CN111670614B - 元件安装装置、元件安装系统及元件安装方法 - Google Patents

元件安装装置、元件安装系统及元件安装方法 Download PDF

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Publication number
CN111670614B
CN111670614B CN201880088192.2A CN201880088192A CN111670614B CN 111670614 B CN111670614 B CN 111670614B CN 201880088192 A CN201880088192 A CN 201880088192A CN 111670614 B CN111670614 B CN 111670614B
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China
Prior art keywords
mounting
component
mounting surface
horizontal
region
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CN201880088192.2A
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English (en)
Chinese (zh)
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CN111670614A (zh
Inventor
寺胁佳秀
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Publication of CN111670614A publication Critical patent/CN111670614A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201880088192.2A 2018-03-09 2018-03-09 元件安装装置、元件安装系统及元件安装方法 Active CN111670614B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/009134 WO2019171564A1 (ja) 2018-03-09 2018-03-09 部品実装装置、部品実装システムおよび部品実装方法

Publications (2)

Publication Number Publication Date
CN111670614A CN111670614A (zh) 2020-09-15
CN111670614B true CN111670614B (zh) 2021-06-29

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CN201880088192.2A Active CN111670614B (zh) 2018-03-09 2018-03-09 元件安装装置、元件安装系统及元件安装方法

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Country Link
JP (1) JP6864153B2 (ja)
CN (1) CN111670614B (ja)
DE (1) DE112018006413T5 (ja)
WO (1) WO2019171564A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198693A (ja) * 2000-11-24 2002-07-12 Mirae Corp 表面実装装置及びその方法
JP2007227617A (ja) * 2006-02-23 2007-09-06 Yamaha Motor Co Ltd 表面実装機および実装ライン
CN101557698A (zh) * 2008-04-08 2009-10-14 索尼株式会社 部件安装装置、安装部件的制造方法和输送装置
JP2011529262A (ja) * 2008-03-18 2011-12-01 レニショウ パブリック リミテッド カンパニー 電子回路の製造装置と方法
CN103929941A (zh) * 2013-01-11 2014-07-16 雅马哈发动机株式会社 电子元件安装装置
JP5779342B2 (ja) * 2010-12-03 2015-09-16 富士機械製造株式会社 電子回路部品装着方法および電子回路部品装着機
JP5904438B2 (ja) * 2012-01-24 2016-04-13 学校法人福岡大学 ３次元実装システム、ｃａｄ装置、実装装置、３次元実装方法及びそのプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000307296A (ja) * 1999-04-19 2000-11-02 Ricoh Microelectronics Co Ltd マウンタおよび電子機器
JP5721469B2 (ja) * 2011-02-28 2015-05-20 富士機械製造株式会社 部品実装方法および部品実装装置
JP2014022587A (ja) * 2012-07-19 2014-02-03 Tokai Rika Co Ltd 実装筐体及びこれを用いた実装方法
JP6396219B2 (ja) * 2015-01-06 2018-09-26 株式会社ソフトサービス チップ部品実装方法及び実装装置
JP2017005206A (ja) * 2015-06-15 2017-01-05 パナソニックＩｐマネジメント株式会社 実装装置
DE112017006747T5 (de) * 2017-01-06 2019-09-19 Yamaha Hatsudoki Kabushiki Kaisha Montagezielarbeitsvorrichtung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198693A (ja) * 2000-11-24 2002-07-12 Mirae Corp 表面実装装置及びその方法
JP2007227617A (ja) * 2006-02-23 2007-09-06 Yamaha Motor Co Ltd 表面実装機および実装ライン
JP2011529262A (ja) * 2008-03-18 2011-12-01 レニショウ パブリック リミテッド カンパニー 電子回路の製造装置と方法
CN101557698A (zh) * 2008-04-08 2009-10-14 索尼株式会社 部件安装装置、安装部件的制造方法和输送装置
JP5779342B2 (ja) * 2010-12-03 2015-09-16 富士機械製造株式会社 電子回路部品装着方法および電子回路部品装着機
JP5904438B2 (ja) * 2012-01-24 2016-04-13 学校法人福岡大学 ３次元実装システム、ｃａｄ装置、実装装置、３次元実装方法及びそのプログラム
CN103929941A (zh) * 2013-01-11 2014-07-16 雅马哈发动机株式会社 电子元件安装装置

Also Published As

Publication number Publication date
JP6864153B2 (ja) 2021-04-28
JPWO2019171564A1 (ja) 2020-12-03
WO2019171564A1 (ja) 2019-09-12
DE112018006413T5 (de) 2020-08-27
CN111670614A (zh) 2020-09-15

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