CN103779323B - Flexible embedded optical interconnected structure and preparation method thereof - Google Patents
Flexible embedded optical interconnected structure and preparation method thereof Download PDFInfo
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- CN103779323B CN103779323B CN201410041869.0A CN201410041869A CN103779323B CN 103779323 B CN103779323 B CN 103779323B CN 201410041869 A CN201410041869 A CN 201410041869A CN 103779323 B CN103779323 B CN 103779323B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The invention discloses a kind of flexible embedded optical interconnected structure and preparation method thereof, wherein flexible embedded optical interconnected structure includes fiber waveguide sheet material, laser ablation groove is offered on fiber waveguide sheet material, the both sides of laser ablation groove are provided with through hole on fiber waveguide sheet material；The chemical plating copper layer with figure, electrodeposition of metals and coat of metal are disposed with the upper and lower surface of fiber waveguide sheet material from inside to outside; photoelectric chip and electrical chip be installed, covered with sealed colloid on photoelectric chip and electrical chip above the coat of metal of fiber waveguide sheet material upper surface；Soldered ball is provided with below the coat of metal of fiber waveguide sheet material lower surface.Manufacture craft of the present invention is simple, is suitable for producing in enormous quantities, is provided the foundation for the popularization of light pcb board.
Description
Technical field
The present invention relates to integrated electronic technical field, particularly a kind of optical interconnected structure and preparation method thereof.
Background technology
With the development of information technology and the application of optical communication technique and popularization, the performance of electronic system is increasingly subject to short
Distance（As between framework, chip chamber between rack room, plate and in plate）The limitation of message capacity.Different size and various criterion it is active
Optical cable has been used between solution framework and the communication performance bottleneck problem of rack room, light pcb board can solve the high speed between plate and in plate
Interconnection problems.
Light pcb board is generally divided into two classes, rigid light pcb board and flexible light pcb board.The research knot of wherein rigid light pcb board
Fruit also has a large amount of reports, and one kind is that glass optical fiber is directly embedded to rigid pcb board, and another kind is that organic optical waveguide is embedded into rigidity
Inside pcb board or rigid pcb board surface is placed in, optical fiber, or embedment organic optical waveguide is either buried, is all in rigid pcb board
Preparation process in some processing steps are inserted to realize.IBM in 2011 is reported pure electric rigid pcb board and reality
The organic film of existing fiber waveguide transmission（There is no metal wiring layer thereon）Prepare respectively, the result of study then fitted together again.
Electroplax tabula rasa separately prepare in conjunction with preparation method reduce the preparation difficulty and cost of light pcb board.It is individually flexible in addition
Light pcb board also has wide practical use in the hand-held electronic products such as smart mobile phone, tablet personal computer, is closed by each company
Note.Either rigid light pcb board or flexible light pcb board, are required for being applied to organic optical waveguide, at present due to organic optical waveguide
Material is also far from ripe and produced in enormous quantities, virtually becomes an important factor for restricting the popularization of light pcb board.
The content of the invention
Present invention solves the technical problem that it is embedded to be to provide the flexibility that a kind of manufacture craft is simple, is suitable for producing in enormous quantities
Formula optical interconnected structure and preparation method thereof.
In order to solve the above technical problems, the technical solution used in the present invention is as follows.
Flexible embedded optical interconnected structure, including be made up of covering material and the fiber waveguide being inlaid in covering material
Fiber waveguide sheet material, offers the laser ablation groove of downward opening band light reflecting interface on fiber waveguide sheet material, on fiber waveguide sheet material
The both sides of laser ablation groove are vertically installed with the through hole through fiber waveguide sheet material；In the upper and lower surface of the fiber waveguide sheet material in
The chemical plating copper layer with figure, electrodeposition of metals and coat of metal outwards are disposed with, fiber waveguide sheet material upper surface
Photoelectric chip and electrical chip be installed, covered with sealed colloid on photoelectric chip and electrical chip above coat of metal；The light
Waveguide plate surface is provided with external electrical interface.
The improvement of the present invention is：The external electrical interface that the metal coating layer surface of the fiber waveguide plate surface is set is
Soldered ball.External electrical interface of the soldered ball as the embedded optical interconnected structure of flexibility, can be directly welded in practical application
On the pad of printed circuit plate surface.
The improvement of the present invention is：The external electrical interface that the fiber waveguide plate surface is set is golden finger, i.e., described soft
The embedded optical interconnected structure of property can be combined with golden finger structure, in practical application, golden finger is electrically connected by connector
Onto printed circuit board.
The improvement of the present invention is：The laser ablation groove is shaped as triangle or trapezoidal, laser ablation groove it is interior
Side forms light reflecting interface.
Further improvement of the present invention is：The smooth reflecting interface and the angle of the upper and lower surface of fiber waveguide sheet material are
40 ° to 50 °.The smooth reflecting interface and the angle of the upper and lower surface of fiber waveguide sheet material are preferably 45 °.
The preparation method of flexible embedded optical interconnected structure, is mainly included the following steps that：
The first step, prepares the fiber waveguide sheet material of sheet or web-like, and the fiber waveguide of the fiber waveguide sheet material is inlaid in cladding material
Expect middle level；
Second step, downward opening laser ablation groove is prepared on fiber waveguide sheet material by laser ablation process, and laser burns
The inner surface of erosion groove forms light reflecting interface；
3rd step, using two sidetrackings of bore process laser ablation groove on fiber waveguide sheet material through the logical of upper and lower surface
Hole, the vertical light guiding plate material of through hole are set；
4th step, chemical-copper-plating process is carried out to fiber waveguide sheet material prepared by the 3rd step, and in fiber waveguide plate surface shape
Into chemical plating copper layer；
5th step, plating is patterned on chemical plating copper layer, forms electrodeposition of metals；
6th step, the light guiding plate that the 5th step is coated with electrodeposition of metals and chemical plating copper layer is handled using quarter process for copper
Material；
7th step, surface metalation processing is carried out to the fiber waveguide sheet material after carving process for copper processing, in metal plating
Layer surface forms coat of metal；
8th step, the coat of metal top of fiber waveguide sheet material upper surface are provided with photoelectric chip and electrical chip；
9th step, covered with sealed colloid on photoelectric chip and electrical chip, and in the metal of fiber waveguide sheet material lower surface
Soldered ball is provided with below protective layer.
It is as follows as a result of above technical scheme, the invention technological progress.
Present invention system is prepared using more ripe plastic optical fiber material and the preparation technology mutually compatible with preparing plastic optical fiber
The fiber waveguide sheet material of sheet or web-like, then flexible embedded optical interconnected structure is prepared on the basis of fiber waveguide sheet material, make work
Skill is simple, is suitable for producing in enormous quantities, is provided the foundation for the popularization of light pcb board.
Brief description of the drawings
Fig. 1 is the part-structure schematic diagram of optical interconnected structure of the present invention.
Fig. 2 is the process chart that the present invention makes flexible embedded optical interconnected structure.
Fig. 3 is that optical signal of the present invention moves towards schematic diagram.
Fig. 4 is the structural representation of present invention application on a printed circuit board.
Fig. 5 applies the structural representation on golden finger for the present invention.
Fig. 6 applies the structural representation on printed circuit board for the present invention with reference to golden finger.
Fig. 7 is the plate level assembling schematic diagram of optical interconnected structure of the present invention.
Wherein：1. fiber waveguide sheet material, 2. fiber waveguides, 3. covering materials, 4. laser ablation grooves, 5. smooth reflecting interfaces, 6. is logical
Hole, 7. chemical plating copper layers, 701. through-hole wall chemical plating copper layers, 702. fiber waveguide flaggy upper and lower surface chemical plating copper layers, 703.
Light reflecting interface chemical plating copper layer, 8. electrodeposition of metals, 801. fiber waveguide flaggy upper and lower surface electrodeposition of metals, 802. light are anti-
Firing area face electrodeposition of metals, 9. coat of metals, 901. fiber waveguide flaggy upper and lower surface coat of metals, 902. light reflection circle
Face coat of metal, 10. photoelectric chips, 11. electrical chips, 12. sealed colloids, 13. soldered balls, 14. smooth transceiver parts, 15. light pass
Defeated part, 16. printed circuit boards, 17. pads, 18. golden fingers, 19. connectors.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be described in further detail.
Embodiment 1
A kind of flexible embedded optical interconnected structure, including by covering material 3 and the fiber waveguide being inlaid in covering material 3
The 2 fiber waveguide sheet materials 1 formed, the laser ablation groove 4 of downward opening band light reflecting interface 5, light are offered on fiber waveguide sheet material 1
The side of laser ablation groove 4 is vertically installed with the through hole 6 through fiber waveguide sheet material 1 on waveguide sheet material 1；The fiber waveguide sheet material 1
Upper and lower surface on be disposed with the chemical plating copper layer 7 with figure, electrodeposition of metals 8 and coat of metal 9 from inside to outside,
The top of coat of metal 9 of the upper surface of fiber waveguide sheet material 1 is provided with photoelectric chip 10 and electrical chip 11, photoelectric chip 10 and battery core
Covered with sealed colloid 13 on piece 11；The lower section of coat of metal 9 of the lower surface of fiber waveguide sheet material 1 is provided with external electrical interface.Fig. 1
It is same for the structural representation of the present embodiment one end, another end structure.It is soldered ball 13 that electrical interface is aligned in the present embodiment.
Heretofore described laser ablation groove 4 is shaped as triangle or trapezoidal, including isosceles triangle, isosceles ladder
Shape, non-isosceles triangle, non-isosceles trapezoid, but not limited to this.Two medial surfaces of laser ablation groove 4 form light reflecting interface 5, light
Reflecting interface 5 and the angle of the upper and lower surface of fiber waveguide sheet material 1 are 40 ° to 50 °, preferably 45 °.
Make the process chart of the above-mentioned embedded optical interconnected structure of flexibility as shown in Fig. 2 preparation method mainly include with
Lower step：
The first step, using plastic optical fiber material and the preparation technology mutually compatible with preparing plastic optical fiber prepares sheet or volume
The fiber waveguide sheet material 1 of shape, the fiber waveguide of the fiber waveguide sheet material are inlaid in covering material middle level, as shown in Figure 1.
Plastic optical fiber has the characteristics such as pliability is good, excellent in cushion effect, cost is low, has its superior in short haul connection
Property, using PMMA materials gradational plastic optical fibre bandwidth up to 3GHz100m, the gradational plastic optical fibre of fluoride
Bandwidth is up to 10GHz100m.
Fiber waveguide sheet material is sheet or web-like.
Fiber waveguide sheet material is not limited to the light of sheet or web-like made of plastic optical fiber material or other organic materials
Waveguide sheet material, its preparation technology can include the processing step of lamination plus photoetching, can also include the processing step of die impressing.
Due to the limitation of preparation method, included using the fiber waveguide sheet material of the preparation technology preparation mutually compatible with preparing plastic optical fiber
Fiber waveguide can only be straight, and what the fiber waveguide sheet material for using the processing step of lamination plus photoetching or die impressing to prepare was included
Fiber waveguide can be arbitrary graphic.
The fiber waveguide of the fiber waveguide sheet material containing multichannel distribution at regular intervals, the spacing distribution of fiber waveguide can be equal
It is even, can also be periodic, but not limited to this.Fiber waveguide can include the material of two or more different refractivity
Sandwich layer and covering are formed, a kind of material of refractive index can also be only included；Fiber waveguide can be refractive index saltant type fiber waveguide,
It can be graded refractive index fiber waveguide.The index distribution of the cross section of fiber waveguide can be circular, square, trapezoidal, but not
It is limited to this.Fiber waveguide sheet material is including at least fiber waveguide, multichannel fiber waveguide can form optical waveguide array all the way.
Covering material 3 is transparent for the work optical wavelength of the present invention, i.e., absorptivity is very low.Covering material 3
Refractive index is less than fiber waveguide 2.
Second step, downward opening laser ablation groove 4, laser are prepared by laser ablation process on fiber waveguide sheet material 1
The inner surface of ablation groove forms light reflecting interface 5.The effect of light reflecting interface 5 is to couple the light wave of the transmission in fiber waveguide 2
Go out the upper surface of light guiding plate material 1, and the light wave for the upper surface for inciding fiber waveguide sheet material 1 is coupled in fiber waveguide 2 simultaneously
Transmitted in fiber waveguide 2.To improve coupling efficiency, it is necessary to the mirror-smooth of light reflecting interface 5.
Laser ablation apparatus used in the present invention can make substrate laser punch device.
3rd step, using two sidetrackings of bore process laser ablation groove 4 on fiber waveguide sheet material 1 through the logical of upper and lower surface
Hole 6, the vertical light guiding plate material 1 of through hole 6 are set.
4th step, chemical-copper-plating process is carried out to fiber waveguide sheet material 1 prepared by the 3rd step, and on the surface of fiber waveguide sheet material 1
Form chemical plating copper layer 7, Seed Layer of the chemical plating copper layer as subsequent selection electroplating technology.Chemical plating copper layer 7 is included in through hole
Wall chemical plating copper layer 701, fiber waveguide flaggy upper and lower surface chemical plating copper layer 702 and light reflecting interface chemical plating copper layer 703.
5th step, plating is patterned on chemical plating copper layer 7, forms electrodeposition of metals 8.
Graphical electroplating technology includes：Plating barrier film is formed on fiber waveguide sheet material upper and lower surface chemical plating copper layer 702,
The plating barrier film is electric insulation, while is that can resist plating corrosion；The plating barrier film can be organic film,
It can also be inoranic membrane, can also be organic/inorganic composite film；The plating barrier film can be monofilm, can also be multilayer
Film；The plating barrier film can be laminated on the chemical plating copper layer 702 of fiber waveguide sheet material upper and lower surface or spray
It is coated onto on fiber waveguide sheet material upper and lower surface chemical plating copper layer 702.The plating barrier film can share the same light reflecting interface chemical plating
Layers of copper 703 directly contacts, and can not also directly be contacted with light reflecting interface chemical plating copper layer 703, but canopy is in laser ablation groove 4
Top.
Using double-sided exposure developing technique it is described plating barrier film on formed selection electroplate figure, it is necessary to plating
Region removes plating barrier film thereon, exposes the chemical plating copper layer in the region, it is not necessary to which the region of plating retains plating and stopped
Film；Through hole 6 and all or part of laser ablation groove 4, the plating barrier film of the region of light reflecting interface 5 are removed, dew
Go out the chemical plating copper layer in the region.After graphical plating, the metal filled situation in through hole 6 can be it is solid or
Hollow（Metal is attached on the inwall of through hole 6）；Formd on fiber waveguide sheet material upper and lower surface chemical plating copper layer 702 patterned
Fiber waveguide sheet material upper and lower surface electrodeposition of metals 801；Light reflecting interface chemical plating copper layer 703 is thickened by metal plating, shape
Into light reflecting interface electrodeposition of metals 802.Electrodeposition of metals can be fine copper, copper alloy, can also be several different metal electricity
The combination of coating.
6th step, the light guiding plate that the 5th step is coated with electrodeposition of metals 8 and chemical plating copper layer 7 is handled using quarter process for copper
Material.
In process for copper is carved, using the thickness difference of different zones metal level, when fiber waveguide sheet material upper and lower surface does not have metal
When the copper product in the region of electrodeposited coating covering, exposed fiber waveguide sheet material upper and lower surface chemical plating copper layer 702 is corroded clean, have
The electrodeposition of metals in the region of electrodeposition of metals covering still has residual, simply than being thinned before carving process for copper.
7th step, surface metalation processing is carried out to the fiber waveguide sheet material after carving process for copper processing, in metal plating
8 surface of layer form coat of metal 9.
The purpose of surface metalation processing is in fiber waveguide sheet material upper and lower surface electrodeposition of metals 801 and light reflecting interface gold
Belong to the surface of electrodeposited coating 802 and form one layer of anticorrosive, oxidation resistant coat of metal, play a protective role.Coat of metal 9 includes
Fiber waveguide sheet material upper and lower surface coat of metal 901 and light reflecting interface coat of metal 902.Usual coat of metal is nickel gold
Composite bed or NiPdAu composite bed.
After the processing step fiber waveguide sheet material upper and lower surface form metal line and chip and component assembling
Pad（Pad）.These metal lines can be electric connection line between chip chamber, component, between chip and component or
Electric connection line between the light transceiver part of the light transceiver part and the other end of power supply supply lines or one end.These gold
The main carrying direct current signal of category wiring, such as direct current supply, direct current biasing, and the low speed signal less than 3GHz frequencies.
8th step, the top of coat of metal 9 of the upper surface of fiber waveguide sheet material 1 are provided with photoelectric chip 10 and electrical chip 11.
Photoelectric chip 10 can be vertical cavity（VCSEL）The photo-detector of laser or photoreceiving surface；Photoelectricity core
Piece 10 can be that the VCSEL of single VCSEL lasers or single photo-detector or multiple VCSEL laser constitutions swashs
The photodetector array of light device array or multiple photo-detectors composition；The VCSEL laser arrays or photodetector array can
To be 1 × N（N is more than or equal to 1）Array or M × N（M, N is more than or equal to 1）Array.When photoelectric chip 10 is M × N battle arrays
, it is necessary to which M row laser ablations groove 4 and light reflecting interface 5 correspond during row, to ensure each independence on photoelectric chip 10
VCSEL lasers or photo-detector and an one optical waveguide 2 relative to being optically coupled.
The installation form of photoelectric chip 10 uses back-off（flip-chip）Installation.
Electrical chip 11 can be the driving chip of VCSEL lasers or the amplification chip of photo-detector.Electrical chip
11 can be single pass, can be multichannel.Electrical chip 11 is located near photoelectric chip 10.The technique is except installation photoelectricity
Outside chip 10 and electrical chip 11, in addition to the installation passive element such as microprocessor chip and resistance, electric capacity, inductance, magnetic bead.Micro- place
Reason device chip is mainly used in controlling the working condition of electrical chip 11.The installation form of photoelectric chip 10 is back-off（flip-chip）
Installation, the installation form of electrical chip 11 can be back-off（flip-chip）Installation or wire bonding（Wire-
banding）Installation.
9th step, covered with sealed colloid 12 on photoelectric chip 10 and electrical chip 11, and in the lower surface of fiber waveguide sheet material 1
The lower section of coat of metal 9 be provided with soldered ball 13.
Sealed colloid 12 can be made up of a kind of material, can also be made up of underfill and encapsulant, photoelectricity
Chip 10 and electrical chip 11 can share a kind of underfill material, can also be respectively with respective underfill material
Material.The underfill of photoelectric chip 10 is transparent in effective spectral band of photoelectric chip 10.When sealed colloid 12 by
During a kind of material composition, the material plays back-off simultaneously（flip-chip）Underfill and the effect of sealing, now require sealing
Colloid 12 is transparent in effective spectral band of photoelectric chip 10.The curing mode of sealed colloid 12 can be ultra-violet curing,
Heat cure, or the combination of the two.
Place technique is usually to be carried out after the curing process of sealed colloid 12, and soldered ball 13 is preferably low temperature soldered ball.
One embedded optical interconnected structure of complete bidirectional flexible should include the light transceiver part and optical transport portion at both ends
Point, the light that a complete unidirectional optical interconnected structure should include the light emitting portion of one end, light transmissive portion and the other end connects
Receiving portions.Above-mentioned preparation method only illustrates the light transceiver part and light transmissive portion of one end, and other end light transceiver part has
With the light transceiver part identical interconnection structure and preparation method of described one end.
The optical signal trend of flexible embedded optical interconnected structure prepared by the present invention is as shown in Figure 3.Left side dashed box portion in figure
It is divided into light transceiver part 14, right side dashed box part is light transmissive portion 15.Light transmissive portion is except the fiber waveguide 2 of part where it
Transmission optical signal is realized between the light transceiver part 14 that Fig. 3 drawn and the other end light transceiver part of the other end of fiber waveguide 2 connection
Light connects, the metal line of the upper and lower surface of fiber waveguide sheet material 1 of light transmissive portion realizes the light transceiver part that Fig. 3 is drawn
14 and the other end of fiber waveguide 2 connection other end light transceiver part between electrical connection.The upper and lower surface of fiber waveguide sheet material 1
Metal line includes chemical plating copper layer 7, electrodeposition of metals 8 and coat of metal 9.Soldered ball 13 is used for the external of light transceiver part 14
Electrical interface.
The structure of the present embodiment application on a printed circuit board is as shown in Figure 4.By the weldering of flexible embedded optical interconnected structure
Ball 13 is welded on the pad 17 on the surface of printed circuit board 16, it is possible to achieve on printed circuit board 16 between different physical location points
, printed circuit board 16 between other printed circuit boards high-speed wideband Large Volume Data transmission and exchange.
Embodiment 2
The external electrical interface of this present embodiment is golden finger, and the structure of the present embodiment one end is as shown in Figure 5.Golden finger 18 is located at
The top of flexible embedded optical interconnected structure, can be the one side distribution in fiber waveguide sheet material 1（Upper surface or lower surface）, also may be used
To be distributed in the upper and lower surface of fiber waveguide sheet material 1 simultaneously.The optical interconnected structure is that electricity is pluggable, using flexible, is convenient for changing.
The present embodiment applies the structure on printed circuit board as shown in Figure 6.Golden finger is arranged on print by connector 19
On circuit board processed, connector 19 is a kind of edge-board connector suitable for flexible material, has enough high frequency bandwidths.Connector
19 are welded on printed circuit board 16 by pad 17, and the golden finger 18 of optical interconnected structure inserts connector 19 and realized with printing
The electrical connection of circuit board 16.To support higher frequency, the high speed pin optimization of golden finger 18 and connector 19 uses ground-signal-letter
Number-ground（GSSG）Or ground-signal-ground-signal-ground（GSGSG）Differential signal set, can also use ground-signal-ground（GSG）
Or ground-signal（GS）Single-ended signal set.
Optical interconnected structure of the present invention and preparation method thereof based on sheet or web-like fiber waveguide sheet material, its prepare work
Skill is mutually compatible with substrate preparation technology, and the 8th step and the 9th step in preparation method assemble suitable for plate level, you can with complete at one piece
The photoelectric chip 10 of multiple smooth transceiver parts 14 and the group of electrical chip 11 are sequentially completed on into the fiber waveguide sheet material 1 of the first seven step
The Place of dress, the covering of sealed colloid 12 and soldered ball 13, the structure of plate level assembling will be as shown in fig. 7, last again will be complete one by one
Whole flexible embedded optical interconnected structure separates.The assembling of plate level is suitable to automation and produced in enormous quantities, yield it is high, it is necessary to alignment time
Number is few, time saving, high yield rate, and cost is cheaper than discrete assembling.
Claims (6)
1. flexible embedded optical interconnected structure, it is characterised in that：Including by covering material（3）And it is inlaid in covering material（3）
In fiber waveguide（2）The fiber waveguide sheet material of composition（1）, fiber waveguide sheet material（1）On offer downward opening band light reflecting interface
（5）Laser ablation groove（4）, fiber waveguide sheet material（1）Upper laser ablation groove（4）Both sides be vertically installed with through fiber waveguide sheet material
（1）Through hole（6）；The fiber waveguide sheet material（1）Upper and lower surface on be disposed with the electroless copper with figure from inside to outside
Layer（7）, electrodeposition of metals（8）And coat of metal（9）, fiber waveguide sheet material（1）The coat of metal of upper surface（9）Pacify top
Equipped with photoelectric chip（10）And electrical chip（11）, photoelectric chip（10）And electrical chip（11）On covered with sealed colloid（12）；Institute
State fiber waveguide sheet material（1）The coat of metal of lower surface（9）Lower section is provided with external electrical interface；
One embedded optical interconnected structure of complete bidirectional flexible includes two light transceiver parts（14）With positioned at two smooth receiving and transmitting parts
Point（14）Middle light transmissive portion（15）, light transmissive portion is except the fiber waveguide of part where it（2）It is also real to transmit optical signal
Existing two light transceiver parts（14）Between light connects, the fiber waveguide sheet material of light transmissive portion（1）The metal line of upper and lower surface is real
Existing two light transceiver parts（14）Between electrical connection；The light transmissive portion（15）For the fiber waveguide sheet material comprising fiber waveguide（1）,
The metal line of fiber waveguide sheet material upper and lower surface includes chemical plating copper layer, electrodeposition of metals and coat of metal；The light transmitting-receiving
Part（14）Including being arranged on fiber waveguide sheet material（1）The photoelectric chip at both ends（10）, electrical chip（11）And it is arranged on light wave
Guide plate material（1）The band light reflecting interface at both ends（5）Laser ablation groove（4）.
2. the embedded optical interconnected structure of flexibility according to claim 1, it is characterised in that：The fiber waveguide sheet material（1）Under
The coat of metal on surface（9）The external electrical interface that lower section is set is soldered ball（13）.
3. the embedded optical interconnected structure of flexibility according to claim 1, it is characterised in that：The fiber waveguide sheet material（1）Under
The coat of metal on surface（9）The external electrical interface that lower section is set is golden finger.
4. the embedded optical interconnected structure of flexibility according to claim 1, it is characterised in that：The laser ablation groove（4）'s
It is shaped as triangle or trapezoidal, laser ablation groove（4）Medial surface form light reflecting interface（5）.
5. the embedded optical interconnected structure of flexibility according to claim 4, it is characterised in that：The smooth reflecting interface（5）With
Fiber waveguide sheet material（1）The angle of upper and lower surface be 40 ° to 50 °.
6. the embedded optical interconnected structure of flexibility according to claim 5, it is characterised in that：The smooth reflecting interface（5）With
Fiber waveguide sheet material（1）The angle of upper and lower surface be 45 °.
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| CN116960003B (en) * | 2023-09-21 | 2023-11-24 | 盛合晶微半导体(江阴)有限公司 | Photoelectric integrated semiconductor packaging structure and preparation method thereof |
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| CN103779323A (en) | 2014-05-07 |
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