CN1115715C - 处理半导体薄膜的方法及利用此方法所制造的半导体器件 - Google Patents
处理半导体薄膜的方法及利用此方法所制造的半导体器件 Download PDFInfo
- Publication number
- CN1115715C CN1115715C CN97199467A CN97199467A CN1115715C CN 1115715 C CN1115715 C CN 1115715C CN 97199467 A CN97199467 A CN 97199467A CN 97199467 A CN97199467 A CN 97199467A CN 1115715 C CN1115715 C CN 1115715C
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- China
- Prior art keywords
- substrate
- temperature
- glass
- film
- strain point
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- Expired - Fee Related
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/162—Non-monocrystalline materials, e.g. semiconductor particles embedded in insulating materials
- H10F77/164—Polycrystalline semiconductors
- H10F77/1642—Polycrystalline semiconductors including only Group IV materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3482—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising silicon, hydrogenated silicon or a silicide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/131—Recrystallisation; Crystallization of amorphous or microcrystalline semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2924—Structures
- H10P14/2925—Surface structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/282—Carbides, silicides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Recrystallisation Techniques (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AUPO3471 | 1996-11-06 | ||
| AUPO3471A AUPO347196A0 (en) | 1996-11-06 | 1996-11-06 | Improved method of forming polycrystalline-silicon films on glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1236481A CN1236481A (zh) | 1999-11-24 |
| CN1115715C true CN1115715C (zh) | 2003-07-23 |
Family
ID=3797782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97199467A Expired - Fee Related CN1115715C (zh) | 1996-11-06 | 1997-11-06 | 处理半导体薄膜的方法及利用此方法所制造的半导体器件 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6624009B1 (https=) |
| EP (1) | EP0946974A4 (https=) |
| JP (1) | JP4427104B2 (https=) |
| CN (1) | CN1115715C (https=) |
| AU (2) | AUPO347196A0 (https=) |
| ID (1) | ID22434A (https=) |
| MY (1) | MY124232A (https=) |
| WO (1) | WO1998020524A1 (https=) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000159546A (ja) * | 1998-11-25 | 2000-06-13 | Nippon Sheet Glass Co Ltd | 熱線反射ガラス及びこれを用いた複層ガラス |
| CN1262508C (zh) * | 2000-08-28 | 2006-07-05 | 应用材料有限公司 | 玻璃衬底的预多晶硅被覆 |
| US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
| US7540920B2 (en) | 2002-10-18 | 2009-06-02 | Applied Materials, Inc. | Silicon-containing layer deposition with silicon compounds |
| US7132338B2 (en) | 2003-10-10 | 2006-11-07 | Applied Materials, Inc. | Methods to fabricate MOSFET devices using selective deposition process |
| US8501594B2 (en) | 2003-10-10 | 2013-08-06 | Applied Materials, Inc. | Methods for forming silicon germanium layers |
| US7166528B2 (en) | 2003-10-10 | 2007-01-23 | Applied Materials, Inc. | Methods of selective deposition of heavily doped epitaxial SiGe |
| US7078302B2 (en) | 2004-02-23 | 2006-07-18 | Applied Materials, Inc. | Gate electrode dopant activation method for semiconductor manufacturing including a laser anneal |
| US20090107545A1 (en) * | 2006-10-09 | 2009-04-30 | Soltaix, Inc. | Template for pyramidal three-dimensional thin-film solar cell manufacturing and methods of use |
| US8399331B2 (en) | 2007-10-06 | 2013-03-19 | Solexel | Laser processing for high-efficiency thin crystalline silicon solar cell fabrication |
| US8129822B2 (en) * | 2006-10-09 | 2012-03-06 | Solexel, Inc. | Template for three-dimensional thin-film solar cell manufacturing and methods of use |
| US9508886B2 (en) | 2007-10-06 | 2016-11-29 | Solexel, Inc. | Method for making a crystalline silicon solar cell substrate utilizing flat top laser beam |
| US8420435B2 (en) * | 2009-05-05 | 2013-04-16 | Solexel, Inc. | Ion implantation fabrication process for thin-film crystalline silicon solar cells |
| US7312128B2 (en) | 2004-12-01 | 2007-12-25 | Applied Materials, Inc. | Selective epitaxy process with alternating gas supply |
| US7560352B2 (en) | 2004-12-01 | 2009-07-14 | Applied Materials, Inc. | Selective deposition |
| US7235492B2 (en) | 2005-01-31 | 2007-06-26 | Applied Materials, Inc. | Low temperature etchant for treatment of silicon-containing surfaces |
| US20060176660A1 (en) * | 2005-02-07 | 2006-08-10 | Ahmad Amiri | Ultra mobile communicating computer |
| KR101171189B1 (ko) * | 2005-10-21 | 2012-08-06 | 삼성전자주식회사 | 더미 글래스 기판과 표시장치의 제조방법 |
| US7674337B2 (en) | 2006-04-07 | 2010-03-09 | Applied Materials, Inc. | Gas manifolds for use during epitaxial film formation |
| JP5101038B2 (ja) | 2006-05-19 | 2012-12-19 | 株式会社フジクラ | 電極基板の製造方法、電極基板の評価方法 |
| CN101496150B (zh) | 2006-07-31 | 2012-07-18 | 应用材料公司 | 控制外延层形成期间形态的方法 |
| US7999174B2 (en) * | 2006-10-09 | 2011-08-16 | Solexel, Inc. | Solar module structures and assembly methods for three-dimensional thin-film solar cells |
| US20080264477A1 (en) * | 2006-10-09 | 2008-10-30 | Soltaix, Inc. | Methods for manufacturing three-dimensional thin-film solar cells |
| US8035028B2 (en) * | 2006-10-09 | 2011-10-11 | Solexel, Inc. | Pyramidal three-dimensional thin-film solar cells |
| US8293558B2 (en) * | 2006-10-09 | 2012-10-23 | Solexel, Inc. | Method for releasing a thin-film substrate |
| US20100304521A1 (en) * | 2006-10-09 | 2010-12-02 | Solexel, Inc. | Shadow Mask Methods For Manufacturing Three-Dimensional Thin-Film Solar Cells |
| US8512581B2 (en) * | 2006-10-09 | 2013-08-20 | Solexel, Inc. | Methods for liquid transfer coating of three-dimensional substrates |
| US8193076B2 (en) | 2006-10-09 | 2012-06-05 | Solexel, Inc. | Method for releasing a thin semiconductor substrate from a reusable template |
| US7811911B2 (en) * | 2006-11-07 | 2010-10-12 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5004160B2 (ja) * | 2006-12-12 | 2012-08-22 | 株式会社日本製鋼所 | 結晶質半導体膜の製造方法および半導体膜の加熱制御方法ならびに半導体結晶化装置 |
| US20080236665A1 (en) * | 2007-04-02 | 2008-10-02 | Jianming Fu | Method for Rapid Liquid Phase Deposition of Crystalline Si Thin Films on Large Glass Substrates for Solar Cell Applications |
| US20100144080A1 (en) * | 2008-06-02 | 2010-06-10 | Solexel, Inc. | Method and apparatus to transfer coat uneven surface |
| WO2010033638A1 (en) * | 2008-09-16 | 2010-03-25 | Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University | Thin group iv semiconductor structures |
| US8294026B2 (en) | 2008-11-13 | 2012-10-23 | Solexel, Inc. | High-efficiency thin-film solar cells |
| US8288195B2 (en) * | 2008-11-13 | 2012-10-16 | Solexel, Inc. | Method for fabricating a three-dimensional thin-film semiconductor substrate from a template |
| MY160251A (en) * | 2008-11-26 | 2017-02-28 | Solexel Inc | Truncated pyramid -structures for see-through solar cells |
| US9076642B2 (en) | 2009-01-15 | 2015-07-07 | Solexel, Inc. | High-Throughput batch porous silicon manufacturing equipment design and processing methods |
| JP2012515453A (ja) * | 2009-01-15 | 2012-07-05 | ソレクセル、インコーポレイテッド | 多孔質シリコン電解エッチングシステム及び方法 |
| US8906218B2 (en) | 2010-05-05 | 2014-12-09 | Solexel, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
| MY162405A (en) * | 2009-02-06 | 2017-06-15 | Solexel Inc | Trench Formation Method For Releasing A Thin-Film Substrate From A Reusable Semiconductor Template |
| US8828517B2 (en) | 2009-03-23 | 2014-09-09 | Solexel, Inc. | Structure and method for improving solar cell efficiency and mechanical strength |
| CN102427971B (zh) * | 2009-04-14 | 2015-01-07 | 速力斯公司 | 高效外延化学气相沉积(cvd)反应器 |
| US9099584B2 (en) * | 2009-04-24 | 2015-08-04 | Solexel, Inc. | Integrated three-dimensional and planar metallization structure for thin film solar cells |
| US9318644B2 (en) | 2009-05-05 | 2016-04-19 | Solexel, Inc. | Ion implantation and annealing for thin film crystalline solar cells |
| EP2427914A4 (en) | 2009-05-05 | 2013-06-05 | Solexel Inc | HIGH PRODUCTION PLANT FOR THE PRODUCTION OF POROUS SEMICONDUCTORS |
| US8445314B2 (en) * | 2009-05-22 | 2013-05-21 | Solexel, Inc. | Method of creating reusable template for detachable thin film substrate |
| EP2436028B1 (en) * | 2009-05-29 | 2016-08-10 | Solexel, Inc. | See-through three-dimensional thin-film solar cell semiconductor substrate and methods of manufacturing |
| EP2510550A4 (en) | 2009-12-09 | 2014-12-24 | Solexel Inc | HIGH-EFFECT PHOTOVOLTAIC SOLAR CELL STRUCTURES WITH REAR-SIDE CONTACTS AND METHODS OF MAKING USING THREE-DIMENSIONAL SEMICONDUCTOR ABSORBERS |
| CN102844883B (zh) | 2010-02-12 | 2016-01-20 | 速力斯公司 | 用于制造光电池和微电子器件的半导体衬底的双面可重复使用的模板 |
| US9870937B2 (en) | 2010-06-09 | 2018-01-16 | Ob Realty, Llc | High productivity deposition reactor comprising a gas flow chamber having a tapered gas flow space |
| US8946547B2 (en) | 2010-08-05 | 2015-02-03 | Solexel, Inc. | Backplane reinforcement and interconnects for solar cells |
| EP2710639A4 (en) | 2011-05-20 | 2015-11-25 | Solexel Inc | SELF-ACTIVATED FRONT PANEL PRE-VOLTAGE FOR A SOLAR CELL |
| JP5983100B2 (ja) * | 2011-07-19 | 2016-08-31 | 日本電気硝子株式会社 | ガラス基材 |
| US8722136B2 (en) * | 2011-10-21 | 2014-05-13 | First Solar, Inc. | Heat strengthening of a glass superstrate for thin film photovoltaic devices |
| JP2014006049A (ja) * | 2012-06-21 | 2014-01-16 | Sumitomo Bakelite Co Ltd | マイクロ流路チップの製造方法 |
| EP3805173B1 (en) * | 2018-05-31 | 2022-06-01 | Panasonic Intellectual Property Management Co., Ltd. | Glass panel unit manufacturing method |
| CN112250292B (zh) * | 2020-10-13 | 2022-05-06 | 浙江旗滨节能玻璃有限公司 | 功能玻璃的热处理工艺及功能玻璃 |
| CN115632080A (zh) * | 2022-09-30 | 2023-01-20 | 湖南兆湘光电高端装备研究院有限公司 | 电池片双玻组件和光伏系统 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61203631A (ja) * | 1985-03-07 | 1986-09-09 | Toshiba Corp | 被膜の形成方法 |
| JPS63221610A (ja) | 1987-03-11 | 1988-09-14 | Hitachi Ltd | 薄膜半導体装置の製造方法 |
| JPH02297923A (ja) | 1989-05-11 | 1990-12-10 | Seiko Epson Corp | 多結晶シリコン再結晶化法 |
| JPH05218367A (ja) | 1992-02-03 | 1993-08-27 | Sharp Corp | 多結晶シリコン薄膜用基板および多結晶シリコン薄膜の作製方法 |
| CN100465742C (zh) * | 1992-08-27 | 2009-03-04 | 株式会社半导体能源研究所 | 有源矩阵显示器 |
| US5372860A (en) * | 1993-07-06 | 1994-12-13 | Corning Incorporated | Silicon device production |
| KR100333153B1 (ko) * | 1993-09-07 | 2002-12-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치제작방법 |
| JPH07109573A (ja) | 1993-10-12 | 1995-04-25 | Semiconductor Energy Lab Co Ltd | ガラス基板および加熱処理方法 |
| JPH1074948A (ja) * | 1996-08-30 | 1998-03-17 | Toshiba Corp | 液晶表示装置の製造方法 |
-
1996
- 1996-11-06 AU AUPO3471A patent/AUPO347196A0/en not_active Abandoned
-
1997
- 1997-11-06 JP JP52088198A patent/JP4427104B2/ja not_active Expired - Fee Related
- 1997-11-06 AU AU47677/97A patent/AU718641B2/en not_active Ceased
- 1997-11-06 CN CN97199467A patent/CN1115715C/zh not_active Expired - Fee Related
- 1997-11-06 EP EP97910163A patent/EP0946974A4/en not_active Withdrawn
- 1997-11-06 MY MYPI97005277A patent/MY124232A/en unknown
- 1997-11-06 WO PCT/AU1997/000753 patent/WO1998020524A1/en not_active Ceased
- 1997-11-06 ID IDW990476A patent/ID22434A/id unknown
- 1997-11-06 US US09/297,502 patent/US6624009B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0946974A1 (en) | 1999-10-06 |
| EP0946974A4 (en) | 2000-11-08 |
| JP4427104B2 (ja) | 2010-03-03 |
| CN1236481A (zh) | 1999-11-24 |
| JP2001503917A (ja) | 2001-03-21 |
| US6624009B1 (en) | 2003-09-23 |
| AU4767797A (en) | 1998-05-29 |
| AUPO347196A0 (en) | 1996-12-05 |
| ID22434A (id) | 1999-10-14 |
| AU718641B2 (en) | 2000-04-20 |
| WO1998020524A1 (en) | 1998-05-14 |
| MY124232A (en) | 2006-06-30 |
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