CN103779323A - Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure - Google Patents
Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure Download PDFInfo
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- CN103779323A CN103779323A CN201410041869.0A CN201410041869A CN103779323A CN 103779323 A CN103779323 A CN 103779323A CN 201410041869 A CN201410041869 A CN 201410041869A CN 103779323 A CN103779323 A CN 103779323A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The invention discloses a flexible embedded type optical interconnection structure and a manufacturing method of the flexible embedded type optical interconnection structure. The flexible embedded type optical interconnection structure comprises an optical waveguide board, laser ablation grooves are formed in the optical waveguide board, and through holes are formed in the two sides of the laser ablation grooves of the optical waveguide board. The upper surface and the lower surface of the optical waveguide board are sequentially provided with electroless copper plating layers with patterns, metal electroplating layers and metal protecting layers from inside to outside, a photoelectric chip and an electric chip are installed above the metal protecting layer on the upper surface of the optical waveguide board, the photoelectric chip and the electric chip are covered with sealing rubber matrixes, and a welding ball is arranged below the metal protecting layer on the lower surface of the optical waveguide board. The flexible embedded type optical interconnection structure is simple in manufacturing process and suitable for mass production, and lays a foundation to popularization of optical PCBs.
Description
Technical field
The present invention relates to integrated electronic technical field, particularly a kind of optical interconnected structure and preparation method thereof.
Background technology
Along with the development of information technology and the application of optical communication technique and universal, the performance of electronic system is subject to the restriction of short distance (as chip chamber between framework, between rack room, plate and in plate) message capacity day by day.The active optical cable of different size and various criterion has been used between solution framework and the communication performance bottleneck problem of rack room, and light pcb board can solve the high-speed interconnect problem between plate and in plate.
Light pcb board is divided into two classes conventionally, rigidity light pcb board and flexible light pcb board.Wherein the result of study of rigidity light pcb board also has a large amount of reports, one class is that glass optical fiber is directly imbedded to rigidity pcb board, another kind is that organic optical waveguide is imbedded to rigidity pcb board inside or is placed in rigidity pcb board surface, no matter be to bury optical fiber, still imbedding organic optical waveguide, is all in the preparation process of rigidity pcb board, to insert some processing step to realize.IBM in 2011 has reported the rigidity pcb board of pure electricity and the organic film (there is no metal wiring layer on it) of realizing fiber waveguide transmission has been prepared respectively, and then the result of study fitting together.The preparation method that electroplax tabula rasa is separately prepared combination has again reduced preparation difficulty and the cost of light pcb board.Independent flexible light pcb board also has wide practical use in the hand-held electronic product such as smart mobile phone, panel computer in addition, receives the concern of each company.No matter be rigidity light pcb board or flexible light pcb board, all need to be applied to organic optical waveguide, at present due to organic optical waveguide material be also far from maturation and production in enormous quantities, virtually become the universal key factor of restriction light pcb board.
Summary of the invention
The technical problem that the present invention solves be to provide a kind of manufacture craft simple, be suitable for embedded optical interconnected structure of flexibility of producing in enormous quantities and preparation method thereof.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows.
Flexible embedded optical interconnected structure, comprise by clad material and be inlaid in the fiber waveguide sheet material that the fiber waveguide in clad material forms, on fiber waveguide sheet material, offer the downward opening laser ablation groove with light reflecting interface, on fiber waveguide sheet material, the both sides of laser ablation groove are vertically installed with the through hole that runs through fiber waveguide sheet material; In the upper and lower surface of described fiber waveguide sheet material, be disposed with from inside to outside chemical plating copper layer, electrodeposition of metals and coat of metal with figure, the coat of metal top of fiber waveguide sheet material upper surface is provided with photoelectric chip and electrical chip, on photoelectric chip and electrical chip, is coated with sealed colloid; Described fiber waveguide sheet material surface is provided with external electrical interface.
Improvement of the present invention is: the external electrical interface that the coat of metal surface on described fiber waveguide sheet material surface arranges is soldered ball.Soldered ball, as the external electrical interface of the embedded optical interconnected structure of described flexibility, can directly be welded on the pad on printed circuit board surface in the time of practical application.
Improvement of the present invention is: the external electrical interface that described fiber waveguide sheet material surface arranges is golden finger, be that the embedded optical interconnected structure of described flexibility can combine with golden finger structure, in the time of practical application, golden finger is electrically connected on printed circuit board by connector.
Improvement of the present invention is: described laser ablation groove be shaped as triangle or trapezoidal, the medial surface of laser ablation groove forms light reflecting interface.
Further improvement of the present invention is: the angle of the upper and lower surface of described smooth reflecting interface and fiber waveguide sheet material is 40 ° to 50 °.The angle of the upper and lower surface of described smooth reflecting interface and fiber waveguide sheet material is preferably 45 °.
The manufacture method of flexible embedded optical interconnected structure, mainly comprises the following steps:
The first step, the fiber waveguide sheet material of preparation sheet or web-like, the fiber waveguide of described fiber waveguide sheet material is inlaid in clad material middle level;
Second step is prepared downward opening laser ablation groove by laser ablation process on fiber waveguide sheet material, and the inner surface of laser ablation groove forms light reflecting interface;
The 3rd step, adopts bore process two sidetrackings of laser ablation groove on fiber waveguide sheet material to run through the through hole of upper and lower surface, and through hole vertical light waveguide sheet material arranges;
The 4th step, fiber waveguide sheet material prepared by the 3rd step carries out chemical-copper-plating process, and forms chemical plating copper layer on fiber waveguide sheet material surface;
The 5th step is graphically electroplated on chemical plating copper layer, forms electrodeposition of metals;
The 6th step, adopts process for copper processing at quarter the 5th step to be coated with the fiber waveguide sheet material of electrodeposition of metals and chemical plating copper layer;
The 7th step, to carrying out surface metalation processing through carving process for copper fiber waveguide sheet material after treatment, forms coat of metal on electrodeposition of metals surface;
The 8th step, the coat of metal top of fiber waveguide sheet material upper surface is provided with photoelectric chip and electrical chip;
The 9th step is coated with sealed colloid on photoelectric chip and electrical chip, and is provided with soldered ball below the coat of metal of fiber waveguide sheet material lower surface.
Owing to having adopted above technical scheme, the invention technological progress is as follows.
The more ripe plastic optical fiber material of utilization processed of the present invention with prepare plastic fiber mutually compatible preparation technology prepare the fiber waveguide sheet material of sheet or web-like, on the basis of fiber waveguide sheet material, prepare again flexible embedded optical interconnected structure, manufacture craft is simple, be suitable for producing in enormous quantities, for the universal of light pcb board provides the foundation.
Accompanying drawing explanation
Fig. 1 is the part-structure schematic diagram of optical interconnected structure of the present invention.
Fig. 2 is the process chart that the present invention makes flexible embedded optical interconnected structure.
Fig. 3 is that light signal of the present invention moves towards schematic diagram.
Fig. 4 is that the present invention is applied in the structural representation on printed circuit board.
Fig. 5 is that the present invention is applied in the structural representation on golden finger.
Fig. 6 is that the present invention is applied in the structural representation on printed circuit board in conjunction with golden finger.
Fig. 7 is the plate level assembling schematic diagram of optical interconnected structure of the present invention.
Wherein: 1. fiber waveguide sheet material, 2. fiber waveguide, 3. clad material, 4. laser ablation groove, 5. smooth reflecting interface, 6. through hole, 7. chemical plating copper layer, 701. through-hole wall chemical plating copper layers, 702. fiber waveguide flaggy upper and lower surface chemical plating copper layers, 703. smooth reflecting interface chemical plating copper layers, 8. electrodeposition of metals, 801. fiber waveguide flaggy upper and lower surface electrodeposition of metalss, 802. smooth reflecting interface electrodeposition of metalss, 9. coat of metal, 901. fiber waveguide flaggy upper and lower surface coat of metals, 902. smooth reflecting interface coat of metals, 10. photoelectric chip, 11. electrical chips, 12. sealed colloids, 13. soldered balls, 14. smooth transceiver parts, 15. smooth hops, 16. printed circuit boards, 17. pads, 18. golden fingers, 19. connectors.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further elaborated.
A kind of flexible embedded optical interconnected structure, comprise by clad material 3 and be inlaid in the fiber waveguide sheet material 1 that the fiber waveguide 2 in clad material 3 forms, on fiber waveguide sheet material 1, offer the downward opening laser ablation groove 4 with light reflecting interface 5, on fiber waveguide sheet material 1, the lateral vertical of laser ablation groove 4 is provided with the through hole 6 that runs through fiber waveguide sheet material 1; In the upper and lower surface of described fiber waveguide sheet material 1, be disposed with from inside to outside chemical plating copper layer 7, electrodeposition of metals 8 and coat of metal 9 with figure, coat of metal 9 tops of fiber waveguide sheet material 1 upper surface are provided with photoelectric chip 10 and electrical chip 11, on photoelectric chip 10 and electrical chip 11, are coated with sealed colloid 13; Coat of metal 9 belows of fiber waveguide sheet material 1 lower surface are provided with external electrical interface.Fig. 1 is the structural representation of the present embodiment one end, and other end structure is identical with it.In the present embodiment, contraposition electrical interface is soldered ball 13.
Make the process chart of the embedded optical interconnected structure of above-mentioned flexibility as shown in Figure 2, manufacture method mainly comprises the following steps:
The first step, adopt plastic optical fiber material and with prepare plastic fiber mutually compatible preparation technology prepare the fiber waveguide sheet material 1 of sheet or web-like, the fiber waveguide of described fiber waveguide sheet material is inlaid in clad material middle level, as shown in Figure 1.
Plastic fiber has the characteristics such as pliability is good, excellent in cushion effect, cost is low, in short haul connection, there is its superiority, adopt the bandwidth of the gradational plastic optical fibre of PMMA material can reach 3GHz100m, the bandwidth of the gradational plastic optical fibre of fluoride can reach 10GHz100m.
Fiber waveguide sheet material be sheet or web-like.
Fiber waveguide sheet material is not limited to plastic optical fiber material, can be also the sheet made of other organic materials or the fiber waveguide sheet material of web-like, and its preparation technology can comprise that lamination adds the processing step of photoetching, also can comprise the processing step of die impression.Due to preparation method's restriction, it can only be straight adopting with preparing the fiber waveguide that the plastic fiber fiber waveguide sheet material that mutually prepared by compatible preparation technology comprises, and can be arbitrary graphic and adopt lamination to add the fiber waveguide that fiber waveguide sheet material prepared by processing step that photoetching or die impress comprises.
This fiber waveguide sheet material can contain the fiber waveguide of multichannel distribution at regular intervals, and it can be can be uniformly, also periodically that the spacing of fiber waveguide distributes, but is not limited to this.Fiber waveguide can comprise material composition sandwich layer and the covering of two or more different refractivity, also can only include a kind of material of refractive index; Fiber waveguide can be refractive index saltant type fiber waveguide, can be also gradually changed refractive index type fiber waveguide.The refraction index profile of the cross section of fiber waveguide can be circular, square, trapezoidal, but is not limited to this.Fiber waveguide sheet material at least comprises a road fiber waveguide, and multi-path light waveguide can form optical waveguide array.
Second step is prepared downward opening laser ablation groove 4 by laser ablation process on fiber waveguide sheet material 1, and the inner surface of laser ablation groove forms light reflecting interface 5.The effect of light reflecting interface 5 is by the upper surface of the coupling luminous waveguide sheet material 1 of light wave in fiber waveguide 2 interior transmission, and the light wave of the upper surface that incides fiber waveguide sheet material 1 is coupled in fiber waveguide 2 and in the interior transmission of fiber waveguide 2.For improving coupling efficiency, need light reflecting interface 5 mirror-smooth.
The laser ablation apparatus using in the present invention can make substrate laser punch device.
The 3rd step, adopts bore process two sidetrackings of laser ablation groove 4 on fiber waveguide sheet material 1 to run through the through hole 6 of upper and lower surface, and through hole 6 vertical light waveguide sheet materials 1 arrange.
The 4th step, fiber waveguide sheet material 1 prepared by the 3rd step carries out chemical-copper-plating process, and forms chemical plating copper layer 7 on fiber waveguide sheet material 1 surface, and chemical plating copper layer is as the Seed Layer of selecting subsequently electroplating technology.Chemical plating copper layer 7 comprises through-hole wall chemical plating copper layer 701, fiber waveguide flaggy upper and lower surface chemical plating copper layer 702 and light reflecting interface chemical plating copper layer 703.
The 5th step is graphically electroplated on chemical plating copper layer 7, forms electrodeposition of metals 8.
Graphical electroplating technology comprises: on fiber waveguide sheet material upper and lower surface chemical plating copper layer 702, form and electroplate barrier film, described plating barrier film is electric insulation, can resist electroplate liquid corrosion simultaneously; Described plating barrier film can be organic film, can be also inoranic membrane, can also be organic/inorganic composite film; Described plating barrier film can be monofilm, can also be multilayer film; Described plating barrier film can be to be laminated on the chemical plating copper layer 702 of fiber waveguide sheet material upper and lower surface, also can spray on fiber waveguide sheet material upper and lower surface chemical plating copper layer 702.The described plating barrier film reflecting interface chemical plating copper layer 703 of can sharing the same light directly contacts, and also can directly not contact with light reflecting interface chemical plating copper layer 703, but canopy is on laser ablation groove 4 tops.
The figure that the selection that employing double-sided exposure developing technique forms on described plating barrier film is electroplated, needs the region of electroplating to remove the plating barrier film on it, exposes the chemical plating copper layer in this region, does not need the region reservation of electroplating to electroplate barrier film; The plating barrier film of through hole 6 and all or part of laser ablation groove 4, light reflecting interface 5 regions is removed, exposes the chemical plating copper layer in this region.After graphical plating, the metal filled situation in through hole 6 can be solid, can be also (metal is attached on through hole 6 inwalls) of hollow; On fiber waveguide sheet material upper and lower surface chemical plating copper layer 702, form patterned fiber waveguide sheet material upper and lower surface electrodeposition of metals 801; Light reflecting interface chemical plating copper layer 703 is thickened by metal plating, forms light reflecting interface electrodeposition of metals 802.Electrodeposition of metals can be fine copper, copper alloy, also can be the combination of several different metal electrodeposited coatings.
The 6th step, adopts process for copper processing at quarter the 5th step to be coated with the fiber waveguide sheet material of electrodeposition of metals 8 and chemical plating copper layer 7.
Carving in process for copper, utilize the thickness difference of zones of different metal level, when not having electrodeposition of metals copper product that cover, the region of exposed fiber waveguide sheet material upper and lower surface chemical plating copper layer 702, fiber waveguide sheet material upper and lower surface is corroded when clean, the electrodeposition of metals in region that has electrodeposition of metals to cover still has residual, just than carved the front attenuate of process for copper some.
The 7th step, to carrying out surface metalation processing through carving process for copper fiber waveguide sheet material after treatment, forms coat of metal 9 on electrodeposition of metals 8 surfaces.
The object of surface metalation processing is to form anticorrosive, the oxidation resistant coat of metal of one deck at fiber waveguide sheet material upper and lower surface electrodeposition of metals 801 and light reflecting interface electrodeposition of metals 802 surfaces, plays a protective role.Coat of metal 9 comprises fiber waveguide sheet material upper and lower surface coat of metal 901 and light reflecting interface coat of metal 902.Conventionally coat of metal is nickel gold composite bed or NiPdAu composite bed.
After this processing step, formed the pad (Pad) of metal line and chip and components and parts assembling in fiber waveguide sheet material upper and lower surface.These metal lines can be between chip chamber, components and parts, electric connection line between chip and components and parts, can be also Power supply lines, can be also the electric connection lines between the light transceiver part of one end and the light transceiver part of the other end.These metal lines mainly carry direct current signal, as direct current supply, direct current biasing, and are less than the low speed signal of 3GHz frequency.
The 8th step, coat of metal 9 tops of fiber waveguide sheet material 1 upper surface are provided with photoelectric chip 10 and electrical chip 11.
The installation form of photoelectric chip 10 adopts back-off (flip-chip) to install.
The 9th step is coated with sealed colloid 12 on photoelectric chip 10 and electrical chip 11, and is provided with soldered ball 13 below the coat of metal 9 of fiber waveguide sheet material 1 lower surface.
Sealed colloid 12 can be made up of a kind of material, also can be made up of underfill and encapsulant, and photoelectric chip 10 and electrical chip 11 can share a kind of underfill material, also can use respectively underfill material separately.The underfill of photoelectric chip 10 is transparent at effective spectral band of photoelectric chip 10.In the time that sealed colloid 12 is made up of a kind of material, this material plays the effect that back-off (flip-chip) bottom is filled and sealed simultaneously, and now requiring sealed colloid 12 is transparent at effective spectral band of photoelectric chip 10.The curing mode of sealed colloid 12 can be ultra-violet curing, hot curing, or the combination of the two.
Place technique is generally to carry out after sealed colloid 12 curing process, and soldered ball 13 is low temperature soldered ball preferably.
An embedded optical interconnected structure of complete bidirectional flexible should comprise light transceiver part and the light hop at two ends, and a complete Unidirectional light interconnection structure should comprise the light receiving part of light radiating portion, light hop and the other end of one end.Above-mentioned preparation method has only illustrated light transceiver part and the light hop of one end, and other end light transceiver part has the interconnection structure identical with the light transceiver part of described one end and preparation method.
The light signal of the embedded optical interconnected structure of flexibility prepared by the present invention moves towards as shown in Figure 3.In figure, the empty frame part in left side is light transceiver part 14, and the empty frame part in right side is light hop 15.The light that light hop is realized between the other end light transceiver part that light transceiver part 14 that Fig. 3 draws is connected with fiber waveguide 2 other ends except fiber waveguide 2 transmitting optical signals of its place part connects, fiber waveguide sheet material 1 upper and lower surface of light hop metal line realize the electrical connection between the other end light transceiver part that light transceiver part 14 that Fig. 3 draws is connected with fiber waveguide 2 other ends.Described fiber waveguide sheet material 1 upper and lower surface metal line comprise chemical plating copper layer 7, electrodeposition of metals 8 and coat of metal 9.Soldered ball 13 is for the external electrical interface of light transceiver part 14.
The present embodiment is applied in structure on printed circuit board as shown in Figure 4.The soldered ball of the embedded optical interconnected structure of flexibility 13 is welded on the pad 17 on printed circuit board 16 surfaces, can realize on printed circuit board 16 between different physical location points, printed circuit board 16 is with the transmission of high-speed wideband Large Volume Data and exchange between other printed circuit board.
The external electrical interface of the present embodiment is golden finger, and the structure of the present embodiment one end as shown in Figure 5.Golden finger 18 is positioned at the top of flexible embedded optical interconnected structure, can be to distribute (upper surface or lower surface) at the one side of fiber waveguide sheet material 1, also can be distributed in the upper and lower surface of fiber waveguide sheet material 1 simultaneously.This optical interconnected structure is that electricity is pluggable, uses flexibly, is convenient for changing.
The present embodiment is applied in structure on printed circuit board as shown in Figure 6.Golden finger is arranged on printed circuit board by connector 19, and connector 19 is a kind of edge-board connectors that are applicable to flexible material, has enough high frequency bandwidths.Connector 19 is welded on printed circuit board 16 by pad 17, and the golden finger 18 of optical interconnected structure inserts connector 19 realizes the electrical connection of same printed circuit board 16.For supporting more high frequency, the high speed pin optimization of golden finger 18 and connector 19 adopts the differential signal setting on ground-signal-signal-ground (GSSG) or ground-signal-ground-signal-ground (GSGSG), also can adopt the single-ended signal setting of ground-signal-ground (GSG) or ground-signal (GS).
Optical interconnected structure of the present invention and preparation method thereof is based on fiber waveguide sheet material sheet or web-like, its preparation technology is compatible mutually with substrate preparation technology, the 8th step in preparation method and the 9th step are suitable for the assembling of plate level, can on a fiber waveguide sheet material 1 that completes the first seven step, complete successively the photoelectric chip 10 of multiple smooth transceiver parts 14 and the assembling of electrical chip 11, the covering of sealed colloid 12 and the Place of soldered ball 13, the structure of plate level assembling as shown in Figure 7, is finally separated embedded complete one by one flexibility optical interconnected structure again.The assembling of plate level is suitable for automation produces in enormous quantities, and productive rate is high, and the aligning number of times needing is few, saves time, and rate of finished products is high, and cost is cheaper than discrete assembling.
Claims (7)
1. flexible embedded optical interconnected structure, it is characterized in that: comprise by clad material (3) and be inlaid in the fiber waveguide sheet material (1) that the fiber waveguide (2) in clad material (3) forms, on fiber waveguide sheet material (1), offer the laser ablation groove (4) of downward opening band light reflecting interface (5), the both sides of the upper laser ablation groove (4) of fiber waveguide sheet material (1) are vertically installed with the through hole (6) that runs through fiber waveguide sheet material (1); In the upper and lower surface of described fiber waveguide sheet material (1), be disposed with from inside to outside chemical plating copper layer (7), electrodeposition of metals (8) and coat of metal (9) with figure, coat of metal (9) top of fiber waveguide sheet material (1) upper surface is provided with photoelectric chip (10) and electrical chip (11), on photoelectric chip (10) and electrical chip (11), is coated with sealed colloid (13); Described fiber waveguide sheet material (1) surface is provided with external electrical interface.
2. the embedded optical interconnected structure of flexibility according to claim 1, is characterized in that: the external electrical interface that coat of metal (9) surface on described fiber waveguide sheet material (1) surface arranges is soldered ball (13).
3. the embedded optical interconnected structure of flexibility according to claim 1, is characterized in that: the external electrical interface that described fiber waveguide sheet material (1) surface arranges is golden finger.
4. the embedded optical interconnected structure of flexibility according to claim 1, is characterized in that: described laser ablation groove (4) be shaped as triangle or trapezoidal, the medial surface of laser ablation groove (4) forms light reflecting interface (5).
5. the embedded optical interconnected structure of flexibility according to claim 4, is characterized in that: described smooth reflecting interface (5) is 40 ° to 50 ° with the angle of the upper and lower surface of fiber waveguide sheet material (1).
6. the embedded optical interconnected structure of flexibility according to claim 5, is characterized in that: described smooth reflecting interface (5) is 45 ° with the angle of the upper and lower surface of fiber waveguide sheet material (1).
7. the manufacture method of flexible embedded optical interconnected structure, is characterized in that mainly comprising the following steps:
The first step, the fiber waveguide sheet material (1) of preparation sheet or web-like, the fiber waveguide of described fiber waveguide sheet material is inlaid in clad material middle level;
Second step, above prepares downward opening laser ablation groove (4) by laser ablation process at fiber waveguide sheet material (1), and the inner surface of laser ablation groove forms light reflecting interface (5);
The 3rd step, adopts bore process to run through the through hole (6) of upper and lower surface at two sidetrackings of the upper laser ablation groove (4) of fiber waveguide sheet material (1), and through hole (6) vertical light waveguide sheet material (1) arranges;
The 4th step, fiber waveguide sheet material (1) prepared by the 3rd step carries out chemical-copper-plating process, and forms chemical plating copper layer (7) on fiber waveguide sheet material (1) surface;
The 5th step is graphically electroplated on chemical plating copper layer (7), forms electrodeposition of metals (8);
The 6th step, adopts process for copper processing at quarter the 5th step to be coated with the fiber waveguide sheet material of electrodeposition of metals (8) and chemical plating copper layer (7);
The 7th step, to carrying out surface metalation processing through carving process for copper fiber waveguide sheet material after treatment, forms coat of metal (9) on electrodeposition of metals (8) surface;
The 8th step, coat of metal (9) top of fiber waveguide sheet material (1) upper surface is provided with photoelectric chip (10) and electrical chip (11);
The 9th step is coated with sealed colloid (12) on photoelectric chip (10) and electrical chip (11), and is provided with soldered ball (13) in coat of metal (9) below of fiber waveguide sheet material (1) lower surface.
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| CN116960003A (en) * | 2023-09-21 | 2023-10-27 | 盛合晶微半导体(江阴)有限公司 | Photoelectric integrated semiconductor packaging structure and preparation method thereof |
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