CN111775018A - Rust removal polishing method for copper target assembly - Google Patents
Rust removal polishing method for copper target assembly Download PDFInfo
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- CN111775018A CN111775018A CN202010628404.0A CN202010628404A CN111775018A CN 111775018 A CN111775018 A CN 111775018A CN 202010628404 A CN202010628404 A CN 202010628404A CN 111775018 A CN111775018 A CN 111775018A
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- Prior art keywords
- polishing
- polished
- rust
- grain
- rusty
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a rust removing and polishing method of a copper target assembly, which comprises the following steps: sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is less than or equal to 0.8 mu m; the grain polishing starts from the central point of the rusty surface. By using the rust removal polishing method provided by the invention, the synergistic effect between rust surface polishing and grain polishing is utilized to simultaneously control the roughness of the polished rust surface, so that the rust surface in the target material passing assembly is removed, and the polished target material has good performance and no change. Thereby effectively avoiding the generation of abnormal discharge during the use process or sputtering of the rusty surface.
Description
Technical Field
The invention relates to the field of rust removal, relates to a rust removal polishing method, and particularly relates to a rust removal polishing method for a copper target assembly.
Background
In the production process of semiconductor chips, the requirements for the appearance cleanness and the like of the target material are very high, and the target material cannot be damaged or polluted by impurities. Before the target material is cleaned, dried and packaged, the target material is ensured to be clean, free of impurities and oxidation rust. CN108213855A discloses a copper target assembly and a manufacturing method thereof, the manufacturing method comprises: providing a back plate and a copper target material, wherein the back plate comprises a first welding surface, and the copper target material comprises a second welding surface; forming a pattern consisting of a plurality of protrusions on the first welding surface; arranging the second welding surface opposite to the first welding surface with the patterns and attaching the second welding surface and the first welding surface to form an initial assembly; and carrying out welding treatment on the initial assembly to enable the bulge in the first welding surface to be embedded into the second welding surface, so as to form a welding layer between the copper target and the back plate, wherein the thickness of the welding layer is greater than or equal to the height of the bulge, so that the copper target assembly is obtained. The technical scheme can effectively reduce the possibility of gaps in the welding layer, thereby effectively improving the quality and the performance of the formed copper target material assembly and being beneficial to improving the yield and the performance of the manufactured semiconductor chip.
CN106558479A discloses a target assembly and a processing method thereof, wherein the processing method comprises: forming a target assembly, wherein the target assembly comprises a back plate and a target connected with the back plate, one surface of the back plate connected with the target is a front surface, and the target comprises a sputtering surface colliding with the charged particles and a side surface connected with the sputtering surface through a chamfer; the area between the joint of the side surface of the target and the chamfer and the joint of the side surface of the target and the front surface of the back plate forms an adsorption area on the surface of the target assembly; and carrying out sand blasting treatment on the adsorption area on the surface of the target assembly. The sand blasting treatment is carried out on the adsorption area for adsorbing the reverse sputtering object on the surface of the target assembly, so that the roughness of the adsorption area on the surface of the target assembly is improved, the adsorption capacity of the target assembly is improved, the possibility of phenomena such as peeling of adsorbed particles and point discharge is reduced, the service life of the target is prolonged, the phenomenon of product rejection caused by the peeling of the adsorbed particles is reduced, and the yield of the product is improved.
CN109385608A discloses a target assembly and a manufacturing method thereof, the manufacturing method includes: and providing a target material and a back plate which is welded and combined with the target material to form a target material assembly, wherein the target material thickness accounts for at least 60% of the thickness of the target material assembly. The proportion of the thickness of the target material in the thickness of the target material assembly is at least 60%, compared with the scheme with a smaller proportion, the thickness of the target material can be increased under the condition of keeping the thickness of the target material assembly unchanged, so that materials which can be used for sputtering of the target material are correspondingly increased, the service life of the target material assembly is effectively prolonged, the frequency of replacing the target material assembly is effectively reduced, and the improvement of process efficiency and the reduction of process cost are facilitated; meanwhile, the thickness of the target assembly can be kept unchanged, so that the sputtering machine does not need to adjust the distance between the target and a product to be formed into a film (such as a wafer), and the initial sputtering rate and the film forming uniformity of the target assembly are prevented from being poor.
However, the longer the Cu target is in the air, the more severe the oxidation rust is, and the rust may contaminate the sputtering chamber, resulting in abnormal phenomena such as Arbing. However, various procedures are required for processing and manufacturing the target material, and the method for controlling or reducing the rusting probability is not very effective and wastes a large amount of manpower and material resources, mainly because the Cu material is exposed in the air.
Disclosure of Invention
In view of the problems in the prior art, the invention aims to provide a rust removing and polishing method for a copper target assembly, which can remove a rust surface in the copper target assembly, and meanwhile, the performance of the polished target is good without any change.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a rust removing and polishing method of a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is less than or equal to 0.8 mu m; the grain polishing starts from the central point of the rusty surface.
By using the rust removal polishing method provided by the invention, the synergistic effect between rust surface polishing and grain polishing is utilized to simultaneously control the roughness of the polished rust surface, so that the rust surface in the target material passing assembly is removed, and the polished target material has good performance and no change. Thereby effectively avoiding the generation of abnormal discharge during the use process or sputtering of the rusty surface.
In the present invention, the roughness Ra of the rusted surface is not more than 0.8. mu.m, and may be, for example, 0.8. mu.m, 0.7. mu.m, 0.6. mu.m, 0.5. mu.m, 0.4. mu.m, 0.3. mu.m, 0.2. mu.m, or 0.1. mu.m, but not limited to the above-mentioned values, and other values not shown in the above range are also applicable.
As a preferred technical scheme, the grinding medium comprises back fluff sand paper and scouring pad.
As a preferable technical scheme of the invention, the rust surface is ground by using back-velvet sand paper.
As the preferable technical scheme of the invention, the grain polishing is performed by polishing with scouring pad.
According to the invention, through reasonable selection of the polishing material, the polishing position and the roughness after polishing, the rust surface in the target assembly is removed, and meanwhile, the performance of the polished target is good.
As a preferable technical solution of the present invention, before the polishing process, a masking process is performed on a non-polished surface.
As a preferable embodiment of the present invention, the masking treatment is to mask the non-polished surface with an adhesive tape.
As a preferable technical scheme of the invention, the back plate in the target assembly is placed on a clamp before being polished.
As a preferable technical scheme of the invention, a purifying cloth is arranged between the back plate and the clamp.
In the invention, the clamp is used for fixing and protecting the product on the back, and in order to avoid the product from being directly contacted with the clamp to cause damage, the cleaning cloth is arranged between the plate and the clamp.
As a preferred technical scheme of the present invention, when the backing plate in the target assembly is polished, the polishing is performed around the center of the backing plate.
As a preferable technical scheme of the invention, the rust removing method comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is less than or equal to 0.8 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
In the invention, the step surface is polished while caution is kept so as to avoid repairing the splashed surface due to scratching. When the product is clamped, the product is kept vertical to the clamp and is directly held and placed so as to avoid damaging the product. When the sealing ring on the back plate is polished, the local fault polishing trace of the sealing ring can not appear, and because the fault polishing appears, the cooling water which fails in vacuum pumping is generated.
Compared with the prior art, the invention has the following beneficial effects:
by utilizing the synergistic effect between rust surface polishing and grain polishing, the rust surface in the target material passing assembly is removed, and the performance of the polished target material is good without any change. Thereby effectively avoiding the generation of phenomena such as abnormal discharge and the like during the use process or sputtering of the rusty surface.
Detailed Description
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
example 1
The embodiment provides a rust removal polishing method for a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is 0.8 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
The copper target material assembly is good in performance after being polished, has no change, and has no abnormal discharge and the like in the using process or sputtering.
Example 2
The embodiment provides a rust removal polishing method for a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is 0.7 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
The copper target material assembly is good in performance after being polished, has no change, and has no abnormal discharge and the like in the using process or sputtering.
Example 3
The embodiment provides a rust removal polishing method for a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is 0.6 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
The copper target material assembly is good in performance after being polished, has no change, and has no abnormal discharge and the like in the using process or sputtering.
Example 4
The embodiment provides a rust removal polishing method for a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is 0.3 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
The copper target material assembly is good in performance after being polished, has no change, and has no abnormal discharge and the like in the using process or sputtering.
Example 5
The embodiment provides a rust removal polishing method for a copper target assembly, which comprises the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is 0.4 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
The copper target material assembly is good in performance after being polished, has no change, and has no abnormal discharge and the like in the using process or sputtering.
Comparative example 1
Only differs from example 1 in that the roughness Ra of the rusted surface after grinding was 2 μm; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 2
Only the difference from example 1 is that no rust surface grinding was performed; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 3
The difference from example 1 is only that no grain polishing is performed; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 4
The difference from the embodiment 1 is that the rust surface is polished by scouring pad; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 5
The difference from the embodiment 1 is only that back fluff sand paper is adopted in grain polishing; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 6
The difference from the embodiment 1 is only that the order of rust surface grinding and grain grinding is changed, namely, grain grinding is firstly carried out and then rust surface grinding is carried out; the copper target assembly has the phenomena of abnormal discharge and the like in the using process or sputtering after being polished, and the service life is short.
Comparative example 7
The difference from the embodiment 1 is that the grain polishing starts from the edge of the rusty surface, and the copper target assembly has abnormal discharge and the like in the use process or sputtering process after being polished, so that the service life is short.
According to the results of the embodiment and the comparative example, the rust removing and polishing method provided by the invention utilizes the synergistic effect between rust surface polishing and grain polishing, so that the rust surface in the target material passing assembly is removed, and the polished target material has good performance and no change. Thereby effectively avoiding the generation of phenomena such as abnormal discharge and the like during the use process or sputtering of the rusty surface.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. A rust removal polishing method for a copper target assembly is characterized by comprising the following steps:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is less than or equal to 0.8 mu m; the grain polishing starts from the central point of the rusty surface.
2. The rust removing polishing method as claimed in claim 1, wherein said polishing medium includes a back-pile sand paper and a scouring pad.
3. The rust removing polishing method as claimed in claim 2, wherein the rust surface polishing is performed by using a back-pile sand paper.
4. The rust removing polishing method as claimed in claim 2, wherein the grain polishing is polishing with a scouring pad.
5. A rust removing grinding method as claimed in any one of claims 1 to 4, characterized in that the non-ground surface is subjected to a masking treatment before the grinding treatment.
6. The rust removing polishing method as claimed in claim 5, wherein said masking treatment is masking the non-polished surface with an adhesive tape.
7. The rust removing polishing method as claimed in any one of claims 1 to 6, wherein the backing plate in the target assembly is placed on a jig before polishing.
8. The rust removing polishing method as claimed in claim 7, wherein a cleaning cloth is provided between said back plate and said jig.
9. The rust removing polishing method as claimed in any one of claims 1 to 8, wherein, when polishing the backing plate in the target assembly, the polishing is performed around the center of the backing plate.
10. The rust removing grinding method as claimed in any one of claims 1 to 9, wherein the rust removing method comprises:
sequentially polishing the rusty surface and the grain of the rusty surface of the copper target component by using a polishing medium; the roughness Ra of the rusty surface after polishing is less than or equal to 0.8 mu m; the grain polishing starts from the central point of the rusty surface;
wherein the grinding medium comprises back fluff sand paper and scouring pad; the rust surface is polished by using back-velvet abrasive paper; the grain polishing is performed by polishing with scouring pad; before the polishing treatment, the non-polished surface is shielded; the shielding treatment is to shield the non-polished surface by using an adhesive tape; a back plate in the target material assembly is arranged on the clamp before being polished; when a back plate in the target assembly is polished, the polishing is carried out around the center of the back plate; and a purifying cloth is arranged between the back plate and the clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010628404.0A CN111775018A (en) | 2020-07-01 | 2020-07-01 | Rust removal polishing method for copper target assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010628404.0A CN111775018A (en) | 2020-07-01 | 2020-07-01 | Rust removal polishing method for copper target assembly |
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| CN111775018A true CN111775018A (en) | 2020-10-16 |
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| CN202010628404.0A Pending CN111775018A (en) | 2020-07-01 | 2020-07-01 | Rust removal polishing method for copper target assembly |
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Cited By (2)
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| CN113182941A (en) * | 2021-04-29 | 2021-07-30 | 合肥江丰电子材料有限公司 | Automatic polishing process method of copper-containing target material |
| CN115139208A (en) * | 2022-07-26 | 2022-10-04 | 先导薄膜材料（广东）有限公司 | Surface treatment method for finished target |
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| CN115139208A (en) * | 2022-07-26 | 2022-10-04 | 先导薄膜材料（广东）有限公司 | Surface treatment method for finished target |
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Application publication date: 20201016 |