 |
DE102020204556.9A DE102020204556A1 (de) | 2019-04-11 | 2020-04-08 | Nabengelagerte klinge |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019075445A JP7383332B2 (ja) | 2019-04-11 | 2019-04-11 | 基台付きブレード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020171992A true JP2020171992A (ja) | 2020-10-22 |
JP7383332B2 JP7383332B2 (ja) | 2023-11-20 |
Family
ID=72613695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019075445A Active JP7383332B2 (ja) | 2019-04-11 | 2019-04-11 | 基台付きブレード |
Country Status (7)
Country | Link |
---|---|
US (1) | US11712783B2 (ja) |
JP (1) | JP7383332B2 (ja) |
KR (1) | KR20200120505A (ja) |
CN (1) | CN111805776A (ja) |
DE (1) | DE102020204556A1 (ja) |
SG (1) | SG10202002645QA (ja) |
TW (1) | TWI827831B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6235764U (ja) * | 1985-08-22 | 1987-03-03 | ||
JP2002178268A (ja) * | 2000-12-14 | 2002-06-25 | Nippon Plastic Seito Kk | 皮膜固定抵抗器のトリミング用研削砥石とその支持具 |
JP2007073586A (ja) * | 2005-09-05 | 2007-03-22 | Disco Abrasive Syst Ltd | 切削工具 |
JP2016221637A (ja) * | 2015-06-01 | 2016-12-28 | 株式会社ディスコ | 基台付きブレード |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5690581B2 (ja) | 2010-12-27 | 2015-03-25 | 株式会社ディスコ | 切削ブレード |
DE102013204922A1 (de) | 2013-03-20 | 2014-09-25 | Hilti Aktiengesellschaft | Vibrationsminimierung bei Diamanttrennscheiben |
JP6069122B2 (ja) * | 2013-07-22 | 2017-02-01 | 株式会社ディスコ | 切削装置 |
KR102303151B1 (ko) * | 2017-03-31 | 2021-09-23 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 연삭 휠 어셈블리 |
-
2019
- 2019-04-11 JP JP2019075445A patent/JP7383332B2/ja active Active
-
2020
- 2020-03-23 SG SG10202002645QA patent/SG10202002645QA/en unknown
- 2020-03-24 KR KR1020200035702A patent/KR20200120505A/ko active Search and Examination
- 2020-03-30 US US16/833,990 patent/US11712783B2/en active Active
- 2020-04-01 TW TW109111329A patent/TWI827831B/zh active
- 2020-04-07 CN CN202010264474.2A patent/CN111805776A/zh active Pending
- 2020-04-08 DE DE102020204556.9A patent/DE102020204556A1/de active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6235764U (ja) * | 1985-08-22 | 1987-03-03 | ||
JP2002178268A (ja) * | 2000-12-14 | 2002-06-25 | Nippon Plastic Seito Kk | 皮膜固定抵抗器のトリミング用研削砥石とその支持具 |
JP2007073586A (ja) * | 2005-09-05 | 2007-03-22 | Disco Abrasive Syst Ltd | 切削工具 |
JP2016221637A (ja) * | 2015-06-01 | 2016-12-28 | 株式会社ディスコ | 基台付きブレード |
Also Published As
Publication number | Publication date |
---|---|
KR20200120505A (ko) | 2020-10-21 |
SG10202002645QA (en) | 2020-11-27 |
CN111805776A (zh) | 2020-10-23 |
US20200324391A1 (en) | 2020-10-15 |
DE102020204556A1 (de) | 2020-10-15 |
TW202037459A (zh) | 2020-10-16 |
US11712783B2 (en) | 2023-08-01 |
JP7383332B2 (ja) | 2023-11-20 |
TWI827831B (zh) | 2024-01-01 |
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