CN201596974U - Sand-blasting system of surface of target material - Google Patents
Sand-blasting system of surface of target material Download PDFInfo
- Publication number
- CN201596974U CN201596974U CN2010200019170U CN201020001917U CN201596974U CN 201596974 U CN201596974 U CN 201596974U CN 2010200019170 U CN2010200019170 U CN 2010200019170U CN 201020001917 U CN201020001917 U CN 201020001917U CN 201596974 U CN201596974 U CN 201596974U
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- Prior art keywords
- nozzle
- target material
- support
- material surface
- blasting system
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- Expired - Lifetime
Links
- 239000013077 target material Substances 0.000 title claims abstract description 52
- 238000005488 sandblasting Methods 0.000 title claims abstract description 30
- 239000004576 sand Substances 0.000 claims description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- 238000005183 dynamical system Methods 0.000 claims description 9
- 238000013519 translation Methods 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 230000003746 surface roughness Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005422 blasting Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HBCZDZWFGVSUDJ-UHFFFAOYSA-N chromium tantalum Chemical compound [Cr].[Ta] HBCZDZWFGVSUDJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 highly purified Al Chemical class 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The utility model provides a sand-blasting system of the surface of a target material, comprising a base for fixing the target material and a bracket bearing a nozzle; the base can rotate by control of a power system; and one end of the bracket is connected with the nozzle. The utility model also provides an another sand-blasting system of the surface of the target material, comprising a ring-shaped sliding rail and the bracket for bearing the nozzle, wherein the sliding rail takes the position of the target material as a circle center; one end of the bracket is connected with the nozzle; and a connecting part of the nozzle and the bracket is positioned on the sliding rail and can run along the sliding rail by control of the power system.
Description
Technical field
The utility model relates to semiconductor manufacturing facility and technology, relates in particular to a kind of target material surface sand blasting system.
Background technology
Particle (ion or neutral atom, molecule) the bombardment surface of solids with certain energy, make the particle of the surface of solids obtain enough big energy and the surface of solids of finally overflowing, this that spill, complicated KPT Scatter process is called sputter, and the solid material that is bombarded is called target.At present, often use sputtering technology and carry out thin film deposition, need the material of the thin-film material decision target of deposition.For example, in semiconductor devices is made, need on silicon substrate, deposit the layer of metal tantalum films, then use the tantalum metal targets that silicon substrate is carried out sputter.Further, target can be simple substance target, alloy target material, perhaps compound target.The simple substance target is generally metals such as highly purified Al, Ta, Ti, Cu.Alloy target material is tantalum aluminium, ambrose alloy, tantalum chromium etc.The compound target is silica, aluminium oxide.Wherein, the surface of target is divided into sputtering zone and non-sputtering zone again.The particle bombardment of certain energy be the sputtering zone of described target, non-sputtering zone is the zone that energy particle can not bombard, or does not need the zone bombarded.
In the sputtering technology of thin film deposition, the quality of sputter effect depends on the cleannes of sputtering chamber.Because, even a slight fragment also can destroy the film that is deposited on substrate surface.
But in sputter procedure, high-speed ion bombardment target as sputter district, the target material that sputters is deposited on substrate surface except meeting, as surface of silicon, also can be deposited on other surfaces of deposition chamber, comprises the non-sputter area of target.Because the high energy characteristic of plasma atmosphere, redeposited material at the non-sputtering zone of target can overflow once more, and the fragment that overflows meeting pollution deposit is at the film of substrate surface.
In order to overcome top problem, the Chinese patent application of application number 200410083416.0 provides a kind of sputtering target material that improves surface texture that has.This background patents application is carried out the roughening processing to the non-sputtering zone of target, utilizes sandblast that described non-sputtering zone is carried out rough processing.Improve the sticking stickiness of non-sputtering zone, made the non-sputter area behind the roughening can better adhere to the target material that deposits to non-sputtering zone, prevented the probability that it overflows.
But, existing sandblast technology is mainly used in the surface treatment of mill run, and described processing method is comparatively simple, and normal the employing handled the target sandblast by hand: target stationary is positioned on the loading stage, from hand-held jetting tool nozzle, what be injected into target treats the sandblast surface to described sand grains by compressor.Wherein, unfixing for the position of nozzle and angle, also more arbitrarily place the position of target, and such method of operating often causes the uniformity of roughness of target material surface bad, can not guarantee the structural stability with a collection of product.
The utility model content
The problem that the utility model solves is that the uniformity of the roughness of target material surface after the sandblast is bad, with the problem of the structural instability of a collection of product.
For addressing the above problem, the utility model provides a kind of target material surface sand blasting system, comprising:
The fixing pedestal of target, described pedestal are rotated by dynamical system control can; The support of carrying nozzle, an end of described support is connected with nozzle.
Optionally, described nozzle can be that rotate at the center with the junction of nozzle and support.
Optionally, described support is fixed on the base, and described support is with respect to base translation up and down.
Optionally, described base has groove, and the other end of described support is filled in described groove.
Optionally, described support by screw or bolting in the ad-hoc location of described groove.
Optionally, described support one side has groove, and an end of nozzle inserts the diverse location place in the described groove.
Optionally, described nozzle is connected to abrasive blast equipment, and described abrasive blast equipment is used to provide sand grains.
The utility model also provides a kind of target material surface sand blasting system, comprising:
Endless glide, described slide rail is the center of circle with the target position;
The support of carrying nozzle, an end of described support is connected with nozzle;
Wherein, the connector of described nozzle and support is positioned on the described slide rail, and can move along slide rail by dynamical system control.
Optionally, contact by pulley between described support and the slide rail.
Optionally, described nozzle can be that rotate at the center with the junction of nozzle and support.
Optionally, described support is fixed on the base, and described support is with respect to base translation up and down.
Optionally, described base has groove, and the other end of described support is filled in described groove.
Optionally, described support by screw or bolting in the ad-hoc location of described groove.
Optionally, described support one side has groove, and an end of nozzle inserts the diverse location place in the described groove.
Optionally, described nozzle is connected to abrasive blast equipment, and described abrasive blast equipment is used to provide sand grains.
Compared with prior art, the utility model is by under the fixed prerequisite of nozzle, and target is done rotation and carried out sandblast, the uniformity of the target material surface roughness after the raising sandblast, and then improve the target quality;
The utility model can also be by under the fixed prerequisite of target, and nozzle rotates and carries out sandblast, the uniformity of the target material surface roughness after the raising sandblast, and then improve the target quality;
Up-down adjustment can be carried out in the position of nozzle, makes nozzle to carry out sandblast along the side of the differing heights of target, improves the uniformity of target material surface roughness, and then improves the target quality.
Description of drawings
Fig. 1 to Fig. 6 is the target material surface sand blasting system of an embodiment of the utility model and uses schematic diagram;
Fig. 7 to Figure 10 is the target material surface sand blasting system of another embodiment of the utility model and uses schematic diagram.
The specific embodiment
The utility model is applied in the target material surface blasting method, by the relative position of target and nozzle is set, promptly select a side (as nozzle) fixing, the opposing party's (as target) does the mode of rotation and carries out the sand blasted surface sandblast, the uniformity and the uniformity of the target material surface roughness after the raising sandblast, and then improve the target quality.
Fig. 1 is the utility model target material surface sand blasting system first embodiment.Comprise: be used for fixing the pedestal 010 of target, described pedestal 010 can be rotated by dynamical system 1 control; The support 102 of carrying nozzle 103, an end of described support 102 is connected with nozzle 103.Described nozzle 103 can be that rotate at the center with the junction A of nozzle 103 and support 102.
Wherein, described support 102 is fixed on the base 101, and described support 102 is with respect to base 101 translation up and down.Described base 101 has groove, and the other end of described support 102 is filled in described groove, and by screw or bolting in the ad-hoc location of described groove.Fig. 1 only shows the situation of fixing with thumb screw.
Further, the connection between described support 102 and the nozzle 103 also can be as follows: described support 102 1 sides have groove, and an end of nozzle 103 inserts the diverse location place in the described groove, to adjust the height of nozzle with respect to support.Be specially: as shown in Figure 2, one side of described support 102 has groove 104, and described groove 104 is provided with several connecting holes 105, also has the hole unidimensional with connecting hole 105 on the end of nozzle 103, and described two holes connect by bolt or screw (indicating among the figure).
Simultaneously, an end of described nozzle 103 also is connected to abrasive blast equipment, and described abrasive blast equipment is used to provide sand grains.
Use with regard to described target material surface sand blasting system is elaborated below.
Target material structure shown in Figure 3 at first is provided, and target 030 is for having the cylinder of symmetry axis, and described cylindrical side 1001 is non-sputtering zone, and two rounded bottom surfaces 1002 are sputtering zone, and wherein said non-sputtering zone is that cylinder side 1001 is for treating the sandblast district.The material of described target is one of tantalum, aluminium, titanium, copper.
And then, use target material surface sand blasting system as shown in Figure 1 that described target material structure 030 is carried out sandblast.As shown in Figure 4, described target 030 is fixed on the pedestal 010; By dynamical system 1 rotating basis 010.Described dynamical system can be engine.Described pedestal 010 is at the uniform velocity rotation, and speed is that per minute is changeed in 0.1 commentaries on classics per minute～1.Be positioned at the also rotation thereupon of target 030 on the pedestal 010, described speed is identical with pedestal.The pivot of described pedestal 010 overlaps with the symmetry axis of target 030.
Described nozzle 103 also is connected to the abrasive blast equipment (not shown) that sand grains is provided, and described sand grains sprays by nozzle 103.
The utility model selects to contain per square inch the sand grains of No. 24 white fused aluminas of 24 white fused aluminas as the abrasive blast equipment use.Lift a preferred embodiment, abrasive blast equipment adopts the pneumatic type abrasive blast equipment.The pneumatic type abrasive blast equipment is to supply with compressed air by air compressor, and compressed air causes negative pressure that sand grains is sucked and the high speed jetting nozzle during by spray gun, forms sand flow and is ejected into piece surface.
Then, pour No. 24 white fused aluminas into abrasive blast equipment, making air compressor machine air pressure is 3.0 * 10
5～5.5 * 10
5Pa, air pressure luffing are 0.5 * 10
5～1.0 * 10
5Pa.
Continuation is with reference to figure 4, the non-sputter face 1001 that nozzle 103 is aimed at targets 030, the surface of promptly treating sandblast.The distance that described non-sputter face 1001 and nozzle 103 are maintained fixed, described distance range are 145～155mm, and the along the line and non-sputter face of the direction of described nozzle alignment 1001 is vertical, and promptly angle between the two is 90 °.
The sand grains that is used to handle target material surface ejects from nozzle 103, is attached to and the non-sputter face 1001 of the target 030 of the described rotation of roughening.
Only carry out exemplary illustration for 90 ° with pneumatic type abrasive blast equipment and angle above, abrasive blast equipment also can use centrifugal abrasive blast equipment, and the angle on No. 24 white fused alumina directions of nozzle ejection and non-sputtering zone surface also can be 90 °.
Target material structure also can be as shown in Figure 5, and target 031 is a Rotary-table, and wherein, the side 2001 of Rotary-table 031 is non-sputtering zone, and two rounded bottom surfaces 2002 are sputtering zone, and wherein said non-sputtering zone 2002 is for treating the sandblast district.
Continue to use target material surface sand blasting system as shown in Figure 1 to carry out blasting treatment.As shown in Figure 6, comprising: the non-sputter face 2001 that nozzle 103 is aimed at target 031, the surface of promptly treating sandblast.Described non-sputter face 2001 and nozzle 103 are maintained fixed certain distance, and described distance range is 145～155mm.By swivel nozzle 103, the along the line and non-sputter face of the direction that described nozzle 103 is aimed at 2001 is vertical, and promptly angle between the two is 90 °.
The sand grains that is used to handle target material surface ejects from nozzle 103, is attached to and the non-sputter face 2001 of the target 031 of the described rotation of roughening.
The utility model also provides another kind of target material surface sand blasting system, as shown in Figure 7: endless glide L001, described slide rail L001 is the center of circle with the target position; The support 202 of carrying nozzle 203, an end of described support 202 is connected with nozzle 203.
Wherein, described nozzle 203 is positioned on the described slide rail L001 with the connector of support 202, and can move along slide rail L001 by dynamical system 2 controls.
Contact by pulley (indicating) between described support 202 and the slide rail L001.Described nozzle 203 can be that rotate at the center with the junction B of nozzle 203 and support 202.Described support 202 is fixed on the base 201, and described support 202 is with respect to base 201 translation up and down.Described base 201 has groove, and the other end of described support 202 is filled in described groove.Described support by screw or bolting in the ad-hoc location of described groove.
Further, the connection between described support 202 and the nozzle 203 also can be as follows: described support 202 1 sides have groove, and an end of nozzle 203 inserts the diverse location place in the described groove.To adjust the height of nozzle with respect to support.Be specially: as shown in Figure 8, be provided with several connecting holes 205 on described groove 204, also have the hole unidimensional with connecting hole 205 on the end of nozzle 203, described two holes connect by bolt or screw (indicating among the figure).
Described nozzle 203 is connected to abrasive blast equipment, and described abrasive blast equipment is used to provide sand grains.
Below in conjunction with accompanying drawing described target material surface sand blasting system is described in detail.
As shown in Figure 9, the connector 021 of described nozzle 203 with support 202 is connected on the track, and described connector moved along track L001 by dynamical system 2.Described connector is at the uniform velocity rotation, and speed is that per minute is changeed in 0.03 commentaries on classics per minute～0.5.
Described nozzle 203 also is connected to the abrasive blast equipment (not shown) that sand grains is provided, and described sand grains sprays by nozzle 203.Sand mold and abrasive blast equipment can be described with reference to first embodiment.
Continuation is with reference to figure 9, the non-sputter face 1001 that nozzle 203 is aimed at targets 030, the surface of promptly treating sandblast.The distance that described non-sputter face 1001 and nozzle 203 are maintained fixed, described distance range are 145～155mm, and the along the line and non-sputter face of the direction that described nozzle 203 is aimed at 1001 is vertical, and promptly angle between the two is 90 °.
The sand grains that is used to handle target material surface ejects from swivel nozzle 203, is attached to and the non-sputter face 1001 of the target 030 of the described rotation of roughening.
Also can use the target material surface treatment system of second embodiment, target shown in Figure 5 031 is carried out blasting treatment.Concrete, the non-sputter face 2001 that nozzle 203 is aimed at target 031, the surface of promptly treating sandblast.Described non-sputter face 2001 and nozzle 203 are maintained fixed certain distance, and described distance range is 145～155mm.By swivel nozzle 203, the along the line and non-sputter face of the direction of described nozzle 203 standards 2001 is vertical, and promptly angle between the two is 90 °.
The sand grains that is used to handle target material surface ejects from the nozzle 203 of rotation, is attached to and the non-sputter face 2001 of the target 031 of the described rotation of roughening.
After above-mentioned each technical scheme of the present utility model of foundation was carried out sandblast, variation had taken place in the non-sputtering zone surface roughness of target.Whether this roughness has reached the standard of corresponding requirements, need weigh with the surface roughness Ra value of measuring.
Directly measure with surface roughometer, surface roughometer is at every 2m
2The selected at least evaluation point in surface, getting evaluation length is 40mm, surveys 5 points in this length range, gets its arithmetic mean of instantaneous value and evaluates a little surface roughness Ra value for this reason.After the utility model was handled the roughness of the non-sputtering zone of target, the Ra value should be in 5.0～8.0 mu m ranges.
Experimental result proves that 90% test data meets the roughness requirement.Original technical method, the surface of the target after the processing only have 70% test data to meet the roughness requirement.
Simultaneously the roughness on a plurality of surfaces is carried out variance ratio, described technical scheme can reach lower variance yields.Variance yields than original technology has reduced by 75%.Improved the surface uniformity of handling the back target to a great extent.
Though the utility model discloses as above with preferable enforcement, the utility model is not to be defined in this.Any those skilled in the art in not breaking away from spirit and scope of the present utility model, all can do various changes and modification, and therefore protection domain of the present utility model should be with claim institute limited range.
Claims (15)
1. a target material surface sand blasting system is characterized in that, comprising:
The fixing pedestal of target, described pedestal are rotated by dynamical system control can; The support of carrying nozzle, an end of described support is connected with nozzle.
2. target material surface sand blasting system according to claim 1 is characterized in that described nozzle can be that rotate at the center with the junction of nozzle and support.
3. as target material surface sand blasting system as described in the claim 2, it is characterized in that described support is fixed on the base, described support is with respect to base translation up and down.
4. as target material surface sand blasting system as described in the claim 3, it is characterized in that described base has groove, the other end of described support is filled in described groove.
5. as target material surface sand blasting system as described in the claim 4, it is characterized in that, described support by screw or bolting in the ad-hoc location of described groove.
6. as target material surface sand blasting system as described in the claim 3, it is characterized in that described support one side has groove, an end of nozzle inserts the diverse location place in the described groove.
7. as the described target material surface sand blasting system of above-mentioned each claim, it is characterized in that described nozzle is connected to abrasive blast equipment, described abrasive blast equipment is used to provide sand grains.
8. a target material surface sand blasting system is characterized in that, comprising:
Endless glide, described slide rail is the center of circle with the target position;
The support of carrying nozzle, an end of described support is connected with nozzle;
Wherein, the connector of described nozzle and support is positioned on the described slide rail, and can move along slide rail by dynamical system control.
9. as target material surface sand blasting system as described in the claim 8, it is characterized in that, contact by pulley between described support and the slide rail.
10. as target material surface sand blasting system as described in the claim 8, it is characterized in that described nozzle can be that rotate at the center with the junction of nozzle and support.
11. as target material surface sand blasting system as described in the claim 10, it is characterized in that described support is fixed on the base, described support is with respect to base translation up and down.
12. as target material surface sand blasting system as described in the claim 11, it is characterized in that described base has groove, the other end of described support is filled in described groove.
13. as target material surface sand blasting system as described in the claim 11, it is characterized in that, described support by screw or bolting in the ad-hoc location of described groove.
14. as target material surface sand blasting system as described in the claim 8, it is characterized in that described support one side has groove, an end of nozzle inserts the diverse location place in the described groove.
15. as claim 8 described target material surface sand blasting system of each claim to the claim 14, it is characterized in that described nozzle is connected to abrasive blast equipment, described abrasive blast equipment is used to provide sand grains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200019170U CN201596974U (en) | 2010-01-07 | 2010-01-07 | Sand-blasting system of surface of target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200019170U CN201596974U (en) | 2010-01-07 | 2010-01-07 | Sand-blasting system of surface of target material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201596974U true CN201596974U (en) | 2010-10-06 |
Family
ID=42808021
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200019170U Expired - Lifetime CN201596974U (en) | 2010-01-07 | 2010-01-07 | Sand-blasting system of surface of target material |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011085A (en) * | 2010-10-29 | 2011-04-13 | 宁波江丰电子材料有限公司 | Method for processing surface of attachment-resisting plate |
| CN102476356A (en) * | 2010-11-23 | 2012-05-30 | 张家港市华杨金属制品有限公司 | Sand blasted surface treatment process for aluminum product |
| CN103481199A (en) * | 2012-06-13 | 2014-01-01 | 宁波江丰电子材料有限公司 | Target material processing method |
| CN105563302A (en) * | 2014-10-30 | 2016-05-11 | 住华科技股份有限公司 | Target processing equipment |
| CN107160292A (en) * | 2017-06-01 | 2017-09-15 | 成都贝施美生物科技有限公司 | Plant external surface abrasive blast equipment |
| CN107309809A (en) * | 2017-06-01 | 2017-11-03 | 成都贝施美生物科技有限公司 | A kind of novel sand blasting device |
-
2010
- 2010-01-07 CN CN2010200019170U patent/CN201596974U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011085A (en) * | 2010-10-29 | 2011-04-13 | 宁波江丰电子材料有限公司 | Method for processing surface of attachment-resisting plate |
| CN102011085B (en) * | 2010-10-29 | 2013-05-01 | 宁波江丰电子材料有限公司 | Method for processing surface of attachment-resisting plate |
| CN102476356A (en) * | 2010-11-23 | 2012-05-30 | 张家港市华杨金属制品有限公司 | Sand blasted surface treatment process for aluminum product |
| CN103481199A (en) * | 2012-06-13 | 2014-01-01 | 宁波江丰电子材料有限公司 | Target material processing method |
| CN103481199B (en) * | 2012-06-13 | 2016-02-17 | 宁波江丰电子材料股份有限公司 | The processing method of target |
| CN105563302A (en) * | 2014-10-30 | 2016-05-11 | 住华科技股份有限公司 | Target processing equipment |
| CN105563302B (en) * | 2014-10-30 | 2019-01-29 | 住华科技股份有限公司 | Target processing equipment |
| CN107160292A (en) * | 2017-06-01 | 2017-09-15 | 成都贝施美生物科技有限公司 | Plant external surface abrasive blast equipment |
| CN107309809A (en) * | 2017-06-01 | 2017-11-03 | 成都贝施美生物科技有限公司 | A kind of novel sand blasting device |
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Address after: 315400, Zhejiang Yuyao Economic Development Zone, state science and Technology Industrial Park, Ann Road Patentee after: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. Address before: 315400, Zhejiang Yuyao Economic Development Zone, state science and Technology Industrial Park, Ann Road Patentee before: Ningbo Jiangfeng Electronic Materials Co., Ltd. |
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