CN111796486B - 位置检测装置、曝光装置和物品制造方法 - Google Patents
位置检测装置、曝光装置和物品制造方法 Download PDFInfo
- Publication number
- CN111796486B CN111796486B CN202010242868.8A CN202010242868A CN111796486B CN 111796486 B CN111796486 B CN 111796486B CN 202010242868 A CN202010242868 A CN 202010242868A CN 111796486 B CN111796486 B CN 111796486B
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- China
- Prior art keywords
- optical system
- array
- aperture stop
- substrate
- position detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 147
- 238000001514 detection method Methods 0.000 claims abstract description 126
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 238000005286 illumination Methods 0.000 claims abstract description 78
- 210000001747 pupil Anatomy 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 83
- 238000000034 method Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 4
- 230000010287 polarization Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
- G02B21/08—Condensers
- G02B21/10—Condensers affording dark-field illumination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/04—Optical benches therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
- G02B21/361—Optical details, e.g. image relay to the camera or image sensor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Multimedia (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019070712A JP7257853B2 (ja) | 2019-04-02 | 2019-04-02 | 位置検出装置、露光装置および物品製造方法 |
| JP2019-070712 | 2019-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111796486A CN111796486A (zh) | 2020-10-20 |
| CN111796486B true CN111796486B (zh) | 2024-09-13 |
Family
ID=72662362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010242868.8A Active CN111796486B (zh) | 2019-04-02 | 2020-03-31 | 位置检测装置、曝光装置和物品制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11231573B2 (enExample) |
| JP (1) | JP7257853B2 (enExample) |
| KR (1) | KR102720087B1 (enExample) |
| CN (1) | CN111796486B (enExample) |
| TW (1) | TWI805906B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023160136A (ja) | 2022-04-21 | 2023-11-02 | キヤノン株式会社 | 校正方法、検出系、露光装置、物品の製造方法及びプログラム |
| CN115682936A (zh) * | 2022-11-18 | 2023-02-03 | 苏州博众智能机器人有限公司 | 转盘检测平台 |
| US20240183657A1 (en) * | 2022-12-05 | 2024-06-06 | Samsung Electronics Co., Ltd. | Optical device and optical measurement method |
| DE102023104118A1 (de) * | 2023-02-20 | 2024-08-22 | Carl Zeiss Smt Gmbh | Maskenmetrologische Messvorrichtung und Verfahren zum Untersuchen einer Fotomaske |
| CN118331000B (zh) * | 2024-05-20 | 2024-11-29 | 无锡旭电科技有限公司 | 一种用于掩模对准光刻设备的照明系统及方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04364020A (ja) * | 1991-06-11 | 1992-12-16 | Hitachi Ltd | パターン検出装置及び露光装置 |
| JP3600920B2 (ja) * | 1995-04-28 | 2004-12-15 | 株式会社ニコン | 位置検出装置、それを用いた露光装置、その露光装置を用いた素子製造方法。 |
| US5994006A (en) * | 1996-06-04 | 1999-11-30 | Nikon Corporation | Projection exposure methods |
| WO1999040613A1 (en) * | 1998-02-09 | 1999-08-12 | Nikon Corporation | Method of adjusting position detector |
| JP3994209B2 (ja) | 1998-08-28 | 2007-10-17 | 株式会社ニコン | 光学系の検査装置および検査方法並びに該検査装置を備えた位置合わせ装置および投影露光装置 |
| KR20010085493A (ko) * | 2000-02-25 | 2001-09-07 | 시마무라 기로 | 노광장치, 그 조정방법, 및 상기 노광장치를 이용한디바이스 제조방법 |
| TWI569308B (zh) * | 2003-10-28 | 2017-02-01 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法 |
| JP4778755B2 (ja) * | 2005-09-09 | 2011-09-21 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びこれを用いた装置 |
| JP2008071839A (ja) * | 2006-09-12 | 2008-03-27 | Canon Inc | 表面位置検出方法、露光装置及びデバイスの製造方法 |
| JP5036429B2 (ja) * | 2007-07-09 | 2012-09-26 | キヤノン株式会社 | 位置検出装置、露光装置、デバイス製造方法及び調整方法 |
| JP5039495B2 (ja) * | 2007-10-04 | 2012-10-03 | ルネサスエレクトロニクス株式会社 | マスクブランク検査方法、反射型露光マスクの製造方法、反射型露光方法および半導体集積回路の製造方法 |
| JP5525336B2 (ja) * | 2010-06-08 | 2014-06-18 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法および欠陥検査装置 |
| JP5706861B2 (ja) * | 2011-10-21 | 2015-04-22 | キヤノン株式会社 | 検出器、検出方法、インプリント装置及び物品製造方法 |
| JP2013175684A (ja) * | 2012-02-27 | 2013-09-05 | Canon Inc | 検出器、インプリント装置及び物品を製造する方法 |
| JP6632252B2 (ja) * | 2015-08-21 | 2020-01-22 | キヤノン株式会社 | 検出装置、インプリント装置、物品の製造方法及び照明光学系 |
| JP6207671B1 (ja) * | 2016-06-01 | 2017-10-04 | キヤノン株式会社 | パターン形成装置、基板配置方法及び物品の製造方法 |
| EP3336605A1 (en) * | 2016-12-15 | 2018-06-20 | ASML Netherlands B.V. | Method of measuring a structure, inspection apparatus, lithographic system and device manufacturing method |
| JP7182904B2 (ja) * | 2018-05-31 | 2022-12-05 | キヤノン株式会社 | 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法 |
-
2019
- 2019-04-02 JP JP2019070712A patent/JP7257853B2/ja active Active
-
2020
- 2020-03-19 TW TW109109106A patent/TWI805906B/zh active
- 2020-03-19 KR KR1020200033522A patent/KR102720087B1/ko active Active
- 2020-03-23 US US16/826,458 patent/US11231573B2/en active Active
- 2020-03-31 CN CN202010242868.8A patent/CN111796486B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200116856A (ko) | 2020-10-13 |
| TW202040643A (zh) | 2020-11-01 |
| US20200319447A1 (en) | 2020-10-08 |
| JP7257853B2 (ja) | 2023-04-14 |
| KR102720087B1 (ko) | 2024-10-22 |
| US11231573B2 (en) | 2022-01-25 |
| CN111796486A (zh) | 2020-10-20 |
| JP2020170070A (ja) | 2020-10-15 |
| TWI805906B (zh) | 2023-06-21 |
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