CN104793288A - Manufacturing method of printed circuit boards with optical waveguide couplers - Google Patents
Manufacturing method of printed circuit boards with optical waveguide couplers Download PDFInfo
- Publication number
- CN104793288A CN104793288A CN201510217581.9A CN201510217581A CN104793288A CN 104793288 A CN104793288 A CN 104793288A CN 201510217581 A CN201510217581 A CN 201510217581A CN 104793288 A CN104793288 A CN 104793288A
- Authority
- CN
- China
- Prior art keywords
- optical waveguide
- layer
- wiring board
- sandwich layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Abstract
A manufacturing method of printed circuit boards with optical waveguide couplers includes the steps of (1) manufacturing a substrate; (2) manufacturing an optical waveguide layer which is composed of a bottom coating graph, a core graph and a top coating graph; (3) manufacturing an optical waveguide reflector by coating an upper reflector on a core bevel to form a micro-mirror; (4) manufacturing the corresponding printed circuit board; (5) subjecting the printed circuit board and the substrate which is of the optical waveguide layer to the process of press fit so as to form a mixture board with the optical waveguide layer and a copper circuit layer; and (6) etching and milling to form the final optical channel. Since the graphs of the optical waveguide layer are exposed by means of gray masks and windows of the upper coating are coated with the reflector, a micro-mirror coupler is formed, and further is formed integrally with the optical waveguide couplers. The core graph comprises a core circuit and the core bevel, and the core bevel is exposed by means of gray mask. The manufacturing method has the advantages that coupling loss is low, manufacturing of the l micro-mirror is easy to achieved, and embedding density of the couplers in a light guide plate is increased.
Description
Technical field
The present invention relates to printed circuit technique field, particularly a kind of manufacture method of the printed wiring board containing optical waveguide coupled device.
Background technology
Along with the development of the information science technologies such as communication and computer technology, PCB traditional copper wire electricity is interconnected will be faced with formidable challenges due to nature problems such as such as LC time delay, crosstalks, industry generally believes, single channel rate is when more than 10G, the technology of electrical interconnection realizes and cost all will be faced with formidable challenges, and needs to adopt brand-new interconnection mode.Light network replaces electrical interconnection, has obvious advantage, comparatively easily realizes and can keep good signal integrity.The advantage of light network comprises:
1. on optical channel, loss is primarily of the structures shape of passage, and the frequency rate not by signal obviously affects.Therefore, signals diverging during high-speed transfer, distortion are little, and loss is low, can ensure good signal integrity;
2. high bandwidth light signal has good space compatible, and without electromagnetic interference problem in its signalling channel, signal cross-talk is little, can realize higher in parallel density, therefore can effectively reduce the size of device and equipment;
3. the optical interconnection system speed of response is fast, and single channel transfer rate can reach magnitude, and the unit storage density of photon is high, and its memory capacity is large, and magnitude power consumption is little, and heat radiation easily, therefore can realize simpler physical structure and design.
PCB light network is realized by PCB optical waveguide, and PCB optical waveguide is made up of 3-tier architecture usually, and two-layer is up and down outer casing, and centre is sandwich layer, and the refractive index of intermediate core layer is slightly larger than outer casing, and light is by the mode transmission of signal of total reflection.
Light waveguide-layer can be produced on the skin of printed-wiring board (PWB), also the internal layer of printed-wiring board (PWB) can be produced on, for the light waveguide-layer at internal layer, the mode that its light source enters optical waveguide is generally divided into following two kinds: light signal enters from printed-wiring board (PWB) side and enters above printed-wiring board (PWB) with light signal.Light signal enters from PCB side, forms difficulty lower.Light signal (90 degree of directions) above PCB enters, and forms difficulty large, relates to different coupling scheme, comprising:
1. directly optical fiber is drawn;
2. transmitting/receiving means is put into cavity;
3. outside making embeds or direct internal production 45 degree of micro mirrors again.
For different coupling scheme, more attractive is at present making 45 degree of micro mirrors, is also the study hotspot of current optical communication plate.
Common method for making mainly comprises: outside make micro mirror again in insert plate, adamas/cut, use 45 degree of moulds.
Outside making in the way of 45 degree of micro mirrors again in insert plate due to coupled apparatus with as the optical waveguide of transmission line is two independently parts, in device insert plate, technology difficulty is large, aligning accuracy is poor, by introducing extra coupling loss between device and optical waveguide, is unfavorable for Signal transmissions; And because 45 degree of micro mirror manufacture crafts limit, micro mirror height is minimum at present can only reach 200um, affects the embedding density of coupled apparatus.
And the micro mirror surfaces roughness that adamas/cut makes is large, uses 45 degree of Mold Making micro mirror complex process to be difficult to realize volume production.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of the printed wiring board containing optical waveguide coupled device, it is with low cost, and technique is simple, is easy to realize the large-scale production under existence conditions; Particularly, aligning accuracy is high; Coupling loss is low, easily realizes the making of microsize micro mirror, is conducive to the embedding density improving coupled apparatus in optical plate.
For achieving the above object, technical scheme of the present invention is:
The present invention, by the exposure of light wave sandwich layer grayscale mask, forms sandwich layer inclined-plane, and the method applying reflection horizon on sandwich layer inclined-plane forms micro mirror coupled apparatus.
Particularly, the manufacture method of a kind of printed wiring board containing optical waveguide coupled device of the present invention, comprises the steps:
1) substrate manufacture
Make substrate with copper-clad plate, be dielectric layer in the middle of this copper-clad plate, two sides is layers of copper; Made by conventional PCB graphic making flow process;
2) light waveguide-layer makes
Substrate makes light waveguide-layer, and it comprises lower integument figure, sandwich layer figure and upper integument figure successively; By coating or pad pasting, exposure, the making of the lower integument figure that developed; Sandwich layer figure mainly comprises sandwich layer circuit and sandwich layer inclined-plane, and by coating or pad pasting, exposure and development complete; The exposure film on sandwich layer inclined-plane is grayscale mask; The making of upper integument figure is completed by the mode of coating or pad pasting, exposure, development; Upper integument corresponding to sandwich layer inclined-plane place needs to be developed removal, to expose sandwich layer inclined-plane;
3) optical waveguide reflecting surface makes
Sandwich layer inclined-plane is covered with reflection horizon, forms micro mirror;
4) supporting printed wiring board makes
Make the supporting printed wiring board carrying out pressing with the substrate with light waveguide-layer;
5) supporting printed-wiring board (PWB) carried out pressing with the substrate of light waveguide-layer, then carries out holing, electroplate, Graphic transitions, form the mixed plate of strip optical waveguide layer and copper wire layer;
6) this mixed plate is carried out groove milling, etch copper, the final printed wiring board formed containing optical waveguide coupled device.
Further, the material that described light waveguide-layer adopts comprises wet film material and dry film material.Wherein wet film material comprises: epoxies, type siloxane, silanes, acrylic compounds or polyimide liquid material; Dry film quasi-optical wave is led material and is comprised the membraneous material that epoxies, type siloxane, silanes, acrylic compounds or polyimide make.
Again, the angle of inclination on described sandwich layer inclined-plane is between 10 degree to 80 degree, preferably 45 degree.
In addition, sandwich layer inclined-plane of the present invention is coated with the reflection horizon be covered with and adopts gold, silver, chromium, nickel, copper, zinc, titanium, tin, sn-ag alloy, SAC, evanohm, nickel alloy or ormolu.
Sandwich layer figure of the present invention mainly comprises sandwich layer circuit and sandwich layer inclined-plane, and by coating or pad pasting, exposure and development complete, and wherein optical waveguide exposure uses common photomask, and the exposure of sandwich layer chamfered portion uses grayscale mask to complete.
Grayscale mask is a kind of special photomask, and it provides variable light percent of pass at mask plane diverse location.When sandwich layer optical waveguide material is exposed under the luminance brightness of the continuous change that grayscale mask stop is formed, waveguide core layer material is removed according to the light intensity levels received, that is by this method, the degree of depth that waveguide core layer material is removed can control.
Beneficial effect of the present invention:
1. with low cost, technique is simple, is easy to accomplish scale production.
Method of the present invention does not increase extra cost, only needs when CAM design and mapping, by the figure of required region grayscale mask, and the figure that other normal optical waveguiding region are conventional.
And other method existing, as cut, machine cuts, embedded micro mirror, use 45 degree moulds, all need the extra production stage of increase or production material, different degree increase production cost.
2. aligning accuracy is high.
In the present invention, micro mirror coupled apparatus and optical waveguide complete in one-shot forming, and 90 degree that are not only conducive to light signal in PCB turn to, and owing to not having the conversion of too much contraposition reference, therefore aligning accuracy is high, and coupling loss is low.
And for the embedded micro mirror of prior art, it needs to be equipped with high-precision contraposition equipment, increase once extra contraposition reference conversion, can coupling loss be increased like this.
3. the micro mirror surfaces formed by chemical method is smooth, and coupling loss is low.
Method provided by the invention is the chemical method adopting exposure, development, and the micro mirror surfaces roughness of formation is less than 100 nanometers, and roughness is little, and final coupling loss is little, is generally less than 1.5dB.
And adopt mechanical type (adamas/laser) cutting method, because equipment has certain step value, therefore the air spots after cutting is sliding, and surfaceness large (generally more than 300 nanometers), the coupling loss that such technique produces is greater than 2dB.
4. the micromirror size formed is little, is applicable to the making of high density product.
In the present invention, micro mirror coupled apparatus forms sandwich layer inclined-plane by exposure, development, and on sandwich layer inclined-plane, apply reflection horizon formed, its micromirror size normally micron order, or even nanoscale, be conducive to the embedding density improving coupled apparatus in optical plate, be applicable to the making of high density optical plate.
And prior art adopts embedded micro mirror, its size, normally more than grade, is not suitable for the making of high density optical plate.
Accompanying drawing explanation
Fig. 1 ~ Figure 10 is the process chart of one embodiment of the invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described.
See Fig. 1 ~ Figure 10, to make the printed wiring board that contains one deck light waveguide-layer and four layers of layers of copper, its technological process is as follows:
1) substrate manufacture, 1,2,3 is the copper-clad plate of well cutting, and copper-clad plate 1,3, for the making of two two layers of layers of copper, is positioned at the making of middle copper-clad plate 2 for light waveguide-layer.Wherein, 101,301 is dielectric layer, and 102,103,302,303 is layers of copper, see Fig. 1; Optical waveguide substrate 21 is for etching away the copper-clad plate of most copper, and this substrate leaves copper face (copper barrier layer) 2021, see Fig. 2 in follow-up making optical waveguide micro mirror region.
2) light waveguide-layer makes, and comprise lower integument 204, sandwich layer figure 205, upper integument 206, (see Fig. 3, Fig. 4), concrete making step comprises pad pasting or coating, exposure, development etc.The making of lower integument 204 is completed by coating or pad pasting, exposure.Sandwich layer figure 205 mainly comprises sandwich layer circuit 205a and sandwich layer inclined-plane 205b, is completed by coating or pad pasting, exposure and development, and wherein the exposure of microscope part uses grayscale mask to complete, see Fig. 4.By coating or pad pasting, exposure, development mode complete the making of upper integument 206, upper integument 206 needs to window, see Fig. 5 at 205b place, sandwich layer inclined-plane.
3) light waveguide-layer 45 degree of reflectings surface make---and on sandwich layer inclined-plane, 205b place sprays metal-gold, forms micro mirror 205b1, see Fig. 6.
4) make the supporting printed wiring board 11,31 (see Fig. 7) needing to carry out pressing with the substrate completing light waveguide-layer, wherein, 1021,1031 and 3021,3031 is the internal layer copper wire figure of supporting printed wiring board 11,31.
5) substrate 25 of the supporting printed wiring board 11,31 and the light waveguide-layer that completes that have made inner figure pressed together, then carries out holing, electroplate, Graphic transitions, form the mixed plate 4 of strip optical waveguide layer and copper wire layer, see Fig. 8.
6) this mixed plate 4 is carried out groove milling (see Fig. 9), etch copper (see Figure 10), the final printed wiring board 41 and 42 formed containing optical waveguide coupled device.
See table 1, embodiment is for adopting method provided by the invention, and the micromirror size of formation is little, is 50um, and micromirror reflects surface roughness is 98 nanometers, and final coupling loss is 1.4dB.
Comparative example is outside make the way of 45 degree of micro mirrors again in insert plate, and wherein embedded micromirror size is 200um, and micromirror reflects surface roughness is 430 nanometers, and final coupling loss is 2.5dB.
Table 1
| Micromirror size (um) | Micromirror reflects surface roughness (nm) | Coupling loss (dB) | |
| Embodiment | 50 | 98 | 1.4 |
| Comparative example | 200 | 430 | 2.5 |
Therefrom can find out, the micro mirror surfaces roughness that the inventive method is formed is little, and final coupling loss is little, easily realizes the making of microsize micro mirror, is conducive to the embedding density improving coupled apparatus in optical plate.
The foregoing is only a preferred embodiment of the present invention, be not used for limiting practical range of the present invention; Namely all equivalents done according to right of the present invention, are the claims in the present invention scope and cover.
Claims (6)
1. a manufacture method for the printed wiring board containing optical waveguide coupled device, is characterized in that, comprise the steps:
1) substrate manufacture
Make substrate with copper-clad plate, be dielectric layer in the middle of this copper-clad plate, two sides is layers of copper; Made by conventional PCB graphic making flow process;
2) light waveguide-layer makes
Substrate makes light waveguide-layer, comprises lower integument figure, sandwich layer figure and upper integument figure successively; By coating or pad pasting, exposure, the making of the lower integument figure that developed; Sandwich layer figure mainly comprises sandwich layer circuit and sandwich layer inclined-plane, and by coating or pad pasting, exposure and development complete, and the exposure film on sandwich layer inclined-plane is grayscale mask; The making of upper integument figure is completed by the mode of coating or pad pasting, exposure, development, and the upper integument corresponding to sandwich layer inclined-plane place needs to be developed removal, to expose sandwich layer inclined-plane;
3) optical waveguide reflecting surface makes
Sandwich layer inclined-plane is covered with reflection horizon, forms micro mirror;
4) supporting printed wiring board makes
Make the supporting printed wiring board carrying out pressing with the substrate with light waveguide-layer;
5) supporting printed-wiring board (PWB) carried out pressing with the substrate of light waveguide-layer, then carries out holing, electroplate, Graphic transitions, form the mixed plate of strip optical waveguide layer and copper wire layer;
6) this mixed plate is carried out groove milling, etch copper, the final printed wiring board formed containing optical waveguide coupled device.
2. the manufacture method of the printed wiring board containing optical waveguide coupled device as claimed in claim 1, it is characterized in that, described substrate leaves copper face in follow-up making optical waveguide micro mirror region.
3. the manufacture method of the printed wiring board containing optical waveguide coupled device as claimed in claim 1, is characterized in that, the material that described light waveguide-layer adopts comprises wet film material and dry film material.Wherein wet film material comprises: epoxies, type siloxane, silanes, acrylic compounds or polyimide liquid material; Dry film quasi-optical wave is led material and is comprised the membraneous material that epoxies, type siloxane, silanes, acrylic compounds or polyimide make.
4. the manufacture method of the printed wiring board containing optical waveguide coupled device as claimed in claim 1, it is characterized in that, the angle of inclination on described sandwich layer inclined-plane is between 10 degree to 80 degree.
5. the manufacture method of the printed wiring board containing optical waveguide coupled device as claimed in claim 1, it is characterized in that, the angle of inclination on described sandwich layer inclined-plane is 45 degree.
6. the manufacture method of the printed wiring board containing optical waveguide coupled device as described in claim 1 or 4 or 5, it is characterized in that, described sandwich layer inclined-plane is coated with the reflection horizon be covered with and adopts gold, silver, chromium, nickel, copper, zinc, titanium, tin, sn-ag alloy, SAC, evanohm, nickel alloy or ormolu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510217581.9A CN104793288A (en) | 2015-04-30 | 2015-04-30 | Manufacturing method of printed circuit boards with optical waveguide couplers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510217581.9A CN104793288A (en) | 2015-04-30 | 2015-04-30 | Manufacturing method of printed circuit boards with optical waveguide couplers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104793288A true CN104793288A (en) | 2015-07-22 |
Family
ID=53558249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510217581.9A Pending CN104793288A (en) | 2015-04-30 | 2015-04-30 | Manufacturing method of printed circuit boards with optical waveguide couplers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104793288A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104977653A (en) * | 2015-06-18 | 2015-10-14 | 湖南晶图科技有限公司 | PLC waveguide micro-coupling mirror machining method |
| CN107340573A (en) * | 2017-08-25 | 2017-11-10 | 西安电子科技大学 | Lamination photoelectricity interconnects printed board and its implementation |
| CN108169841A (en) * | 2017-12-28 | 2018-06-15 | 中国电子科技集团公司第五十四研究所 | A kind of mask and the preparation method of optical waveguide reflecting surface and optical waveguide |
| CN111586981A (en) * | 2020-05-28 | 2020-08-25 | 深圳市博敏电子有限公司 | Design and manufacturing method of integrated coupling printed board |
| CN113009625A (en) * | 2021-03-09 | 2021-06-22 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of multilayer LCP optical transmission module of integrated optical waveguide |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5480764A (en) * | 1992-11-27 | 1996-01-02 | Lockheed Missiles And Space Comapny, Inc. | Gray scale microfabrication for integrated optical devices |
| CN1416589A (en) * | 2000-03-08 | 2003-05-07 | Ntu企业私人有限公司 | Quantum well intermixing |
| EP1378772A2 (en) * | 2002-07-03 | 2004-01-07 | Samsung Electronics Co., Ltd. | Method of manufacturing tapered optical waveguide |
| EP1394580A1 (en) * | 2002-08-29 | 2004-03-03 | Samsung Electronics Co., Ltd. | Method of fabricating planar light waveguide circuits with vertical taper structure |
| CN101808470A (en) * | 2010-03-02 | 2010-08-18 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with optical function |
| CN103364893A (en) * | 2012-03-29 | 2013-10-23 | 日东电工株式会社 | Opto-electric hybrid board |
| CN103529514A (en) * | 2013-10-30 | 2014-01-22 | 上海美维科技有限公司 | Production method of buried optical waveguide printed circuit board |
| CN103926647A (en) * | 2013-01-11 | 2014-07-16 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with conical optical waveguide |
| CN104516055A (en) * | 2013-09-26 | 2015-04-15 | 上海美维科技有限公司 | Method for improving optical quality of optical waveguide cut surface |
-
2015
- 2015-04-30 CN CN201510217581.9A patent/CN104793288A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5480764A (en) * | 1992-11-27 | 1996-01-02 | Lockheed Missiles And Space Comapny, Inc. | Gray scale microfabrication for integrated optical devices |
| CN1416589A (en) * | 2000-03-08 | 2003-05-07 | Ntu企业私人有限公司 | Quantum well intermixing |
| EP1378772A2 (en) * | 2002-07-03 | 2004-01-07 | Samsung Electronics Co., Ltd. | Method of manufacturing tapered optical waveguide |
| CN1469140A (en) * | 2002-07-03 | 2004-01-21 | 三星电子株式会社 | Method for producing conical light wave guide |
| EP1394580A1 (en) * | 2002-08-29 | 2004-03-03 | Samsung Electronics Co., Ltd. | Method of fabricating planar light waveguide circuits with vertical taper structure |
| CN101808470A (en) * | 2010-03-02 | 2010-08-18 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with optical function |
| CN103364893A (en) * | 2012-03-29 | 2013-10-23 | 日东电工株式会社 | Opto-electric hybrid board |
| CN103926647A (en) * | 2013-01-11 | 2014-07-16 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with conical optical waveguide |
| CN104516055A (en) * | 2013-09-26 | 2015-04-15 | 上海美维科技有限公司 | Method for improving optical quality of optical waveguide cut surface |
| CN103529514A (en) * | 2013-10-30 | 2014-01-22 | 上海美维科技有限公司 | Production method of buried optical waveguide printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104977653A (en) * | 2015-06-18 | 2015-10-14 | 湖南晶图科技有限公司 | PLC waveguide micro-coupling mirror machining method |
| CN104977653B (en) * | 2015-06-18 | 2018-03-23 | 湖南晶图科技有限公司 | A kind of processing method of the micro- coupling minute surface of PLC waveguide |
| CN107340573A (en) * | 2017-08-25 | 2017-11-10 | 西安电子科技大学 | Lamination photoelectricity interconnects printed board and its implementation |
| CN107340573B (en) * | 2017-08-25 | 2019-06-21 | 西安电子科技大学 | Lamination photoelectricity interconnects printed board and its implementation |
| CN108169841A (en) * | 2017-12-28 | 2018-06-15 | 中国电子科技集团公司第五十四研究所 | A kind of mask and the preparation method of optical waveguide reflecting surface and optical waveguide |
| CN108169841B (en) * | 2017-12-28 | 2019-12-24 | 中国电子科技集团公司第五十四研究所 | Mask, optical waveguide reflecting surface and optical waveguide preparation method |
| CN111586981A (en) * | 2020-05-28 | 2020-08-25 | 深圳市博敏电子有限公司 | Design and manufacturing method of integrated coupling printed board |
| CN113009625A (en) * | 2021-03-09 | 2021-06-22 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of multilayer LCP optical transmission module of integrated optical waveguide |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104793288A (en) | Manufacturing method of printed circuit boards with optical waveguide couplers | |
| KR100402221B1 (en) | Optical interconnection circuit board and manufacturing method thereof | |
| JP5877749B2 (en) | Manufacturing method of opto-electric hybrid board | |
| CN101506705B (en) | Optical waveguide substrate and substrate mounting photoelectric hybrid circuit | |
| US20100040327A1 (en) | Optical waveguide and spot size converter using the same | |
| US20140355931A1 (en) | Glass-Polymer Optical Interposer | |
| CN101808470B (en) | Method for manufacturing printed circuit board with optical function | |
| CN102129102B (en) | Circuit substrate and manufacture method thereof | |
| CN108415124A (en) | A kind of high density optical waveguide structure and printed circuit board and preparation method thereof | |
| KR100969435B1 (en) | A printed circuit board comprising a optical waveguide and method for manufacturing the same | |
| CN108901126B (en) | The production technology of printed circuit board, electronic equipment and printed circuit board | |
| CN103760635A (en) | Glass base three-dimension photoelectricity simultaneous transmitting device and manufacturing method thereof | |
| US11693181B2 (en) | High-density optical waveguide structure and printed circuit board and preparation method thereof | |
| CN103926647A (en) | Method for manufacturing printed circuit board with conical optical waveguide | |
| CN208060766U (en) | A kind of high density optical waveguide structure and printed circuit board | |
| CN103754817A (en) | Three-dimensional vertical-interconnection silicon-based light and electricity simultaneous transmission device and manufacturing method thereof | |
| CN103762205A (en) | Multifunctional base plate based on PCB technology and manufacturing method thereof | |
| US8979372B2 (en) | Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board | |
| CN103779323B (en) | Flexible embedded optical interconnected structure and preparation method thereof | |
| CN103813617B (en) | Wiring board and preparation method thereof and the electrooptical device with this wiring board | |
| CN105636341A (en) | PCB with hollow cavity structure and manufacturing method therefor | |
| CN104375238B (en) | Electrical optical circuit board with semi-conical-end optical waveguide and manufacturing method thereof | |
| CN103763855A (en) | Photoelectric printed board and manufacturing method thereof | |
| CN220252233U (en) | Photoelectric co-packaging integrated structure | |
| KR101105680B1 (en) | Large area Optical-Printed Circuit Board and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150722 |