CN101597727A - The treatment process of copper target material surface - Google Patents
The treatment process of copper target material surface Download PDFInfo
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- CN101597727A CN101597727A CNA2009101397421A CN200910139742A CN101597727A CN 101597727 A CN101597727 A CN 101597727A CN A2009101397421 A CNA2009101397421 A CN A2009101397421A CN 200910139742 A CN200910139742 A CN 200910139742A CN 101597727 A CN101597727 A CN 101597727A
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- sputtering zone
- pearls
- target material
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Abstract
A kind of treatment process of copper target material surface comprises: the copper target is distinguished sputtering zone and non-sputtering zone; And, with 125 flint glass F pearls shot peening is carried out on the surface of non-sputtering zone, and the surperficial angulation of shot blasting direction and non-sputtering zone is 45 ° a integral multiple.Wherein, 125 flint glass F pearls are meant and contain 125 granulated glass spherees per square inch.The present invention had not both increased process complexity, difficulty by changing bullet model and the spray angle in the existing shot-peening roughened, again can high quality, high-level efficiency improves the roughness of copper target material surface.
Description
Technical field
The present invention relates to a kind of treatment process of copper target material surface, relate in particular to a kind of ball blasting method that improves copper target material surface.
Background technology
Particle (ion or neutral atom, molecule) bombardment solid surface with certain energy makes the particle on the nearly surface of solid obtain enough big energy and the solid surface of finally overflowing, and this that spill, complicated particle scattering process is called sputter.At present, often use sputtering technology and carry out thin film deposition, in this process, the solid material that is bombarded is called target, needs the material of sedimentary thin-film material decision target.For example, in semiconducter device is made, need on silicon substrate, deposit layer of metal copper film, then use the copper target and carry out sputter.
Target is made up of the backboard (Backing Plate) of target blank (Target Blank) and support target blank.Target blank can be simple substance target, alloy target material, perhaps compound target.The simple substance target is generally metals such as highly purified Al, Ta, Ti, Cu.Alloy target material is titanium aluminium, ambrose alloy, titanium chromium etc.The compound target is silicon oxide, aluminum oxide.The backboard that supports blank adopts copper, aluminum to form usually.Application number is 200510114034 Chinese patent, discloses a kind of backing plates for sputtering targets.Target blank and backboard is welded together, formed the target that sputter is used jointly.
In the sputtering technology of thin film deposition, the quality of sputter effect highly depends on the degree of cleaning of sputtering chamber.Because, even a slight fragment also can destroy the film that is deposited on substrate surface.
The Chinese patent of application number 200410083416.0 (hereinafter to be referred as the background patents application) provides a kind of sputtering target material that improves surface tissue that has.Shown in the structural representation of Fig. 1 target, target 1 is divided into sputter area 2 and non-sputter area 3, non-sputter area 4.Shown in the sectional view of Fig. 2 target 1, in one embodiment, non-sputtering zone 3,4 reamings of non-sputter area are gone in the surface of target 1, make non-sputtering zone 3, non-sputter area 4 place a position that is lower than sputtering zone 2.
In the sputter procedure, the sputter area 2 of high speed ion bombardment target 1, the target material that sputters is deposited on substrate surface except meeting, also can be deposited on other surfaces of deposition chamber, comprises non-sputter area 3, the non-sputter area 4 of target.Because the high energy characteristic of plasma atmosphere, redeposited material in target 1 non-sputtering zone 3, non-sputter area 4 can overflow once more, and the fragment that overflows meeting pollution deposit is at the film of substrate surface.
In order to overcome top problem, this background patents application is carried out roughened twice to the non-sputter area 3 of target 1, non-sputter area 4 surfaces, at first carries out the coarse processing of macroscopic, utilizes sandblast or shot-peening to carry out the coarse processing of microcosmic then.Improved the sticking stickiness of non-sputtering zone 3,4 like this, made non-sputter area 3, non-sputter area 4 behind the roughening can better adhere to redeposited target material, prevented the probability that it overflows once more to non-sputtering zone.
Summary of the invention
The objective of the invention is to, propose the treatment process of high quality, high-level efficiency copper target material surface.
The treatment process of a kind of copper target material surface provided by the invention comprises:
The copper target is distinguished sputtering zone and non-sputtering zone;
With 125 flint glass F pearls shot peening is carried out on the surface of described non-sputtering zone;
Wherein, in the shot peening, the surperficial angulation of shot blasting direction and non-sputtering zone is 45 ° a integral multiple.
In the shot peening, shot blasting direction and non-sputtering zone surperficial at 45.
In the shot peening, the shot blasting direction becomes 90 ° with the surface of non-sputtering zone.
In the shot peening, the shot blasting direction becomes 135 ° with the surface of non-sputtering zone.
The surface of non-sputtering zone is divided into the first non-sputtering zone surface and the second non-sputtering zone surface, with 125 flint glass F pearls described shot peening is carried out on the first non-sputtering zone surface and the second non-sputtering zone surface, wherein, the first non-sputtering zone surface and the second non-sputtering zone surface do not belong to a plane.
Earlier described shot peening is carried out on the first non-sputtering zone surface, described shot peening is carried out to the second non-sputtering zone surface in the back.
Simultaneously shot peening is carried out on the first non-sputtering zone surface, the second non-sputtering zone surface.
Before carrying out shot peening, 125 flint glass F pearls are carried out the bullet screening.
125 flint glass F pearls are carried out the bullet screening to be comprised:
Choose the maximum standard screen cloth of 125 flint glass F pearls;
Removal covers 125 flint glass F pearls of maximum standard sieve net surface;
Choose the minimum sandards screen cloth of 125 flint glass F pearls;
Remove 125 flint glass F pearls by the minimum sandards screen surface.
Before 125 flint glass F pearls are carried out bullet screening, the bullet quality is evaluated in advance.
The bullet quality evaluated in advance comprises:
Select some 125 flint glass F pearl screen clothes for use by net hole size;
Place screen cloth successively from top to bottom according to the descending order in net hole, net hole maximum is placed on and goes up most, and net hole minimum is placed on the most following;
Pour whole 125 flint glass F pearls into net the hole maximum screen cloth, white fused alumina can fall into the different screen cloth in net hole according to the difference of size;
125 flint glass F pearls on each screen cloth are poured in the container of corresponding numbering;
With 125 flint glass F pearls weighing and the record data on electronic scales on each screen cloth;
The weight addition of 125 flint glass F pearls on each screen cloth is drawn total weight;
The weight that calculates 125 flint glass F pearls on each screen cloth accounts for the per-cent of gross weight.
Before carrying out shot peening, the sputtering zone of copper target material surface is covered protection.
After carrying out shot peening, carry out the roughness inspection.
In the shot peening, air compressor machine air pressure is 6.0 * 10
5～6.5 * 10
5Pa.
In the shot peening, nozzle is 20-30mm to non-sputtering zone surface distance.
Compared with prior art, the present invention does not promptly increase process complexity, difficulty by changing bullet model and the spray angle in the existing shot-peening roughened, again can high quality, high-level efficiency improves the roughness of copper target material surface.
Description of drawings
Fig. 1 is the structural representation of target in the prior art;
Fig. 2 is the diagrammatic cross-section of target in the prior art;
Fig. 3 is the diagrammatic cross-section of copper target in the one embodiment of the invention;
Fig. 4 is the diagrammatic cross-section of copper target in the another embodiment of the present invention;
Fig. 5 is the process flow figure of copper target material surface of the present invention;
Fig. 6 is the process flow figure of the copper target material surface of a preferred embodiment of the present invention.
Embodiment
A kind of ball blasting method that improves copper target material surface provided by the invention comprises: the copper target is distinguished sputtering zone and non-sputtering zone; And, with 125 flint glass F pearls shot peening is carried out on the surface of non-sputtering zone, and the surperficial angulation of shot blasting direction and non-sputtering zone is 45 ° a integral multiple.Wherein, 125 flint glass F pearls are meant and contain 125 granulated glass spherees per square inch.
As shown in Figure 5, carry out step S1, the copper target is distinguished sputtering zone and non-sputtering zone.
With reference to figure 3, the surface of copper target 11 is divided into the first non-sputtering zone surface 113, the vertical second non-sputtering zone surface 114 of sputtering zone surface 112 and level.Two non-sputtering zone surfaces also can be the planes that is mutually other angles, and for example two non-sputtering zone surfaces are mutually 100 ° of angles, and present embodiment is only made exemplary illustration with two non-sputtering zone surfaces of vertical and level.
Then, in the S5 step, shot peening is carried out on the surface of non-sputtering zone with 125 flint glass F pearls, wherein, the granulated glass sphere spray angle can for 45 °, 90 °, 135 ° one of them.
Shot-peening is exactly with bullet, utilizes pressurized air or mechanical centrifugal force to carry out the method on surface for power and frictional force.The principal element that influences the shot-peening quality has: bullet material, bullet diameter, velocity of shot, bullet flow, spray angle, jet length, injecting time, fraction of coverage etc.The variation of any one parameter all can influence the effect of shot peening strengthening to some extent, and wherein for material, hardness, size, the granularity of bullet, and the angle of spraying is even more important.
The present invention selects to contain per square inch the bullet of 125 flint glass F pearls of 125 granulated glass spherees as the shotblasting machine use.Lift a preferred embodiment, shotblasting machine adopts the pneumatic type shotblasting machine.The pneumatic type shotblasting machine is to supply with pressurized air by air compressor, and pressurized air causes negative pressure that bullet is sucked and the high speed jetting nozzle during by spray gun, forms bullet stream and is ejected into piece surface.Also have a mechanism that makes part movement in the shotblasting machine, can guarantee the homogeneity of shot-peening and certain coverage is arranged.
Pour 125 flint glass F pearls into shotblasting machine, making air compressor machine air pressure is 6.0 * 10
5～6.5 * 10
5Pa, air pressure luffing are 0.5 * 10
5～1.0 * 10
5Pa, sand bucket air pressure are 4.5 * 10
5～5.5 * 10
5Pa, but must not be less than 4.0 * 10
5Pa.Pressurized air must be handled through refrigerating unit and water-and-oil separator, to guarantee drying, not have oil.Compressed air valve is slowly opened the inaccurate 0.8MPa that surpasses of air pressure.
As shown in Figure 3, Figure 4, respectively shot peening is carried out on the 113 and second non-sputtering zone surface 114, the first non-sputtering zone surface.When the shot-peening operation is carried out on the first non-sputtering zone surface 113, keep the non-sputtering zone of nozzle to the first surface 113 distances to be no more than 5cm, be preferably in 20-30mm.The included angle A on 125 flint glass F pearl directions, the 115 and first non-sputtering zone surface 113 of nozzle ejection is 45 °.
When the second non-sputtering zone 114 is carried out shot-peening, keep the non-sputtering zone of nozzle to the second surface 114 distances to be no more than 5cm equally, be preferably in 20-30mm.The included angle B on 125 flint glass F pearl directions, the 115 and second non-sputtering zone surface 114 of nozzle ejection is 45 °.
Shot peening is carried out on the 113 and second non-sputtering zone surface 114, the first non-sputtering zone surface, can carry out in two steps, also can carry out simultaneously.When carrying out shot peening in two steps, can carry out shot peening to the first non-sputtering zone surface 113 earlier, shot peening is carried out to the second non-sputtering zone surface 114 in the back; Also can carry out shot peening to the second non-sputtering zone surface 114 earlier, shot peening is carried out to the first non-sputtering zone surface 113 in the back.When carrying out shot peening simultaneously, two nozzles are set, arrange, simultaneously shot peening is carried out on two non-sputtering zone surfaces then by the 45 that configures.
Only carry out exemplary illustration for 45 ° with pneumatic type shotblasting machine and angle above, shotblasting machine also can use centrifugal shotblasting machine, and the 125 flint glass F pearl directions of nozzle ejection and the angle on non-sputtering zone surface also can be 90 ° or 135 °.
Granulated glass sphere is to make from high-quality glass cullet crushing sorting, and the size after the formation can be variant.Simultaneously, granulated glass sphere often is repeated to utilize, and damaged phenomenon also takes place often.And granulated glass sphere hits the energy-producing size in surface, and is directly related with its weight and jet velocity, so granulated glass sphere preferably has complete profile and uniform size.Therefore, as shown in Figure 6, carry out step S5 performing step S3 before, screen 125 flint glass F pearls.
Step S3 screens 125 flint glass F pearls, comprises following S301-S304 step:
S301, choose the maximum standard screen clothes of 125 flint glass F pearls;
The 125 flint glass F pearls that S302, removal cover maximum standard sieve net surface;
S303, choose the minimum sandards screen clothes of 125 flint glass F pearls;
The 125 flint glass F pearls that the minimum sandards screen surface is passed through in S304, removal.
Maximum standard screen cloth and choosing of minimum sandards screen cloth will be set according to actual needs.For example, net hole size difference relatively stricter to the effect requirements of roughened, so maximum, the minimum sandards screen cloth preferably reduces, and the 125 flint glass F pearl sizes of choosing like this are more even.
Carry out the situation of roughening shot peening at the recycling granulated glass sphere, before the step S3 that carries out the granulated glass sphere screening, evaluate the step S2 of bullet quality earlier in advance, evaluate in advance but promptly the reuse of 125 flint glass F pearls is carried out quality.
Step S2 evaluates the bullet quality in advance, comprises following S201-S207 step:
S201, select some 125 flint glass F pearl screen clothes for use by net hole size;
S202, place screen cloth successively from top to bottom according to net hole descending order, net hole maximum is placed on and goes up most, and net hole minimum is placed on the most following;
S203, pour whole 125 flint glass F pearls the screen cloth of net hole maximum into, granulated glass sphere can fall into the different screen cloth in net hole according to the difference of size;
S204,125 flint glass F pearls on each screen cloth are poured in the container of corresponding numbering;
S205, with 125 flint glass F pearls weighing and record data on electronic scales on each screen cloth;
S206, the weight additions of 125 flint glass F pearls on each screen cloth is drawn total weight;
S207, the weight that calculates 125 flint glass F pearls on each screen cloth account for the per-cent of gross weight;
Select a minimum sandards screen cloth in each screen cloth, when the weight percent less than 125 flint glass F pearls of minimum sandards screen cloth was higher than the numerical value that expection sets, the granulated glass sphere of pouring into before showing was broken too many, should change all 125 granulated glass spherees as early as possible.If the integrity degree of glass is relatively good, carry out the screening of step S3 so.Choosing of minimum sandards screen cloth can change according to the above-mentioned effect of mentioning according to handling.
Before carrying out the S5 step, can also cover the step S4 of protection to the sputtering zone 112 on copper target 11 surfaces.With special-purpose masking tape sputtering zone 112 being protected, constructs by drawing in the protection zone.Adhesive tape must have certain viscosity and tensile strength, is difficult for during shot-peening breaking.
Carried out to enter step S6 behind the shot peening step S5, the roughness inspection.
Behind the shot-peening, variation has taken place in the non-sputtering zone surfaceness of copper target.Whether this roughness has reached the standard of corresponding requirements, need weigh with the surface roughness Ra value of measuring.
Directly measure with surface roughometer, surface roughometer is at every 2m
2The selected at least evaluation point in surface, getting evaluation length is 40mm, surveys 5 points in this length range, gets its arithmetical av and evaluates a little surface roughness Ra value for this reason.After the present invention handled the roughness of the non-sputtering zone of copper target, the Ra value should be in 5.0～8.0um scope.
Though the present invention discloses as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art without departing from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be with claim institute limited range.
Claims (15)
1. the treatment process of a copper target material surface is characterized in that, comprising:
The copper target is distinguished sputtering zone and non-sputtering zone;
With 125 flint glass F pearls shot peening is carried out on the surface of described non-sputtering zone;
Wherein, in the described shot peening, the surperficial angulation of shot blasting direction and non-sputtering zone is 45 ° a integral multiple.
2. the treatment process of copper target material surface as claimed in claim 1 is characterized in that, in the described shot peening, and shot blasting direction and non-sputtering zone surperficial at 45.
3. the treatment process of copper target material surface as claimed in claim 1 is characterized in that, in the described shot peening, the shot blasting direction becomes 90 ° with the surface of non-sputtering zone.
4. the treatment process of copper target material surface as claimed in claim 1 is characterized in that, in the described shot peening, the shot blasting direction becomes 135 ° with the surface of non-sputtering zone.
5. as the treatment process of the described copper target material surface of any claim of claim 1-4, it is characterized in that, the surface of described non-sputtering zone is divided into the first non-sputtering zone surface and the second non-sputtering zone surface, with described 125 flint glass F pearls described shot peening is carried out on the described first non-sputtering zone surface and the second non-sputtering zone surface, wherein, the described first non-sputtering zone surface and the second non-sputtering zone surface do not belong to a plane.
6. the treatment process of copper target material surface as claimed in claim 5 is characterized in that, earlier described shot peening is carried out on the described first non-sputtering zone surface, and described shot peening is carried out to the described second non-sputtering zone surface in the back.
7. the treatment process of copper target material surface as claimed in claim 5 is characterized in that, simultaneously described shot peening is carried out on the described first non-sputtering zone surface, the second non-sputtering zone surface.
8. as the treatment process of the described copper target material surface of any claim of claim 1-4, it is characterized in that, carry out described shot peening before, 125 flint glass F pearls are carried out bullet screening.
9. the treatment process of copper target material surface as claimed in claim 6 is characterized in that, described 125 flint glass F pearls is carried out the bullet screening comprise:
Choose the maximum standard screen cloth of 125 flint glass F pearls;
Removal covers 125 flint glass F pearls of maximum standard sieve net surface;
Choose the minimum sandards screen cloth of 125 flint glass F pearls;
Remove 125 flint glass F pearls by the minimum sandards screen surface.
10. the treatment process of copper target material surface as claimed in claim 6 is characterized in that, described 125 flint glass F pearls are carried out bullet screening before, the bullet quality is evaluated in advance.
11. the treatment process of copper target material surface as claimed in claim 8 is characterized in that, described bullet quality is evaluated in advance comprise:
Select some 125 flint glass F pearl screen clothes for use by net hole size;
Place screen cloth successively from top to bottom according to the descending order in net hole, net hole maximum is placed on and goes up most, and net hole minimum is placed on the most following;
Pour whole 125 flint glass F pearls into net the hole maximum screen cloth, granulated glass sphere can fall into the different screen cloth in net hole according to the difference of size;
125 flint glass F pearls on each screen cloth are poured in the container of corresponding numbering;
With 125 flint glass F pearls weighing and the record data on electronic scales on each screen cloth;
The weight addition of 125 flint glass F pearls on each screen cloth is drawn total weight;
The weight that calculates 125 flint glass F pearls on each screen cloth accounts for the per-cent of gross weight.
12. the treatment process as the described copper target material surface of the arbitrary claim of claim 1-4 is characterized in that, carry out described shot peening before, the sputtering zone of copper target material surface is covered protection.
13. the treatment process as the described copper target material surface of any claim of claim 1-4 is characterized in that, carry out described shot peening after, carry out the roughness inspection.
14. the treatment process as the described copper target material surface of any claim of claim 1-4 is characterized in that, in the described shot peening, air compressor machine air pressure is 6.0 * 10
5～6.5 * 10
5Pa.
15. the treatment process as the described copper target material surface of any claim of claim 1-4 is characterized in that, in the described shot peening, nozzle is 20-30mm to non-sputtering zone surface distance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101397421A CN101597727A (en) | 2009-06-30 | 2009-06-30 | The treatment process of copper target material surface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009101397421A CN101597727A (en) | 2009-06-30 | 2009-06-30 | The treatment process of copper target material surface |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560382A (en) * | 2011-12-29 | 2012-07-11 | 余姚康富特电子材料有限公司 | Target and forming method thereof |
| CN103481199A (en) * | 2012-06-13 | 2014-01-01 | 宁波江丰电子材料有限公司 | Target material processing method |
| CN111331518A (en) * | 2020-04-22 | 2020-06-26 | 宁波江丰电子材料股份有限公司 | Surface treatment method for high-purity copper rotary target material |
| CN111775018A (en) * | 2020-07-01 | 2020-10-16 | 宁波江丰电子材料股份有限公司 | Rust removal polishing method for copper target assembly |
| CN113340261A (en) * | 2021-06-28 | 2021-09-03 | 宁波江丰电子材料股份有限公司 | Target roughness monitoring method |
-
2009
- 2009-06-30 CN CNA2009101397421A patent/CN101597727A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560382A (en) * | 2011-12-29 | 2012-07-11 | 余姚康富特电子材料有限公司 | Target and forming method thereof |
| CN103481199A (en) * | 2012-06-13 | 2014-01-01 | 宁波江丰电子材料有限公司 | Target material processing method |
| CN103481199B (en) * | 2012-06-13 | 2016-02-17 | 宁波江丰电子材料股份有限公司 | The processing method of target |
| CN111331518A (en) * | 2020-04-22 | 2020-06-26 | 宁波江丰电子材料股份有限公司 | Surface treatment method for high-purity copper rotary target material |
| CN111775018A (en) * | 2020-07-01 | 2020-10-16 | 宁波江丰电子材料股份有限公司 | Rust removal polishing method for copper target assembly |
| CN113340261A (en) * | 2021-06-28 | 2021-09-03 | 宁波江丰电子材料股份有限公司 | Target roughness monitoring method |
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Open date: 20091209 |