CN111788668A - 基板搬运装置以及基板搬运方法 - Google Patents

基板搬运装置以及基板搬运方法 Download PDF

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Publication number
CN111788668A
CN111788668A CN201980015141.1A CN201980015141A CN111788668A CN 111788668 A CN111788668 A CN 111788668A CN 201980015141 A CN201980015141 A CN 201980015141A CN 111788668 A CN111788668 A CN 111788668A
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CN
China
Prior art keywords
substrate
holding
period
unit
hand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980015141.1A
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English (en)
Chinese (zh)
Inventor
深津英司
小河丰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN111788668A publication Critical patent/CN111788668A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201980015141.1A 2018-02-28 2019-01-11 基板搬运装置以及基板搬运方法 Pending CN111788668A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-035510 2018-02-28
JP2018035510A JP7007948B2 (ja) 2018-02-28 2018-02-28 基板搬送装置および基板搬送方法
PCT/JP2019/000740 WO2019167447A1 (ja) 2018-02-28 2019-01-11 基板搬送装置および基板搬送方法

Publications (1)

Publication Number Publication Date
CN111788668A true CN111788668A (zh) 2020-10-16

Family

ID=67804892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980015141.1A Pending CN111788668A (zh) 2018-02-28 2019-01-11 基板搬运装置以及基板搬运方法

Country Status (5)

Country Link
JP (1) JP7007948B2 (ja)
KR (1) KR102468631B1 (ja)
CN (1) CN111788668A (ja)
TW (1) TWI728306B (ja)
WO (1) WO2019167447A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113510689A (zh) * 2020-04-10 2021-10-19 日本电产三协（浙江）有限公司 工业用机器人和工业用机器人的控制方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240025052A1 (en) * 2020-09-03 2024-01-25 Kawasaki Jukogyo Kabushiki Kaisha Substrate holding hand and substrate conveying robot
TWI776412B (zh) * 2021-03-03 2022-09-01 迅得機械股份有限公司 物件容器的移載裝置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321165A (ja) * 1994-05-24 1995-12-08 Tokyo Electron Ltd プローブ装置
JPH11145241A (ja) * 1997-11-06 1999-05-28 Toshiba Corp マルチチャンバシステムおよび基板検出方法
CN101226878A (zh) * 2007-01-15 2008-07-23 大日本网目版制造株式会社 基板处理装置以及基板处理方法
KR20120127220A (ko) * 2011-05-12 2012-11-21 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 이것을 구비하는 도포 현상 장치, 및 기판 반송 방법
JP2018010992A (ja) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 フォーカスリング交換方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100852A (ja) 2001-09-25 2003-04-04 Dainippon Screen Mfg Co Ltd 基板飛び出し検出装置およびそれを用いた基板処理装置
JP4276440B2 (ja) 2003-01-06 2009-06-10 東京エレクトロン株式会社 基板検出方法及び装置並びに基板処理装置
JP2009064807A (ja) * 2007-09-04 2009-03-26 Tokyo Electron Ltd 基板位置ずれ検出システム
JP2010283334A (ja) 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP2012074485A (ja) * 2010-09-28 2012-04-12 Tokyo Electron Ltd 基板処理装置及び基板搬送方法並びにその方法を実施するためのプログラムを記憶する記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321165A (ja) * 1994-05-24 1995-12-08 Tokyo Electron Ltd プローブ装置
JPH11145241A (ja) * 1997-11-06 1999-05-28 Toshiba Corp マルチチャンバシステムおよび基板検出方法
CN101226878A (zh) * 2007-01-15 2008-07-23 大日本网目版制造株式会社 基板处理装置以及基板处理方法
KR20120127220A (ko) * 2011-05-12 2012-11-21 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 이것을 구비하는 도포 현상 장치, 및 기판 반송 방법
JP2018010992A (ja) * 2016-07-14 2018-01-18 東京エレクトロン株式会社 フォーカスリング交換方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113510689A (zh) * 2020-04-10 2021-10-19 日本电产三协（浙江）有限公司 工业用机器人和工业用机器人的控制方法

Also Published As

Publication number Publication date
KR20200083623A (ko) 2020-07-08
JP7007948B2 (ja) 2022-01-25
WO2019167447A1 (ja) 2019-09-06
JP2019153609A (ja) 2019-09-12
KR102468631B1 (ko) 2022-11-17
TWI728306B (zh) 2021-05-21
TW201936471A (zh) 2019-09-16

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