CN111586981B - Design and manufacturing method of integrated coupling printed board - Google Patents
Design and manufacturing method of integrated coupling printed board Download PDFInfo
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- CN111586981B CN111586981B CN202010465751.6A CN202010465751A CN111586981B CN 111586981 B CN111586981 B CN 111586981B CN 202010465751 A CN202010465751 A CN 202010465751A CN 111586981 B CN111586981 B CN 111586981B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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Abstract
The invention discloses a design and manufacturing method of an integrated coupling printed board, which comprises the following steps: s1, drilling holes in an aluminum plate, and plugging the drilled holes in the aluminum plate with resin; s2, manufacturing an optical waveguide layer; s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and manufacturing by adopting magnetron sputtering when directly drilling holes in the aluminum plate for metallization; s4, copper deposition electroplating, namely performing copper deposition processing on a hole which is formed by plugging resin on the aluminum plate and drilling again through a chemical copper deposition process, and thickening a plating layer; s5, pattern transfer, namely forming a circuit in the pattern of the outer layer high-frequency substrate by adopting laser direct-writing type photoetching equipment; s6, alkaline etching; s7, printing green oil; s8, character printing, S9, outline processing, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board. Compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience in integration with other circuits.
Description
Technical Field
The invention belongs to the field of integrated coupling printed boards, and particularly relates to a design and manufacturing method of an integrated coupling printed board.
Background
The fifth generation communication technology is used for constructing an ecosystem of information and communication technology, is one of the hottest subjects in the industry at present, is different from the former 2G, 3G and 4G,5G is not only the upgrading and updating of the mobile communication technology, but also the driving platform of the digital world and the development infrastructure of the Internet of things in the future, and a new world which is fully connected is truly created, and the main characteristics of the 5G network to provide services comprise large bandwidth, low time delay and mass connection, so that new demands are put forward on the antenna base station in terms of bandwidth, capacity, time delay and networking flexibility. How to meet the bearer requirements of 5G different services by setting up new 5G base stations is a great challenge for 5G base station networks. The bandwidth of the antenna of the base station is the first key index born by 5G under the 5G technology, the bandwidth increase needs the working frequency of the antenna base station, and the working frequency of the antenna base station under the 4G technology is generally 800M-2300MHz. The coupling printed board for the communication base station antenna under the 5G technology is developed to higher frequency, miniaturization and densification. The 5G spectrum is divided into two regions FR1 and FR2, FR being the meaning of Frequency Range. The frequency range of FR1 is 450MHz to 6GHz, 2.6GHz,3.5GHz,4.5Ghz and 6Ghz are opened in China at present, the frequency range of FR2 is 24GHz to 52GHz (lower than 6 GHz), the electromagnetic wave wavelength of the frequency spectrum is mostly millimeter level, thus the frequency range of FR1, namely Sub6G, is established by the base station at present.
In the prior art, a reflecting plate and a coupling standard network plate in a communication base station antenna are of split design, have complex structures and complicated manufacture, and are inconvenient for other circuit integration during use, so that a design and manufacturing method of an integrated coupling printed board are provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a design and manufacturing method of an integrated coupling printed board.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the design and manufacturing method of the integrated coupling printed board comprises the following steps:
s1, drilling holes in an aluminum plate, and plugging the drilled holes in the aluminum plate with resin; and (3) drilling the aluminum plate, adopting a volcanic ash grinding plate and anodic oxidation as pretreatment, and carrying out vacuum resin plugging on the other side of the aluminum plate after the high-temperature adhesive tape is stuck on one side of the aluminum plate.
S2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and designing three types of holes on the substrate, wherein the three types of holes are a PTH grounding hole, a non-metallized hole and a metallized hole for connecting wires respectively; when the aluminum plate is directly metallized, magnetron sputtering is adopted for manufacturing;
s4, copper deposition is carried out on the substrate through a copper deposition process, so that an inner core layer of the optical waveguide layer is connected with an outer layer circuit, and the copper deposition layer in the hole is thickened in a VCP or pulse electroplating mode;
s5, pattern transfer, namely forming a circuit in the pattern of the outer layer high-frequency substrate by adopting laser direct-writing type photoetching equipment;
s6, alkaline etching is carried out, and a rectangular opening required by a high-precision rectangular positioning micro groove is formed on the copper foil layer on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, covering ink on an optical waveguide layer, then adopting laser direct-writing type photoetching equipment to manufacture a required solder resist pattern, emulsifying a photosensitive film of a region where laser polymerization reaction does not occur through sodium carbonate developer, and removing the green oil of an unexposed part, wherein the PH value of the sodium carbonate developer is 9-13;
and S8, printing characters, namely printing the corresponding characters on the surface of the printed board by using a screen printer, and drying the printed characters by using an oven after printing.
S9, processing the appearance, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
Preferably, after the aluminum plate is drilled in the step S1, volcanic ash grinding plate and anodic oxidation are adopted as pretreatment, the volcanic ash concentration is 15-25%, and the anodic oxidation is carried out: the aluminum plate is placed in electrolyte solution for electrifying treatment, and an aluminum oxide film is formed on the surface of the aluminum plate by utilizing electrolysis, and the film thickness is formed by anodic oxidation: 5-30um. The anodic oxidation can improve corrosion resistance and wear resistance, and the array type formed on the surface is similar to a honeycomb structure, so that the surface roughness is improved, and the binding force of the surface PP is facilitated. And after the high-temperature adhesive tape is stuck on one side of the aluminum plate, the hole is plugged by the vacuum resin from the other side.
Preferably, hole metallization is performed on the PTH grounding hole in the step S3 in a magnetron sputtering manner, the non-metallized hole is used for preventing the process processing from eroding aluminum base in the hole, the non-metallized hole is formed before the forming, and the metallized hole for connecting the wiring is manufactured in a manner of drilling a through hole in a manner of filling resin into an aluminum plate.
Preferably, the optical waveguide layer in step S2 is subjected to laser direct-writing lithography by attaching an LDI special dry film, and development to complete the manufacture of the lower cladding layer pattern; the core layer pattern mainly comprises a core layer circuit and a core layer inclined plane, and is completed by pasting an LDI special dry film, laser direct writing type photoetching and developing, and an exposure negative film of the core layer inclined plane is a gray mask; the upper wrapping layer pattern is manufactured by pasting an LDI special dry film, performing laser direct writing lithography and developing, and the upper wrapping layer corresponding to the inclined surface of the core layer needs to be developed and removed so as to expose the inclined surface of the core layer.
Preferably, the electroless copper plating process in step S4 uses electroless copper plating solution to perform copper plating processing on the clamping plate, where the electroless copper plating solution includes a mixture of copper sulfate, sodium hydroxide, formaldehyde, and EDTA.
Preferably, the magnetron sputtering in step S3 specifically includes:
1) Sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min through an ultrasonic groove with the power of 2KW of an ultrasonic cleaner, and performing two-section hot air drying (85 ℃ +/-5 ℃) for 12min and one-section cold air drying (85 ℃ +/-5 ℃) for 12min after cleaning, placing the cleaned FR4 plate spacing plate in a sealed storage box, and controlling a baking oven to finish sputtering coating within 4 hours after 120×30 min;
2) Sputtering coating, namely coating the aluminum plate by adopting a magnetron sputtering high-speed low-temperature sputtering method, vacuum packaging and sealing after coating, and immediately assembling, disassembling and immediately electroplating during electroplating.
Preferably, the magnetron sputtering process specifically requiresThe method comprises the following steps: vacuum degree 1.3X10 -3 And filling inert gas argon in a vacuum state of Pa, adding high-voltage direct current between the base material and the metal target, exciting the inert gas by electrons generated by glow discharge to generate plasma, and bombing atoms of the metal target out by the plasma to deposit on the aluminum plate.
Preferably, the method is characterized in that: the coating condition control parameters of the sputtering machine are as follows: vacuum degree at the beginning of sputtering 1.3X10 -3 Pa, sputtering current: titanium 15A, copper 15A; the heating temperature of the coating cavity is set to be 100 ℃; sputtering titanium layer to set thickness to 200nm; the copper layer was set to a thickness of 1100nm.
Preferably, the pH of the sodium carbonate developer in step S7 is 9-13.
The invention has the technical effects and advantages that: compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience in integration with other circuits.
Drawings
FIG. 1 is a flow chart of a method for designing and manufacturing an integrated coupling printed board according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a design and manufacturing method of an integrated coupling printed board as shown in figure 1
The design and manufacturing method of the integrated coupling printed board comprises the following steps:
s1, drilling holes in an aluminum plate, and plugging the drilled holes in the aluminum plate with resin; and (3) drilling the aluminum plate, adopting a volcanic ash grinding plate and anodic oxidation as pretreatment, and carrying out vacuum resin plugging on the other side of the aluminum plate after the high-temperature adhesive tape is stuck on one side of the aluminum plate.
S2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, taking the aluminum plate as a shielding layer, and designing three types of holes on the substrate, wherein the three types of holes are a PTH grounding hole, a non-metallized hole and a metallized hole for connecting wires respectively; when the aluminum plate is directly metallized, magnetron sputtering is adopted for manufacturing;
s4, copper deposition is carried out on the substrate through a copper deposition process, so that an inner core layer of the optical waveguide layer is connected with an outer layer circuit, and the copper deposition layer in the hole is thickened in a VCP or pulse electroplating mode;
s5, pattern transfer, namely forming a circuit in the pattern of the outer layer high-frequency substrate by adopting laser direct-writing type photoetching equipment;
s6, alkaline etching is carried out, and a rectangular opening required by a high-precision rectangular positioning micro groove is formed on the copper foil layer on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, covering ink on an optical waveguide layer, then adopting laser direct-writing type photoetching equipment to manufacture a required solder resist pattern, emulsifying a photosensitive film of a region where laser polymerization reaction does not occur through sodium carbonate developer, and removing the green oil of an unexposed part, wherein the PH value of the sodium carbonate developer is 9-13;
and S8, printing characters, namely printing the corresponding characters on the surface of the printed board by using a screen printer, and drying the printed characters by using an oven after printing.
S9, processing the appearance, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
Wherein, step S1, drilling an aluminum plate, adopting a volcanic ash grinding plate and anodic oxidation as pretreatment, wherein the volcanic ash concentration is 15-25%, and the anodic oxidation: the aluminum plate is placed in electrolyte solution for electrifying treatment, and an aluminum oxide film is formed on the surface of the aluminum plate by utilizing electrolysis, and the film thickness is formed by anodic oxidation: 5-30um. The anodic oxidation can improve corrosion resistance and wear resistance, and the array type formed on the surface is similar to a honeycomb structure, so that the surface roughness is improved, and the binding force of the surface PP is facilitated. And after the high-temperature adhesive tape is stuck on one side of the aluminum plate, the hole is plugged by the vacuum resin from the other side.
And (3) performing hole metallization on the PTH grounding hole in the step (S3) in a magnetron sputtering mode, wherein the non-metallized hole is used for preventing the process processing from biting the aluminum base in the hole, the non-metallized hole is formed before forming, and the metallized hole for connecting the wiring is manufactured in a mode of drilling the through hole in a mode of filling resin into an aluminum plate.
The optical waveguide layer in the step S2 is subjected to laser direct-writing photoetching by sticking an LDI special dry film, and the lower wrapping layer pattern is manufactured through development; the core layer pattern mainly comprises a core layer circuit and a core layer inclined plane, and is completed by pasting an LDI special dry film, laser direct writing type photoetching and developing, and an exposure negative film of the core layer inclined plane is a gray mask; the upper wrapping layer pattern is manufactured by pasting an LDI special dry film, performing laser direct writing lithography and developing, and the upper wrapping layer corresponding to the inclined surface of the core layer needs to be developed and removed so as to expose the inclined surface of the core layer.
The electroless copper plating process in the step S4 adopts electroless copper plating solution to perform copper plating processing on the clamping plate, wherein the electroless copper plating solution comprises a mixture of copper sulfate, sodium hydroxide, formaldehyde and EDTA.
The magnetron sputtering manufacturing in the step S3 specifically includes:
1) Sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min through an ultrasonic groove with the power of 2KW of an ultrasonic cleaner, and performing two-section hot air drying (85 ℃ +/-5 ℃) for 12min and one-section cold air drying (85 ℃ +/-5 ℃) for 12min after cleaning, placing the cleaned FR4 plate spacing plate in a sealed storage box, and controlling a baking oven to finish sputtering coating within 4 hours after 120×30 min;
2) Sputtering coating, namely coating the aluminum plate by adopting a magnetron sputtering high-speed low-temperature sputtering method, vacuum packaging and sealing after coating, and immediately assembling, disassembling and immediately electroplating during electroplating.
The magnetron sputtering process specifically comprises the following steps: vacuum degree 1.3X10 -3 Filling inert gas argon into Pa vacuum state, and forming a base material and a metalHigh-voltage direct current is added between targets, and electrons generated by glow discharge excite inert gas to generate plasma, so that the plasma bombards atoms of the metal targets and deposits the atoms on the aluminum plate.
Wherein, its characterized in that: the coating condition control parameters of the sputtering machine are as follows: vacuum degree at the beginning of sputtering 1.3X10 -3 Pa, sputtering current: titanium 15A, copper 15A; the heating temperature of the coating cavity is set to be 100 ℃; sputtering titanium layer to set thickness to 200nm; the copper layer was set to a thickness of 1100nm.
Wherein, the PH value of the sodium carbonate developer in the step S7 is 9-13.
To sum up: compared with the traditional technology, the design and manufacturing method of the integrated coupling printed board provided by the invention has the advantages of compact structure, simplicity in manufacturing and convenience in integration with other circuits.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (5)
1. The design and manufacturing method of the integrated coupling printed board is characterized by comprising the following steps of: the method comprises the following steps:
s1, drilling holes in an aluminum plate, and plugging the drilled holes in the aluminum plate with resin; drilling an aluminum plate, adopting a volcanic ash grinding plate and anodic oxidation as pretreatment, and carrying out vacuum resin plugging on the other side of the aluminum plate after a high-temperature adhesive tape is stuck on one side of the aluminum plate;
s2, manufacturing an optical waveguide layer, wherein the optical waveguide layer sequentially comprises a lower wrapping layer pattern, a core layer pattern and an upper wrapping layer pattern from bottom to top;
s3, manufacturing a substrate, namely pressing an optical waveguide layer and an aluminum plate, forming a high-frequency substrate by taking the aluminum plate as a shielding layer, and designing three types of holes on the high-frequency substrate, wherein the three types of holes are a PTH grounding hole, a non-metallized hole and a metallized hole for connecting wires respectively; the PTH grounding hole is subjected to hole metallization in a magnetron sputtering mode, and the metallized hole for connecting the wiring is manufactured in a mode of drilling a through hole in a mode of filling resin into an aluminum plate;
s4, copper deposition is carried out on the substrate manufactured in the step S3 through a copper deposition process, so that the optical waveguide layer core layer is connected with the outer layer circuit, and the copper deposition layer in the metallized hole is thickened in a VCP or pulse electroplating mode;
s5, pattern transfer, namely forming an outer layer circuit of the high-frequency substrate by adopting laser direct-writing type photoetching equipment to form a printed circuit board substrate;
s6, alkaline etching, namely forming a rectangular opening required by a high-precision rectangular positioning micro groove on the upper surface of the printed circuit board substrate by adopting an alkaline etching process;
s7, printing green oil, namely covering the optical waveguide layer with the green oil, then adopting laser direct-writing type photoetching equipment to manufacture a required solder resist pattern, emulsifying the green oil in a region where laser polymerization reaction does not occur through sodium carbonate developer, and removing the green oil in an unexposed part, wherein the PH value of the sodium carbonate developer is 9-13;
s8, printing characters, namely printing the corresponding characters on the surface of the printed board by a screen printer, and drying the printed characters by an oven after printing;
s9, processing the appearance, namely cutting the substrate through high-speed fiber laser cutting equipment according to the actual size of the manufactured integrated coupling printed board.
2. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: step S1, drilling an aluminum plate, adopting a volcanic ash grinding plate and anodic oxidation as pretreatment, wherein the volcanic ash concentration is 15-25%, and the anodic oxidation is carried out: the aluminum plate is placed in electrolyte solution for electrifying treatment, and an aluminum oxide film is formed on the surface of the aluminum plate by utilizing electrolysis, and the film thickness is formed by anodic oxidation: 5-30um; the anodic oxidation can improve corrosion resistance and wear resistance, and the array type formed on the surface is similar to a honeycomb structure, so that the surface roughness is improved, and the binding force of the surface PP is facilitated; and after the high-temperature adhesive tape is stuck on one side of the aluminum plate, the hole is plugged by the vacuum resin from the other side.
3. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: the optical waveguide layer in the step S2 is subjected to laser direct writing lithography by pasting an LDI dry film, and development to complete the manufacture of a lower wrapping layer pattern; the core layer pattern mainly comprises a core layer circuit and a core layer inclined plane, and is completed by pasting an LDI dry film, laser direct writing type photoetching and developing, and an exposure negative film of the core layer inclined plane is a gray mask; the upper wrapping layer pattern is manufactured by pasting an LDI dry film, performing laser direct writing photoetching and developing, and the upper wrapping layer corresponding to the inclined surface of the core layer needs to be developed and removed so as to expose the inclined surface of the core layer.
4. The method for designing and manufacturing an integrated coupling printed board according to claim 1, wherein: the magnetron sputtering manufacturing in the step S3 specifically comprises the following steps:
1) Sputtering pretreatment, namely cleaning and soaking an aluminum plate for 6min by using an ultrasonic groove with the power of 2KW of an ultrasonic cleaner, drying the aluminum plate at 85+/-5 ℃ for 12min by using two sections of hot air, drying the aluminum plate at 85+/-5 ℃ for 12min by using one section of cold air, placing the aluminum plate in a sealed storage box by using a FR4 board spacing plate subjected to cleaning treatment, and controlling the temperature of an oven at 120 ℃ for 30min to finish sputtering coating within 4 hours;
2) Sputtering coating, namely coating the aluminum plate by adopting a magnetron sputtering high-speed low-temperature sputtering method, vacuum packaging and sealing after coating, and immediately assembling, disassembling and immediately electroplating during electroplating.
5. The method for designing and manufacturing an integrated coupled printed board according to claim 4, wherein: the magnetron sputtering process specifically requires: vacuum degree 1.3X10 -3 Filling inert gas argon in a vacuum state of Pa, adding high-voltage direct current between the base material and the metal target, and exciting the inert gas by electrons generated by glow discharge to generate plasma which excites atoms of the metal targetBombing out, deposit on aluminum plate.
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